High Performance Post Singulation Test

Full Traceability with MAP

file update

100% touch down

efficiency

Side walls µcrack inspection with minimum crack

thickness down to 5µm

Precision � Eliminates test escapes created by singulation

process

� Tri Temp testing

� Direct docking to test head

� Full test & finishing process in one system

Stress-Free Handling � No clamping mechanism

� Device alignment by vision (closed-loop)

� 6 sides vision inspection

� Full traceability

Productivity & Flexibi l ity � High test parallelism with 100% touch down

efficiency

� Kitless AccuChuck can accommodate various device patterns for reuse of existing probe cards / sockets

� High throughput for high volume manufacturing and high-volume QA

High Performance Post Singulation Test

Rev2019042

4

MarCom@cohu.com

Test Handler Group

Cohu, Inc.

12367 Crosthwaite Circle, Poway, CA 92064-6817 | Tel. +1 858.848.8000

www.cohu.com | © 2019 Cohu, Inc.: All rights reserved.

Process Capabilities

Input Wafer frame, De-taping Waffle Pack

Output Tape & Reel Output Sorting

Jedec Tray Waffle Pack Wafer frame

Processes Device Flip X-Y- θ touchless precisor Kitless AccuChuck Direct docking to tester head Tri-temperature testing Laser marking (optional) 6 sides vision inspection Multiple sorting in Waffle Pack or single wafer frame Tape & Reel (max. 2) Automatic rejection & replacement in tape NVcore Vision Inspection

1D/2DMC code reader 2D/3DFlex ball/Bump co-planarity Mark, Surface, Top, Bottom, 4 sides Pre-tape, In-tape, post sealing inspection

Testing High test parallelism with 100% touch down efficiency Tri-temperature testing Automatic probe card cleaning Device placement accuracy within ±15µm

Specifications

Performance Characteristics Process UPH up to 16,000UPH with Wafer input Process UPH up to 12,000UPH with de-taping input MTBA: Typical ≥ 1h MTBF: Typical ≥ 168h

Temperature Characteristics Range: ambient to 135° Range: -45°C to 160° (under development) Accuracy: ±2°C Soak capacity: 6 AccuChuck (max.) Time to temperature: ≤30min 1

ESD Control Field strength at device < 100 Volt/inch (max) Decay time: 1,000V to 100V in ≤10 s Ionizer Balance: ±30V. (Class 1 ±5V optional)

Electrical Interfaces TTL parallel interface for Tester and Laser RS232, GPIB (optional) Network: Ethernet capability Wafer Mapping: SECS GEM (SEMI E4, E5, E30, E37)

Wafer Input Media Wafer frame: 4” to 12” wafer De-taping: 8, 12, 16, 24mm

Output Tape & Reel (max. 2) : 8, 12, 16, 24mm Waffle Pack: 2”x 2” (max. 32), 4”x 4” (max. 9) Wafer frame (max. 1): 4” to 12” wafer Jedec Tray: 2 (max.)

Device range WLCSP: 1 x 1 to 12 x 12mm / thickness ≥ 100μm

AccuChuck Dimensions Overall dimension: 55 x 175mn Maximum working area: 50 x170 mm Devices per AccuChuck: 600 (max.)

Facilities Requirement

I/O Modules: 100VAC - 240VAC 50/60 Hz, One Phase 3.5kVA with vacuum pump (optional) Test Module: 208 VAC - 240VAC 50/60 Hz, Three Phases 9.6kVA with vacuum pump (optional)

Common Air Pressure range: 6 to 10 bar ± 10% Air consumption: 500l/min (typical) Vacuum Network: 0.6 Bars ± 10% CDA dew point: < -70°C; Air temp range +15°C to +40°C

Physical Dimensions Overall dimensions: 3 x 2.5 x 2.1m Weight net: 1900 to 2400 kg (configuration dependent)

Specifications subject to change without notice.

For detailed performance specifications, please contact Cohu. 1Ambient (+25°C) to set point