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America’s Flexible Hybrid Electronics Manufacturing Institute
AMERICA’SFLEXIBLE HYBRID ELECTRONICS
MANUFACTURING INSTITUTEPRINT ELECTRONICS COMMITTEE
JASON MARSHDIRECTOR OF TECHNOLOGY
NextFlex
Network Status and Growth Plans
FHE MIIFlex. Hybrid Elec.
San Jose, CA
ESTABLISHED INSTITUTES
America MakesAdditive Mfg.
Youngstown, OH
Power America
ElectronicsRaleigh, NC
LIFTLight/Modern Metals
Detroit, MI
IACMIAdv. Composites
Knoxville, TN
AIM PhotonicsAlbany & Rochester, NY
DMDIIDigital Mfg.Chicago, IL
Smart Mfg.for Energy Efficiency
Proj. Award TBD
INSTITUTES IN COMPETITION/DEVELOPMENT
Revolutionary Fibers & Textiles
Proj. Award:December 2015
TopicTBA
NNMI NETWORK
AUG US T 2 8 , 2 0 1 5Announcement Day
BY THE NUMBERS
4
Established 28 August 2015
Lead FlexTech Alliance
Hub Location San Jose, California
Proposal Contributors 145+ in 27 states
Federal Funding $75 million over 5 years
Committed Matching $96 million
Government Agencies Engaged 17 DOD & OGAs
HUB & NODE STRUCTURE
Government NodeGov’t technical participationDOD User requirements
Partner Organizations: Mar ‘16Corporate Academic/Non-Profit Federal Government
Tier 2
Tier 1
Tier 3
Tier 2
Observer
Tier 3
Associations
EconomicDevelopment
State/Local Government
Tier 1
Prospective Participants in 2016
NEXTFLEX VISION
• Enable the development of a domestic FHE manufacturing ecosystem
• Create and lead a Pilot Line/Hub Facility and a network of Nodes
• Craft capability for designing, testing, and manufacturing new products for human
performance monitoring, healthcare, distributed sensors, and consumer
electronics
• Empower, companies, universities, and research organizations to advance FHE
technology from Manufacturing Readiness Level 4 to 7
• Conduct integrated education, training, and workforce development initiatives.
NextFlex Charter
DUAL USE
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20
40
60
80
100
120
4 106 6 106 8 106 1 107 1.2 107 1.4 107 1.6 107 1.8 107 2 107
DI Water0.1 uM Orexin-A1 uM Orexin-A10 uM Orexin-A100 uM Orexin-A500 uM Orexin-A1000 uM Orexin-A
Impe
danc
e (o
hm)
Frequency (Hz)
MRL/TRL Assessment Criteria
Definitional Material Solution Analysis
Technology Development & Commercial Merit
Engineering & Manufacturing Development
MRL 1Mfg
feasibility assessed
MRL 2Mfg
conceptsdefined
MRL 3Proof of
mfgconcept
MRL 4Breadboard
& manufacturing processes in a laboratory environment
MRL 5Breadboard
& component
manufacturingin a relevant environment
MRL 6Prototype, system &
subsystem in
production relevant environ-
ment
MRL 7Prototype, system &
subsystem in
operations and
production environ-
ment
MRL 8Pilot line
capability demon-strated;
Ready to begin low-rate initial
production
MRL 9Low-rate
production demon-strated;
capability in place to begin full-
rate production
TECHNOLOGY DEMONSTRATORS
11
Integrated Array Antenna Systems
Asset Monitoring Systems
Human Monitoring Systems
Soft Robotics
1 3 42
MANUFACTURING THRUSTS
12
01DEVICE INTEGRATION AND PACKAGINGDevelopment of new tools for testing, slicing, and thinning of silicon wafers as well as for electronic device and sensor integration on flexible, stretchable, and/or foldable substrates. Leveraging advanced precision printing and high-speed automated pick & place for integration of device components, interconnects, and data lines.
02MATERIALSManufacturing scale-up of conductive and dielectric inks and pastes, adhesives, encapsulantmaterials, and flexible substrates.
03 PRINTED FLEXIBLE COMPONENTS AND MICROFLUIDICS Developing and maturing contact and non-contact printing processes that support hybrid device concepts, including sensors and discrete device components. Printing & integration of microfluidic channels and fluidic control elements.
04MODELING AND DESIGNLeveraging existing software & hardware design capabilities, simulation techniques, and manufacturing process control tools while also integrating novel manufacturing design rules for FHE.
05STANDARDS, TEST & RELIABILITYDeveloping tools and test protocols to evaluate device-level and system-level FHE performance as well as reliability in both commercial and military environments. Partnering with standards organizations and professional societies to develop specifications & standards.
FHE
67 workshop participants• 37 industry personnel from 15
companies• 8 faculty from 5 universities• 18 government personnel• 4 NextFlex personnel
TWG Roadmap Workshop at GE
TWG TimelineTWG
TeleconferencesDraft Roadmaps
Due
Roadmap Feedback Provided
Final Roadmaps
Due
TWG Roadmap Workshop at GE
Monterey TWG
Meetings
Calender
Deadline for TWG Members
to Join NextFlex
Roadmaps serve as basis for Project Call 2.0.
Suggested PC 2.0 Topics
Submitted to TC
PC 2.0 Released
NextFlex Roadmap Framework
Device Integration & Packaging
Printed Flexible Components & Microfluidics
Materials
Modeling & Design
Standards, Testing & Reliability
Time
Device/PlatformCapabilities
• Strong End-User Participation• Result in Key Tangible
Deliverables for the Institute• Demonstrate potential of FHE
technology
ManufacturingCapabilities
• Prioritized by TPD Needs• Result in new/matured
processes, manufacturing and design tools, etc.
• Develop FHE manufacturing infrastructure
Human Monitoring Asset MonitoringIntegrated Array Antennas
Soft Robotics
Demonstrator XKey features:#1#2#Y
Demonstrator 1Key features:#1#2#X
Device/Platform Requirements FHE Manufacturing
Capabilities
• Device Integration and Packaging– Gov’t Co-Lead: Bruce Hughes (AMRDEC)– Industry Co-Lead: Val Marinov (Uniqarta)– Industry Co-Lead: Steve Gonya (Lockheed Martin)– University Co-Lead: Mark Poliks (Binghamton University)
• Materials– Gov’t Co-Lead: Army– Industry Co-Lead: Jim Lamb (Brewer Science)– Industry Co-Lead: John Williams (Boeing)– University Co-Lead: Joey Mead (UMass Lowell)
• Printed Flexible Components & Microfluidics– Gov’t Co-Lead: Dan Berrigan (AFRL)– Industry Co-Lead: Chris Stoessel (Eastman Chemical)– University Co-Lead: Margaret Joyce (Western Michigan Univ.)
• Modeling & Design– Gov’t Co-Lead: Phil Buskohl (AFRL)– Industry Co-Lead: Jim Huang (Hewlett Packard Enterprise)– University Co-Lead: Suresh Sitaraman (Georgia Tech)
• Standards, Test & Reliability– Gov’t Co-Lead: Emily Fehrman-Cory (AFRL)– Industry Co-Lead: Chris Jorgensen (IPC)– Interim University Co-Lead: Mark Poliks (Binghamton)
Technical Working Group Co-Leads
• Human Monitoring Systems― Gov’t Co-Lead: Christian Whitchurch (DTRA)― Industry Co-Lead: Azar Alizadeh (GE GRC)― University Co-Lead: Jeff Morse (UMass Amherst)
• Asset Monitoring Systems― Gov’t Co-Lead: Open― Industry Co-Lead: Robert Smith (Boeing)― University Co-Lead: Pradeep Lall (Auburn University)
• Integrated Array Antenna Systems― Gov’t Co-Lead: Steven Weiss (ARL)― Industry Co-Lead: Joe Kunze (Si2 Technologies)― University Co-Lead: Alkim Akyurtlu (UMass Lowell)
• Soft Robotics― Gov’t Co-Lead: Open― Industry Co-Lead: Todd Danko (GE GRC)― University Co-Lead: Chuck Zhang (Georgia Tech)
Manufacturing Thrust Areas Technology Platform Demonstrators
Draft Device Integration &
Packaging Roadmap
2016 (State of the Art) 2018 2020 2022Attributes Attributes Attributes Attributes
Encapsualtion
Circuitization
Non-Printed Cmpnt's
Device Assembly
Selection or development of encapsulant/underfill matl's, processes, and equipment to meet application requirements
Matl's - silicones, epoxies, Teflon, paralyene. Equip - R2R, single-die/batch. Pre-treat - ozone, plasma, chemical. Test - mechanical, environ.
Step-by-step/sheet-to-sheet. Materials set established. Process still single-unit.
Automated high-speed, high-volume process equipment
Development of materials, processes, and equipment to enable non-printed components for FHE systems
Transferring, aligning, and attaching an independently manufactured device, element, or component to a flexible substrate
Integrated passives on Si. Grind/post-grind bonding 45-50 um. ASI process. Rigid carrier for ultrathin wafer. Blade dicing. 50 um pick & place.
Photolith <= 16 um pitch Cu on flex (PI, PET, PEN, LCP) with 50 um vias. Cutouts embedded in PDMS for stretch. Screen printing at 50 um resolution - Ag and Cu.
High through-put of 10-20 um bare dies with pick & place tools. Wafer thin to 15 um. Handling with vacuum collets. Thin wafers from 5 companies.
High conducitivy flex inks, multi-axis deposition. R2R fab by semi-additive process. Stretchable conductor processes. Additive processes for optical traces.
High-volume, R2R, low-cost processes. Tailored localization of encapsulants for high-volume/throughput & low-cost processes. Sustainable/recyclable.
Building up signal paths on or within a substrate to provide interconnectivity between functional components
Kapton, PET, PEN with Cu circuitry, plated through vias, solder mount passives, 25 um interconnects, wirebonding
Printed inks with multi-axis 50 um deposition. R2R two-layer capability
Fully additive, multi-layer deposition. 1 um lines and spaces, 1 um vias. Embedded active thinned die in flex substrates, optical interconnects & transmission lines.
Dvlpm't of integrated passives for FHE. 10 um thinned dies. Non-contact laser & electrostatic collets. Thin wafers from 50 companies.
High pitch/pattern density, multi-material software control. Direct-write integrated on R2R. Mechanically robust packaging. Processes for optical assembly, alignment, interconnect.
Dvlpm't of SoC components, eliminating discrete components. 5 um thinned dies. Thin wafers from 500 companies.
Full additive fab of signal pads and components. Fully R2R processes. High performance stretchable & reliable circuitry. Flex circuits with optical interconnects.
Example GE Workshop Outcome:
Draft Device Integration &
Packaging Projects Plan
15 um wafer thinning 10 um wafer thinnig 5 um wafer thinning
Sidewall damage < 3 um Sidwall damage < 2 um Sidewall damage < 1 um
Laser & ESC 250x250, 10 um Laser & ESC 50x50, 5 um
Multi-axis deposition Multi-material control Full additive fabrication
R2R semi-additive Integrate direct write/R2R Fully additive R2R
Stretchable conductors Robust packaging Stretchable circuits
Additive optical traces Flexible optical interconnectAssembly and alignment of optical components
Interconnects for harsh environments Fine pitch, high I/O connections - self-assembly
Addive, multi-layer circuit board for multi applications
Fab & assemble compliant interconnects
Ultra-thin die-handling pick & place tool
Materials ID & Specs for Integrated FHE Solutions High Volume Supply Chain
Manufacturing Projects 2016 2018 2020 2022
ID high-volume processes for surface treatment and materials dispensing
Integration at pilot scale, validation with field test
Demo high volume R2R flex circuit fab Embedded chips - RDL elimination
Low temp interconnect matl's and processes Intreconnects for high frequency devices & components
Encapsulation
Device Assembly
Non-Printed Components
Circuitization
Example GE Workshop Outcome:
2016 (State of the Art)Attributes Mfg Gaps Mfg Gaps Mfg Gaps
Medical(invasive)
Abbott Freestyle Libre
low cost microfluidics, reagent storage, calibration
robust modular structures, reagents, and calibration
low cost, high volume, calibration, sensitivity
Physiological (non-invasive)
Garmin VivofitFitbit SurgePolar A360Microsoft Band
algorithms, calibration, sensitivity
algorithms, calibration, sensitivity, molular senor packages for individual needs
low cost, high volume, calibration, sensitivity
Occupational Performance
Garmin VivofitFitbit SurgePolar A360Microsoft BandGoogle Glass
high data rates, rapid analyics, integration and reporting to individual quickly to allow intervention
defined minimum data accuracy and reliability, reportable confidence in measures
persistant low-power data transfer and analytics, miniturization and high volume production, low cost
Wellness& Analytics
Health MapBiosurvaillance EcosystemGoogle HealthkitApple Health
low overhead comms and algorithms, low cost integration and production
defined minimum data accuracy and reliability, reportable confidence in measures
persistant low-power data transfer and analytics, miniturization and high volume production, low cost
multi-source data synergy
person/population analytics, ubiquitious across population
low power, descrimation of background from individual
high resolution, short term data collection to support specific tasks
networking, comm standards, HIPPA,
additonal sensing modalities, custimizable to individual physiology
integration of external data sources, incorporate operational enviorment metrics
integration with existing clothing, disposable, modular
persistance multi-marker monitoring for limited disease states
Attributes Attributes
integration with existing clothing, disposable, modular, wearable, forgettable
2022
expandable multi-marker monitoring for broader metrics and increased Dx
integration with existing clothing, disposable, modular, wearable,
Attributes2018 2020
Draft Human Monitoring
Systems Roadmap
Example GE Workshop Outcome:
NextFlex HQ Layout Draft
Assembly AreaClass 10,000
Test
and
M
easu
rem
ent
Lab
–C
lass
10
,000
Seminar, Training and Workforce Development
MechanicalLab
WearablesLab
ProductDisplay
DesignLab
Materials Registry Library
Goals for NextFlex HQ
• FHE “Collaboratory”: The
Collaboration Center for the
Industry
• Workforce Training Showpiece
• Key Technology Back-End Fab
• Laser Solder
• Thin Silicon SMT Handling
• High Resolution Printing
• Novel Material Integration
Cubicles
PartnerArea
Par
tner
Are
a
Par
tner
Are
a
Par
tner
Are
a
ConfRoom
BoardRoom
ShipReceive
Break Room
Lunch Room
ScreenExp
Printing and Additive Processing Area
Class 10,000
Lobb
y
NextFlex HQ Focus Areas• Classroom for Workforce Development and Training Seminars
• Additive Circuitry Lab [CL-10k]• Ability to print, using aerosol, screen, extrusion; thermal, photonic and catalytic curing
• Assembly Lab [CL-10k]• SMT, reflow solder, selective solder, ACF bonding, encapsulation, adhesive, ultrasonic bonders
• Wearables Lab• Textile processing equipment, cutting, screening, sewing, thermal transfer
• Mechanical Lab• 3D printing, light machining, mechanical assembly
• Test and Measurement Lab [CL-10k]• Metrology – SEM, AFM, optical, confocal laser, FTIR, oscilloscope, image Capture• Test – Strain, dynamic strain, temp/humidity, UV Radiation
We want the ability for someone to come into NextFlex HQ and produce a pilot run prototype faster than it would be possible anywhere else in the world.
Project Calls
Engagements
Soft Robotics Wideband Array Antennas
Structural HealthMonitoring
Wearable Medical / Human Performance
Systems
Data Driven Supply Analytics
Data Driven Demand Analytics
FHE Materials Scale Up
Thinned Device
Processing
Device / Sensor Integrated Printing /
PackagingSystem
Design ToolsReliability Testing &
Monitoring
Technology Platform Demonstrations
5 Focus Areas
Outreach
New Curriculum Content
New Job / Skill Creation Workforce
Retraining
Internships
Foundational Tenets Lean, iterative approach rooted on
the technology focus areas and TPDs
Generate growth from data driven analysis and user/consumer input
Requirements / needs based Measurable on effectiveness
rather than performance
Outcomes Better synchronization of
industry demand, educational alignment, and talent pool outreach
Ability to Capture, Share, and Proliferate Knowledge across FHEMII members
Precision investment of time, people, and money resources
Growing a Lean and Flexible WFD Program
Manufacturable Flexible Hybrid Oral Biochemistry Sensing System
Objective / Deliverables
CostTotal: $1,159,983 NextFlex: $580K Share: 50%Duration: 16 Months
TeamLead: PARCKey Partners: UCSD
Small, flexible form factor (2 cm by 4 cm) appropriate for a mouth guard (previous demonstrations are on rigid PCBs or too large to mount on a mouth guard) Encapsulation of the electronics to protect them from saliva for 24 hours (previous demonstrations were not encapsulated) Wireless charging of a secondary battery (previous demonstrations used a primary battery) Biostability in saliva for 8 hours (not previously demonstrated) Manufacturing-appropriate processing steps and semi-automated fabrication (fabrication of previous demonstrators combined manual and automated processes) Removable, disposable printed electrode strip (not previously demonstrated) Bluetooth communication via over at least 3 meters, compatible with a smart watch or phone Incorporation of at least one bare-die component
Creation of a mouth guard device with integrated saliva analyte sensors and circuitry for computation and wireless connectivity embedded on board. Includes provisions for replaceable sensor element to reduce the risk of sensor fouling.
A Flexible Smart Wound Dressing with Integrated On-Demand 02-Release and Sensing Capability
Objective / Deliverables
CostTotal: $1,200,000 NextFlex: $600 Share: 50%Duration: 12 months
TeamLead: PurdueKey Partners: Western Michigan, Integra Life Sciences
Key Specifications:Dressing area 25–1500 cm2 ref22Dressing lifetime 24–72 hours ref23,24Dynamic sensor range 5–100 mmHg ref25Sensor resolution 1 mmHg ref7Normal skin O2 50–100 mmHg ref8,10Required O2 generation rate 3 mL/h (at STP) ref26
Integrated oxygen delivery and sensing system on a single low-cost, manufacturable, flexible platform, with closed loop sensing and delivery control system
MANUFACTURING OF DISTRIBUTED, FLEXIBLE AND STRETCHABLE ASSET MONITORING SENSOR NETWORKS
Objective / Deliverables:• Assess, down-select and advance state-of-the-art FHE approaches for asset monitoring with
broad FHE applicability.• Deliver: Prototype design, design rules, manufacturing process steps with high yield, process
integration and fabrication of a functional, stretchable sensor network & electronics deployed on a composite wing.
Cost:Total: $2.60M (NextFlex: $1.30M) Share: 50%Duration: 18 months
Team:Lead: UTRC (Sameh Dardona, PI)Key Partners: Stanford, Acellent, (with Eastman Chem, Uniqarta support)
Sensor Integration for Flexible and Wearable Wound Monitoring Bandage
Objective / Deliverables
CostTotal: $1.4M NextFlex: $700K Share: 50%Duration: 18 Months
TeamLead: Berkeley, BWRCKey Partners: UCSD, Jabil
System design based on COTS Ics Provide design and bill of materials for an integrated system based on commercial-off-the-shelf (COTS) ICs.Integration processes for COTS Demonstrate scalable methods for chip bond and interconnects. (MRL4 to MRL5)Sensor and microelectrode optimization Provide protocols for sensor and stimulation micro-electrode array fabrication that is compatible with an integrated system. (From TRL4 to TRL5)Integration processes for COTS Demonstrate scalable methods for multi-layer interconnects. (MRL5 to MRL6)Next-generation low-power Ics Based on COTS results, design better IC chips and communications protocol for low-power wearable systems. (TRL4 to TRL5)System test on in-vivo wound models Demonstrate in-vivo measurements on mouse model using integrated sensors and micro-electrode arrays. (TRL5 to TRL6
Wound monitoring and electrostimulation wound therapy device with wireless connectivity which monitors by impedance spectroscopy and reflectance oximetry. The device will integrate a chip scale integrated radio for connectivity to a Body Area Network.
• DoD and commercial need
• Accelerates adoption of devices
• Helps to qualify processes and feed data to design and modelling
tools
• Ensures that we work on the gaps
• Controls and unruly landscape of variables
Standards Test and Reliability