high volume piezoelectric thin film production process or ... · high volume piezoelectric thin...
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piezoMEMS workshop 2010 – Aachen
High volume piezoelectric thin film production f i t
Frode Tyholdt
process for microsystems
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SINTEF
piezoMEMS workshop 2010 – Aachen
BackgroundBackground Piezoelectric PZT thin films have been Piezoelectric PZT thin films have been
integrated with Si for ~20 years
Small and medium companies/ Universities have ideas where PZT thinUniversities have ideas where PZT thin film technology is needed But, often no means to develop/produce
piezoMEMS
Companies are looking for high volume solutions Prototyping Deposition
F b i ti Fabrication
Reliable deposition/fabrication solutions will increase the interest in piezoMEMS technology
piezoMEMS accelerometers
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technology
piezoMEMS workshop 2010 – Aachen
What are the current key bottlenecks for high volume fabrication of piezoMEMS?high volume fabrication of piezoMEMS?
(Question asked in ~2007)
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piezoMEMS workshop 2010 – Aachen
FP7 piezoVolume (2010 – 2013)FP7 piezoVolume (2010 2013)High volume piezoelectric thin film production process for microsystems5,14 M€ project
PZT thin film deposition toolsand procedures
Fabrication proceduresDesign handbook
Automated chemicall ti d iti t l
piezoMEMS design tools piezoMEMS device fabrication procedures(wafer level)
solution deposition tool
In-line quality monitoring tools
Packaging and integration with electronics
End piezoMEMSproduct
(wafer level)
Sputtering tool
Bottleneck 3 Design tools
Bottleneck 1 High volume PZT deposition
Bottleneck 2In-situ quality control
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Design tools High volume PZT deposition In situ quality control
Project focus ends here
piezoMEMS workshop 2010 – Aachen
piezoVolume – partnerspiezoVolume partners
PZT thin film deposition toolsand procedures
Fabrication proceduresDesign handbook
Automated chemicalsolution deposition tool
End piezoMEMS
VERMON
piezoMEMS design tools piezoMEMS device fabrication procedures(wafer level)
In-line quality monitoring tools
Packaging and integration with electronics
End piezoMEMSproduct
Sputtering tool
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piezoMEMS workshop 2010 – Aachen
piezoMEMS design handbookpiezoMEMS design handbook
Material specifications and design guidelines
Material parameters Design guidelines and
process limitationsprocess limitations Definition of lithographic
masks
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piezoMEMS workshop 2010 – Aachen
The piezoVolume processThe piezoVolume process
Add-on:BCB bonding to plain SiSi
Release etch of piezoMEMS wafers
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to plain or patterned glass wafers
Siglass
Si
piezoMEMS workshop 2010 – Aachen
piezoMEMS modelling toolpiezoMEMS modelling tool piezoMEMS modelling toolpiezoMEMS modelling tool
3D parametric library of standard piezoMEMS components
Integration with FEM software Material parameters included in process
design kit (PDK)
Process emulation (virtual manufacturing) 2D masks + description of fabrication
process to create a voxel based 3D solid model.
Beam (in green): 400 x 50 um^2, 3um thickE=1.6e5 MPa, =0.2
Piezoelectric material (in magenta):300 x 50 um^2, 1um thickElastic-AnIso
piezoMEMS beam in Coventorware ARCHITECT.
Virtual manufacturing Save Money by finding problems before
fabrication. Enhance communication with highly
d t il d i t ti 3D d ldetailed, interactive 3D models. Reduce time-to-market and gain a
competitive advantage. Improve documentation and reduce
document creation effort. Enhance Yield through improved design
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Enhance Yield through improved design rules and defect modeling. Virtual manufacturing of MEMS bond pads and comb drive.
Courtesy X-FAB Semiconductor Foundries, AG.
piezoMEMS workshop 2010 – Aachen
Process design kit (PDK)Process design kit (PDK) A Library of process emulation filesA Library of process emulation files
(*.proc) define foundry-specific processes
Material property database (*.mpd) provides process-specific valuesprovides process specific values associated with materials
Layout template file (*.cat, *.gds) contains geometric and process descriptions for pre-defined MEMSdescriptions for pre-defined MEMS elements
Library of parametric and non-parametric elements support schematic and physical designschematic and physical design (optional)
Link to design handbooks including validated MEMS design rules, detailed
i f ti d d i
Process Flow of the piezoVolume PZT process represented in CoventorWare
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process information and design case studies are available upon request
piezoMEMS workshop 2010 – Aachen
Choice of deposition methodChoice of deposition method-e31,f
[C/m2]Relative
permittivity.Dissipation
factor,Current main bottleneck for[C/m ] permittivity.
er
factor,tan d
bottleneck for high volume
CSD 12-18 1100-1600 ~0.03 Throughput
S tt i 4 8? 900? Q lit
CSD: High quality, but low throughput (manual deposition ~1 wafer/h µm)
Sputtering ~4-8? 900? Quality
wafer/h µm)
Sputtering: M lti t t DC ti tt i l th h t Multi target DC reactive sputtering: low throughput Single oxide target RF sputtering: higher throughput, but still too low
quality
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piezoMEMS workshop 2010 – Aachen
Deposition tools CSDDeposition tools – CSD Adaptation of Solar-semi cluster coaterAdaptation of Solar semi cluster coater
tool
Throughput goal 4 wafers/h·µm (65 nm/min) on 200 mm
f i t ti CSD t lwafers using new automatic CSD tool (15.000 wafers/y @ 43 % uptime)
Performance goal e31 f ~ -14 C/m2 e31,f 14 C/m
Deposition cost 10-20 €/wafer·µm due to consumables
and equipment depreciation @ 43 % uptimeuptime 4-8 €cent per 1x1 cm die using 200 mm
wafers
Will be optimized for PZT but can also be used for other oxides
Solar-semi coating cluster
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be used for other oxides
43 % uptime = 12h/day and 6d/week
piezoMEMS workshop 2010 – Aachen
Deposition tools sputteringDeposition tools – sputtering
New hot chuck sputtering add-on New hot chuck sputtering add on for Oerlikon’s Clusterline 200 II for in-situ sputtering of PZT
Throughput goal Throughput goal 3.6 wafers/h·µm (60 nm/min) on
200 mm wafers (11.000 wafers/y @ 43 % uptime)
Performance goal e31,f ~ -14 C/m2
Oerlikon Systems Clusterline 200 II
Deposition cost 10-20 €/wafer·µm due to
consumables and equipment depreciation @ 43 % uptime
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4-8 €cent per 1x1 cm die using 200 mm wafers
Hot chuck during sputtering
43 % uptime = 12h/day and 6d/week
piezoMEMS workshop 2010 – Aachen
How to do quality monitoring?How to do quality monitoring?
Method Information retrieved
Suitability for high volume piezo thin film quality monitoringq y g
In-situ XRD Structure/texture/morphology
No 1:1 correlation between e.g. rocking curve and piezoelectric performance
Thickness/refractiveEllipsometry Thickness/refractive index Only thickness
Electromechanical Piezoelectric coefficients/r
Wafer must be processed to extract the coefficients
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piezoMEMS workshop 2010 – Aachen
In line quality monitoringIn-line quality monitoring Indirect estimation of e31,f from d33,f31,f 33,f
and Needed resolution for thin films <10
pm Laser interferometry
Accuracy Better 4 % of real e31,f
Throughput
aixACCT double beam laser interferometer (aixDBLI)
Throughput 10 wafers/h
Automation of measurements through electrode mask layoutthrough electrode mask layout Parameter/coefficient tracking
Operations cost 4 €/wafer due to equipment
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aixPlorer data management and analysissoftware
q pdepreciation @ 43 % uptime
piezoMEMS workshop 2010 – Aachen
piezoVolume end userspiezoVolume end users
Sonitor Sonitor Microphones for ultrasonic
indoor positioning
Océ Technologies Ink jets Ink jets
VERMON pMUT for medical ultrasound
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piezoMEMS workshop 2010 – Aachen
piezoMEMS competence centrepiezoMEMS competence centre The competence centre aims to act as contact point for interested parties and The competence centre aims to act as contact point for interested parties and
covers the whole production process for piezoelectric microsystems
World-class piezoelectric thin films (PZT). e31,f ~ -14 C/m2 @ 10 Hz Deposition process and tools for high-performance PZT thin films on silicon wafers Modelling software specifically for piezoMEMS Modelling software specifically for piezoMEMS Modelling of device ideas and design assistance Evaluation of alternative processing routes Testing services and sophisticated testing equipment Manufacturing of prototypes Small scale production using 150 mm wafers
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Small scale production using 150 mm wafers
piezoMEMS workshop 2010 – Aachen
Project statusProject status Project started Jan 1st 2010Project started Jan 1 2010
Modelling tools piezoMEMS PDK for
Coventorware available fromCoventorware available from COVENTOR
Further developments in 2010 –2011
Deposition tools Under development First results expected in 2010 –
2011 0
In-line quality monitoring tools Under development First results expected in 2010
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First results expected in 2010 –2011
piezoMEMS workshop 2010 – Aachen
Check status atCheck status atwww.piezovolume.com
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piezoMEMS workshop 2010 – Aachen
AcknowledgementsAcknowledgements
The research leading to these results has receivedThe research leading to these results has received funding from the European Community's Seventh Framework Programme (FP7/2010-2013) under grant agreement n° 229196
Thank you!
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