international electronics manufacturing initiative
TRANSCRIPT
iNEMIInternational Electronics Manufacturing Initiative
iNEMI Roadmap
and Research Seminars
Grace O’Malley,
VP Global Operations
October 24, 2014
Today’s Objectives
iNEMI Roadmap process
iNEMI member Research seminar series
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What is iNEMI?
International Electronics Manufacturing
Initiative (iNEMI) is an industry-led consortium
of over 100 global manufacturers, suppliers,
industry associations, government agencies
and universities.
A Non Profit Fully Funded by Member Dues;
All Funding is Returned to the Members in High
Value Programs and Services;
In Operation Since 1994.
www.inemi.org
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Our Mission
Forecast and Accelerate improvements in the Electronics Manufacturing Industry for
a Sustainable Future
iNEMI Roadmap
Collaborative Projects
Forums, Workshops &
Seminars
• Anticipate technology requirements
• Identify gaps
• Focus R&D priorities
• Eliminate gaps
• Deliver learning & critical data
• Leverage efforts & resources of participants
• Share solutions & best practices
• Prioritize key challenges
• Network with customers & suppliers
iNEMI Industry Value
Today’s Challenges
Capitalize on business opportunities evolving from new technologies
Reduce risks and costs
• in new business and technology development
• on the journey to a sustainable world
Influence the industry and drive improvements
• be a leader and collaborate with leaders
Engage with the global supply chain
iNEMI Roadmap
Benefits of a Roadmap
• Assessment of where the industry is at
• Identification of where we/industry want to be
• Cost and performance
• Comparison of various technology paths
• Clarification on what is needed to get there
• Visibility to what is happening
• Communication to the industry and along the supply chain is enhanced
• Identify where collaboration or innovation is necessary
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Who participates?
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Software Solutions
Marketing Design ManufacturingOrder
Fulfillment
Supply Chain ManagementInformation Technology
LogisticsCommunications
Business Practices
Build toOrder
Materials
Components
Customer
Equipment
MaterialsTransformation
Collaborative Design
Lifecycle SolutionsSoftware
Solutions
Statistics of 2013 Roadmap (10th roadmap)
• 650+ participants
• 350+ companies/organizations
• 18 countries from 4 continents
• 20 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• 1,900+ pages of information
• Roadmaps the needs for 2013-2023
iNEMI Roadmap
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Outlook for the next 10 years, updated every other year,
global participation, covers the full supply chain for
electronics manufacturing
Flextronics depends on roadmaps coming from iNEMI. We need that level of support and visibility from a consortium like iNEMI that has a lot more visibility into the industry. — Murad Kurwa, Flextronics
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Roadmap Development
Product Emulator GroupsTWGs
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
2013 Product Sector Needs Vs. Technology Evolution
Business Processes
Prod Lifecycle Information Mgmt.
2013 Product Emulator Groups (PEGs)
Emulator Characteristics
Consumer / Portable
Produced in high volumes, cost is the primary driver,
hand held battery powered products are also driven by
size and weight reduction
Office Driven by the need for maximum performance over a
wide range of cost targets
Automotive ProductsProducts that must operate in an automotive
environment
High-End Systems
(The Cloud)
Products that serve the high performance
computing/storage markets including networking,
datacom and telecom and cover a wide range of cost
and performance targets
Medical ProductsProducts that must operate with high reliability and, in
some cases, support life critical applications
Aerospace / DefenseProducts that must operate reliably in extreme
environments
Key content of PEG chapter
• Situation Analysis
• Roadmap of Quantified Key attribute Needs
• Critical Issues (Infrastructure)
• Prioritized Technology Requirements and Trends
• Recommendations on Priorities and Alternative Technologies
Parameter Descriptions Metric 2011 2013 2015 2017 2023
Components/ PackageTypical Product Family
Utilizing
Max Component I/O density Substrate Density I/O/sq.cm 500 600 700 800 1200
Average Component I/O density Substrate Density I/O/sq.cm 50 55 60 80 120
Average Component Density Substrate Density #/sq.cm 30 40 50 80 120
Maximum I/O per packageState of the Art
(production volume)I/O per part 600 675 725 1000 1400
Average I/O per packageState of the Art
(production volume)I/O per part 7 7.5 8 9 11
Max Components/sq. cm. Substrate Density #/sq.cm 55 60 70 75 95
Max I/O for 50 mm square SCM
w/ full area array
State of the Art
(production volume)# 3000 3500 5000 8000 1300
Max I/O for 100 mm square
MCM w/ full area array
State of the Art
(production volume)# UA UA UA UA UA
Package I/O Pitch, (area array)Minimum Pitch
(Production volume)mm 0.4 0.4 0.3 0.3 0.3
Package I/O Pitch for SCM (area
array)
Minimum Pitch
(Production volume)mm 0.4 0.4 0.3 0.3 0.3
Package I/O Pitch for MCM (area
array)
Minimum Pitch
(Production volume)mm 0.5 0.4 0.4 0.3 0.3
Package I/O Pitch (perimeter)Minimum Pitch
(Production volume)mm 0.4 0.4 0.3 0.3 0.3
Portable/Consumer, Key Parameters
Table 1 (12 rows of ≈ 250)
Technology Working Groups (TWGs)
Organic PCBBoard
Assembly Customer
RF Components &
Subsystems
OptoelectronicsLarge Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging
&
Component
Substrates
Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Systems
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Purple=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Many Contributing Organizations
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iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
Key Outputs of the iNEMI Roadmap
• Short term
– Information on technology evolutions and industry needs for the
short to mid term
– Technical plan for iNEMI Technical Committee
• Where should industry focus efforts
• Project areas/specific projects
• Topics for further investigation – workshops/forums
• Long term
– Research Priorities Report
• Highlight the longer term needs of the industry
• Highlights where academic research should be focused and funded
• Identify key areas that need further investigation
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Technical Plan for Members
5 Year Plan for Implementation
2013
Technical
Plan
(iNEMI Members Only)
• Implementation Plan for Key
Areas
• Areas selected by TC
• Plans developed and
Prioritized by Members
• 2013 Plan Covered 7 Project
Areas
2013 Research Priorities
Chapter 1: Introduction
Chapter 2: Research Needs to support iNEMI
Technology Implementation Groups (TIGs)
and current Projects
Chapter 3: Emerging Technologies
Chapter 4: Research Priorities Summarized by
Research Area
Design
Manufacturing Processes
Materials & Reliability
Sustainability
Summary
Chapter 5: Conclusions and
Recommendations
Appendixes
2013
Research
Priorities
Example: Photonics Systems Manufacturing Consortium
(PSMC), May 2014
• The AMTech Program allocated $539,990 for the iNEMI / MIT
PSMC Consortium for a 19-month program
• PSMC will establish a community of Academics, Technologists
and Companies to:
– define gaps and roadblocks for an integrated photonic
technology roadmap
– build a common manufacturing platform for cost-effective, high-
volume manufacturing
NIST Advanced Manufacturing Technology Consortia
(AMTech) Program
iNEMI Roadmap Process
• Leaders for Product Emulators Groups (PEGs) and Technical
working Groups (TWGs) identified
• PEGs prepare the updates for the market segments
• TWG teams are formed and start to update the tables and
technology reviews
• PEGS input reviewed by TWGs
• TWG finish reports
• Final editing
• Publishing
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iNEMI ResearchSeminars
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Research Seminars
• Focused on iNEMI Research members
• Topics identified in 2013 Research priorities document
MEMS
Jean Phillippe Polizzi and Andre Rouzaud.
MEMS technologies are now facing a maturity period, with high
constraints for manufacturing simplification, as well as cost and
time-to-market reductions. The Léti MEMS team presented its work
in the context of the expected trends in the design and development
of innovative products and the R&D response in particular for
physical and chemical sensors.
Circuits in Plastics
Professor David Thiel
Circuits in Plastic – Addressing the major issues in creating a sustainable electronics industry
Circuits in plastic is a circuit and electronic product manufacturing method that uses existing circuit components and printed technologies, existing circuit layout designs and tools and offers the following advantages:No solder or adhesive steps, One only, low temperature thermal step, 80% reduction in energy use, Simple incorporation of optical interconnects, Robust thermal and mechanical properties, The use of bioplastics and recycled plastics, Environmental protection of circuit boards, Design rules for optical and radio transparencyThis presentation will outline the technology with some examples of applications and use. This technology fits well within the 2013 Research Priorities for Integrated photonics, Electronic packaging and Design for the environment
Printed Electronics
Dr. Chuck Zhang
Printed Electronics – Manufacturing Technologies and Applications (with a Focus on Aerosol Jet® Printing)
Printed electronics technology enables product customization and improved performance, function and costs – desired attributes for future electronics devices. It can also serve as a useful prototyping tool for high volume, scale-up (e.g., roll-to-roll) manufacturing of electronics products. The rapid growth and ongoing improvement in areas such as display, sensors, lighting, energy generation devices, and medical devices, among others, ensures that printed electronics will be a R&D and application focal point for a number of industries in the years ahead. After an overview of printed electronics technologies, this presentation will discuss the R&D activities at the Georgia Tech Manufacturing Institute (GTMI) on printed electronics, particularly aerosol jet® printing
Sustainability Tools
Dr. Jennifer Mangold
End-of-Life of Consumer Electronics – Methods and Tools to Improve Product Design and Material Recovery
This webinar highlights work at UC Berkeley to develop methodsand tools to inform end-of-life strategies for consumer electronicproducts during the design and end-of-life phases of the productlifecycle. Jennifer Mangold is a post-doctoral researcher at theLaboratory for Manufacturing and Sustainability at UC Berkeley. Thefocus is on developing tools to aid designers in making products andprocesses more sustainable.
3D Printing
Simin Zhou
3D Printing - Innovation, Challenges and Opportunities
This presentation highlights innovation leveraging 3D printing and
additive manufacturing across consumer, commercial, industrial and
healthcare industries, and discuss key challenges and
opportunities. In addition, the presentation will touch on emerging
standards and regulations.
Additional Seminars
The National Additive Manufacturing Innovation Institute's Mission and R&D Portfolio –
Ed Morris , Vice President, National Center for Defense Manufacturing and Machining (NCDMM) and Director of America Makes – National Additive Manufacturing Innovation Institute
Flexible Electronics - Innovation, Challenges and OpportunitiesThe Center for Advanced Microelectronics Manufacturing
(CAMM) at Binghamton university.
www.inemi.org
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www.inemi.orgNorth America:
Bill Bader
Europe:
Steve Payne
Asia Pacific:
Haley Fu