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Contents1. Summary2. Organization chart3. Marketing4. Services & Quality assurance5. Technology capability6. Raw material suppliers7. Main equipments8. Vision, Mission and Culture

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Summary

Established : 1995Total employees : 850Register capital : 100 million RMB Plant floor space: 18,000M²2014 capacity (forecast) : 360K square meter/annualWorking hours : 2 shifts

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Summary

Certified : TS16949, AS9100, ISO9001, ISO14001Our advantage

High quality controlled, quickly production lead-time and prompt response, high mixed products to support our customers with professional business service.

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Organization Chart

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Quality Assurance Chart

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Structure of Employees

Operator, 63.30%

QA, 10.00%

Others, 12.70%

Management, 9.00%

R&D, 5.00%

Management

R&D

QA

Operator

Others

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MarketingAnnual Sales turnover & production Capacity output

18.923.1

29.5 32.136.7

30 33.6

46.855

68

0

10

20

30

40

50

60

70

80

2009 2010 2011 2012 2013

Capacity Output(10K SQM) Sales Revenue(Million USD)

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<4L and 4L,15.00%

6L, 13.00%

8L, 18.00%10L, 20.00%

12L, 18.00%

14L, 8.00%

>=16L, 8.00%<4L and 4L

6L

8L

10L

12L

14L

>=16L

Products Structure

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Application Field航天航空Aerospacedefence

15%

通讯Telecommunication 35%

工业控制Industrial control 20%

医疗 10%Medical Devices

交运设备、电器、数码产品…Transportation，Electric equipment，digital… 20%

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Global Customers

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Quality Policy

Focus on customers, provide high quality products and excellent service to customers

Environment Policy

Commit to sky blue, air fresh, water clear

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High Quality Certifications

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High Quality Certifications

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Technology Capability for Rigid and Rigid-Flex PCB

Layer count : 2--40 layersMax manufacturing size: 630mm*1500mmBoard thickness: Double sided: 0.05mm—6.0mm4 layers: 0.4mm—8.0mm6 layers: 0.8mm—8.0mm10 layers: 1.2mm—8.0mm12 layers: 1.5mm—8.0mm Copper foil thickness: 0.25OZ—13OZMin line width/space: 2.5mil/2.5milMin finished holes size: 0.15mm(mechanical),0.1mm(laser)Aspect ratio: 16:1Impedance control tolerance: +/-5% Surface treatment: HASL；LF HASL; Immersion Gold(ENIG); Immersion Tin; Immersion Ag; Gold Finger; Flash Gold; Hard Gold; OSPMaterials: FR4, Tg: 130/150/170/180℃, Rogers, Bergquist, Arlon…

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Technology Capability for Flex PCBLayer count : 1--10 layersMax manufacturing size: 430mm*530mmBoard thickness: 0.1mm—6.0mmCopper foil thickness: 0.25OZ—3OZMin line width/space: 2.5mil/2.5milOutline tolerance: +/-0.05mm for laser, +/-0.15mm for punchingStiffener type: FR4(0.2-6.0mm), steel(0.2-0.4mm),PI(0.2mm)Impedance control tolerance: +/-10% Surface treatment:

Immersion gold, ENEPIG,Soft gold,hard gold,immersion silver/tin,OSP, ENIG+OSP，ENIG+G/FMaterials: Shengyi, Taiflex, Dupont, Panasonic…

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Lead-time for ProductionProduction capacity is 30 000 sqm (3500 part numbers) monthly

Layers Express lead time Standard lead-time of mass roduction

Double Sided: 2-6 Calendar days 12 Calendar days4 Layers: 3-7 Calendar days 13 Calendar days6 Layers: 3-9 Calendar days 17 Calendar days8 Layers: 4-12 Calendar days 19 Calendar days10 Layers: 5-15 Calendar days 20 Calendar days10+ Layers: 6-18+ Calendar days 21-25 Calendar days

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Raw Material Supplier

To ensure the reliability and stability of product quality, we choose the well-known suppliers in domestic or abroad to provide quality raw materials.

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PCB Sample

High mixed PCB: aluminum base PCB, mixed lamination PCB, flexible PCB…

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High density &blind via PCBName: HDI printed circuit boardPart No.: E0214040025ALayer count: 10 Material: FR4 ,1.6mm, TG 180, 1 OZ for all layerMinimum tack: 2.6milMinimum space(gap): 2.6milMinimum hole: 0.10mmSurface finished: ENIGPanel size: 390*368mm/4upCharacteristics: high density interconnect, high TG

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High Density & Blind Via PCBName: HDI printed circuit boardPart No.: E0214040025ALayer count: 16 Material: FR4 ,1.6mm, TG 180, 1 OZ for all layerMinimum tack: 2.6milMinimum space(gap): 2.6milMinimum hole: 0.10mmSurface finished: ENIGPanel size: 390*368mm/4upCharacteristics: high density interconnect PCB,via on pad(plug with resin,and plate copper flat),high TG

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Aluminum Base PCBName: aluminum base printed circuit boardPart No.: E0214040021ALayer count: 1Material: FR4 ,1.6mm,thermal conductance 2 W, 3 OZ for all layerMinimum tack: 14milMinimum space(gap): 14milMinimum hole: 0.50mmSurface finished: Lead Free HASLPanel size: 60*60mm/1upCharacteristics: aluminum base PCB,high thermal conductance

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Rigid Flexible PCB Name: rigid flex printed circuit boardPart No.: E0214040058ALayer count: 8 Material: FR4 + Polymide,1.6mm, 1 OZ for all layerMinimum tack: 4milMinimum space(gap): 4milMinimum hole: 0.30mmSurface finished: ENIG( Au 2 U")Panel size: 120*430mm/1upCharacteristics: rigid flex multilayer PCB

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Selective Hard Gold PCBName: Hard gold printed circuit boardPart No.: E0214040027ALayer count: 2 Material: FR4 ,0.2mm, TG 130, 1 OZ for all layerMinimum tack: 4milMinimum space(gap): 4milMinimum hole: 0.20mmSurface finished: Selective hard gold( Au 30 U")Panel size: 120*108mm/36upCharacteristics: selective hard gold PCB,thin finished board thickness

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Flexible PCB

Name: flexible printed circuit boardPart No.: E0214040057ALayer count: 6 Material: Polymide 0.2mm, 1 OZ for all layerMinimum tack: 4milMinimum space(gap): 4milMinimum hole: 0.30mmSurface finished: ENIG( Au 2 U")+ selective hard gold(20 U")Panel size: 46*106mm/1upCharacteristics: hard gold flex PCB, for smart mobile phone

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Main Production Equipments

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Main Measurement Equipments

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Vision and MissionVision: To be the top PCB service enterprise

Mission: Providing high quality products and prompt

satisfactory service to customers around the world

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Culture and Core Value

Focus onCustomer

Cooperation, Improving Sharing

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Contact UsTel: +86-755-23724206 E-mail: sales@hiquality-pcb.comSkype: Shawnwang2006Add: Building7, Wanxia industry Park ,Gonghe

Village, Shajing Town,Baoan District , Shenzhen ,China

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