IMI Labs Semiconductor Applications

June 20, 2016

Materials Are At the Core of Innovation in the 21st Century

2

Weight

Space

Flexibility

Heat Management

Lightweight

Energy Efficient

Lightweight

Energy Efficient

Temperature

Energy Efficient

Smart Buildings

Performance

Power

Cost

Scaling

Risk management

of new materials

The Materials Innovation Problem

3

Many options, one

experiment at a time

Limited R&D infrastructure

for experimentation

Materials

innovation

is complex, costly

and slow

Long learning

cycle times

Empirical approach

needed

Manufacturing environment

is adverse to change

Trusted Partner For Materials Innovation

4

IMI

World-class

interdisciplinary team

Serving large markets

where new materials are key Unique high-throughput

experimentation platform

Top memory semiconductor

manufacturers are customers

State-of-the art development

facility and characterization

Fast

Facts Nasdaq:

IMI

CEO:

Bruce McWilliams

2015 Revenue:

$45.3M

Product Lines

IMI Discoveries

• Licensed Products

IMI Labs

• Materials Innovation as a Service

• DRAM - Non Volatile Memory - Logic

5

Materials Innovation As A Service

6

INV

ES

TM

EN

T

Government

& Universities

Private

Sector Product

Manufacturers

GAP

Reproducibility

Data quality

Experimentation

Transfer to production

Credit: Jack Hu/NIST

Closing The Gap in the Ecosystem

7

CUSTOMERS

Academia/Consortia

Government

Equipment and Materials

End-products

Growing Complexity & Cost of Semiconductor

8

Source: Intel

0

500

1,000

1,500

2,000

$ M

illio

ns

0.13 90nm 65nm 45nm 32nm 22nm 14nm

Process Technology Development Costs By Node

Source: Common Platform & All Partners Analysis

• Advanced materials are key to the

Semiconductor roadmap and leadership

• Since 2000s, 50 materials, often in complex

compound or stacks were developed

• Early identification of suitable materials is a

significant advantage

“New material selection and evaluation was

one of the hardest parts of 14 nanometer logic

development.”

Dr. Sanjay Natarajan, Former Intel VP and

14nm Program Manager

Next Wave of Semiconductors

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DRAM

• 1Y/1Z nm

• MIM Capacitors stack

• High-K dielectrics

• Barrier Electrodes

• 4F2 cell

Memory

NAND

• 3D

• Charge Storage layers

• Band engineered

stack

• Electrodes

New materials like Chalcogenides

Not a single materials but combined stacks

New elements interfacing with multiple layers

Multiple stringent specs to meet – Low leakage, performance, nanoscale

Modeling is limited and empirical data are required

Limited R&D infrastructure

Enormous risks in bringing new materials in expensive production Fabs

7nm and beyond

• High mobility Channel

• Embedded NV memory

• Low resistance contacts

• Beyond CMOS: Spin/

Tunnel FET

Logic

Facing Significant Materials Challenges

Storage Class Memory

• Architecture

• Selector ION/IOFF

• Phase change material

• R Memory element

• 10nm conductors

Courtesy of Dr. Scott E. Thompson

Semiconductor Materials Challenges

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Example : High K Dielectric Materials Challenges

Yim et al., NPG Asia Materials (2015) 7, e190;

doi:10.1038/am.2015.57

Example: Universal Memory

L.Perniola et al., IMW2016

Source: IBM JVSTB_2014

“You are going to see an explosion of materials in memory,” said

Gregg Bartlett, senior VP and CTO of GLOBALFOUNDRIES,

SEMI SMC 2013

Source :ASM 2015, IMI

“The industry is facing major challenges ranging from architecture choices to materials selection.

The next wave of semiconductors will require inventing over 40 materials.”

Dr. Scott E. Thompson, IEEE Fellow, U. Florida

2D

Chalcogenides

STT-RAM

IMI LABS

IMI Labs Flexible Offering

11

SCAN SEARCH STUDY SOLVE

Standard Services Custom Services

Quick mapping of

materials composition

Rule in / rule out

Explore multiple

materials for a

given application

More complex,

more data

Customer directed

exploration of materials

IMI delivers to

customer’s

specifications

FAST TURN VALUE ADDED EXPERTISE

Unique Development Platform

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High throughput experimentation accelerates and de-risks materials innovation

Materials

Expertise

Accelerated

Experimentation

Analytics

Excellence

130+ engineers

and scientists

65% advanced degrees

Application knowledge

Understanding of

integration issues

Benefits of High-Throughput Experimentation

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Experiments per Wafer

Experimental Efficiency

Material & Process Options

One

Limited

Few

Conventional

Optimized for Materials Understanding Optimized for Manufacturing

Experiments per Wafer

Experimental Efficiency

Material & Process Options

10 to 100

High

Many

Capabilities In Place For Materials Understanding

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FACILITY

Cleanroom

Controlled Process

Flow

CHARACTERIZATION

Composition

Mechanical

Electrical

Optical

DEPOSITION

PVD*

ALD*

WETS

Integration

MATERIALS

Metal Oxides and Nitrides

Metal Alloys

Chalcogenides

*PVD Physical Vapor Deposition

ALD Atomic Layer Deposition

IMI Labs Semiconductor Uses Cases

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Capacitor cell development and characterization

• Screen and optimize material systems for MIM

Capacitors

• PVD and ALD based evaluation of several different

dielectrics, electrodes, or interlayer materials in a

MIM capacitor film stack

• PVD co-sputtering combined on a cluster platform

with other PVD, ALD and anneal chambers

• Extensive physical and electrical characterization

• Dielectrics, electrode materials and interface layers

NVM cell and selector devices

• Screen and optimize metal-oxide, MIEC, or OTS

(phase-change) material systems for non-

volatile memory

• PVD based evaluation of multi-nary materials (> 5

elements) and metal/metal nitride electrodes.

• PVD co-sputtering with multiple, composite PVD

targets

• Extensive physical and electrical characterization

• Chalcogenide & metal-oxide switching layers and

metal/nitride electrodes

Memory Use Cases

High-Throughput Experimentation - New Materials for Devices

DRAM Non Volatile Memories

Expansion of Capabilities

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Expand

-Materials-

-Process-

-Characterization-

Semiconductor

• Memories

• Logic

Optical coatings

• Displays

• Architectural

Glass

Alloys

Consumer

Industrial

Automotive

Aerospace

Summary

• Materials are at the core of innovation in the 21st century

• Materials innovation is complex, costly and slow

• There is a gap between the data produced by academia and government, and the need to scale new materials to production by product companies

• Experimentation is key to materials understanding. The entire innovation ecosystem needs a materials innovation platform and associated expertise to generate reproducible, high quality data in a flexible way

• The next wave of semiconductors rely on new and complex materials

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• The new IMI Labs service bridges this gap, opening up the IMI high-throughput experimentation platform, materials expertise and analytics to the industry to accelerate and de-risk the exploration, discovery, characterization and selection of advanced materials

• The first offering, IMI Labs - Semiconductor, showcases use cases for DRAM and Non-volatile Memory applications

• IMI Labs continues to expand capabilities in other areas such as Logic, Optical Coatings, Automotive and Aerospace

• IMI’s mission is to be the industry’s trusted partner for advanced materials innovation