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INSTITUT FÜR MIKROELEKTRONIK STUTTGART

English Version

ChipsIdeas on

IDEAS ON CHIPS – Lecture•Research•Development and Production of Microelectronic Systems

Institut für Mikroelektronik StuttgartAllmandring 30 a, 70569 Stuttgart, Germany Tel.: +49 711 21855 - 0 • Fax: +49 711 21855 - [email protected] • www.ims-chips.de

Institut für Mikroelektronik Stuttgart

INSTITUT FÜR MIKROELEKTRONIK STUTTGART www.ims-chips.de292/F/07_16

Micro electronics and nano struc-turing competence

The Institut für Mikroelektronik Stuttgart (IMS CHIPS) concen-trates on research and small series production in semiconductor integration, integrated circuits & systems, MEMS technology, nano structuring and image sensor technology. The research facility being a public foundation under civil law regards itself as partner to small and medium-sized companies and cooperates with leading global semiconductor companies and suppliers.

CORE COMPETENCES

Design of circuits and systems for microchips and micro systems

ASICs and CMOS image sensors

Innovative chip manufacture processing, processing services

MEMS, optical elements, replication masters, stencil masks

Independent certified development and consolidated manufacture

IDEAS ON CHIPS – Lecture•Research•Development and Production of Microelectronic Systems




The institute is partner to small and medium scale with a particular focus on compa-nies in Baden Württemberg and cooperates with internationally renowned semi-conductor corporations and contractors.

Among the institute´s research areas are nanotechnology, micro mechanics, micro systems and image sensors.

The IMS has developed a tiny video endoscope with a 3 millimeter image sensor integrated into the endoscope´s tip.

Furthermore, scientists at the IMS have developed chips for use in medical research during the development of the retina implants whose goal it is to restore partial visual ability to the vision impaired.

Also, the IMS plays in the top international league in terms of the development and manufacture of highly developed photo masks and diffractive optical components. This is achieved in a development and production environment with the latest struc-tural and measurement equipment.

The IMS is partner in international research projects and cooperates closely with the Universität Stuttgart and other universities in Baden-Württemberg.

In 1995 the facilitis was among the first three European companies to be awarded the EN 100 114 and is certified with the latest QC 001002-3 today.


Allmandring 30a70569 Stuttgart

Tel. 0711 21855-0 Fax. 0711 21855-111

[email protected]

Director: Prof. Dr. Joachim Burghartz

Number of employees: 100+

Budget size: 19,1 mio

Cooperation with number of companies, research facilities and universities: above 100

Number of publicly funded joint projects: 20 Stand: 10. 2015




Integrierte Schaltungen & Systeme

Contact: Thomas Deuble • phone +49 711 21855-244 • [email protected]

.

The Integrated Circuits and Systems division is divided into four different fi elds of activity: ASICs, Biomedical Electronics, Industrie 4.0 and Micro systems. These divisions design microelectronic circuits, sensors, implantable electrodes and circuits, components für so-called Cyber-Physical Systems (CPS) and circuits for photonic micromechanical and power elctronic micro system.

A large portion of the application-oriented research and development is conducted with large publicly funded joint projects between us and industrial partners, other research facilities and universities. These projects are either funded by the local state, federal state or the European Union.

The allocation of microelectronic components ordered in small series (<100.000/a) is another crucial fi eld of activity for this division. Especially small and medium-sized companies can access their own microelectronic components this way since industrial semiconductor manufacturers are hardly accessible for SMEs as subcontractors. The division combines all client requests regarding integrated circuits and systems and processes them from the initial request all the way to the quality-assured and certifi es serial delivery.

COMPETENCES

PROJECTS

PRODUCTS

AREAS OF ACTIVITY

◆ InnBW-Implant Chip-in-foil systems for bio-electronic medicine

◆ TENECOR Telemetric multimodale neonatal cortex monitoring

◆ KATMETHAN Catalytic methane synthesis

◆ ParsiFAl4.0 Product-capable autonomous and safe foil systems for

automation solutions in Industrie 4.0

◆ InnBW-CPS

◆ X-Mind Analyses on extremely miniaturized optical speed

sensor

◆ InnBW-SmartLIB Intelligent Li ion batteries in production and use

ASICs◆ digital/mixed-signal/analog◆ FPGA conversion◆ small series manufacture◆ Cadence Design Tools◆ GATE FOREST® Gate Array ◆ XFAB, IHP, UMC, LFoundry

Biomedical electronics◆ evaluating ASICs◆ electrode arrays◆ implants◆ sensors

Industrie 4.0◆ smart sensor systems◆ sensor data processing◆ security/coding

Micro systems◆ ASIC integrated sensors◆ ASICs for MEMS◆ active optical sensors


Integrated circuits & systems

INSTITUT FÜR MIKROELEKTRONIK STUTTGART www.ims-chips.de


296 /F/07_16

Consolidated ASICs - from design to series productionThe ASICs business unit develops, manufactures and tests microelectronic circuits focusing on the Gate Array principle ASICs. During the Gate Array process the pre-processed master wafer is equipped with customer-specific plating levels. Using the IMS 0.5µm/0.8µm CMOS process provides the powerful Gate Array technology applicable for a fully digital and Mixed Signal Application with analog functions.

Basic data of our Mixed Signal Gate Array technology: • analog and digital signal processing • low development costs • short production times • also available in small quantities

IMS ASICs can be purchased in small and medium quantities and long-term without an obli-gation to purchase a minimum amount. Processing and manufacture are certified according international standards (ISO 9001 and QC 001002-3).

IMS GATE FOREST® ASICs ....

...ideal for small and medium-sized companies

• fast and cost effective manufacture of individual wafers and small series lots for typical lot sizes of 1,000 to 10,000 ASICs per purchase order• assembly line for ceramics and specialized frames• external packaging service for chip mounting in plastic frames• testing lab for wafers and components using standardized or customer-specific testing methods• flexible delivery as wafers, individual chips (bare die) or as component in a frame• component qualification according to MIL-STD in an in-house quality assurance lab and in cooperation with certified partners• European second source for supply reliability and higher required production output

IMS ASIC SERVICE





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HyperBraille –area display capable of graphics for the blind and vision impaired

Using the two-dimensional interactive and graphic Braille Display the vision impaired shall gain access to graphic user interfaces of computer programs similar to the ones that are standard to people “with vision” today.The display is not only limited to displaying Braille but can also display any outlines, such as program windows or buttons. All elements of the display are touch-sensitive, i. e. the user can carry out commands by touching the relevant area display. This corre-sponds to the click with the mouse. This functionality is reached through a IMS Mixed Signal ASIC (CSAS2) that recognizes the minimal capacity variation caused through the touch of a finger on the plate and forwards this signal on to the control.

All fundamental components and processing for the manufacture of the HyperBraille are being developed within this project and will be available as prototypes. The IMS is designing and developing the evaluating ASIC CSAS2 and the piezo driver HVASIC 10D. Further development will equip these chips with more functionality and a higher degree of portability.

ca. 8

5 m

m

60 x 12 Braille module (120 x 60 pixels/300 x 150 mm2)

By scanning the reeled-out Braille pins the information illustrated according to the standardized computer Braille or as graphics is perceived.

In addition, a signal recognized in CSAS2 and digitalized is generated by the finger approximating or touching the display. These signals can trigger com-puter actions, such as the click with the mouse, the opening of menus etc.

Functionality of the module

Design and controlHVASIC 10D: controls the piezo bender of the Braille pins directly with 200 V.

MODULE: view from top and from side using HV 10D and CSAS2. Touch-sensitive area 12.5 x 5 mm.

CSAS2: processes the signals of the approximation sensor, controls the HVASIC 10D and communicates with the display controller.

Additional project partners and subcontractors: METEC Ingenieur-AG, Stuttgart F.H. Papenmeier GmbH & Co. KG, Schwerte Institut für Angewandte Informatik der TU Dresden Institut für Informatik der Universität Potsdam Blista, Deutsche Blindenstudienanstalt e.V. Institut für Zeitmesstechnik, Fein- und Mikrotechnik, Universität Stuttgart Institut für Visualisierung und Interaktive Systeme, Universität Stuttgart T.O.P. GmbH & Co. KG, Freiburg

Funding: Förderprogramm Konvergente IKT/Multimedia

Bundesministerium für Wirtschaft und Technologie (BMWi)

Project management: Deutschen Zentrum für Luft- und Raumfahrt e.V.

Projektträger Multimedia, Köln

Project duration: April 1, 2007 thru March 31st, 2010

proximity sensor

plungers

piezobender





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Highly specialized image sensors and ASICs for space

TanDEM-X and TerraSAR-X in formation flight

TanDEM-X delivers first 3D images: Don region in Kalasha

Cross-sectional view of the star sensorwith camera housing and optics

ASICs used in space applications are exposed to extreme environmental conditions, such as temperature, acceleration and radiation exposure. In addition, a long-term and reliable operation is expected.The IMS looks back on years of experience in the development of chips suitable for applications in space. The most recent examples are the two German TerraSAR-X and TanDEM-X radar satellite equipped with IMS ASICs.

ASICs used in space applications are exposed to extreme environmental conditions, such as temperature, acceleration and radiation exposure. In addition, a long-term and reli-able operation is expected.The IMS looks back on years of experience in the develop-ment of chips suitable for applications in space.

The satellites circle the earth along the polar orbit at a height of 514 kilometers. They work independently from weather condi-tions, cloud cover and daylight and will be active for the next 5 years. The satellites can recognize object larger than 1 meter.

On June 21st, 2010, the Dnjepr satellite launching rocket was lifted into space from the Baikonur spaceport in Kazakhstan carrying the radar sat-ellite TanDEM-X designed by the Friedrichshafen-based EADS subsidiary Astrium. Together with its “twin“ TerraSAR-X that has been in space since 2007 this radar satellite will be mapping the earth´s entire land surface once again. The intention is to create a digital ground model surpassing all previous ones in quality. TanDEM-X and TerraSAR-X together will generate a radar interferometer: They will fly just a few hundred meters apart from each other in a tight formation and thus enable a simultaneous recording of the area from different angles.

TerraSAR-X and TanDEM-X radar satellite

Star sensor to determine position of space vehicles

Image sensor with 664 x 664 pixel resolution




Contact: Christian Burwick • phone +49 711 21855-243 • [email protected]

Testing and characterization of Mixed Signal ICs and sensor systems at the IMSThe IMS looks back on years of experience in the development and manufacture of digital and analog circuits, such as the GATE FOREST® family and the HDRC im-age sensors, as well as comprehensive know-how in testing and characterization of Mixed Signal ICs and sensor systems.

All circuits are tested regarding their functionality as laid down in strict criteria within the frame of the quality assurance system. The tests are carried out on com-pleted silicon wafers (wafer test) and mounted ICs (component test). Suited test-ing and verifying strategies therefore guarantee the delivery of functional chips.

For all common packages the Verigy-made SOC Tester V9300 in combination with 8” wafer probes and component handlers is used.

• expansion stage with 256 digital channels and updated 64 MVectors storage depth. • clock frequency up to 800 MHz • 4 digitizers to scan analog signals (AD translator, 14 bit/65 msps, 24 bit/200 ksps) • 4 Arbitrary Waveform Generators (DA translator, 14 bit/100 msps, 24 bit/1024 ksps) • flexible interface design • optical stimulation tor the characterization of image sensors.



Integrated circuits & systems / M(E)MS technology

Contact Integrated circuits & systems: Thomas Deuble • phone +49 711 21855-244 • [email protected] Contact M(E)MS technology: Florian Letzkus • phone +49 711 21855-451 • [email protected]

Fast and low-voltage organic chipsrecord speeds to organic thin-film transis-tors enabled by silicon stencil masks

IMS CHIPS in cooperation with the Institute for Nano- and Microelectronic Systems and Max Planck Institute for Solid State Research in Stuttgart, Germany, is developing the smallest and fastest low-voltage organic thin-film transistors (OTFTs) ever hav-ing been manufactured suitable for industrial application.The manufacturing is based on high-resolution silicon stencil masks that provide excellent stiffness and stability, enabling submi-cron channel lengths and far improved transistor matching, which offers a significant performance boost to circuitry.

A silicon stencil mask is a thin silicon membrane with a pattern cut out of it through which the compounds can be deposited marking the same pat-tern on the substrate. The masks are fabricated on 150 mm (6 inch) SOI wafers featuring small structures down to less than 0.8 µm and edge roughness below 50 nm, thus, providing supreme device uniformity and allowing to exploit circuit topologies that would not be feasible other-wise.

In contrast to most international competitors, our group is focusing on low-voltagetransistor operation (<5 V), which makes the technology well suited for battery-powered or frequency-coupled applications. A generic OTFT DC/AC simula-tion model is implemented, which covers all operating regimes of the transistor and is valid for a large variety of device architectures, transistor types, material specifications and fabrication technologies.

OTFT is viewed as the basic device technology considered for future flexible electronic products, owing to their low-cost and low-temperature manufacturability on light-weighted and large-area substrates. This includes flexible displays, intelligent plasters for medical monitoring, bio sensors, and other solutions such as RF-ID, ticketing and smart signage.

SEM image of a stencil mask Photograph of an OTFT

Measured and modeled characteristics of an OTFT

-3 -2 -1 0-20

-15

-10

-5

0

VDS [V]

I D [µ

A]

VGS = -3 V

-2.7 V

-2.4 V

-2.1 V

-1.8 V

Output Characteristics

-3 -2 -1 010-12

10-10

10-8

10-6

10-4

VDS [V]

Measured dataModeled data

|I D [A

]|

VDS = -1.5 V

Input Characteristics

VDS = -0.1 V

Layout, chip photograph, top-contact stencil mask of a D/A converter demonstrator circuit




Imaging sensors

Contact: Markus Strobel • phone +49 711 21855-280• [email protected]

.

The Imaging Sensors division researches, develops and manufactures high-power customer-specifi c CMOS image sensors and cameras and has comprehensive expertise in CMOS circuit design, optical technology, packaging, system integration and image processing for the innovative devel-opment of new image and camera technologies.

As part of German and European research projects as well as industrial contracts customer-specifi c image sensors and cameras for applications in medical, safety, measurement and testing technology and process automation are being developed in the Imaging Sensors business unit The latest areas of research and development have been intelligent service robots using 3D image recognition as well as integrative technologies for autonomous sensor systems.

Many outstanding products and applications by our partners and clients are using the IMS-made HDRC® (High Dynamic Range CMOS) image sensors. This is enabled by the high-dynamic range of 120 dB which means that the brightness ratio is larger than 1. 1,000,000 of these HDRC® image sensors are therefore products with a unique feature. The Imaging Sensor division supports the industrial realization of the process starting with the specifi cation all the way to the serial delivery in accordance with the quality standards ISO 9001:2008.

COMPETENCES

PROJECTS & APPLICATIONS

PRODUCTS

AREAS OF ACTIVITY

◆ HiDRaLoN High Dynamic Range Low Noise CMOS Imagers

◆ ColorEye High-dynamic range color sensor with a new type of color and corrective algorithm

◆ SITARA Self-adapting intelligent multi aperture camera modules

◆ ITAS Integrative technology for autonomous sensor systems

◆ INSERO3D Intelligent Service Robotics by means of 3D image

capture and processing

◆ KonKaMis Confi gurable camera for micro systems

◆ Medical technology

◆ Measurement and testing technology

◆ Safety technology

◆ Process automation

CMOS image sensors◆ Extremely high-dynamic HDRC®

◆ Global– and Rolling Shutter◆ Multi-spectral◆ Application-specifi c image sensors

Image sensor systems and cameras◆ Miniaturized AVT◆ Electronics development◆ FPGA, embedded processors◆ Software development

Touch-free temperature measurements◆ HDRC® Q-PyroCam◆ Space-resolved (VGA, 640 x 480) ◆ Independent of emissivity ◆ High-temperature (600 – 1900 °C)


Imaging sensors


Contact: Markus Strobel • phone +49 711 21855-280• [email protected]

308/F/07_16

CMOS image sensors and cameras de-signed for highest requirements, cus-tom-specifically developed and manufac-tured

An experimental development platform is provided capable of utilizing and evaluating all HDRC® sensor characteristics for research and development tasks. Our partnering companies GEVITEC and hema electronic GmbH offer HDRC® cameras and systems for in-dustrial applications. Due to our years of experience with various client contracts and research projects we have been able to achieve a comprehensive expertise in circuit design, optical technology, packaging, system integration and image processing of new image sensor technologies - from specifi cation to serial delivery - in line with the ISO 9001:2008 quality standard.

HDRC® MDC - Digital camera system with GigE Vision interface

HDRC® Q-PyroCam - Touchfree high-temperature measurement-calibrated and independent of the emissivity of the temperature scenes

HDRC® GEVILUX CCTV - Intelligent CCTV camera with switchable readout mod

seelector ICAM weld - Camera with a high processing power and high dynamics for visualization and monitoring of weldings processes

PILZ PSENvip 2PILZ SAFETYeye - Premier safe camera system for 3D surveillance

These cameras bear the unique characteristics of HDRC® image sensors

Industrial image processingHigh-dynamic image sensors for automation and inspection tasks under extreme lighting conditions and for safety applica-tions in security and surveillance areas.

Medical technologyMiniaturized image sensors for endoscopes and development of a retina implant for the vision impaired.

Air and SpaceRadiation-resistant sensor design and manufacturing technology for use in space.

AutomotiveImage sensor technology for traffic technology in a difficult environment.

HDRC® VGAx, 768 x 496 pixels, 30 images

CCD camera, 1280 x 960 pixels, Automatic mode, 50 half images

CCD HDRC®

There are more than 200 companies and research facilities worldwide that use HDRC® sensors and cameras based on the HDRC® principle. HDRC® image sensors (High-Dynamic-Range CMOS) have very high brightness dynamics of up to 170 dB. Standard and customer-specifi c products are available in monochrome or color with Rolling or Global Shutter. HDRC® sensors are available in various resolutions and sizes of 200 x 180 pixels for endoscope applications up to HDTV (1980 x 1080 pixels).


Imaging sensors


Contact: Franz Hutter • phone +49 711 21855-405 • [email protected]

347/F/11_16

Die Q-PyroCam GigE displays the temperature distribution of a scene and a parallax-free gray scale image. In order to adjust to the geometrical conditions of the measuring system lenses with various focal distances (16, 25, 50 and 75mm) at variable lumi-nosities can be applied. The bi-spectral image sensor (640 X 480 Pixel, VGA) processes the radiance analog to a radiance ratio pyrometer and, thus, compensates the emissivity distribution.

MeVis – CF 1,8/50 TAMRON 2,8/50 TAMRON 3,9/75Determination of width of melting zone using HDRC® Q-PyroCam GigE (©2013 BIAS/IMS CHIPS

• The unknown emissivity process on the surface is compen-sated pixel by pixel through the generation of the quotient

• Extremely large temperature range made possible by the dynamic range of the image sensor (600°C – 1900°C)

• Defi nition of small monitoring areas (ROI) enables higher Image rates (up to 400 images/s)

• Easy handling through Ethernet interface (GigE)

• Visualizing software for WIN7/64bit, DLL for customer-owned application software

• Control of highly-dynamic cut and welding processes

• Determination of temperature profi les of surface-emitting diodes (fl ame-cutting, mill train)

• Control of material fusing processes (laser surface-layer welding)

• Control of combustion chamber (clinker, tile, cement pro-duction)

Build-up weldingVariety of lenses to adjust the measurement system s visual field

Characteristics Applications

HDRC®Quotient Pyro Camera GigE –the calibrated infrared camera

10 mm

With specialized MeVis – CF 1,8/50 lens


Imaging sensors

INSTITUT FÜR MIKROELEKTRONIK STUTTGART www.ims-chips.de312F/07_16

Miniature video sensors for medical applications with 40,000 pixels

Within the joint European project “Intracorporeal Video Probe IVP” miniature video sensors for medical technology were developed with specially adapted HDRC® (High-Dynamic-Range CMOS) image sensors, micromechanical components as well as software for image processing and diagnosis.

CMOS image sensors (highest quality, high dynamic, small, cost-efficient)Image processing and diagnosis softwareMicro-mechanical components

Implementing high-dynamic image sensors with very small dimen-sions enables the manufacture of small video endoscopes (ø 3.5 mm). Cost-efficient CMOS image sensors requiring very few leads enable the setup of miniature endoscopes through modern setup techniques.

The IVP2 video pill (ø 11 mm) provided with a HDRC® image sensor and wireless data transmission, external power supply and pivoting head was designed for the implementation in gastroenterology.

Miniature Endoscope IVP1 with 200 x 180 pixels

Swallowable video pill IVP2 with 768 x 496 pixels

Sensor data IVP2

Sensor data IVP1 A: front view ceramics with image sensor B: back view with condensator

A B

Miniendoskop with handwheel control

Autonome Videopille Stand-alone video pill with movable camera

IVP2 camera head with sensor, optics and LED in a test packaging

For further information on the joint project “Intracorporeal Video Probe (IVP)” within the European IST Programme, please visit: ivp.ims-chips.de/start.html Industrial cooperation with: www.karlstorz.de

Image area 768 x 496 pixels

Pixel pitch 4,6 µm

Chip size 4,6 x 3,7 mm2

Image area 200 x 180 pixels

Pixel pitch 4,6 µm

Chip size 1,7 x 1,3 mm2




Semiconductor integration

Contact: Christine Harendt • phone +49 711 21855-403 • [email protected]

.

The Semiconductor Integration division is divided into three areas of activity: Silicon processing, systems-in-foil and GaN technology. These areas of activity focus on the development of technologies and processes to manufacture, individualize and integrate microelectronic circuits, sensors and electrodes on wafer level into a complete system. Besides central tasks, such as the manufacture of integrated circuits and services, the production and packaging of ultra-thin silicon chips are a main concern.

A large portion of the application-oriented research and development is conducted with large publicly funded joint projects between us and industrial partners, other research facilities and universities. These projects are either funded by the local state, federal state or the

The division offers all semiconductor processing steps available at the IMS as a service for research and development as well as a support for other process lines. The main products being Mixed Signal ASICs from the CMOS manufacturing line. The ChipFilm™ technology and the ChipFilm™ patch technology enable production as well as packaging of ultra-thin mechanical fl exible systems. In addition, externally-manufactured chips can be combined into a hybrid system by thinning and embedding. This particularly offers access to the production of prototypes for small and medium-sized companies and, thus, enables access to new technologies on the market. Another focus has been created by the characterization of substrates for the GaN technology which can provide immediate information on the quality of the different substates. IMS CHIPS offers access to the PRONTO production platform that supports MST manufacturers during the set-up and initiation of a serial production for their own manufacturing line. PRONTO is jointly run by Hahn-Schickard in Stuttgart and in Villingen-Schwenningen as well as the Naturwissenschaftliches und Medizinisches Institut (NMI).

COMPETENCES

PROJECTS

PRODUCTS

AREAS OF ACTIVITY

Silicon processing◆ CMOS-compatible individual processing◆ Deposit and etching processes◆ Epitaxy◆ Implanting◆ Porous silicon ◆ Customer-specifi c processing◆ Packaging◆ Certifi ed 0.5 μm CMOS processing

Systems-in-foil◆ Ultra-thin chip manufacture and packaging◆ ChipFilmTM technology◆ ChipFilmTM patch◆ Wafer-/chip thinning ◆ Micro-hybrid integration◆ Hybrid systems-in-foil (HySiF) ◆ Sensor arrays in foil

GaN technology◆ CMOS compatible processing◆ Fast GaN characterizing processing◆ GaN-on-Si processing◆ Electrical characterization up to 800 V◆ High-Electron-Mobility transistor (GaN-HEMTs)◆ GaN HEMTs for voltage above 600 V

◆ KoSiF - Complex systems in foil Integration of thin chips, thin-fi lm components and organic electronics on a mutual foil substrate http://kosif.ims-chips.de

◆ InnBW-Implant Chip-in-foil systems for bio-electronic medicine

◆ ParsiFAl4.0 Product-capable autonomous and safe foil systems for automation solutions in Industrie 4.0 www.parsifal40.de





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Chipfilm™ – thin-film siliconManufacture of integrated circuits on ultra-thin sili-con films achieved by a new processing technique

IMS CHIPS in cooperation with Robert Bosch GmbH in Reutlingen is devel-oping a industry-compatible process for the manufacture of ultra-thin chips with chip thicknesses of below 20 µm and is investigating the characteristics of such components. The new process is based on the creation of cavities in silicon wafers positioned a few micro meters below the surface. After the integration of electronic circuits the chips can broken off the wafer surface.

Micro chips with low constructional depth are integrated in products today. For new applications, such as the combination of logic and sensor components on flexible substrates or 3D integration, ultra-thin chips with a thickness of mere-ly a few micro meters are required. Electronic paper or intelligent textiles are future products containing electronic components in flexible foil. Applications requiring special chip forms can be found among else in medical technology.

During the Chipfilm™ pre-process porously etched silicon is used for the manufacture of ultra-thin chips. Silicon wafers are manufactured bearing a silicon membrane with a few micro meters thickness attached to pilars. Using conventional semiconductor processes integrated circuits can be manufactured on these silicon layers.

This new “Pick, Crack & Place™” process enables the manufacture and handling of ultra-thin micro chips. The functionality of the circuits on the thin silicon film does not differ from the circuits with a standard thickness.

Ultra-thin RFID chip on foil substrate

20 μm silicon chip (4.5 mm x 4.5 mm etch length)

Chipfilm™ wafer with broken off chip

Flexible 20 μm chip

Manufacture of circuits on membrane wafers followed by “Pick, Crack & Place™” process




Contact: Joachim N. Burghartz • phone +49 711 21855-200 • [email protected]

Wissenschaftsminister Professor Dr. PeterFrankenberg presentedthe Landesforschungs-preis Baden-Württemberg 2009 in Stuttgart on July 8th, 2010. Prof. Dr.-Ing. Joachim Burghartz is

awarded the Landesforschungspreis in the applied research field. The prize for fundamental research goes to Professor Dr. Jörn Leonhard of the Universität Freiburg. The award cere-mony of the 100,000 Euro prize was held at Neues Schloss in Stuttgart. The event was presented by the SWR presenter Markus Brock.

This award recognizes the development of the Chipfilm™ technology and its practical application. The Ministerium für Wissenschaft, Forschung und Kunst awards this research prize annually.

Prof. Burghartz views this prize as recogni-tion of the work car-ried out by the entire team involved at the IMS as well as its exter-nally participating part-ners and the Universität Stuttgart. The prize

money will go to a new joint research project with the scientists of the Stuttgart-based Max-Planck-Institut on flexible organic electronics where the institute will also involve its expertise on the manufacture of new stencil masks and the design of integrated circuits (ASIC). “With this prize money we will be

able to explore these new research areas. I am already look-ing forward to these new opportunities now”, says Joachim Burghartz.

The team at Institut für Mikroelektronik Stuttgart around Joachim Burghartz has devel-oped a new method for the manufacture of extremely thin silicon chips. They were able to produce chips that are 50 times as thin as ordinary microchips. This technology is char-acterized by the gener-

ation of buried cavities in the silicon substrate before the actual processing of CMOS circuits.

With Chipfilm™ technology patented by the Institut für Mikroelektronik Stuttgart and further developed in cooperation with the Robert Bosch GmbH the manufacture of ultra-thin mechanically flexible chips has now become reality.

Landesforschungspreis for Ultra-thin ChipsProfessor Dr.-Ing. Joachim Burghartz is awarded the Landes-forschungspreis in the applied research field. This award recognizes the development of the Chipfilm™ technology and its practical application.

Wissenschaftsminister Professor Dr. Peter Frankenberg

Comparison of an ordinary microchip to an ultra-thin microchip with equal functions

The Chipfilm team





320/F/07_16

Calculable start-up into micro production

Production platform for micro systems

PRONTO... is interesting for those wanting to materialize their own ideas on micro systems into concrete solutions and do not have in-house development and production capabilities.

... guarantees results with high and reproducible quality and enables prototype production as well as small series manu-facture.

... supports MST producers during the establishment and serial production start-up of their own manufacturing line.

The PRONTO platform shall act as instrument for the industry in order to test, introduce and support a variety of non-sector specific micro system technology applications while establishing a serial production.

PRONTO offers access to:

• inspection, testing and handling technology for MST

• mass production processing, such as „role-to-role“ and inkjet printing techniques of sensors and MIDs

• manufacture and application of ultra-thin microchips

• planning and serial production start-up of MST production equipment

• manufacture of prototypes • small series • production start-up • industrial quality

FIELDS OF APPLICATION

Image sensors inside molded package

Ultra-thin chip on fl exible circuit carrier

Thermal fl ow sensor in 3D MID package

TopSpot print chip

Printed intrusion sensor

1

2 6

7

8

9

Intelligent test card (µ-Probe)

MID (Molded Interconnect Device)

Flexible micro electrode array (FlexMEA)

Electrode fi eld of a perforated microelectrode array (pMEA)

5

3

4

Implants

Smart Microsystems

Flexible electronics

Autonomous systems

1

3

4

2Würth Elektronik

7

6

8

9

5

Feinmetall





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µ-Probe – heatable steering plates for probe cards

Micro chips are fitted with many contact areas along their edges in order to connect them to the outside world. Hundreds and thousands of these chips are manufactured on a silicon wafer. These wafers are tested for their func-tionality using a so-called probe card. The probe card punches fine needles into the chip contact areas so the electric current can flow and activate the chip. Since the chips can be tested in various temperatures (hot - cold) the thermal expansion of the wafer can cause inaccuracies if the wafer expands more or faster than the probe card. In the past this caused contact errors and expensive waiting periods during testing. The steering plate developed during the µ-Probe project can now readjust the wafer expansion fast and precisely, shortening the testing period and, thus, enormously reducing testing costs.

During the project the accuracy of the testing process on a heatable silicon steering plate inside a probe card was probed during a semiconductor wafer test. The IMS manufac-tures silicon wafers with highly-precise openings for test needles and heating elements (see on the right). The subsequently developed steering plate was integrated into a heat-able probe card by our partner Feinmetall (see top).

Using this technology precision-testing the next generation´s silicon chips is possible at different temperatures. As part of the MicroTEC Spitzencluster the project´s joining partners Feinmetall und Advantest Europe realized the project´s intention to develop a new type of probe card technology. The reason for this is the increasing miniaturization in micro electronics resulting in ever so smaller structure sizes on silicon chips as well as the users´ demands in electronics for operation of their products at very high and very low temperatures. Of course, testing of the silicon chips has to be done at all temperatures as well posing high demands on the mechanical precision of the tester during probing.

The software development to control the card and the integration of the new system into the prober environment was realized by Advantest (formerly Verigy). The measurement proved the following: This card significantly reduces the test needles´ undesired position shifts during temperature changes.

Silicon steering plate with heating elements

Silicon plate with hole arrays for the test needles (scanning electron mikroscope recording)

Feinmetall

F E I NM E TA L L





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The sub-retinal implant for the vision impaired

There are efforts around the globe to develop a retina implant that may restore the vision to a certain extend after turning blind (retinitis pigmentosa, old-age macula degeneration). A sub-retinal implant uses the fact that biological retina tissue is receptive to artificially generated electrical impulses. These are triggered from a CMOS circuit similar to the image generated by the lense of an eye.

A stimulatory sensor chip processing the brightness dynamics of the view field similar to our eye was de-veloped for the retina implant. The optical signal is directly forwarded to the patient´s retinal tissue. Thus, a limited seeing image is created allowing for the orientation in enclosed space.

Illustrations 2 and 3 show the effects of retinis pigmentosa and macula degeneration

1 2 3

Retina implant chip with 1600 Pixel cells and a driver power variable with up to 400 %. The close-up shows the photo diode and the stimulation electrode.

The IMS was awarded the “Jack Raper Award for Outstanding Technology Directions Paper” for it presentation of the “CMOS Imager Technologies for Biomedical Applications” in San Francisco.

Implant for human studies

Project partner and funding

“Jack Raper Award” 2009

70 µm

Photodiode

3 mm

Elektrode

alt neu




M(E)MS technology

Contact: Florian Letzkus • phone +49 711 21855-451 • [email protected]

.

The M(E)MS technology division is divided into the following areas of activity: Large-scale M(EMS) and Si photonics These two primary activities develop and manufacture micro mechanic Si components, optoelectronic micro systems for beam defl ection and active/passive photonic Si and Si3N4 components. By combining M(E)MS, CMOS and nano structuring processes new types of prototypes and systems can be realized in a fast and cost-effi cient manner.

The division carries out application-oriented research, development and small series manufacture for publicly-funded projects and predominately bilateral industrial projects.

The manufacture of photonic and micro electro mechanic components, from an individual sample to a small series, is displayed in this division. This requires all core competences at Institut für Mikroelektronik Stuttgart, such as designing, technological processing, packaging and testing in order to develop and manufacture complex micro systems.

COMPETENCES

PROJECTS

PRODUCTS

AREAS OF ACTIVITY

◆ Oktopol Micromechanical defl ection system for scanning

scanning electron microscopes

◆ 256k BLC Micromechanical defl ection system for scanning scanning electron microscopes

◆ ViP+ NASIKA project Night vision camera with germanium photo diodes

for automotive applications

◆ IQST Integration of III-V quantum dot lasers in

silicon technology

◆ MEMS DMFC Direct methanol fuel cell based on doted

SiO2 membranes

◆ NEMEZU New precious metal-free membrane electrode units for future fuel cells

M(E)MS◆ Optoelectronic microsystems for beam defl ection in e-beam writers and scanning electron microscopes

Silicon photonics◆ Si, Si3N4 wave ducts and grids◆ Active components◆ Interferometer, ring resonators◆ Echelle grating, AWG (Arrayed Waveguide Grating)

Fuel cells◆ Si, Si3N4, SiO2 based membranes

Stencil masks & micro mechanics◆ Si, Si3N4 wave ducts and sub-100 nm minimal structures◆ 3D Si plates◆ Active optical sensors ◆ Gear wheels

10 µm




Nanostrukturierung

Contact: Mathias Irmscher • phone +49 711 21855-450 • [email protected]

.

IMS has a unique industrial-oriented micro electronic infrastructure consisting of a CMOS wafer line, a mask line and2 modern, mask-free lightening systems, the shaped Vistec SB4050 e-beam writer as well as the VPG400 laser writer by Heidelberg Instruments. The nano structuring division is researching, developing and manufacturing components with nanometer structures for a variety of applications even in small series by utilizing the technological equipment as well as the decades-long experience.

A 3D structuring of surfaces is a sophisticated technology with a broad variety of applications. Various customer-specifi c surface functions have already been realized in multiple materials using the analog e-beam technique at IMS.

Another technology is complex multi-level structures that enable the manufacture of fl exible surface profi les. The high precision of the e-beam writer supports the production of tiniest elements, such as a molding master required for the manufacture of organic transistors.

As part of joint projects basic technologies are developed building the grounds for many further ac-tivities or products. In cooperation with industrial partners products are developed that are generally followed through at the IMS until production stage and the actual production itself. The joint projects EXEPT, ETIK and SeNaTe created technologies and are still creating technologies for the manufacture of highly-precise large-scale diffractive optical elements.

COMPETENCES

PROJECTS & PRODUCTS

AREAS OF ACTIVITY

2 µm 2 µm 200 nm

Replication masters◆ Originals from all common second-cast techniques◆ Strucutures, binary, multi-level, analog◆ Resolution: >20 nm◆ Materials: Resist, silicon, quartz◆ Substrate size: up to 430 mm Ø

Diffractive optical elements ◆ Strucutures, binary, multi-level, analog◆ Materials: qz wafers, qz blanks, specialized substrates◆ Substrate size: up to 430 mm Ø

Photo masks◆ Masks for special applications ◆ Binary Cr masks◆ Phase masks◆ Use of the technology for specialized components


Nanopatterning



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Stencil mask with a membrane window of 126 mm

Optical component on a 230 mm x 230 mm substrate

EUV reflexion mask

Nano lithography for highly complex and highly specific applications

70 nm-structures of a stack level manufactured by mod-ern nano imprint lithography. The mask necessary for the imprint process was developed at the IMS.

50 nm Gitter

Structures with a line width of 32 nm and more are transmitted by the Extreme-Ultraviolet (EUV)- Lithography. The IMS is cooper-ating with partners in developing a manufacturing technology for EUV masks and has delivered the first prototype to ASML for evaluating the first EUV stepper.

The IMS has developed resist processes for the electron lithographic production of complex nano structures of up to 50 nm on 300 mm wafers.

Development and manufacture of diffractive optical components up to a maximum substrate size of 230 mm x 230 mm. The IMS manufactures structured and unstructured membranes as well as membranes with a structured absorber layer.

Advanced Mask Technology

High-Resolution E-Beam Direct Writing

Optical Components


Nanopatterning



332F/07_16

IMS CHIPS is partner of the MEDEA project FANTASTIC, a European research association for the development of the UV nanoprint lithography.

NANOIMPRINT TEMPLATES – basic technology established at IMS CHIPS

The UV nanoimprint technology has increasingly developed into an attractive technology, enabling the best-efficient production of very small structures. A transparent template containing the negative of the structure to be printed is pressed into the monomer which is superimposed on a substrate and then hardened by UV illumination.

Thus, the resolutions and geometry obtainable by this technology depend on the tem-plate. Printing of three-dimensional structures is possible as well. IMS CHIPS plays a key role in this research area.

There are a multitudes of applications, for example, in the field of micro and nano system engineering, nano optics and nano photonics. The nanoimprint technology was included in the ITRS Roadmap in 2004 and is considered to be a possible structuring technology for the 32 and/or 22 nanometer nodes.

In addition to perfecting the imprint process, the fabrication of complex and flawless templates is a great challenge. The availability of an advanced mask line as well as experience of high-resolution direct-writing enables IMS CHIPS perfectly to develop a template technology. On the basis of binary 6-inch masks provided with a Cr layer of few nanometers a process was established allowing the generation of quartz structures up to the 40 nm range with an aspect ration of 1:3 (fig. 1).

The direct printing of dielectric layers for the dual damascene technique may simplify the fabrication of CMOS chips significantly since vias and conductor lines can be structured in one step. A prerequisite for this process is the availability of 3 D templates provided with exactly positioned posts on the future metal lines (fig 2 and fig 3).

Fig. 1: 40 nm holes in quartz

Fig 3: Template with CMOS design

Fig. 2: Template with 60 nm posts



Nanopatterning & M(E)MS technology

340/F/07_16

Nanopatterning information Mathias Irmscher • Telefon +49 711 21855-450 • [email protected] writer information Florian Letzkus • phone +49 711 21855-451 • [email protected]

E-beam & laserdirect-writing at the IMS

SB4050 Vistec e-beam writer

VPG400 laser writer

Diffractive optical element real-ized on a 230 mm quartz plate

Replication masters with micro structures etched in Si

Replication master with pillars based on a 150 nm Si wafer

Connection of embedded thin chips

Active components in silicon photonics: Ring resonator

Metal and contact level during ASIC personalization

The electron beam lithography (electron beam lithography frequently being call e-beam lithogra-phy) is a structuring process on a electron-sensitive coating (a resist also known analog to photo lithography or photo resist). Since this technique is maskless multiple structures with a resolution down to a few nano meters can be achieved without large setup costs.

The IMS looks back on more than 2 decades of experience using e-beam lithography with vari-able shaped beam equipment that intrinsically creates a variable illumination area by means of a double aperture system. The Vistec SB4050 e-beam writer combined with the IMS infrastructure enable various size structuring on wafers and quartz substrates. E-beam lithography is, among else, commonly used in the development and production of masks for special applications, micro mechanic and optical elements as well as the direct writing of electrical and photonic circuits.

December 2014 saw the launch of the VPG400 laser direct writer made by Heidelberg Instruments Mikrotechnik at the IMS. The equipment working with a diode-pumped solid-state laser (DPSS laser) having a laser light wave lengths of 355 nm enables a maskless production of micro structures on a variety of materials, such as wafers, quartz plates or ceramics and plastics substrates. On an area of 400 x 400 mm² micro structures up to a minimal size of 0.7 μm can directly be written on the photo-sensitive resist coated substrate. Combining the other lithogra-phy techniques available at the IMS creates a variety of applications even on large-scale substrates.

E-beam writer applications• Optical components• Replication masters (originals for second cast processes)• 3D structuring of photo resists• MEMS and MEO components• Silicon photonics (passive and active circuits)

Laser writer applications• Hybrid systems-in-foil• Adaptive structuring of embedded ultra-thin chips• Front and rear exposure of wafers• Personalization levels on ASICs• Production of large-scale optical components

The Institut für Mikroelektronik Stuttgart is partner for applied research and small-volume industrial semiconductor manufacturing.Leading developer of nanoscale imprint templates, production of state-of-the-art masks and optical components. Project partner for national and inter-national R&D projects. ASIC design and manufacturing services. Support of start-up companies in the field of micromechanical systems and wireless microsystems. The Institute is an industrial research foundation established by the State of Baden-Wuerttemberg and is located in Stuttgart, Germany. More than 300 companies worldwide are partners and custom ers of IMS.


Allmandring 30a,D-70569 Stuttgart, Germany

☎: +49 (0) 711 / 21855 - 0Fax: +49 (0) 711 / 21855 - [email protected]

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