america’s flexible hybrid electronics · pdf fileamerica’s flexible hybrid...

29
America’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE PRINT ELECTRONICS COMMITTEE JASON MARSH DIRECTOR OF TECHNOLOGY NextFlex

Upload: vankiet

Post on 17-Mar-2018

246 views

Category:

Documents


5 download

TRANSCRIPT

Page 1: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

America’s Flexible Hybrid Electronics Manufacturing Institute

AMERICA’SFLEXIBLE HYBRID ELECTRONICS

MANUFACTURING INSTITUTEPRINT ELECTRONICS COMMITTEE

JASON MARSHDIRECTOR OF TECHNOLOGY

NextFlex

Page 2: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Network Status and Growth Plans

FHE MIIFlex. Hybrid Elec.

San Jose, CA

ESTABLISHED INSTITUTES

America MakesAdditive Mfg.

Youngstown, OH

Power America

ElectronicsRaleigh, NC

LIFTLight/Modern Metals

Detroit, MI

IACMIAdv. Composites

Knoxville, TN

AIM PhotonicsAlbany & Rochester, NY

DMDIIDigital Mfg.Chicago, IL

Smart Mfg.for Energy Efficiency

Proj. Award TBD

INSTITUTES IN COMPETITION/DEVELOPMENT

Revolutionary Fibers & Textiles

Proj. Award:December 2015

TopicTBA

NNMI NETWORK

Presenter
Presentation Notes
Page 3: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

AUG US T 2 8 , 2 0 1 5Announcement Day

Page 4: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

BY THE NUMBERS

4

Established 28 August 2015

Lead FlexTech Alliance

Hub Location San Jose, California

Proposal Contributors 145+ in 27 states

Federal Funding $75 million over 5 years

Committed Matching $96 million

Government Agencies Engaged 17 DOD & OGAs

Page 5: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

HUB & NODE STRUCTURE

Government NodeGov’t technical participationDOD User requirements

Page 6: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Partner Organizations: Mar ‘16Corporate Academic/Non-Profit Federal Government

Tier 2

Tier 1

Tier 3

Tier 2

Observer

Tier 3

Associations

EconomicDevelopment

State/Local Government

Tier 1

Prospective Participants in 2016

Page 7: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

NEXTFLEX VISION

Page 8: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

• Enable the development of a domestic FHE manufacturing ecosystem

• Create and lead a Pilot Line/Hub Facility and a network of Nodes

• Craft capability for designing, testing, and manufacturing new products for human

performance monitoring, healthcare, distributed sensors, and consumer

electronics

• Empower, companies, universities, and research organizations to advance FHE

technology from Manufacturing Readiness Level 4 to 7

• Conduct integrated education, training, and workforce development initiatives.

NextFlex Charter

Page 9: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

DUAL USE

0

20

40

60

80

100

120

4 106 6 106 8 106 1 107 1.2 107 1.4 107 1.6 107 1.8 107 2 107

DI Water0.1 uM Orexin-A1 uM Orexin-A10 uM Orexin-A100 uM Orexin-A500 uM Orexin-A1000 uM Orexin-A

Impe

danc

e (o

hm)

Frequency (Hz)

Page 10: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

MRL/TRL Assessment Criteria

Definitional Material Solution Analysis

Technology Development & Commercial Merit

Engineering & Manufacturing Development

MRL 1Mfg

feasibility assessed

MRL 2Mfg

conceptsdefined

MRL 3Proof of

mfgconcept

MRL 4Breadboard

& manufacturing processes in a laboratory environment

MRL 5Breadboard

& component

manufacturingin a relevant environment

MRL 6Prototype, system &

subsystem in

production relevant environ-

ment

MRL 7Prototype, system &

subsystem in

operations and

production environ-

ment

MRL 8Pilot line

capability demon-strated;

Ready to begin low-rate initial

production

MRL 9Low-rate

production demon-strated;

capability in place to begin full-

rate production

Page 11: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

TECHNOLOGY DEMONSTRATORS

11

Integrated Array Antenna Systems

Asset Monitoring Systems

Human Monitoring Systems

Soft Robotics

1 3 42

Page 12: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

MANUFACTURING THRUSTS

12

01DEVICE INTEGRATION AND PACKAGINGDevelopment of new tools for testing, slicing, and thinning of silicon wafers as well as for electronic device and sensor integration on flexible, stretchable, and/or foldable substrates. Leveraging advanced precision printing and high-speed automated pick & place for integration of device components, interconnects, and data lines.

02MATERIALSManufacturing scale-up of conductive and dielectric inks and pastes, adhesives, encapsulantmaterials, and flexible substrates.

03 PRINTED FLEXIBLE COMPONENTS AND MICROFLUIDICS Developing and maturing contact and non-contact printing processes that support hybrid device concepts, including sensors and discrete device components. Printing & integration of microfluidic channels and fluidic control elements.

04MODELING AND DESIGNLeveraging existing software & hardware design capabilities, simulation techniques, and manufacturing process control tools while also integrating novel manufacturing design rules for FHE.

05STANDARDS, TEST & RELIABILITYDeveloping tools and test protocols to evaluate device-level and system-level FHE performance as well as reliability in both commercial and military environments. Partnering with standards organizations and professional societies to develop specifications & standards.

Page 13: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

FHE

Page 14: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

67 workshop participants• 37 industry personnel from 15

companies• 8 faculty from 5 universities• 18 government personnel• 4 NextFlex personnel

TWG Roadmap Workshop at GE

Page 15: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

TWG TimelineTWG

TeleconferencesDraft Roadmaps

Due

Roadmap Feedback Provided

Final Roadmaps

Due

TWG Roadmap Workshop at GE

Monterey TWG

Meetings

Calender

Deadline for TWG Members

to Join NextFlex

Roadmaps serve as basis for Project Call 2.0.

Suggested PC 2.0 Topics

Submitted to TC

PC 2.0 Released

Presenter
Presentation Notes
Emphasize accelerated schedule Opportunities for 711th participation
Page 16: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

NextFlex Roadmap Framework

Device Integration & Packaging

Printed Flexible Components & Microfluidics

Materials

Modeling & Design

Standards, Testing & Reliability

Time

Device/PlatformCapabilities

• Strong End-User Participation• Result in Key Tangible

Deliverables for the Institute• Demonstrate potential of FHE

technology

ManufacturingCapabilities

• Prioritized by TPD Needs• Result in new/matured

processes, manufacturing and design tools, etc.

• Develop FHE manufacturing infrastructure

Human Monitoring Asset MonitoringIntegrated Array Antennas

Soft Robotics

Demonstrator XKey features:#1#2#Y

Demonstrator 1Key features:#1#2#X

Device/Platform Requirements FHE Manufacturing

Capabilities

Page 17: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

• Device Integration and Packaging– Gov’t Co-Lead: Bruce Hughes (AMRDEC)– Industry Co-Lead: Val Marinov (Uniqarta)– Industry Co-Lead: Steve Gonya (Lockheed Martin)– University Co-Lead: Mark Poliks (Binghamton University)

• Materials– Gov’t Co-Lead: Army– Industry Co-Lead: Jim Lamb (Brewer Science)– Industry Co-Lead: John Williams (Boeing)– University Co-Lead: Joey Mead (UMass Lowell)

• Printed Flexible Components & Microfluidics– Gov’t Co-Lead: Dan Berrigan (AFRL)– Industry Co-Lead: Chris Stoessel (Eastman Chemical)– University Co-Lead: Margaret Joyce (Western Michigan Univ.)

• Modeling & Design– Gov’t Co-Lead: Phil Buskohl (AFRL)– Industry Co-Lead: Jim Huang (Hewlett Packard Enterprise)– University Co-Lead: Suresh Sitaraman (Georgia Tech)

• Standards, Test & Reliability– Gov’t Co-Lead: Emily Fehrman-Cory (AFRL)– Industry Co-Lead: Chris Jorgensen (IPC)– Interim University Co-Lead: Mark Poliks (Binghamton)

Technical Working Group Co-Leads

• Human Monitoring Systems― Gov’t Co-Lead: Christian Whitchurch (DTRA)― Industry Co-Lead: Azar Alizadeh (GE GRC)― University Co-Lead: Jeff Morse (UMass Amherst)

• Asset Monitoring Systems― Gov’t Co-Lead: Open― Industry Co-Lead: Robert Smith (Boeing)― University Co-Lead: Pradeep Lall (Auburn University)

• Integrated Array Antenna Systems― Gov’t Co-Lead: Steven Weiss (ARL)― Industry Co-Lead: Joe Kunze (Si2 Technologies)― University Co-Lead: Alkim Akyurtlu (UMass Lowell)

• Soft Robotics― Gov’t Co-Lead: Open― Industry Co-Lead: Todd Danko (GE GRC)― University Co-Lead: Chuck Zhang (Georgia Tech)

Manufacturing Thrust Areas Technology Platform Demonstrators

Page 18: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Draft Device Integration &

Packaging Roadmap

2016 (State of the Art) 2018 2020 2022Attributes Attributes Attributes Attributes

Encapsualtion

Circuitization

Non-Printed Cmpnt's

Device Assembly

Selection or development of encapsulant/underfill matl's, processes, and equipment to meet application requirements

Matl's - silicones, epoxies, Teflon, paralyene. Equip - R2R, single-die/batch. Pre-treat - ozone, plasma, chemical. Test - mechanical, environ.

Step-by-step/sheet-to-sheet. Materials set established. Process still single-unit.

Automated high-speed, high-volume process equipment

Development of materials, processes, and equipment to enable non-printed components for FHE systems

Transferring, aligning, and attaching an independently manufactured device, element, or component to a flexible substrate

Integrated passives on Si. Grind/post-grind bonding 45-50 um. ASI process. Rigid carrier for ultrathin wafer. Blade dicing. 50 um pick & place.

Photolith <= 16 um pitch Cu on flex (PI, PET, PEN, LCP) with 50 um vias. Cutouts embedded in PDMS for stretch. Screen printing at 50 um resolution - Ag and Cu.

High through-put of 10-20 um bare dies with pick & place tools. Wafer thin to 15 um. Handling with vacuum collets. Thin wafers from 5 companies.

High conducitivy flex inks, multi-axis deposition. R2R fab by semi-additive process. Stretchable conductor processes. Additive processes for optical traces.

High-volume, R2R, low-cost processes. Tailored localization of encapsulants for high-volume/throughput & low-cost processes. Sustainable/recyclable.

Building up signal paths on or within a substrate to provide interconnectivity between functional components

Kapton, PET, PEN with Cu circuitry, plated through vias, solder mount passives, 25 um interconnects, wirebonding

Printed inks with multi-axis 50 um deposition. R2R two-layer capability

Fully additive, multi-layer deposition. 1 um lines and spaces, 1 um vias. Embedded active thinned die in flex substrates, optical interconnects & transmission lines.

Dvlpm't of integrated passives for FHE. 10 um thinned dies. Non-contact laser & electrostatic collets. Thin wafers from 50 companies.

High pitch/pattern density, multi-material software control. Direct-write integrated on R2R. Mechanically robust packaging. Processes for optical assembly, alignment, interconnect.

Dvlpm't of SoC components, eliminating discrete components. 5 um thinned dies. Thin wafers from 500 companies.

Full additive fab of signal pads and components. Fully R2R processes. High performance stretchable & reliable circuitry. Flex circuits with optical interconnects.

Example GE Workshop Outcome:

Page 19: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Draft Device Integration &

Packaging Projects Plan

15 um wafer thinning 10 um wafer thinnig 5 um wafer thinning

Sidewall damage < 3 um Sidwall damage < 2 um Sidewall damage < 1 um

Laser & ESC 250x250, 10 um Laser & ESC 50x50, 5 um

Multi-axis deposition Multi-material control Full additive fabrication

R2R semi-additive Integrate direct write/R2R Fully additive R2R

Stretchable conductors Robust packaging Stretchable circuits

Additive optical traces Flexible optical interconnectAssembly and alignment of optical components

Interconnects for harsh environments Fine pitch, high I/O connections - self-assembly

Addive, multi-layer circuit board for multi applications

Fab & assemble compliant interconnects

Ultra-thin die-handling pick & place tool

Materials ID & Specs for Integrated FHE Solutions High Volume Supply Chain

Manufacturing Projects 2016 2018 2020 2022

ID high-volume processes for surface treatment and materials dispensing

Integration at pilot scale, validation with field test

Demo high volume R2R flex circuit fab Embedded chips - RDL elimination

Low temp interconnect matl's and processes Intreconnects for high frequency devices & components

Encapsulation

Device Assembly

Non-Printed Components

Circuitization

Example GE Workshop Outcome:

Page 20: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

2016 (State of the Art)Attributes Mfg Gaps Mfg Gaps Mfg Gaps

Medical(invasive)

Abbott Freestyle Libre

low cost microfluidics, reagent storage, calibration

robust modular structures, reagents, and calibration

low cost, high volume, calibration, sensitivity

Physiological (non-invasive)

Garmin VivofitFitbit SurgePolar A360Microsoft Band

algorithms, calibration, sensitivity

algorithms, calibration, sensitivity, molular senor packages for individual needs

low cost, high volume, calibration, sensitivity

Occupational Performance

Garmin VivofitFitbit SurgePolar A360Microsoft BandGoogle Glass

high data rates, rapid analyics, integration and reporting to individual quickly to allow intervention

defined minimum data accuracy and reliability, reportable confidence in measures

persistant low-power data transfer and analytics, miniturization and high volume production, low cost

Wellness& Analytics

Health MapBiosurvaillance EcosystemGoogle HealthkitApple Health

low overhead comms and algorithms, low cost integration and production

defined minimum data accuracy and reliability, reportable confidence in measures

persistant low-power data transfer and analytics, miniturization and high volume production, low cost

multi-source data synergy

person/population analytics, ubiquitious across population

low power, descrimation of background from individual

high resolution, short term data collection to support specific tasks

networking, comm standards, HIPPA,

additonal sensing modalities, custimizable to individual physiology

integration of external data sources, incorporate operational enviorment metrics

integration with existing clothing, disposable, modular

persistance multi-marker monitoring for limited disease states

Attributes Attributes

integration with existing clothing, disposable, modular, wearable, forgettable

2022

expandable multi-marker monitoring for broader metrics and increased Dx

integration with existing clothing, disposable, modular, wearable,

Attributes2018 2020

Draft Human Monitoring

Systems Roadmap

Example GE Workshop Outcome:

Page 21: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

NextFlex HQ Layout Draft

Assembly AreaClass 10,000

Test

and

M

easu

rem

ent

Lab

–C

lass

10

,000

Seminar, Training and Workforce Development

MechanicalLab

WearablesLab

ProductDisplay

DesignLab

Materials Registry Library

Goals for NextFlex HQ

• FHE “Collaboratory”: The

Collaboration Center for the

Industry

• Workforce Training Showpiece

• Key Technology Back-End Fab

• Laser Solder

• Thin Silicon SMT Handling

• High Resolution Printing

• Novel Material Integration

Cubicles

PartnerArea

Par

tner

Are

a

Par

tner

Are

a

Par

tner

Are

a

ConfRoom

BoardRoom

ShipReceive

Break Room

Lunch Room

ScreenExp

Printing and Additive Processing Area

Class 10,000

Lobb

y

Page 22: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

NextFlex HQ Focus Areas• Classroom for Workforce Development and Training Seminars

• Additive Circuitry Lab [CL-10k]• Ability to print, using aerosol, screen, extrusion; thermal, photonic and catalytic curing

• Assembly Lab [CL-10k]• SMT, reflow solder, selective solder, ACF bonding, encapsulation, adhesive, ultrasonic bonders

• Wearables Lab• Textile processing equipment, cutting, screening, sewing, thermal transfer

• Mechanical Lab• 3D printing, light machining, mechanical assembly

• Test and Measurement Lab [CL-10k]• Metrology – SEM, AFM, optical, confocal laser, FTIR, oscilloscope, image Capture• Test – Strain, dynamic strain, temp/humidity, UV Radiation

We want the ability for someone to come into NextFlex HQ and produce a pilot run prototype faster than it would be possible anywhere else in the world.

Page 23: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Project Calls

Engagements

Soft Robotics Wideband Array Antennas

Structural HealthMonitoring

Wearable Medical / Human Performance

Systems

Data Driven Supply Analytics

Data Driven Demand Analytics

FHE Materials Scale Up

Thinned Device

Processing

Device / Sensor Integrated Printing /

PackagingSystem

Design ToolsReliability Testing &

Monitoring

Technology Platform Demonstrations

5 Focus Areas

Outreach

New Curriculum Content

New Job / Skill Creation Workforce

Retraining

Internships

Foundational Tenets Lean, iterative approach rooted on

the technology focus areas and TPDs

Generate growth from data driven analysis and user/consumer input

Requirements / needs based Measurable on effectiveness

rather than performance

Outcomes Better synchronization of

industry demand, educational alignment, and talent pool outreach

Ability to Capture, Share, and Proliferate Knowledge across FHEMII members

Precision investment of time, people, and money resources

Growing a Lean and Flexible WFD Program

Page 24: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Manufacturable Flexible Hybrid Oral Biochemistry Sensing System

Objective / Deliverables

CostTotal: $1,159,983 NextFlex: $580K Share: 50%Duration: 16 Months

TeamLead: PARCKey Partners: UCSD

Small, flexible form factor (2 cm by 4 cm) appropriate for a mouth guard (previous demonstrations are on rigid PCBs or too large to mount on a mouth guard) Encapsulation of the electronics to protect them from saliva for 24 hours (previous demonstrations were not encapsulated) Wireless charging of a secondary battery (previous demonstrations used a primary battery) Biostability in saliva for 8 hours (not previously demonstrated) Manufacturing-appropriate processing steps and semi-automated fabrication (fabrication of previous demonstrators combined manual and automated processes) Removable, disposable printed electrode strip (not previously demonstrated) Bluetooth communication via over at least 3 meters, compatible with a smart watch or phone Incorporation of at least one bare-die component

Creation of a mouth guard device with integrated saliva analyte sensors and circuitry for computation and wireless connectivity embedded on board. Includes provisions for replaceable sensor element to reduce the risk of sensor fouling.

Page 25: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

A Flexible Smart Wound Dressing with Integrated On-Demand 02-Release and Sensing Capability

Objective / Deliverables

CostTotal: $1,200,000 NextFlex: $600 Share: 50%Duration: 12 months

TeamLead: PurdueKey Partners: Western Michigan, Integra Life Sciences

Key Specifications:Dressing area 25–1500 cm2 ref22Dressing lifetime 24–72 hours ref23,24Dynamic sensor range 5–100 mmHg ref25Sensor resolution 1 mmHg ref7Normal skin O2 50–100 mmHg ref8,10Required O2 generation rate 3 mL/h (at STP) ref26

Integrated oxygen delivery and sensing system on a single low-cost, manufacturable, flexible platform, with closed loop sensing and delivery control system

Page 26: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

MANUFACTURING OF DISTRIBUTED, FLEXIBLE AND STRETCHABLE ASSET MONITORING SENSOR NETWORKS

Objective / Deliverables:• Assess, down-select and advance state-of-the-art FHE approaches for asset monitoring with

broad FHE applicability.• Deliver: Prototype design, design rules, manufacturing process steps with high yield, process

integration and fabrication of a functional, stretchable sensor network & electronics deployed on a composite wing.

Cost:Total: $2.60M (NextFlex: $1.30M) Share: 50%Duration: 18 months

Team:Lead: UTRC (Sameh Dardona, PI)Key Partners: Stanford, Acellent, (with Eastman Chem, Uniqarta support)

Page 27: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Sensor Integration for Flexible and Wearable Wound Monitoring Bandage

Objective / Deliverables

CostTotal: $1.4M NextFlex: $700K Share: 50%Duration: 18 Months

TeamLead: Berkeley, BWRCKey Partners: UCSD, Jabil

System design based on COTS Ics Provide design and bill of materials for an integrated system based on commercial-off-the-shelf (COTS) ICs.Integration processes for COTS Demonstrate scalable methods for chip bond and interconnects. (MRL4 to MRL5)Sensor and microelectrode optimization Provide protocols for sensor and stimulation micro-electrode array fabrication that is compatible with an integrated system. (From TRL4 to TRL5)Integration processes for COTS Demonstrate scalable methods for multi-layer interconnects. (MRL5 to MRL6)Next-generation low-power Ics Based on COTS results, design better IC chips and communications protocol for low-power wearable systems. (TRL4 to TRL5)System test on in-vivo wound models Demonstrate in-vivo measurements on mouse model using integrated sensors and micro-electrode arrays. (TRL5 to TRL6

Wound monitoring and electrostimulation wound therapy device with wireless connectivity which monitors by impedance spectroscopy and reflectance oximetry. The device will integrate a chip scale integrated radio for connectivity to a Body Area Network.

Page 28: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

• DoD and commercial need

• Accelerates adoption of devices

• Helps to qualify processes and feed data to design and modelling

tools

• Ensures that we work on the gaps

• Controls and unruly landscape of variables

Standards Test and Reliability

Page 29: AMERICA’S FLEXIBLE HYBRID ELECTRONICS · PDF fileAmerica’s Flexible Hybrid Electronics Manufacturing Institute AMERICA’S. FLEXIBLE HYBRID ELECTRONICS MANUFACTURING INSTITUTE

Jason Marsh

Director of Technology

[email protected]

Thank You