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    HP BladeSystem c7000 EnclosureQuick Setup Instructions

    Part Number 411762-006November 2008 ( Edition)Sixth

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    Verifying the pallet contents

    Item Name Description

    1 HP BladeSystemc7000 Enclosure

    The HP BladeSystem enclosure

    2 Rear cage The rear section of the enclosure

    3 Device bay blank A mandatory insert installed inany unused device bay

    4 Power supply blank A mandatory insert installed inany unused power supply bay

    5 Enclosure hot-plugpower supply(quantity as ordered)

    The power supply for theenclosure

    Item Name Description

    6 Full-height device(quantity asordered)

    The full-height server orstorage blade

    7 Half-height device(quantity asordered)

    The half-height server orstorage blade

    8 Local I/O cable A cable with serial, USB, avideo connectors that conn

    to the I/O connector on thefront of a blade

    9 Fan blank A mandatory insert installedany unused fan bay

    10 HP Active Cool 200Fan (quantity asordered)

    A fan used to cool thecomponents installed in theenclosure

    11 OnboardAdministrator withKVM module

    Hot pluggable enclosuremanagement module. Onemodule is required to manathe components installed inenclosure. To provideredundant enclosuremanagement, you can insta

    an optional second module12 Onboard

    Administrator withKVM blank

    A mandatory cover installeany unused OnboardAdministrator bay

    13 Interconnect blank A mandatory insert installedany unused interconnect ba

    14 Interconnect module(quantity and typeas ordered)

    Any of several componentssuch as pass-thrus or switchthat enable communicationbetween the blade and theenclosure

    15 Onboard

    Administrator withKVM tray

    Hot pluggable tray that hou

    up to two OnboardAdministrator modules andprovides two enclosure linkconnectors, the rear enclosUID LED, and switch.

    16 HP BladeSystemInsight Display

    A display that providesinformation about the healtand operation of the enclos

    17* Power retention ties(single-phaseenclosures only)

    Tie straps that help preventsingle-phase power cablesfrom disconnecting from thepower connectors

    18* Documentation CD The CD containing detaileddocumentation on using theenclosure

    19* SmartStart CD A CD containing SmartStarsoftware, a collection thatoptimizes single-server setu

    20* Hard copyinstallationinstructions forblades, options andinterconnects

    The printed installationinstructions

    21* Installation checklist A checklist to guide youthrough installation of theenclosure and its compone

    * Not shown

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    4. Install the rear cage into the enclosure, close the hinges, andtighten the thumbscrews.

    Enclosure bay identificationefore installing front or rear components into the enclosure, reviewnclosure bay numbering for each component.

    Full-height device bay numbering

    Half-height device bay numbering

    Power supply bay numbering

    Fan bay numbering

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    nstalling the front componentsCAUTION: To prevent improper cooling and thermaldamage, do not operate the enclosure unless all bays arepopulated with a component or a blank.

    your HP BladeSystem c7000 Enclosure is equipped with a three-hase power configuration, you need six power supplies.

    o install a power supply:

    . To gain access to all power supply bays, slide the HPBladeSystem Insight Display to the right or left as needed.

    2. Insert the power supply into the enclosure, and then close thepower supply bracket.

    NOTE: This document discusses installation of AC powersupplies only. For information on configuring DC powersupplies or HP Carrier Grade Solutions, see thedocumentation that came with your power supply.

    3. Add any ordered options to each server blade:o Additional processoro Additional memoryo Mezzanine option cards

    4. (Optional) If you are installing a full-height device, remove thehalf-height device bay shelf. If you are installing a half-heightdevice, omit this step.

    5. Remove the connector covers.6. Install the server or storage blades.7. Install device bay blanks into any unused device bays.

    If the empty bays are configured for a full-height device, jotwo device bay blanks to create a full-height blank.

    Installing the rear componentCAUTION: To prevent improper cooling and thermaldamage, do not operate the enclosure unless all bays apopulated with a component or a blank.

    1. Install fans in even-numbered groups, based on the totalnumber of blades installed in the enclosure:

    o Four fan configurationFan bays 4, 5, 9, and 10 areused to support a maximum of two devices located indevice bays 1, 2, 9, or 10. Only two device bays canused with four fans.

    o Six fan configurationFan bays 3, 4, 5, 8, 9, and 10used to support devices in device bays 1, 2, 3, 4, 9, 111, or 12.

    o Eight fan configurationFan bays 1, 2, 4, 5, 6, 7, 9, 10 are used to support devices in all device bays.

    o Ten fan configurationAll fan bays are used to suppodevices in all device bays.

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    NOTE: When installing a fan in the top row of fan bays,orient the fan so that the LED is in the lower right corner.

    When installing a fan in the bottom row of fan bays,orient the fan so the LED is in the upper left corner.

    2. Install fan blanks in any unused fan bays.3. Install the Onboard Administrator with KVM modules into the

    Onboard Administrator with KVM tray based on the totalnumber ordered:

    o One Onboard Administrator with KVM module: Bay 1o Two Onboard Administrator with KVM modules: Bays 1

    and 2

    Install an Onboard Administrator with KVM blank into anyunused Onboard Administrator with KVM bay.

    Connecting the cables1. Identify all connectors.

    Item Connector Description

    1 OA/iLO Ethernet 1000BaseT RJ45 connector, which providEthernet access to the Onboard Administrator with

    KVM and the iLO on each blade. Also supportsinterconnect modules with management processorsconfigured to use the enclosure management netwAutonegotiates 1000/100/10 or can be configureto force 100Mb or 10Mb full duplex.

    2 USB USB 2.0 Type A connector used for connectingsupported USB devices such as DVD drives, USB kedrives, or a keyboard or mouse for enclosure KVMuse. To connect multiple devices, a USB hub (notincluded) is required.

    3 Serialconnector

    Serial RS232 DB-9 connector with PC standardpinout. Connect a computer with a null-modem sercable to the Onboard Administrator with KVMcommand line interface (CLI).

    4 VGAconnector

    VGA DB-15 connector with PC standard pinout. Toaccess the KVM menu or Onboard Administrator wKVM CLI, connect a VGA monitor or rack KVMmonitor for enclosure KVM.

    5 Enclosurelink-downport

    Connects to the enclosure link-up port on the enclobelow with a CAT5 patch cable.

    6 Enclosurelink-up portandserviceport

    Connects to the enclosure link-down port on theenclosure above with a CAT5 patch cable. On astand-alone enclosure or the top enclosure in a seriof linked enclosures, the top enclosure link-up portfunctions as a service port.

    2. To connect to the management network, connect a standaCAT5 patch cable to the OA/iLO port of each installedOnboard Administrator with KVM module.

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    3. If more than one enclosure is installed in the rack, use a CAT5patch cable to connect the enclosure link-down port on theupper enclosure to the enclosure link-up port on the lowerenclosure.

    NOTE: The enclosure link ports are designed only tosupport c-Class enclosures in the same rack. The enclosurelink-up port on the top enclosure is the service port, andthe enclosure link-down port on the bottom linkedenclosure is unused.

    NOTE: The HP BladeSystem c-Class enclosure link portsare not compatible with the HP BladeSystem p-Classenclosure link ports.

    Mapping to interconnect portseveral port types are referenced in the following tables.

    Examples of 1x ports are 1-Gb Ethernet (1 GbE) switchmodules and Fibre Channel interconnect modules.

    An example of a 2x port is a Serial Attached SCSI (SAS)interconnect module. (Reserved for future use.)

    Examples of 4x ports are 10-Gb Ethernet (10 GbE)interconnect modules.

    NOTE: 1x and 2x port mezzanine cards interface withsingle-wide interconnect modules. 4x port mezzaninecards interface with double-wide interconnect modules.

    he term "1x/2x" refers to the number of interconnect lanes per portrovided by the controller. The more lanes provided per port, the

    igher the data transmission rate coming from that port.

    Mapping half-height blades

    The following table lists the available configurations for half-heigdevices installed in device bay N (116).

    Connection Port number Connects tointerconnectbay/port

    Comments

    Embedded NIC NIC 1

    NIC 2

    1/Port N

    2/Port N

    One or two singwide Ethernetinterconnectmodules

    Mezzanine slot11x or 2xcards

    1x/2x port 1

    1x/2x port 2

    3/Port N

    4/Port N

    One singwideinterconnmodule

    Four portcards willonly connthe first twports.

    Mezzanine slot14x cards

    4x port 1 3/Port N One doubwideinterconnmodule

    Only portof a two pcard will connected

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    Connection Port number Connects tointerconnectbay/port

    Comments

    Mezzanine slot21x or 2xcards

    1x/2x port 1

    1x/2x port 2

    1x/2x port 3

    1x/2x port 4

    5 / port N

    6 / port N

    7 / port N

    8 / port N

    One or two single-wide interconnectmodules

    Mezzanine slot24x cards

    4x port 1

    4x port 2

    5/Port N

    7/Port N

    One or twodouble-wide

    interconnectmodules

    Connectivity to interconnect bays 7 and 8 is only available withour-port mezzanine cards or port 2 of 4x card in Mezzanine slot 2.

    Mapping full-height blades

    he following table lists the available configurations for full-heightevices installed in device bay N (18).

    Connection Portnumber

    Connects tointerconnectbay/port

    Comments

    NIC NIC 1

    NIC 2

    NIC 3

    NIC 4

    1/Port N+8

    2/Port N+8

    1/Port N

    2/Port N

    One or two single-wide Ethernetinterconnectmodules

    Connection Portnumber

    Connects tointerconnectbay/port

    Comments

    Mezzanine slot11x or 2xcards

    1x/2x port 1

    1x/2x port 2

    1x/2x port 3

    1x/2x port 4

    3/Port N

    4/Port N

    3/Port N+8

    4/Port N+8

    One or two singwide interconnemodules

    Mezzanine slot14x cards

    4x port 1 3/Port N One doubwideinterconnemodule

    Only port of a two-pcard can bconnected

    Mezzanine slot21x or 2xcards

    1x/2x port 1

    1x/2x port 2

    1x/2x port 3

    1x/2x port 4

    5/Port N

    6/Port N

    7/Port N

    8/Port N

    Up to four singlewide interconnemodules

    Mezzanine slot

    24x cards

    4x port 1

    4x port 2

    5/Port N

    7/Port N

    One or two dou

    wide interconnemodules

    Mezzanine slot31x or 2xcards

    1x/2x port 1

    1x/2x port 2

    1x/2x port 3

    1x/2x port 4

    7/Port N+8

    8/Port N+8

    5/Port N+8

    6/Port N+8

    Up to four singlewide interconnemodules

    Mezzanine slot34x cards

    4x port 1

    4x port 2

    5/Port N+8

    7/Port N+8

    One or two douwide interconnemodules

    * Connectivity to interconnect bays 7 and 8 is only available wifour-port mezzanine cards or port 2 of 4x card in Mezzanine slo

    Mapping BL2x220c Blades

    To support network connections for specific signals, install aninterconnect module in the bay corresponding to the embedded or mezzanine signals.

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    nterconnect device mapping for double denseerver blades

    he following table lists the available configurations for doubleense server blades installed in device bay N (1-16).

    Connection Port number Connects tointerconnect bay/port

    Server A EmbeddedNIC

    NIC 1 (ENET:1)

    NIC 2 (ENET:2)

    1/Port N

    3/Port N

    Server A Mezzanine Port 1

    Port 2

    5/Port N

    6/Port N

    Server B EmbeddedNIC

    NIC 1 (ENET:1)

    NIC 2 (ENET:2)

    2/Port N

    4/Port N

    Server B Mezzanine Port 1

    Port 2

    7/Port N

    8/Port N

    nterconnect device mapping for AMC Telco I/Oexpansion blades

    he following table lists the available configurations for AMC Telco/O expansion blades installed in device bay N (1-16).

    Connection Port number Connects tointerconnect bay/port

    AMC Embedded (1) Port 1

    Port 2

    Port 3

    Port 4

    1/Port N

    2/Port N

    3/Port N

    4/Port N

    AMC Embedded (2) Port 5

    Port 6

    Port 7

    Port 8

    5/Port N

    6/Port N

    7/Port N

    8/Port N

    Bay-to-bay crosslinksour trace SerDes signals between adjacent bays are provided in thenclosure midplane to permit bay-to-bay communications.nterconnect modules can only connect horizontally.

    Device bay crosslinks

    Device bay crosslinks are wired between adjacent horizontal debay pairs.

    For half-height blades, these signals connect a four-lane PCIe moto a partner blade such as a tape blade or a PCI expansion blaFor full-height blades, these signals are used to connect a PCIemodule to a partner blade in the lower adjacent bay and requirePCIe pass-thru mezzanine card installed in mezzanine connectoThe Onboard Administrator with KVM disables the device baycrosslinks when they cannot be used, such as when two serverblades reside in adjacent device bays.

    Interconnect bay crosslinks

    Interconnect bay crosslinks are wired between adjacent interconbay pairs.

    You can enable these signals to provide module-to-moduleconnections, such as Ethernet crosslink ports between matchingswitches, or Virtual Connect modules as stacking links. Onboard

    Administrator with KVM disables the interconnect bay crosslinkswhen they cannot be used, such as when two different modulesreside in adjacent horizontal interconnect bays.

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    nstalling interconnect modules

    Server bladesignal

    Interconnect baynumber

    Interconnect bay label

    NICs 1, 2, 3, and 4(embedded)

    1, 2

    Mezzanine 1 3, 4Mezzanine 2 5, 6 and then 7, 8

    Mezzanine 3 7, 8 and then 5, 6

    NOTE: For information on the location of LEDs and portson individual interconnect modules, see the documentationthat ships with the interconnect module.

    . Install the interconnect modules based on the number orderedand the number of fabrics in the configuration.

    The enclosure ships with interconnect bay dividers installed.The interconnect bay dividers must be removed before

    installing double-wide interconnect modules. To remove aninterconnect bay divider, press the release tab, and pull theinterconnect bay divider out of the enclosure.

    2. Install interconnect blanks in any unused interconnect bays.3. Connect each installed interconnect module to the external

    connections with the appropriate cable.

    Powering up the enclosure

    Single-phase power configuration

    For a single phase power configuration:

    1. Connect the AC power cables to the power connectors on rear of the enclosure corresponding to the power supply thwas populated on the front of the enclosure.

    2. Be sure each power cable is securely attached to the poweconnectors.

    3. Connect the AC power cables to the AC power source or tinstalled power distribution unit (PDU).

    4. Turn on the AC circuit breakers that power the power cablinstalled in the enclosure.

    5. Locate the power retention bracket that came with theenclosure.

    6. Verify that the power cord retention tabs are on the correctside.

    o On the left side: To install the power cord retention braon the left side of the enclosure, ensure the power cord

    retention tabs are located to the right of the snap clamo On the right side: To install the power cord retention

    bracket on the right side of the enclosure, ensure the pcord retention tabs are located on the left side of the sclamps.

    7. Place the power cord retention bracket under the power coand then align the power cords with the snap clamps.

    8. Open the snap clamps, and then insert each power cord ineach clamp.

    9. Slide the power cord retention bracket until the bracket touthe enclosure.

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    0. Insert the power cord retention tabs into the slots on theenclosure until they snap into place.

    1. Slide each snap clamp over the end of each power cordovermold, and then squeeze each snap clamp closed.

    Three-phase power configuration

    or a three-phase power configuration, the AC power cables arelready attached to the enclosure. To cable the enclosure using a

    hree-phase AC configuration:

    . Connect the AC power cables to the AC power source.2. Turn on the AC circuit breakers that power the power cables

    installed in the enclosure.

    Setting up the HP BladeSystem

    nsight DisplayWhen the enclosure is powered up for the first time, the InsightDisplay launches an installation wizard to guide you through theonfiguration process. After configuring the enclosure, the Insight

    Display verifies that there are no installation or configuration errors.errors are present, the Insight Display guides you through therocess of correcting the errors.

    o identify the enclosure, the rear enclosure UID light and theackground of the Insight Display are illuminated blue when thenclosure is powered on initially.

    To set up an enclosure with network connectivity to the OnboardAdministrator with KVM:

    1. On the Enclosure Settings screen, confirm the default settino Use the navigation arrows to navigate to a particular

    setting, and then press OK.

    o Navigate to the ? box next to a setting, and then to gehelp, press OK.

    2. Confirm the Power mode for the power supplies, which istypically AC Redundant.

    3. If the facility must limit AC power to the enclosure below wthe power supplies can draw, set the Power Limit.

    4. To provide the highest power efficiency without affecting sperformance, enable Dynamic Power Savings.

    5. Record the OA1 and OA2 (if present) IP address. Thisinformation is needed when deploying the managementsoftware.

    o If the OA1 or OA2 IP address is 0.0.0.0., set the addNavigate to the address, and then press OK. Use the uand down arrows to select Static IP address. Use the uand down arrows on each field to set the IP, netmask,

    gateway one octet at a time. Press OK, and then pressagain on Accept to confirm the new IP address settings

    o If neither IP address is 0.0.0.0., record the displayedaddress to use for remote login to the Onboard

    Administrator with KVM over the management network

    6. (Optional) Edit the Enclosure Name. The default value is thenclosure serial number.

    7. (Optional) Edit the Rack Name. The default value isUnnamedRack.

    8. Set the Insight Display PIN to prevent other users of the LCDfrom changing the settings.

    9.Select Accept All at the bottom of the Enclosure Settings, athen press OKto Accept all the settings to continue. If you setting up a single enclosure, proceed to step 11.

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    0. Select Accept, and then press OKto apply the EnclosureSettings (Redundancy Mode, Limit AC, Power Savings, RackName, and Insight Display PIN) to other linked enclosures.

    1. Follow the instructions on the Check: Installation & Cablesscreen, and then select Continue.

    2. Follow the instructions on the Blades Powering Up screen, andthen select Main Menu.

    3. Open a browser and connect to the active OnboardAdministrator with KVM module using the OnboardAdministrator with KVM IP address that was configured duringthe Insight Display installation wizard process.

    14. Enter the user name and password from the tag supplied wthe Onboard Administrator with KVM module to access theremote Onboard Administrator with KVM web interface ancomplete the Onboard Administrator with KVM first timeinstallation wizard.

    To set up the enclosure without network connectivity to the OnboAdministrator with KVM, see the Onboard Administrator User G

    The installation is complete.

    For more informationFor more detailed setup and configuration information, see the HBladeSystem c-Class Solution Overviewand the HP BladeSystemc7000 Enclosure Setup and Installation Guide. You can also findinformation on the HP website(http://www.hp.com/go/bladesystem/documentation).

    http://www.hp.com/go/bladesystem/documentationhttp://www.hp.com/go/bladesystem/documentation
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    Copyright 2006, 2008 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in theexpress warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additionalwarranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

    Part Number 411762-006November 2008 (Sixth Edition)