huawei ascend mate 7 fingerprint sensor fingerprint cards fpc1020 2015 teardown reverse costing...
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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
April 2014 – Version 1 – Written by Elena Barbarini
Ascend Mate 7 Fingerprint Scanner
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8
– Fingerprint Cards
3. Physical Analysis 12
– Synthesis of the Physical Analysis
– Ascend Mate 7 Fingerprint Scanner disassembly 14
– Fingerprint Scanner Removal
– Fingerprint Scanner Assembly 18
– Fingerprint Scanner Views
– Fingerprint Scanner Croos-Section
– Fingerprint Scanner Patents
– Sensor Die 31
– Sensor Die View & Dimensions
– Sensor Die marking
– Sensor Die Capacitors
– Sensor Die Edge Contact
– Sensor Delayering & main Blocs
– Sensor Die Process
– Sensor Die Cross-Section
– Sensor Die Process Characteristic
4. Sensor Manufacturing Process 53
– Sensor Die Front-End Process
– Sensor Die Front-End Wafer Fabrication Unit
– Packaging Process
– Packaging Fabrication unit
– Synthesis of the main parts
5. Cost Analysis 59
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Explanation
– Yields Hypotheses
– Sensor die 64
– Sensor Die Front-End Cost
– Sensor Die Probe Test, Thinning & Dicing
– Sensor Die Wafer Cost
– Sensor Die Cost
– LGA Packaged Component 70
– LGA Packaging Cost
– Back End: Final Test
– Component Cost
– Complete Module Fingerprint 75
– Assembled Components Cost
– Synthesis of the assembling
– Fingerprint Component Cost
6. Huawei’s vs Samsung’s vs Apple’s fingerprint sensor 80
Contact
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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Huawei Ascend Mate 7 Fingerprint Sensor Assembly.
• The Fingerprint Sensor technology has been developed by Fingerprint Cards AB. Which is a main
actor in capacitive sensing human interface solutions for consumer electronics companies.
• Huawei’s technological choice for the fingerprint sensor go to the opposite direction than Apple’s
and Samsung’s one. The fingerprint device is much more bigger and more expensive than its
competitors (2.5 factor) to guarantee a better image quality. It presents a new sensing device
design and structure; an innovative packaging and a different supply chain model.
• The fingerprint sensor of the Ascend Mate 7 is located on the back side of the telephone and it has
the dimension of 16.33x15.8 mm. The sensor is assembled on LGA packaging and incorporated
within a rectangular shaped housing composed of an aluminum ring and plastic ring.
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4Fingerprint Scanner disassemblyFingerprint Scanner disassembly-Back View
Fingerprintscanner connector
Fingerprintscanner
• The fingerprint scanner is located on the backof the telephone and it is connected to theboard by a terminal located on the electronicboard.
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Ascend Mate 7 sensing die back View
Flex PCB
Sensing Die contact pin
Ascend Mate 7 fingerprint scanner front View
The sensing device is connected to the flex PCB by 20 solder pins.
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Ascend Mate 7 Fingerprint Scanner
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Ascend Mate 7 Fingerprint Scanner
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• The die marking includes:
FPC1020 S 3A
FINGERPRINTS
2013 Ⓜ
Sensor Die Marking
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Ascend Mate 7 Fingerprint Scanner
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Ascend Mate 7 Fingerprint Scanner
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 11Capacitors Area – SEM View – metal 5
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 12Sensor Die – SEM View
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Ascend Mate 7 Fingerprint Scanner
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ICFront-End &
Back-End 0 Cost
Assembly & Test Cost
Fingerprint sensor
• We perform the economic analysis of the Sensor IC Front-End, Back-End 0 & packaging with the IC Price+ tool.
• We perform the economic analysis of the Home button Assembly with the Syscost+ tool.
Other Components Cost(Stainless steel ring,
tactile switch, chips, …)
LGA Packaging
ICDesign
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Ascend Mate 7 Fingerprint Scanner
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Ascend Mate 7 Fingerprint Scanner
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Ascend Mate 7 Fingerprint Scanner
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• Reverse costing analysis represents the best cost/price evaluation given the publically available data, andestimates completed by industry experts.
• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10%correction on the manufacturing cost (if all parameters are cumulated)
• These results are open for discussion. We can reevaluate this circuit with your information. Please contactus:
• Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]
– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]
• Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]
– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]
• Financial services
– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]
• General
– Email: [email protected]