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Real-Time Operating Systems Displays Mil/Aero ElectronicsIn This Issue...

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e tools for the busy EEJANUARY 2012

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Vol. 54, No. 8 JANUARY 2012coNteNts

PRODUCT UPDATEConnectors and sockets

56OUTLOOKA new Co-Fe alloy for MEMS

COVER STORY36th ANNUAL Product of the Year Awards

31 ADN3000-06/11 Optical Receivers from Analog Devices

3LG Family of CrystalFree CMOS Oscillatorsfrom Integrated Device Technology

IR3550 Buck Gate Driver from International Rectifier

KJ-33000 MEMS Joystick from Knowles Acoustics

LabMaster 9 Zi-A Modular Oscilloscope Systemfrom LeCroy

LTC5569 Dual Active Downconverting Mixerfrom Linear Technology

MAX44007 / MAX44009 Digital Ambient-Light Sensor ICsfrom Maxim Integrated Products

MXC6226XC MEMS Thermal Accelerometer from MEMSIC

PXIe-5665 14-GHz PXIe VSA from National Instruments

EPIC PS25x01 Series Electric-potential Sensorsfrom Plessey

QHS710 802.11n 4x4 MIMO Chipset from Quantenna Communications

22-in. Transparent Color LCD Panelfrom Samsung Electronics LCD Business

SF-2200 SSD Processor from SandForce

MHP30-36 Metal Hybrid PPTC Circuit Protectionfrom TE Connectivity

PlanarMag E2101 10/100 Ethernet Media Filterfrom TE Connectivity

BQ25504 Boost Charger IC from Texas Instruments

National LM5113 GaN Gate Driver from Texas Instruments

TMP006 MEMS IR Temperature Sensorfrom Texas Instruments

Virtex-7 2000T Field-Programmable Gate Array from Xilinx

FEATURES

18 DisplaysChanging the capacitive touch-sensing methodology

22 Real-Time Operating Systems RTOS facilitates MCU power management

28 Real-Time Operating SystemsUsing a RTOS in multicore-based MCU designs

ENERGY-SAVING INITIATIVE SERIES

46 sic MosFets offer superior switching

48 Power-efficient comm engines in FPGAs

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DEPARTMENTS

6 Viewpoint: Yeah, it may just be that simple

8 Product of the Year Story Behind the Story: Judging the Product of the Year entries

11 OUTLOOK (Technology News)◾ Advanced electrode may aid large-scale power storage ◾ Alloy sensitive to magnetic fields could produce new MEMS devices ◾ Team demos control of magnetic thermal fluctuations using current◾ APEC 2012 brings latest in power to Orlando◾ DesignCon 2012 begins Jan. 30

50 Product Teardown: What’s Inside Apple iPhone 4S Mobile Handset

52 Product Application: Mil/Aero ElectronicsMulticore DSPs support power-efficient,high-performance UAVs

56 Product Update: Connectors and sockets

NEW PRODUCTS

62 Intergrated Circuits

64 Components & Subassemblies

71 Power Sources

74 Test & Measurement

77 Packaging & Interconnections

Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.

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Want to see what the Editors are thinking? www2.electronicproducts.com/electronicProductsBlogs.aspx

environmental benefits of smart metersMaxim Integrated Products

From the education center:5 things to know: IBM’s racetrack memory chip

what’s ONLINE...electronicproducts.com

11What’s Inside Apple iPhone 4S Mobile Handset

50

ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012 5

VIEWPOINT

ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012

When I was in China a month or so ago, I was headed to lunch. I was in Beijing, and like with many other big cities, the restaurant

was on an upper floor of the building. The lobby of the building was under construc-tion, not an uncommon thing in big cities either. There were rickety-look-ing scaffolding and construction debris everywhere. There was no back entrance, and the building was not closed off in any way. No sepa-rate walkway, no tape or ropes blocking it off. Nothing. In fact, anyone coming to and fro just kept to the side.

As I was passing the site, one of the workers dropped a crowbar from 30 feet up or so. It landed maybe three feet to the left of my group. “No Chinese OSHA here,” I thought. No harm, no foul. We all went on our way.

Two weeks later I was in New York City. Like Beijing, there are always build-ings under construction. There was a build-ing, similar to the one in Beijing, that also had its lobby under construction. The big dif-ference was that the areas of the building being worked on were completely sealed off to the public by boards. I was hard-pressed to see a worker on the interior, almost

Yeah, it may just be that simple

having to go out of my way to sneak a peek, and the only debris I saw was what was already in a Dumpster.

My point is not to debate the value of human life or safety, or whether hard hats should be

worn on a construction site. What occurred to me is that we, in the United States, have a lot of laws around safety. Hell, we have a lot of laws around every as-pect of life, government, technology, etc. In China and many other coun-tries there are noticeably fewer regu-

lations around certain areas.There are pros and cons of

both. Really there are pros and cons with any extremes. Few-

er laws and restrictions may mean being able to produce products more efficiently and less expensively. More laws mean human safety, better products, and more consumer rights.

Would we as Ameri-can be willing to take a little risk for cheaper products? I mean, we do

it with smoking in some ways. We know smoking

is bad for consumers’ health, but we choose to sell

cigarettes. I’m not really sure. Maybe some of the laws we have

in place are all a bunch of Voodoo anyway. Maybe it’s time to rethink so we can reinvent.

Bryan DeLucaTo comment on this Viewpoint visit www.eebeat.com

Or maybe it’s all a bunch of Voodoo anyway

Redefining energy measurement for the smart gridRedefining energy measurement for the smart grid

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Editor Christina Nickolas Analog/Mixed-Signal ICs, Analog EDA Software, Oscillators, Electromechanical Switches, Prototyping Tools, Microwave Components 516-227-1459 • [email protected]

Technical Editor Jim Harrison Digital ICs, Boards & Peripherals, Development Tools, Motors & Controls 415-456-1404 • [email protected]

Editor Richard Comerford Test & Measurement, Optoelectronics, Sensors & Transducers, Enclosures, Cabinets, Chassis 516-227-1433 • [email protected]

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Electronic products

Judging the Product of the Year entries

PRODUCT OF THE YEARThe STory Behind The STory

Once again, the editors of Elec-tronic Products spent the past couple of months research-

ing, analyzing, and debating with each other for one purpose: Finding products worthy of being called one of Electronic Products’ 2011 Products of the Year.

Our in-house team of experts pored through hundreds of entries — using a strict set of criteria — to select those which reflected the pinnacle of inno-vation, as well as a significant ad-vancement in technology or its appli-cation, and a substantial achievement in price and performance.

“This year’s crop of POY entrants were extremely strong, making the judging very difficult, and we’re very excited to unveil the winners of this year’s competition,” said Bryan De-

Luca, Content Operations Director for Hearst Electronics Group.

What resulted is a select group of 19 winners that not only stand alone, but collectively reflect emerging product trends for the industry in 2011 while offering a glimpse into what we might expect in the future.

Cellular communicationsOne of the standout trends was a move toward “small-cell” cellular networks and communication con-trollers to fit that application area.

The MEMSIC MSC6226XC Digi-tal Accelerometer is one such prod-uct, notable as it is not only consid-ered the smallest production MEMS accelerometer today, but also one of the lowest-priced accelerometers on the market.

Overall, many digital ICs were submitted, especially DSPs, FPGAs, and communication chips. Our edi-tors noted that the FPGAs are larger,

lower cost, and faster, while the DSPs are lower power and feature floating-point operations.

Meanwhile, Ethernet and network processors remained well represent-ed, such as the E2101 single-port 10/100 Ethernet media filter and iso-lation transformer from TE Connec-tivity that embeds magnetic ferrites into a single surface package. This product is the first in a series of de-vices configured for high-speed data communications applications.

Other trendsSensor technology also had a strong showing this year. Specifically, Plessey’s EPIC sensor measures chang-es in an electric field as a magnetom-eter detects changes in a magnetic field. The EPIC sensor will enable in-

novative new products to be made, such as medical scanners that are sim-ply held close to a patient’s chest to obtain a detailed ECG reading or de-vices that can see through walls, the company notes.

Of course green is still in demand, as our editors see companies provid-ing higher power density, higher ef-ficiency, more circuit integration, better light-load efficiency, intelli-gent power management, and small-er packages, among other features.

There are many trends and prod-ucts to absorb from this year’s win-ners. To see all of the winners of the 2011 Product of the Year Awards, turn to page 31 and visit www.elec tronicproducts.com/productyear.aspx.

If you are searching for the most innovative products to complete your next design, start with this list as each represents the best of 2011.

John FilippelliManaging Editor

(L. to R.) EP Senior Editor Paul O’ Shea, Editor Richard Comerford, and Technical Editor Jim Harrison debate POY candidates during this year’s judging.


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News about Products... Product Technology... Product ApplicationsOUTLOOK


Alloy sensitive to magnetic fields could produce new MEMS devices

A rare-earth-element-free al-loy of cobalt and iron could be the basis for a new class of

sensors and micromechanical sys-tem (MEMS) devices controlled by magnetism. The alloy was created by a team led by researchers from the University of Maryland (UMd) and including researchers from Or-egon State University, Rowan Uni-versity, the National Institute of Standards and Technology (NIST), and the Russian Institute of Metal Physics, Urals Branch of the Academy of Science.

The Co-Fe alloy exhibits gi-ant magnetostriction, the phe-nomenon in which an amplified change in dimensions occurs when the material is placed in a sufficiently strong magnetic field. The effect can be used in various ways, such as for creat-ing sensitive magnetic-field de-tectors and micromechanical actuators. Unlike piezoelectrics, magnetostrictive elements can

be controlled by an external magnetic field and don’t need to be wired up.

Advanced electrode may aid large-scale power storage

The sun doesn’t always shine and the breeze doesn’t always blow and therein lie perhaps the biggest hurdles to making

wind and solar power usable on a grand scale. Stanford researchers have developed a new electrode that employs crystalline nanoparti-cles of a copper compound that could be part of a dream battery to store large quantities of excess power generated on windy or sunny days until we needed it.

The average lithium-ion battery can han-dle about 400 charge/discharge cycles before it deteriorates too much to be of practical use. Grid tied batteries would have to handle much more that this. In laboratory tests, the new electrode survived 40,000 cycles of charging and dis-charging, and after which could still be charged to more than 80% of its original capacity.

Colin Wessells, a graduate student in materials science and engineering, is the lead author of a paper describing the research, published in Nature Communications. “That is a breakthrough performance – a battery that will keep running for tens of thousands of cycles and never fail,” said Yi Cui, an associate professor of materials science and engineering, who is Wessell’s adviser and a coauthor of the paper.

The electrode’s durability derives from the atomic structure of the crystalline copper hexacyanoferrate used to make it. The crystals have an open framework that al-lows ions to easily go in and out without damaging the

electrode. Most batteries fail because of accu-mulated damage to an electrode’s crystal struc-ture. Because the ions can move so freely, the electrode’s cycle of charging and discharging is extremely fast, which is important because the power you get out of a battery is proportional to how fast you can discharge the electrode.

To maximize the benefit of the open struc-ture, the researchers needed to use the right size ions. Too big and the ions would tend to get stuck and could damage the crystal struc-ture. Too small and they might end up sticking to one side of the open spaces between atoms, instead of easily passing through. The right-sized ion turned out to be hydrated potassium,

a much better fit compared with other hydrated ions such as sodium and lithium.

The researchers used a water-based electrolyte — which is basically free compared to the cost of an organic elec-trolyte in lithium ion batteries. The significant limitation to the new electrode is that its chemical properties cause it to be usable only as a high-voltage electrode. But every battery needs two electrodes — a high-voltage cathode and a low-voltage anode. The researchers need to find an-other material to use for the anode before they can build an actual battery. But Cui said they have already been investigating various materials for an anode and have some promising candidates. For more information see http://mse.stanford.edu.

Jim Harrison

Fig. 1. This TEM image taken at NIST shows the two-phase iron-rich (shaded blue) and cobalt-rich (shaded red) structure of an annealed cobalt-iron alloy. The high magnetostriction of the alloy is due to this structure and the nanoscale segregation.

Yi Cui, associate professor of materials science and engineering. (Credit: Linda A. Cicero / Stanford News Service)

OUTLOOK


APEC 2012 brings latest in power to Orlando

The Applied Power Electronics Conference and expo-sition (APEC) takes place at Disney Coronado Springs Resort, Orlando, FL, from February 5 to 9. It

should be typical balmy, sunshiny days to help offset the blues for engineers from the northern climes.

APEC 2012 will continue its tradition of addressing

Team demos control of magnetic thermal fluctuations using current

A team of researchers from the NIST Center for Na-noscale Science and Technology, the University of Muenster, and West Virginia University has dem-

onstrated control of magnetic thermal fluctuations us-ing current. This development promises insight into the complexity of spin current phenomena and suggests a route for controllably manipu-lating fluctuations in future magnetic nanodevices. The complete work, reported in the September 2 issue of Physical Review Letters, represents an important step to-ward manipulating the noise properties of magnetic nanosensors and memory devices.

The researchers measured the mag-netic fluctuations of a 2-µm-diameter disk of a NiFe alloy (permalloy) using microfocus Brillouin light scattering while a current passed through a sup-porting Pt strip. The current generated a spin current, which was injected into the permalloy disk through its back surface. While the electrons move through the Pt strip, they scatter differently, depending on each electron’s spin. The electrons with “up” spin scat-

ter slightly toward the top surface and the electrons with “down” spin scatter slightly toward the bottom.

This “spin Hall effect” drives a spin current, but not a charge current, into the bottom of the magnetic disk.

The researchers were able to show that the thermal fluctuations of the disk’s magnetization are sup-pressed if the injected spins are parallel to the magnet’s spins, and that the fluctuations are

strongly amplified if the injected spins and the magnet’s spins are antiparallel. By

changing the current down the Pt strip, the fluctuations were controllably re-duced to 0.5 times or increased to 25

times their thermal level. The measured population of the disk’s magnetic excita-

tions is different from a thermal distribu-tion, showing that the effect is not simply cooling or heating. This re-search gives an insight into the com-plexity of spin current phenomena

and suggests a route for controllably manipulating fluc-tuations in future magnetic nanodevices. For more infor-mation, call Robert McMichael at 301-975-5121.

Christina Nickolas

The team of researchers used microfocus Brillouin light scattering spectroscopy to study the interaction of spin current with magnetic fluctuations in a Permalloy microdisk located on top of a Pt strip carrying an electric current.

The alloy might also offer both size and processing ad-vantages over piezoelectric microdevices, says NIST mate-rials scientist Will Osborn. “Magnetorestriction devices are less developed than piezoelectrics, but they’re becom-ing more interesting because the scale at which you can operate is smaller,” he says. “Piezoelectrics are usually ox-ides, brittle and often lead-based, all of which is hard on manufacturing processes. These alloys are metal and much more compatible with the current generation of in-tegrated device manufacturing. They’re a good next-gen-eration material for microelectromechanical machines.”

To find the best mixture of metals and processing, the team fabricated hundreds of 10-mm-long test cantilever and coated them with a thin film of alloy, gradually vary-ing the ratio of cobalt to iron across the array of cantile-vers. The researchers found that by heating the alloy to annealing temperature and then quenching it, they cre-ated a delicate, heterogeneous, nanoscale structure in which cobalt-rich crystals were embedded throughout an

iron-rich crystal structure (see Figure 1).The best annealed alloy showed a sizeable magneto-

striction effect in magnetic fields as low as about 0.01 Tesla. Magnetostriction was determined by measuring the amount by which the alloy bent the tiny silicon can-tilever in a magnetic field,

According to team leader, Professor Ichiro Takeuchi of UMd, the results are lower than, but comparable to, the values for the best known magnetostrictive material (ter-bium-dysprosium-iron, or Tb-Dy-Fe) but with the advan-tage that the new alloy doesn’t use any rare-earth ele-ments, which are sometimes difficult to obtain. “Freezing in the heterogeneity by quenching is an old method in metallurgy, but our approach may be unique in thin films,” he observes. “That’s the beauty: a nice, simple technique, but you can get these large effects.” For further information, contact Ichiro Takeuchi at [email protected], or 301-405-6809.

Richard Comerford

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OUTLOOK


DesignCon 2012 begins Jan. 30

DesignCon will be held at the Santa Clara Conven-tion Center starting January 30, with the exhibits area opening the following day. A

hundred-plus exhibitors will vie for your attention as will eighty-eight 40-minute technical sessions with topic such as chip-level design for signal/power integ-rity, PCB design tools and methodolo-gies, and high-speed signal processing, equalization and coding.

Other important events include the daily keynotes held from 12 to 12:30. These include Ilan Spillanger, Vice Presi-dent of Hardware and Technology at Microsoft, on Mon-day; Prith Banerjee, Senior Vice President of Research and Director of HP Labs at Hewlett-Packard, on Tuesday; and Joe Macri, Corporate Vice President and CTO of the Client Division at Advanced Micro Devices, on Wednesday.

To give you a flavor of what the exhibit floor (open Tues-day and Wednesday 12:30 to 6:00 p.m.) will offer, here are just three of the products that will be on display:

The IT5 high-speed next-gen mezzanine connector se-ries from Hirose is structured with a helix contact inter-poser and a new, better-grounding BGA receptacle. It han-dles 25-Gbit signal lines. An embedded dc capacitor on the interposer will be also available for easy board routing. The company also has the IT-P high-power mezzanine connec-tor which provides 50 A with a safety guiding wall for UL 1977 and wide floating range features also available.

FCI will feature its high-speed backplane connector systems, high-speed I/O connections copper with optical

cable links, and Power SolutionsSM power distribution connectors and cable assemblies at DesignCon 2012. Visit

Booth #414 to see AirMax VSe high-speed backplane connectors, Mini-SAS HD high-speed cable link products, Pwr-Blade+ power distribution connectors, and more.

The folks from Rohde & Schwarz will be featuring their RTO series of oscillo-scopes that is said to have the lowest noise and highest dynamic range in their class. The instruments include a real-time spec-trum analysis function with 16 digital

channels that are all tightly synchronized to provide true multi-do-main signal analysis. The scopes also feature indus-try’s first real time digital trigger offers nearly zero trigger jitter in all modes and the instrument ac-quires up to 1 M wave-form acquisitions per sec-ond, which enables the capture of rare signal events.

Jim Harrison

FCI’s Mini-SAS HD high-speed cable link backplane connectors

The RTO series of oscilloscopes from Rohde & Schwarz

DesignCon 2012 will be held at the Santa Clara Conven-tion Center. The conference extends from January 30 to February 2. The exhibit hall is open Tuesday, January 31, and Wednesday, February 1, from 12:30 to 6:00 p.m.

immediate and long-term interests for the power elec-tronics engineer. Here’s your chance catch up and keep up to date with events in power. Include in that the per-sonal attention you get when you visit with the companies at their booths or talk one-on-one with presenters and technology ex-perts. Here is where you can gath-er insight into the trends with the details you need. You can hear speakers from the industry as well as hear what researchers in the universities are doing for the fu-ture designs and products.

The plenary session starts at 1:30 and finishes at 5:30 p.m. followed immediately by the exhibit hall welcome reception. The exhibit hours on Tuesday are from noon to 5 p.m. and 10:15 a.m. until 2 p.m. on Wednesday.

The education seminars include tracks on topologies and control, digital control, battery management, compo-nents, EMI and surge protection, and sustainable energy. There will be industry sessions that tackle energy harvest-ing, power in hybrid electric vehicles, design for reliabil-ity, LED lighting, Trends for ac-power loss of power mag-netics, power electronics for electric vehicles, system

design, nanotechnology applications, components and semiconductors, presentations on the electric grid.

The APEC lectures offer presentations on dc/dc con-verters, solar energy harvesting, lighting, inverters, converters, electric machines and drives, power supply on chip magnetics, power electronics, rectifier and inverter modeling, GaN and SiC applications, grid connected in-verter applications, EMI, model-ing and simulation, and ac/dc converters.

Poster sessions provide snap-shots of presentations with access to the authors. They will include posters investigating ac/dc converters, dc/dc converters, power electronics for utility interfaces, motor drives, system integration, modeling, renewable energy, vehicular electronics, packaging, and more.

APEC also provides some fun times for attendees. Wednesday night attendees with a social event ticket will be transported to Universal Orlando and have access to all the rides within The Wizarding World of Harry Potter area.

Paul O’Shea

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While you can’t always trust statistics — a wise man once said they should be used in an argument much the way that a drunkard uses a

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Gartner (Stamford, CT) expects U.S. sales of smartphones to grow from 67 million in 2010 to 95 million in 2011 and become the highest-selling consumer electronic device category.IDC (Framingham, MA) expects total smartphone sales in 2011 to reach 472 million across the globe, rising to 982 million in 2015. IMS Research (Austin, TX) is equally optimistic and expects smartphones to represent 28% of the 2011 mobile handset market, rising to half the market (and over 1 billion units) in 2016.So how does the trend toward

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MouserMobile: Your On-the-Go Resource for Parts and Information


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Displays

Changing the capacitive touch-sensing methodology

Bring the touch functionality of consumer electronics to industrial-grade displays can be highly challenging

BY MARK CAMBRIDGECEOZytronicwww.zytronic.com

The unbridled success of touch-enabled user interfaces in products such as smart-

phones, MP3 players, desk top monitors, and tablet computers over the last few years has been driven by the all-round perfor-mance and increased availability of projected capacitive touch sensors. Now manufacturers of industrial-grade equipment are keen to bring the same levels of touch function-ality to their products with small touch displays.

Achieving this functionality can be highly challenging when using the identical mutual capacitance sensing methodology currently used in consumer devices as the require-ments for durability and longevity are often very different and it can be a struggle to deliver the neces-sary overall robustness required for some applications. An alterna-tive projected capacitive sens-ing methodology is needed, which enables touchscreens to cope with harsher environ-mental conditions.

Touch sensor alchemyA very large proportion of por-table consumer touchscreens rely on indium tin oxide (ITO) as their active, conductive element. With its combination of good electrical conductivity and near invisibility when deposited as a thin film, this material has been widely used in display and touchscreen manufacture for many years and is well understood.

ITO’s ready availability has aided the explosive growth of the touch-

screen market, with Table 1 testify-ing to the current size and expected growth in this dynamic market. The combination of performance and availability has resulted in ITO be-coming the material of choice for

almost all consumer electronic touchscreen applications, initially with resistive, surface-capacitive, and now projected-capacitive touch sensor types.

Although these impressive fig-ures are dominated by the expected continued growth in portable con-sumer devices, other application

areas will inevitably be addressed. Until now, the ability for conven-tional ITO-based small-format, pro-jected capacitive touchscreens to make inroads into the more de-manding, industrial applications

has been hampered by the sensing mechanism it relied on.

For all its benefits — outperform-ing both conventional surface capac-itive and resistive alternatives — mu-

tual capacitive ITO sensors (where the capacitance be-tween two electrodes is mea-sured) exhibit relatively limit-ed through-glass performance. They are typically only capable of reliably detecting touch through overlays that are less than 2 to 3 mm thick, which cannot adequately protect the display from the more exact-ing physical strains found out-side the relatively trouble-free sphere of portable consumer design.

For ITO to make real head-way within more demanding

industrial applications, the domi-nant mutual capacitance sensing technique will not always be appro-priate. An alternative sensing tech-

2009 2010 2011 2012 2013 2014 2015

Shipments (million units) 607 800 987 1,161 1,341 1,538 1,735

Year on year growth (%) 29.6 31.8 23.3 17.6 15.6 14.7 12.8

Revenue (million $) 4,332 6,177 7,646 8,900 10,146 11,331 12,432

Year on year growth (%) 19 42.6 23.8 16.4 14.0 11.7 9.7

Source: 2010 Touch Market Analysis, DisplaySearch

Table.1: Touch module shipment and revenue forecast (2009-2015)

Displays

For all its benefits, mutual capacitive ITO sensors exhibit relatively limited through-glass performance. They are typically only capable of reliably detecting through overlays less than 3 mm thick, which cannot adequately protect the display from more

exacting physical strains


nique needs to offer the same levels of touch performance and functionality, but simultaneous-ly provide a far greater degree of ruggedness, handling high hu-midity levels, extremes of tem-perature, liquid ingress, and ex-posure to chemicals.

A new perspective The shortcomings of mutual capacitive screens based on ITO in industrial or other challenging applications can be overcome if, instead of bas-ing the sensing mechanism on mutual capacitance, a self-capacitance approach is used. Self-capacitance touch sensing measures the capacitance of a single electrode to ground, with the field generated by the user inducing alterations in the field around the sensor matrix.

Frequency modulation across the ITO electrodes (see Fig. 1) in the sen-sor matrix means that, when the us-er’s finger approaches the surface of the screen, a change in the waveforms

passing through the electrodes can be determined. By measuring where this change is most profound, the posi-tion touch event on the x and y axes can be accurately located.

Methodology benefitsDetecting picofarad-level changes in capacitance means this approach

Fig. 1: With the frequency modulation technique used in projected capacitive touch sensing, the frequency of the signal when the finger far from the sensor (red) decreases when the finger is close to the sensor (blue)

is extremely sensitive, and provides the touchscreen with greater dynamic z-axis (depth) touch control. This in turn allows activation to be tuned to respond to the lightest of touches, even through a heavily gloved hand, and through very thick overlays of glass, plas-tic and similarly non-con-ductive materials.

The greater through-glass performance of self-capaci-tance ITO sensors means they are far better suited to heavy duty use. In addition, with suitable touch control-lers and application software, gesture recognition and dual touch functionality can be

incorporated into a wide range of everyday industrial scenarios.

The benefits derived from ITO touch sensors using self-capacitance will allow small display and porta-ble industrial devices with more ro-bust user interfaces to enter the market.

Changing the capacitive touch-sensing methodologyDisplays

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RTOS facilitates MCU power management

Power-aware real-time operating systems take full advantage of available hardware facilities

BY ARVIND RAGHURAMANEmbedded Software EngineerMentor Graphicswww.mentor.comandMIGUEL MORALESMarketing ManagerStellaris ARM Cortex-MTexas Instrumentswww.ti.com

A pervasive trend in the embed-ded space today is the relent-less demand for increased end-

device functionality. The advent of 32-bit microcontrollers with en-hanced features such as network con-nectivity and advanced human-ma-chine interfaces has drastically increased the processing power and functional capability available to MCU-based devices. System designers today are taking advantage of this de-velopment to design fully functional, feature-rich applications. However, they still face challenges when it comes to optimizing devices to oper-ate within tight power budgets im-posed by battery life and heat dissipa-tion constraints of the system.

In order to help designers opti-mize systems for power-efficiency, silicon vendors provide various hard-ware facilities to optimize and man-age MCU power consumption. Pow-er-aware real-time operating systems, such as the Nucleus RTOS from Men-tor Graphics, take full advantage of these hardware facilities and provide built-in power management capabili-ties that enable developers to effec-tively drive MCU power consump-tion from application level. It’s important that system designers have a good understanding of what an RTOS can do for them for applica-tion-driven power management.

There are four key aspects to re-ducing MCU power consumption.

The first two — process technology and IC design — are managed by sili-con vendors. The last two — applica-tion-driven power management (en-abled by a power-aware RTOS) and system-level design (that is, the placement of other electronic com-ponents) — are under the control of the system designer.

Process technology/IC design for optimized powerProcess technology has traditionally been the means for reducing power consumption in an MCU, since shrinking a design and lowering its internal voltage yields significant savings. For example, TI’s Stellaris LM4F Cortex-M4 based microcon-

troller implemented in a 65-nm pro-cess balances high performance (up to 80 MHz plus an FPU) with good power efficiency (375 μA/MHz ac-tive, standby modes as low as 1.6 μA) to provide superior efficiency com-pared to previous generations.

Silicon vendors have developed innovative IC design techniques to create distinct power domains with-in the MCU and enable various low-power operating modes. This allows developers to shut down those sec-tions of the MCU that are not in use, based on the dynamic needs of the application.

Some architectures even inte-grate hibernate blocks with a com-pletely independent voltage domain from the rest of the microcontroller. These hibernate blocks enable very low power consumption by includ-ing only the minimum number of gates required (such as a low-fre-quency oscillator, a real-time clock, a small amount of RAM to save state, and a wakeup mechanism to exit from hibernate) to keep the system “breathing” on a backup battery.

A system will consume the most power in active state. The faster the system can complete its tasks and transition to a low-power mode, the more efficient it will be (see Fig. 1a). Transitioning to low-power

modes causes systems to suffer loss-es. The CPU takes time and power to transition between power modes (see Fig. 1b).

Developers can minimize mode switching losses by reducing switch-ing frequency. Silicon manufacturers further improve power efficiency by reducing the actual mode transition time. For example, the Stellaris LM4F microcontroller series supports wake times as fast as 500 μs. For ultra-low-power applications that can operate under 30 MHz, TI’s 16-bit MSP430 MCU family can achieve operation at less than 1 μA with a 5-μs wakeup.

Fig. 1: Silicon vendors have made significant progress in minimizing “wake time” to improve power efficiency.

Real-Time Operating Systems


RTOS facilitates MCU power managementReal-Time Operating System

The importance of a power-aware RTOSWith the addition of network con-nectivity and advanced HMI func-tionality, even simple applications are no longer single-threaded systems. To coordinate operation, as well as maxi-mize use of an MCU’s low-power ar-chitectural capabilities, applications need a power-aware RTOS.

An RTOS-based design provides two key advantages for developing power-efficient applications. First, the multi-threaded application model en-abled by using an RTOS provides an enabling framework to switch the system to low-power operating modes during system idle time. Second, a power-aware RTOS equips developers with proven, well abstracted, ready-to-use APIs for application-level con-trol of peripheral power states, system power states, and operating voltage and frequency.

Optimizing dynamic power consumptionDuring periods of low or no system ac-

Fig. 2a: Power savings achieved by

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Offered in a variety of package and tolerance options, Abracon’s 32.768kHz Precision Crystals & Oscillators are an essential part of virtually all timing applications. Abracon’s impressive track record of high reliability products for Automotive Electronics uniquely positions itself to offer low-cost, high quality devices for most Industrial and high

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tivity, the low-power modes provided by the MCU can be effectively exploit-ed by the operating system to achieve run-time power savings. In addition to switching the MCU to low-power mode, other power-hungry blocks present in the system can be transi-tioned to low-power operating states to maximize power savings.

For example, SDRAM modules can be put in self-refresh mode during long periods of inactivity. An OS scheduler can make intelligent deci-sions on the best low-power state to switch to, based on the expected sys-tem idle time and power cost of switch-ing in and out of the low-power state — as compared to the expected power savings.

Note that the calculated power sav-ings may not be fully realized if the CPU is frequently interrupted during idle time. Figure 2a illustrates the pow-er savings achieved by placing CPU in idle mode and SDRAM in self-refresh mode during system idle time.

Techniques such as OS tick sup-pression can be used to prolong the duration of CPU idle time, thereby multiplying idle-time power savings. Typical real-time kernels use a peri-odic OS tick timer interrupt to evalu-ate internal state and to make sched-

Fig. 2b: The Nucleus RTOS can provide a 50x reduction in tick frequency during periods of system inactivity.

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uling decisions. Tick suppression enables the kernel to dynamically change the time period of the OS tick timer interrupt based on the ex-pected idle time, enabling the sys-tem to stay in low-power modes for longer periods of inactivity. Figure 2b illustrates OS tick profiles with and without tick suppression enableFor longer periods of system inactivity, such as when a device can go into hi-bernation mode, RTOS systems will use any hibernate facilities provided by hardware to save and restore sys-tem state. Most applications require the peak processing capability of the

Fig. 3: Illustration of power savings achieved by system power state control.

underlying CPU for only a small percentage of its o p e r a t i o n a l time. Consider-

able power savings can be obtained using dynamic frequency and volt-age-scaling (DVFS) techniques. The system developer can make applica-tion-level decisions to pick an opti-mal operating point depending on the functionality required. A switch from one operating point to another requires: 1. all concerned peripherals be noti-

fied of the operating point change request

2. peripheral activity be stopped3. CPU clock, bus clocks, and periph-

eral clocks be changed for the new operating point

4. CPU and peripheral activity be re-sumedA power-aware RTOS should ab-

stract these details and enable the user to make application level DVFS decisions.

Optimizing static power consumption Static power consumption in a sys-tem can be directly attributed to the number of peripheral blocks that are active (clocked and powered ON) at a given point in time. Although pow-ering off peripherals that are not be-ing used sounds fairly simple, the implementation details of safely switching between peripheral power states during run-time in a multi-threaded environment could get complicated.

Power-aware RTOSes abstract these implementation details and enable developers to make high-level deci-sions on peripheral power states. Fig-ure 3 illustrates a hypothetical MP3 player leveraging Nucleus RTOS sys-tem power states to optimize static power consumption.

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Using a RTOS in multicore-based MCU designs

A real-time operating system provides a framework for multicore that can dramatically reduce time to market

BY JEAN J. LABROSSEFounder, President, and CEOMicriumwww.micrium.com

Recently introduced multicore-based MCUs have raised the complexity level of embedded

system designs. The use of an RTOS, however, provides a framework for multicore that can dramatically re-duce time to market.

RTOS fundamentalsA real-time kernel is software that manages the time of a CPU and en-sures that critical tasks are processed in a timely manner. The term “real-time operating system” (RTOS) is of-ten confused with real-time kernels; a kernel is actually a subset of an RTOS. An RTOS thus consists of a kernel and possibly such additional services as a file system (FS), a TCP/IP-stack, USB stacks (device and/or host), a graphical user interface (GUI), CANbus, and possibly other components.

A full-featured RTOS is generally not necessary for most embedded sys-tems and in fact, it’s quite possible to design a product using a subset of the services available from an RTOS. For example, a digital SLR camera might only use a kernel, an FS, a GUI, and a USB device stack.

Most 32-bit embedded designs would benefit from the use of a real-time kernel, given that a kernel offers a framework to build upon as well as the ability to split application code into smaller, more manageable chunks. The framework includes many useful services for the application program-mer such as multitasking; interrupt management, intertask communica-tion and signaling, resource manage-ment, time management, memory partition management, and more. Most kernels used for embedded sys-tems are “preemptive,” meaning that

the kernel always executes the most important task that is ready to run. Preemptive kernels are also event driv-en, which basically means that tasks are designed to wait for events to oc-cur in order to execute. For example, a task could wait for a timer to expire and another task can wait for a packet to be received on an Ethernet control-ler, or another for a character to be re-ceived on a UART.

Many embedded programmers shy away from using a kernel because they fear that kernels add too much complexity to their application. It turns out that you only need a hand-ful of services to get your project off the ground with a kernel. It is possible to write fairly complex multitasking application with the use of only five API functions out of the nearly 70 API calls offered by µC/OS-III, for exam-ple. You can thus build your kernel knowledge as you are bringing your application up.

Multicore in MCUsMicrocontrollers have traditionally been equipped with single cores. How-

ever, using NXP Semiconductors’ LPC4300 series as an example, there are Cortex-M4 and Cortex-M0 cores besides a full complement of peripher-als including an Ethernet controller, dual USB 2.0, quad UART, LCD con-troller, motor control PWM, timers, CAN 2.0, dual I2C, 10-bit ADC, 10-bit DAC, AES decryption, and an Inter Processor Communication (IPC).

This dual-core configuration is called asymmetrical multiprocessing (AMP) since the cores are not identi-cal. AMP is generally the preferred architecture when designing embed-ded systems, given the dedicated na-ture of such systems. Thus, unlike general-purpose computers that are used for different applications at dif-ferent times, embedded systems gen-erally have known functions at de-sign time.

Performance is the first thing one thinks about when considering the use of a multicore device, but, just as im-portant especially for battery-operated embedded systems, multiple cores al-low you to run your product slower and thus reduce the power consumption with basically the same performance as a single-core system running at a much higher frequency.

For the LPC4300, the Cortex-M0 is designed as a slave to the Cortex-M4. The Cortex–M0 core, used as an I/O controller, offloads I/O and interrupts from the Cortex-M4, which can be used, unbothered, to perform control algorithms (PID loops, state machines, etc.) and computationally intensive op-erations (audio compression/decom-pression, image processing, filtering, encryption, etc.). Figure 1 shows the re-lationship between the Cortex-M4 and the Cortex-M0 in the LPC4300 for a possible industrial control system.

NXP provides code for the IPC, but this does not preclude the use of other IPCs such as the one defined by the

Fig. 1: Industrial controller running on an NXP LPC4300.

Real-Time Operating Systems


Multicore Association called Multicore Communication Application Pro-gramming Interface (MCAPI).

MCAPI provides a lightweight and efficient communication stack. Com-munication is performed using chan-nels and a channel can be used to send scalars or packets. The transport mechanism for MCAPI is flexible and can be shared memory, I/O ports, or other on-board devices.

MCAPI, as well as tools to config-

ure and optimize multicore applica-tions, is available from third parties such as Polycore Software. Scalable to any number of cores, it should be con-sidered when migrating applications to different CPU architectures using a standard API instead of being locked into a vendor-specific one.

Multicore and RTOSsHaving multiple cores doesn’t render obsolete the need for an RTOS kernel as

shown in Fig. 1. A kernel is still highly desirable to make optimum use of both cores. In fact, in the above example, both cores run their own instance of the same or possibly different kernels to manage the multiple tasks.

Debugging a multiple-core system is certainly more complicated than a single-core system, but if you keep a clean separation of functionality be-tween cores then each can be de-bugged in isolation and possibly by different development teams. One team could work on the Cortex-M4 code and another on the I/O devices and then get together to integrate both pieces. Obviously, each team would have its own evaluating board so it could develop and test software sepa-rately prior to merging both pieces.

A kernel such as µC/OS-III allows a designer to determine CPU use on a per-task basis and thus better optimize the design by load balancing the tasks between cores. This load balancing would typically be done at design time as opposed to run time. In other words, having an RTOS kernel makes it easier to move functionality between cores.

Ideally, both cores would be identi-cal since that would allow both teams to use the exact same tools and kernel port. This would make development slightly easier since you would not have to deal with the slightly different cores. It’s quite possible that NXP and/or other semiconductor manufactur-ers will be introducing such devices in a not so far future. Also, it’s quite un-likely that these devices will be limited to only two cores. AMP is very scalable and in the coming years, we should see MCUs with many cores showing up on the market.

Multicore-based MCUs increase the complexity of embedded system de-signs but offers the benefit of increased performance as well as lower power consumption. Each core should use an RTOS to make better use of the CPU and its associated resources and func-tions. Intercore communication should be kept to a minimum to avoid interdependencies.

About the authorJean Labrosse is the founder, president, and CEO of Micrium and the creator of the µC/OS-III family of products. He has published several books including µC/OS-III, The Real-Time Kernel, avail-able as a free PDF download at www.micrium.com.

Real-Time Operating System Using an RTOS in multicore-based MCU designs


JANUARY 2012

36th AnnualProduct of the Year

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Analog DevicesADN3000-06/11Optical Receivers

Integrated Device Technology3LG Family ofCrystalFree CMOS Oscillators

International RectifierIR3550Buck Gate Driver

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LeCroy LabMaster 9 Zi-AModular Oscilloscope System

Linear TechnologyLTC5569Dual Active Downconverting Mixer

Maxim Integrated ProductsMAX44007 I MAX44009Digital Ambient-Light Sensor ICs

MEMSIC MXC6226XC MEMS Thermal Accelerometer

National InstrumentsPXIe-566514-GHz PXIe VSA

PlesseyEPIC PS25x01 SeriesElectric-potential Sensors

Quantenna CommunicationsQHS710802.11n 4x4 MIMO Chipset

Samsung Electronics LCD Business22-in. Transparent Color LCD Panel

SandForceSF-2200SSD Processor

TE ConnectivityMHP30-36Metal Hybrid PPTC Circuit Protection

TE Connectivity PlanarMag E2101 10/100 Ethernet Media Filter

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Crystal-free oscillators finally

enable quartz device

replacement

36th AnnualProduct of the Year Awards

As semiconductor technology contin-ues to advance, the limitations of quartz technology do not scale well

High-speed optical receiver ICs integrate photodiode

The industry’s first commercially avail-able 6- and 11-Gbit/

s integrated opti-cal receivers, the

ADN30 0 0 - 06 and ADN3000-

11, consume only 65 mW from a sin-

gle 3.3-V power supply while offering typical sensitivity of -19 dBm OMA (optical modulation amplitude) at 6 Gbits/s and –17 dBm OMA at 11 Gbits/s. The 0.84 x 0.68 11-pad die-packaged devices include the detector, tran-simpedance amplifier, and power monitor.

Manufactured on ADI’s XFCB high-speed complementary bipolar process on bonded SOI, the ICs significantly reduce system component count and cut power consumption by at least half, as compared to current solutions. The devices cost only $3.95 and $5.95 each in 1,000 quantities. They are wavelength agnostic and work across all key optical wavelengths, including 850, 1310, and 1550 nm. With their monolithic approach, they have a ful-ly characterized interface between the photo detector and the transimped-ance amplifier, so designers don’t have to worry about bond wires interac-tions. Analog DevicesWilmington, MASales 800-262-5643www.analog.com

60-A power stage is cool-running,

targeting next-gen servers

The IR3550 PowIRstage is a synchro-nous buck gate driver with an inte-grated synchronous MOSFET, and a Schottky diode available in a 6 x 6 x 0.9-mm PQFN package. It targets high-current multiphase buck regu-lators and simplifies dc/dc converter design for next-generation servers, storage, and communication sys-tems.

The gate driver delivers the high-est benchmarked efficiency in the marketplace for high current multi-phase solutions and it does it at the highest useful current rating of 60 A.

This allows customers to: 1. Increase the main CPU dc/dc efficiency sig-nificantly, saving energy and total cost of ownership or, 2. Meet a simi-lar efficiency to previous generations but without a heat sink, saving space and cost; or 3. Meet a similar effi-ciency to previous generations but with at least one, possibly two fewer phases (For example, converting a six-phase design to a five- or even four-phase design) because of the high current-handling capability

The MOSFET device achieves up to a 97% efficiency at 1.2 V, has an input voltage range to 25 V, and out-put range from 0.25 to 3.3 V, and a switching frequency up to 1.0 MHz. It inte-grates a current-sense amplifier and features a synchronous di-ode-emulation that removes the zero-current detection and control burden from the PWM controller. The layout of the IR3550 allows few-er decoupling capacitors compared to other monolithic and multichip devices that perform a similar func-tion. IR shows cases where the heat is removed from the printed circuit board, without airflow or a heatsink required, and to prove this capabili-ty, the company provides reference designs comparing the IR3550 to competitive devices using the exact same size, copper thickness, stackup, and via configuration.International RectifierEl Segundo, CASales 310-252-7105www.irf.com

in price, size, fre-quency, capacity, and lead-time like silicon-based technology does. Leveraging semi-conductor econ-omies of scale to enable high performance, low price, and short lead time, the 3LG family of CrystalFree CMOS oscillators (see www2.electronicproducts.com/Low_power_CMOS_oscillator_offers_50_ppm_frequency_accuracy-article-hlcn03_dec2011-html.aspx) feature a breakthrough 50-ppm frequency ac-curacy while replacing traditional quartz crystal-based oscillators for up to 75% power savings in a broad range of applications, including computing, communications, and consumers products.

They generate stable frequencies up to 125 MHz and offer high-per-formance phase jitter of less than 1 ps over the wide frequency offset of 12 kHz to 20 MHz. In addition, they are the only technology and product capable of replacing active XOs and passive XTALs as both packaged de-vices and die.Integrated Device TechnologySan Jose, CASales 408-284-8200www.idt.com

MEMS-based device brings the feel of a real joystick to mobile devices

It’s no surprise that one of the more popular pastimes for the owners of smartphones and tablets is playing electronic games — think Angry Birds — and serious gamers are eager


36th Annual Product of the Year Awards

Oscilloscope system rises above the pack, to 45 GHzAmong top oscilloscopes manufactur-ers, there has rarely been a time when one has been ahead of its competition for long. But in the past year, the introduction of a new oscilloscope by LeCroy has left oth-ers far behind. Not only does the LabMaster 9 Zi-A provide a band-width — 45 GHz — that is about 50% greater than what its competition can offer, but it also provides the highest

to embrace mobile technology too. The problem is, the touch interface such devices rely on is awkward; your fingers are likely to get in the way of the action. And while some hand-held devices are employing optical sensors, their lack of physical feed-back slows down reaction times.

Enter the KJ-33000 from Knowles Acoustics — an ultra-low-power MEMS-based joystick in a package that’s only 9.8 x 9.8 x 1.6 mm. The device converts the joystick button movement — up to 1 mm from its

center — into two 4-bit digital values representing X and Y displacements, while giving the user the feel of a real stick with 360° variable-speed scrolling and navigation.

To support hours of play and work, the KJ-33000 has been de-signed to operate at extremely low power. Its current consumption is only 40 μA during active mode and a

mere 3 μA in sleep mode. That re-duces battery drain by a factor of 25 compared to optical joysticks and by 200 compared to Hall-effect sensors.Knowles, Itasca, ILInformation [email protected]

sample rate of 120 Gsamples/s, and can be configured with as many as 20 full-performance channels. This con-figurability seriously lowers the cost of multichannel oscillography, while earning the instrument the right to truly be called a modular oscilloscope system.

The 9 Zi-A accomplishes all this with a system architecture that sepa-rates the oscilloscope signal acquisi-tion function from the display, con-trol, and processing functions. Master acquisition modules contain the display and control, as well as a single acquisition module, while ser-vant acquisition modules contain add-on acquisition systems. Chan-nelSync technology enables the mas-ter and servants to synchronize per-fectly, and a server-class CPU is in a third module provides processing power for the immense amounts of data the system can collect.

The scope’s higher bandwidth is not merely an engineering tour de force; it is needed by engineers devel-oping and installing systems with the high data rates demanded by cloud computing and mobile com-



Ambient-light sensors raise bar on power consumption and dynamic range

Digital ambient-light sensors (ALS) control backlighting in LCD displays

Accelerometer follows different

path to shrink size, increase rugged-ness, and more

Accelerometers have become a mainstay in con-sumer electron-ics, turning up in devices from s m a r t p h o n e s and tablets to kids’ toys and steam irons. So for a new company to make headway in a market dominated by large players, it has to offer something unique and truly valuable. The MEMSIC MX-C6226XC MEMS-based dual-axis ac-celerometer does both, in spades.

The monolithic sensor is built us-ing the manufacturer’s proprietary MEMS thermal accelerometer tech-nology and wafer-scale packaging

High-performance VSA moves into

PXIe realmTraditionally, the highest perform-ing instruments have always been monolithic, box instruments, be-cause trying to get high-speed perfor-mance from a rack of card-modules con-nected by a copper back-plane has been a stumbling block. The NI PXIe-5665 14-GHz three-stage RF vector signal analyzer (VSA) upsets that tradition by outperform-ing box VSAs in several areas, at the same time significantly reducing the cost of such instrumentation.

The modulular VSA’ exceptionally low phase noise of −129 dBc/Hz at a 10-kHz offset at 800 MHz, and an av-erage noise level of −165 dBm/Hz, are backed by other high-performance specifications such as an industry’s best third-order intercept point of 24 dBm with an absolute amplitude ac-curacy of ±0.10 dB, as well as error vector magnitude of 0.33% for a 256-QAM modulated signal.

The VSA has a multicore comput-ing architecture and uses NI Lab-VIEW to employ its parallel program-ming capabilities. It also offers

Dual-broadband RF mixer enables 4G MIMO multimode

receivers by drawing 300 mW/ch

In order to make LTE, a 4G (fourth-genera-tion) high-data-rate wireless technology attractive to the car-rier for deployment,

basestation manufacturers worldwide are trying to build a multiband, multi-mode platform that is easily field con-figured for use in any frequency band and standard to make the deployment cost attractive. The 26.8-dBm IIP3 LTC5569 dual-broadband RF mixer ac-complishes this by combining 26.8 dBm IIP3, 300mW/ch, and a wide 300-MHz to 4-GHz frequency range (see www2.electronicproducts.com/26_8_dBm_IIP3_dual_broadband_RF_mix-er_draws_300_m W_charticlehlcn07_jul2011-html.aspx).

So a receiver such as that based on the LTC5569, is capable of working in all of the 700-MHz, 880-MHz, 1.7-GHz, 1.8-GHz, 1.9-GHz, 2.4-GHz, and 2.6-GHz bands. In addi-tion, within each band, the receiver must receive signals that are 60 MHz wide, compared to the previous 20 MHz wide — without sacrificing per-formance. The LTC5569 meets both of these requirements with outstand-ing performance. Linear Technology , Milpitas , CA Sales Office 408-428-2050 www.linear.com

(WLP), a combination that produces a very small, rugged device. At 1.2 x 1.7 x 1.0 mm, it is the smallest MEMS accelerometer now in production. And while other accelerometers may withstand shocks to 10,000 G, the MEMSIC device holds up under 50,000-G shocks. As a point of refer-ence, a 10,000-G shock can be gener-ated by simply banging a product on a desktop; imagine how many G’s an angry kid can generate by throwing his electronic toy at a wall.

The monolithic IC includes all the electronics needed for signal conditioning as well as an embedded microprocessor core to provide pro-grammability and an 8-bit digital output. And did I mention that, at $0.35 in OEM quantities, it’s also the lowest-priced accelerometer on the market today?MEMSIC, Andover, MAInformation [email protected]

munication. These designers really need affordable multichannel scopes with the highest bandwidths, and they won’t find a comparable instru-ment anyplace else.LeCroy, Chestnut Ridge, NYCustomer Care Center 800-453-2769www.lecroy.com

that are used in tablets, smart-phones, and TVs. Manufacturers today not only continue to strive for lower power with a wider dynamic range, but they are also trying to improve spectral re-sponse to closely match the human eye for accurate light measurements, especially when the top display glass is tinted or dark in color. As a solution to this concern, the MAX44007/MAX44009 digital ALSs cut power consumption by over 100 times that of the nearest competitor (124 μW).

The sensors feature an integrated adaptive-gain block that automati-cally selects the optimum gain range. The MAX44009 can measure light levels from 0.045 lux to 188,000 lux, yielding a dynamic range of more than 4,000,000 to 1. High sensitivity becomes important when these sen-sors are put behind black glass in products. The black glass attenuates almost 90% of the light. The signal is reduced almost by a factor of 10, and high sensitivity is needed to get a better result.Maxim Integrated ProductsSunnyvale, CACustomer Service [email protected]


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Electric-potential sensor offers

fundamentally new measurement

approachBased on technology licensed from the University of Sussex, U.K., the EPIC (electrical potential integrated

peer-to-peer data streaming for sig-nal processing and a flexible MIMO architecture for phase-coherent mea-surements. Priced starting at $49,999, typical configurations cost about a third less then monolithic instru-ments.National InstrumentsAustin, TXInformation [email protected]/

circuit) PS25x01 series sensors are the first to measure changes in an electric field much as a magnetometer detects changes in a magnetic field, requiring no physical or resistive con-tact to take readings. As such, the sen-sors enable all sorts of new products, the first being medical de-vices that are simply held close to a pa-tient’s chest, without wetting or shav-ing off hair, to obtain a detailed ECG.

Traditional laboratory electrome-ters and field mills have issues that prevent their widespread use in elec-tric potential sensing. Unlike them, EPIC technology works at normal room temperatures and functions as an ultra-high-input impedance sen-sor, using active feedback techniques to both lower the effective input ca-pacitance of the sensing element and boost its input resistance. in effect, it is a near-perfect voltmeter, highly stable and able to measure tiny changes in an electric field down to milliVolts.

The basic sensor technology itself has great potential. It could enable de-vices that can see through walls, con-trol artificial limbs from a simple pad on the skin’s surface, and detect eye muscle movements for new human-machine interfaces, all without the need to implant electrodes. Further, the sensor’s ability to detect move-ment over distances ranging from a few centimeters to several meters en-ables applications in security systems and for proximity control of lighting and other electric appliances. Plessey SemiconductorsPlymouth, U.K.Sales [email protected]

4x4 MIMO chipset with digital dynamic

beamforming enables wire-like performance for challenging home

environmentsUnleashing a new realm of wireless video distribution that promises to transform the way millions of people transmit, share, and watch HDTV in the home, the Quantenna QHS710

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Color LCD is transparently

uniqueThe transformation of the computer/television display from cathode-ray tube to solid-state device has brought many new attributes to viewing technology; larger and thinner screens, more detailed and colorful images, and better and more varied touch control. But now a new LCD technology has created a display characteristic never before seen in this space: transparency. At the same time, the display is actually more friendly to the environment than previous devices.

The Samsung Transparent Color Liquid Crystal Display Panel lets viewers see through a vivid-color, high-definition still or video to whatever is behind it, and to interact with the display through a transpar-ent touch screen. Initially available in a 22-in. size, larger versions, to 46 in., are also available now. Due to its light weight, the panel is easy to at-tach to other glass surfaces. Another bonus of the design is that the panel uses only about 90% of the power consumed by conventional backlit LCD panels, allowing it to operate wirelessly on solar-replenished bat-tery power.

In addition to notebook PCs, it is expected that the transparent dis-play will be used in a variety of new applications, such as on coolers or commercial freezers in supermar-kets, on vending machines, in vari-ous touch-accessed retail storefront showcase applications, for “smart” windows in homes or offices, or as interfaces to interactive museum dis-

solution was offered as the first fully compliant 802.11n chipset with 4x4 MIMO, dy-namic digital beamforming, and support for four spatial streams with unequal mod-ulation. Support for four spatial streams with un-equal modulation per stream enables up to 600 Mbit/s PHY data rates and best-in-class performance.

Support for low-density parity check (LDPC) en-ables efficient error cor-rection coding for superi-or coverage and improved range. The QHS710 chip-set has a wide variety of interfaces including dual RGMII/MII, PCI-e, and SPI flash, and its dual embed-ded ARC processors pro-vide full wireless Media

Access Control (MAC) and network processing support.Quantenna CommunicationsSunnyvale, CASales [email protected]

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SSD processor accelerates newest drives

The second-generation SandForce SF-2200 SSD processor features a 6-Gbit/s SATA host interface with an unprecedented sustained sequential read and write performance of 500 Mbytes/s. The chip targets SSDs used in client computing applications and supports state-of-the-art high-

speed ONFi2, and Toggle flash interfaces in single-level and multi-level cell NAND flash SSDs, and has enabled a num-ber of new SSDs to attain new performance milestones this past year.

The IC also provides trusted Computing Group OPAL se-curity with 256-bit AES encryption and automatic, line-rate double encryption with a drive-level password. It has an ad-vanced ECC engine correcting up to 55 bits per 512-byte sector to assure high data integrity. The IC optimizes writes to the flash and highly intelligent block management and wear leveling extends flash endurance. PCB layout using the SF-2200 is also enhanced because external DRAM is not needed. SandForce has set a new standard for flash interface. I wonder what the next year will bring.SandForce, Milpitas, CAOEM Sales 408 [email protected]

Best features of bimetal breaker, PPTC device protect

battery-based toolsThe MHP30-36 is a metal hybrid polymeric positive tem-perature coefficient (PPTC) device that combines a bimetal protector in parallel with a PPTC device. The hybrid device offers 30-A hold current and an initial resistance of less than 2 mΩ. The PolySwitch (PPTC) polymeric positive temperature coefficient provides resettable overcurrent, overtemperature protection. The PolySwitch PPTC device

is a conductive polymer-based thermistor. It is characterized by either negative temperature coef-ficient behavior (NTC) where the resistance of the device decreases with temperature, or positive tem-perature coefficient (PTC), behav-ior where the device resistance in-creases with temperature. The

PPTC is made from a composite of semi-crystalline poly-mer and conductive particles.

The MHP (Metal Hybrid PPTC) device combines a bi-metal protector and a PolySwitch PPTC device. This com-bination incorporates the best features of a bimetal break-er and PPTC and allows the PPTC technology to be used

plays. In reality, potential applications for this new tech-nology are only limited by the designer’s imagination.Samsung Electronics LCD Business, San Jose, CAInformation 866-726-4249www.samsung.com/us/business/oem-solutions/lcdpan-els/index.html Superior Solutions

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An IR temperature sensor that opens up new apps

In today’s smartphones, no contact-type sensor can be built in to measure case temperature because of assembly con-straints, and contact-less solutions have been too large and, at prices greater that $5 in high volumes, cost-prohibitive. Housed in a 1.6 x 1.6 x 0.625-mm WCS package, the TMP006 MEMS-based infrared temperature sensor changes that by offering a low-cost, easy-to-add solution for monitoring case temperature. The device can not only provides greater safety and better system performance, but it opens up a range of new possi-bilities for cellular devices.

The highly integrated device — it incorporates a complete thermopile sensor, signal conditioning, analog-to-digital converter, and local temperature and voltage references on a single monolithic IC — can monitor the passive infrared energy radiated by any object in front of it without physi-cal contact. Thus the sensor can let consumer electronics products measure temperature in the real world. For ex-ample, if placed in smartphone adjacent to the camera module, the sensor transforms the phone into a complete

A component that marks the end of

hand-wound coils in datacomToday, magnetic coils used for inductors and transformers are traditionally wound by people, either by hand or by winding machines that people control. Consistency var-

ies depending on the ex-pertise of the workers, and variations in the work force has lead to extensive prod-uct supply shortages and quality issues. As a result,

the datacom industry, which has relied upon such coils for its current high-speed data products, is looking for a new coil solution that will let it advance reliably to high-er, multi-gigahertz rates. Which is where the PlanarMag E2101 Ethernet single-port media filter comes in.

The E2101 is a 10/100-MHz device that, for the first time, eliminates the hand-wound coils by embedding lithographically encoiled magnetic ferrites into an FR4 substrate and enclosing it into a small surface-mount package. This filter, the first in a series of high-speed-data-communication devices, can be placed on a printed circuit board adjacent to a high-speed data interface, or even integrated into a complete RJ-45 connector. While the process by which these devices are made is similar to the way in which semiconductors are manufactured, it is a tightly kept secret, surrounded by numerous patents both granted and pending. But the proof of its effective-ness is available to anyone today in the E2101.TE Connectivity, Harrisburg, PAProduct Information Center 800-522-6752www.te.com/planarmag

in higher current applications. The MHP device can be useful in dc-rated designs that require arc-suppressed, latched, high-current protection. The resettable MHP30-36 device provides excellent arc suppression characteris-tics compared to standard breaker devices that must limit the number of switching cycles since arcing between con-tacts may damage them. During normal operation, be-cause contact resistance is very low, most of the current goes through the bimetal. When the contact begins to open, contact resistance increases quickly. If the contact resistance is higher than the PPTC device’s resistance, most of the current goes to the PPTC device and no (or less) current remains on the contact, therefore preventing arcing between the contacts. When current shunts to the PPTC device, its resistance rapidly increases to a level much higher than the contact resistance and the PPTC heats up. After the contact opens, the PPTC device starts to heat up the bimetal and keeps it open until the over-current event ends or the power is turned off.

The MHP device is used for high-power Li-ion technol-ogy such as portable or motive applications including cordless power tools, medical devices, and e-bikes. In ad-dition, customer interest in the core MHP technology has led to some extensions of the technology to create three-terminal MHP devices that enable external electronic ac-tivation of the device via a signal line.TE Circuit Protection GroupMenlo Park, CATechnical assistance 800-227-7040www.circuitprotection.com


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• Heavy Loads and Actuators

Applications

10328Cwww.irf.com 07-11 | 10969A

Untitled-8 1 12/12/11 12:55 PM

SupIRBuck® Online Design Tool Simplifies Design

Comprehensive online design tool featuring parametric search, schematic capture, AC, Steady State, Transient Analysis, Thermal Analysis, BOM creation, and more…

The IR Advantage

• Best-in-class efficiency over entire load range

• Common series footprint enables “cut and paste” design, and scalability allowing for faster time to market

• Integrated solution offers high power density with reduced component count and improved performance

• Single stage POL conversion saves energy, size and cost by eliminating the need for an intermediate bus

• Low profile and excellent thermal performance allows for back-side board mounting for additional space savings

• Wide input and output voltage range(s) maximizes appeal for broadest range of applications

Integrated Voltage Regulator Product Offering

Design Configuration SimulationPCB Layout and

Thermal Analysis SummaryDesign Requirements

mypower.irf.com/supirbuck

1 - 16V 1.5 - 21V 3 - 27V

5V bias required Integrated LDO 5V bias required

1-4A IR3843W IR3897* IR3853

4-6A

IR3842 IR3839* IR3863 IR3473

IR3842W IR3898* IR3856

IR3832W*

6-10A

IR3831W* IR3838* IR3859 IR3475

IR3841 IR3899* IR3865

IR3841W

10-15AIR3840 IR3837* IR3476

IR3840W IR3477

15-35AiP1827

iP1837*DDR Tracking

15 35Current (A)

SupIRBuck®

1-10A

2-15A

12-35A

iPOWIR ®

Size(mm)

7.7x7.7

5x6

4x5

IR3840 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---

IR3841 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---

IR3842 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---

IR3840W 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---

IR3841W 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---

IR3842W 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---

IR3843W 5x6mm 2 16 5 0.7 PWM Y Y --- --- --- ---

IR3831W 5x6mm 8 16 5 0.7 PWM --- Y --- --- Y ---

IR3832W 5x6mm 4 16 5 0.7 PWM --- Y --- --- Y ---

IR3837 5x6mm 14 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---

IR3838 5x6mm 10 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---

IR3839 5x6mm 6 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---

IR3859 4x5mm 9 21 5 0.7 PWM Y Y Y --- --- Y

IR3856 4x5mm 6 21 5 0.7 PWM Y Y Y --- --- Y

IR3853 4x5mm 4 21 5 0.7 PWM Y Y Y --- --- Y

IR3899 4x5mm 9 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y

IR3898 4x5mm 6 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y

IR3897 4x5mm 4 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y

iP1837 7.7x7.7mm 35 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y

iP1827 7.7x7.7mm 25 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y

IR3473 4x5mm 6 27 5 0.5 COT* --- Y --- --- --- Y

IR3475 4x5mm 10 27 5 0.5 COT* --- Y --- --- --- Y

IR3476 5x6mm 12 27 5 0.5 COT* --- Y --- --- --- Y

IR3477 5x6mm 15 27 5 0.5 COT* --- Y --- --- --- Y

IR3863 4x5mm 6 21 5 0.5 COT* --- Y --- --- --- Y

IR3865 4x5mm 10 21 5 0.5 COT* --- Y --- --- --- Y

* Constant On Time control offers improved light load efficiency

Part

Numbe

r

Pack

age

size

Max

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[A]

Max

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[V]

Vbia

s [V]

Vref

[V]

Cont

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tart

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Mar

gini

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DDR Tr

ackin

gOve

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tage

Prot

ectio

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Untitled-8 2 12/12/11 12:55 PM

SupIRBuck® Online Design Tool Simplifies Design

Comprehensive online design tool featuring parametric search, schematic capture, AC, Steady State, Transient Analysis, Thermal Analysis, BOM creation, and more…

The IR Advantage

• Best-in-class efficiency over entire load range

• Common series footprint enables “cut and paste” design, and scalability allowing for faster time to market

• Integrated solution offers high power density with reduced component count and improved performance

• Single stage POL conversion saves energy, size and cost by eliminating the need for an intermediate bus

• Low profile and excellent thermal performance allows for back-side board mounting for additional space savings

• Wide input and output voltage range(s) maximizes appeal for broadest range of applications

Integrated Voltage Regulator Product Offering

Design Configuration SimulationPCB Layout and

Thermal Analysis SummaryDesign Requirements

mypower.irf.com/supirbuck

1 - 16V 1.5 - 21V 3 - 27V

5V bias required Integrated LDO 5V bias required

1-4A IR3843W IR3897* IR3853

4-6A

IR3842 IR3839* IR3863 IR3473

IR3842W IR3898* IR3856

IR3832W*

6-10A

IR3831W* IR3838* IR3859 IR3475

IR3841 IR3899* IR3865

IR3841W

10-15AIR3840 IR3837* IR3476

IR3840W IR3477

15-35AiP1827

iP1837*DDR Tracking

15 35Current (A)

SupIRBuck®

1-10A

2-15A

12-35A

iPOWIR ®

Size(mm)

7.7x7.7

5x6

4x5

IR3840 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---

IR3841 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---

IR3842 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---

IR3840W 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---

IR3841W 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---

IR3842W 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---

IR3843W 5x6mm 2 16 5 0.7 PWM Y Y --- --- --- ---

IR3831W 5x6mm 8 16 5 0.7 PWM --- Y --- --- Y ---

IR3832W 5x6mm 4 16 5 0.7 PWM --- Y --- --- Y ---

IR3837 5x6mm 14 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---

IR3838 5x6mm 10 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---

IR3839 5x6mm 6 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---

IR3859 4x5mm 9 21 5 0.7 PWM Y Y Y --- --- Y

IR3856 4x5mm 6 21 5 0.7 PWM Y Y Y --- --- Y

IR3853 4x5mm 4 21 5 0.7 PWM Y Y Y --- --- Y

IR3899 4x5mm 9 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y

IR3898 4x5mm 6 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y

IR3897 4x5mm 4 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y

iP1837 7.7x7.7mm 35 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y

iP1827 7.7x7.7mm 25 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y

IR3473 4x5mm 6 27 5 0.5 COT* --- Y --- --- --- Y

IR3475 4x5mm 10 27 5 0.5 COT* --- Y --- --- --- Y

IR3476 5x6mm 12 27 5 0.5 COT* --- Y --- --- --- Y

IR3477 5x6mm 15 27 5 0.5 COT* --- Y --- --- --- Y

IR3863 4x5mm 6 21 5 0.5 COT* --- Y --- --- --- Y

IR3865 4x5mm 10 21 5 0.5 COT* --- Y --- --- --- Y

* Constant On Time control offers improved light load efficiency

Part

Numbe

r

Pack

age

size

Max

Iout

[A]

Max

Vin

[V]

Vbia

s [V]

Vref

[V]

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Untitled-8 3 12/12/11 12:55 PM

Integrated POL Voltage RegulatorProduct Selection Guide

Product Line Overview

Integrated design platforms that enable customers to add energy-conserving features that achieve lower operating energy costs and manufacturing Bill of Material (BOM) costs.

• Appliances

• Audio

• Display

• Industrial

• Lighting

• SMPS

Product Line

Energy Saving Products

Optimized power management sys-tem solutions that deliver bench-mark power density, efficiency and performance in enterprise power.

Enterprise Power

Automotive grade power manage-ment solutions qualified to meet the needs of 12V, 24V and HEV/EV appli-cations with a zero defect goal.

Automotive

IR continues to lead the industry by offering power MOSFETs with the lowest RDS(on) and widest range of packages up to 250V for a diverse range of applications.

Benchmark MOSFETs

Our discrete components, complex hybrid power module assemblies and rugged DC-DC converters uti-lize leading-edge power technology which, together with demanding environmental specifications help engineers to meet their toughest design challenges.

HiRel

• Servers

• Storage Networks

• Switchers & Routers

• Workstations

• Notebooks

• Game Stations

• Set-Top Box

• Audio

• Computing

• Communications

• Motor Control

• Power Supply

• Synchronous Rectification

• Space

• Military

• Commercial Aviation

• Rugged Industrial

• Medical

• DirectFET®plus

• Low-Voltage ICs

• SupIRBuck ®

• iPOWIR ®

• PowIRstage ®

• CHiL Digital Controllers

Automotive Qualified:

• HEXFET® Power MOSFETs

• Intelligent Power Switches

• Driver ICs

• IGBTs

• DirectFET®2

• Discrete HEXFET® MOSFETs

• Dual HEXFET® MOSFETs

• FETKY®

• RAD-Hard MOSFETs

• Power Modules/Hybrid Solutions

• Motor Control Solutions

• DC-DC Converters

• Digital Control ICs

• High-Voltage ICs

• IGBTs

• IRAM Integrated Power Modules

• MERs

Key Products

• AC and DC Motor Drives

• Powertrain / Engine control

• Body Electronics

• Lighting

• Class D Audio

• Heavy Loads and Actuators

Applications

10328Cwww.irf.com 07-11 | 10969A

Untitled-8 4 12/12/11 12:55 PM


Stacked silicon interconnect

technology yields huge FPGA

The Xilinx Virtex-7 2000T field-pro-grammable gate array is the world’s highest-capacity pro-grammable logic device. It has 6.8 billion transis-tors and 2 million logic cells equivalent to 20 million ASIC gates. This capacity is made possible by stacked silicon interconnect tech-nology, or what’s known as 2.5D IC stacking. The FPGA uses through-hole vias and an interposer.

The devices silicon interposer lay-er acts as a sort of microcircuit board in silicon on which multiple die are set side by side and interconnected. SSI technology avoids the power and reliability issues that can result from stacking multiple dies on top of each other. Engineers are using the 2000T FPGA to replace large capacity ASICs and for the all-important prototyp-ing and emulation of advanced ASIC designs. Having a large ASIC simu-lated in one FPGA chip increases timing accuracy and thus reduces the risk of very costly re-spins.

The price of this device has not been released - but you can be as-sured this chip is not what you would call “low cost.”Xilinx, San Jose, CASales 408-559-7778www.xilinx.com

Driving GaN FETs becomes reality

The National LM5113 is the industry’s first 100-V half-bridge gate driver opti-mized for use with enhancement-mode GaN power field-effect transis-tors (FETs) in high-voltage power converters. This is significant because GaN FETs have an absolute maximum gate-to-source voltage rating of 6 V. Any voltage above this value will dam-age the device. GaN FETs also have a low threshold voltage that could be

triggered during transient events that, through PCB parasitic, could cause the device to prema-turely turn on and cause dam-age. This device

includes a low-impedance gate drive source, which helps to minimize this false triggering.

The device is a highly integrated high-side and low-side GaN FET driver that reduces component count by 75% and shrinks PCB area by 85% com-pared to discrete driver designs. The half-bridge gate driver meets the strin-gent requirements of enhancement-mode GaN FETs. Using proprietary technology, the device regulates the high-side floating bootstrap capacitor voltage at approximately 5.25 V to op-

Boosting extremely low power makes energy harvesting

very attractiveThe bq25504 boost charger IC pro-vides a simple innovative solution in a single IC for boosting power for en-ergy-harvesting applications. It solves several energy-harvesting is-sues customers have been struggling

with, and that have prevent-ed them from offering end e q u i p m e n t that fully use e ne r g y- h a r-vesting capa-bilities. The

boost charger manages the micro-watts to milliwatts of power generat-ed from a number of sources, such as solar, thermal electric, electromag-netic and vibration, and stores the extracted energy in various storage elements, including Li-ion batteries and super capacitors. It includes cir-cuitry to protect the energy storage element from over voltage and under voltage conditions, and to kick-start the system when the battery is deep-ly discharged. Other specs include a power range from 5 μW to 300 mW, The boost charger increases the us-able harvested energy 30% to 70% in a solar panel compared to a linear regulator, to power a handheld de-vice operating in indoor light condi-tions. It has a 330-nA typ quiescent current and a conversion efficiency of >80%. The programmable device can be used with a variety of energy sources and energy storage elements, such as different battery chemistries or super capacitors, and features a 330-mV cold-start voltage.

The boost converter interfaces to various energy sources such as ther-moelectric generators, electromag-netic coils, single photovoltaic cells,

and infrared emitters. The device does not distinguish between imped-ance of sources as it modulates the ef-fective impedance of the energy transfer circuitry to regulate the in-put voltage to the sampled reference voltage and effectively maximizes the power extracted from the energy source. Some solutions on the market have essentially half the function of the bq25504 without the optional full-wave rectifier, which means a regulation and battery charging cir-cuit is still needed. This 9-mm2 de-vice has all the specs to aid your en-ergy-harvesting designs but add to that the very competitive price and minimal supporting parts needed, in-cluding the Li-ion cell, an inductor, resistors, and capacitors, and you’re looking at a very attractive sum of about $5 for the whole BoM.Texas InstrumentsDallas, TXInformation 800-477-8924www.ti.com

timally drive eGaN power FETs with-out exceeding the maximum gate-source voltage rating. It offers independent sink and source outputs for flexibility of the turn-on strength with respect to the turn-off strength. A low-impedance pull-down path of 0.5 Ω provides a fast turn-off mecha-nism for the voltage, and features an integrated high-side bootstrap diode to further reduce PCB real estate. The device also provides independent logic inputs for the high-side and low-side drivers.Texas InstrumentsDallas, TXInformation 800-477-8924www.ti.com

portable measurement system. Just point the phone at what you’d like to measure and use the camera to aim. So you could use your phone for tasks ranging from checking to see if a ba-by’s milk is at a safe temperature to basic medical diagnosis.Texas InstrumentsDallas, TXInformation 800-477-8924www.ti.com


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SiC MOSFETs offer superior switching

The commercialization of SiC technology for switching devices represents a revolutionary change in power electronics

BY BOB CALLANAN, SiC Power Products Applications ManagerCreewww.cree.com

In power electronics applications, the compound semiconductor sili-con carbide (siC) has been demon-

strated in published literature to be a superior material to silicon (si) in many properties for the construction

of power switching devices. With a bandgap that is approximately 3X wider than silicon, siC devices also exhibit significantly lower leakage current at high-temperature opera-tion — by more than two orders of magnitude.

in Figs. 1 and 2, the forward con-duction characteristics of si MOs-FETs, trench field stop (TFs) insulated gate bipolar transistors (igBTs), non-punch-through (nPT) igBTs are com-pared with those of siC MOsFETs at 25°C and at 150°C.

as shown in Fig. 3, the silicon MOs-FET’s normalized on-state resistance (rDs(on)) increases by more than 250% from 25°C to 150°C, while the rDs(on) of the siC MOsFET increase just 20% over the same temperature range. The impact of this characteristic on the thermal design of a power electronics system is significant, including the re-

duction of up to 50% of the thermal management hardware (fans and/or heatsinks).

The siC MOsFET, as a majority carrier switch, effectively eliminates the minority carrier current “tail” ex-perienced with silicon igBTs (see Fig. 4), resulting in much lower switching losses and facilitates much easier par-alleling of switching devices.

at the 1,200-v rating, siC MOsFETs may be specified in virtually any ap-plication that currently employs 1,200-v silicon igBTs, especially for those applications requiring higher operating frequency and higher sys-tem efficiencies. Figure 5 graphically depicts the application area for siC MOsFETs vs. silicon igBTs, including solar power inverters, wind turbine in-verters, motor drives, induction heat-

ing systems, as well as high-voltage dc/dc converters.

There are two design characteris-tics that must be observed when ap-plying siC MOsFETs in a power elec-tronics circuit – the elimination of the ‘turn-off tail current’ exhibited by silicon igBTs; and a modest trans-conductance that needs to be factored into the gate drive circuit design.

although the elimination of the tail current is a significant advan-tage of the siC MOsFET over the silicon igBT, it is also critical to take into account

Fig. 5: SiC MOSFET application areas

Fig. 4: Switching loss

vs. temperature comparison (VDD = VCC =

800 V, ID = IC = 20 A,

RG = 10 Ω)

Figs. 1 and 2: Forward conduction characteristics comparison Fig. 3: Normalized RDS(on) vs. temperature

Tj = 25°C Tj = 150°C


that the IGBT’s tail current does have the effect of dampening parasitics during turn-off. It is vital to design sufficient snubber circuits to manage output interconnection parasitics and prevent the ringing from reaching damaging levels.

Compensating for the modest transconductance in the SiC MOSFET requires that gate-source voltage (VGS) must be 20V to ensure optimal perfor-mance from the device. This transcon-ductance characteristic can also im-pact the transition between where the MOSFET operates as a voltage-con-trolled resistance device to where it becomes a voltage-controlled current source, as a function of VDS. This tran-sition will typically occur at higher VDS values than with conventional sili-con MOSFETs or IGBTs.

The transconductance effect must also be considered in the gate drive circuit design, most notably in the requirement that the gate driver be capable of voltage swing of 22 V or higher (for example, a recommended on-state VGS of +20 V, with an off-state VGS of –2 V or -5 V).

Careful consideration must be given to controlling the fidel-ity of the gate drive pulse, re-quiring a nominal threshold voltage of 2.3 V when the device is not fully on (dVDS/dt ≈ 0), un-til gate-source voltage reaches 16 V or higher. The first-order gate circuit is approximated in Fig. 6, depicting a voltage pulse driv-ing a simple series RLC circuit.

By minimizing LLOOP, the val-ue of RLOOP necessary for critical dampening can be minimized, along with the rise/fall time of the circuit. This can be best accom-plished by ensuring that the gate drive is located as closely as possible to the SiC MOSFET.

To illustrate the advantages of SiC MOSFETs in power electronics, con-sider the following solar power in-verter application. The B6 topology employs a split-link dc-capacitor with the neutral conductor of each capaci-tor connected at the center point, with the unit connected to a 400-V grid. The 1,200-V silicon IGBTs origi-nally designed into the system were directly replaced with 1,200-V SiC MOSFETs, without any optimization

of the drive circuit. As shown in Fig. 7, the result was a dramatic increase in system efficiency.

Replacement of the silicon IGBTs with SiC MOSFETs achieved the sys-tem’s maximum efficiency by 1.92% and boosted the overall European ef-ficiency rating by 2.36%, translating into a 50% reduction in overall system losses and a reduction in heatsink temperature by 43°C. Allowing the three-phase grid-connected system to achieve a 99% maximum rating.

To demonstrate the potential for SiC MOSFETs in motor drive applica-tions, engineers at Cree performed an experiment by substituting SiC MOS-FETs for the original silicon IGBTs in a 230 Vac, 2-kW three-phase motor drive operating at 16 kHz. The SiC

MOSFETs produced a 2% overall effi-ciency improvement and a 50% reduc-tion in heatsink temperature, enabling a significant reduction and/or simpli-fication of thermal management sys-tems, such as fans. In addition, the ability to operate at higher frequencies (48 kHz and higher), allowed for dra-matically reducing the size and weight of magnetic components such as EMI filters and inductors.

For applications in three-phase 480-V power factor correction circuits requiring 1,200-V switching devices, SiC MOSFETs are expected to find wide application. At these voltages,

traditional silicon MOSFETs have ex-cessive conduction losses, and silicon IGBTs exhibit significantly higher switching losses, thus putting a limit on their operating frequency. The SiC MOSFETs, however, exhibit both low switching losses and low conduction losses, making them ideal for these types of applications.

High-voltage industrial equipment, including plasma cutters and welders will also be prime applications for the 1,200-V SiC MOSFET. By using the SiC MOSFETs, a 10-kW, 1-kV dc/dc con-verter operating at 32 kHz has been demonstrated with an efficiency of more than 97%.

The commercialization of SiC tech-nology for switching devices repre-sents a revolutionary change in the

field of power electronics. Beyond the device costs, the following system considerations need to be evaluated for a true picture of the potential cost savings:

1. Passive component reduction. Because of their relative numbers, passive power components often comprise the majority of the over-all bill of materials costs in a pow-er electronics application. By in-creasing the operating frequency, both the number of these compo-nents (and their corresponding size and cost) can be reduced.

2. Cooling requirement reduc-tion. By reducing heatsink tem-peratures by more than 50% (as demonstrated by experiments presented in this article), the adoption of SiC technology has the potential to significantly re-duce the size and number of heat-sinks, as well as a reduction or elimination of cooling fans.

3. Energy-cost reduction over the equipment lifecycle. Looking beyond the simple component costs and manufacturing expenses of a system, the true value proposition of SiC technology comes only if the overall energy savings over the lifecycle of the equipment is considered; and in some cases can be the majority of the savings potential. In systems such as a solar inverter, where cost savings are directly dependent on inverter technology, the elimination of 40% to 50% of switching losses can be the determining factor in the adoption of SiC technology.

Fig. 6: First-order analysis of gate drive circuit

Fig. 7: Comparison of three-phase PV inverter efficiency

Alternative Energy


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EnErgy-saving InItIatIve

Power-efficient comm engines in FPGAs

BY RAJESH TRIVEDI, Brand ManagerLattice Semiconductorwww.latticesemi.com

The rapid pace of innovation across industries is driving new approaches to electronic system

design. Designers are increasingly seeking to build their next-generation electronic products on flexible plat-forms that can be customized quickly to create additional, derivative prod-ucts to meet diverse customer needs.

in addition, in a networked world, electronic equipment of all types must continuous-ly communicate with each other. These two trends are encouraging system engineers to look for flexible design platforms with industry-stan-dard communication inter-faces. End-customers as well want low-cost, low-power de-sign platforms that can be manufactured in volume and are competitive in the mar-ketplace.

Efficient communication enginesField-programmable gate arrays offer a flexible design platform with a variety of resources – high-speed configurable interfaces, embedded memory, digital signal processing and a programmable logic fabric. The cost and power con-sumption of FPga platforms can be reduced by selecting widely used func-tional blocks, which do not vary from application to application, for imple-mentation in hard standard-cell logic gates. FPgas that provide a balance between a soft programmable fabric and hard, but configurable functional blocks are ideal design platforms for system manufacturers.

One set of functional blocks that is

an ideal candidate for hard imple-mentation in FPgas are communica-tion interfaces. an increasing variety of electronic equipment use industry standard communication interfaces such as PCi Express, gigabit Ethernet, Tri-speed Ethernet and serial rapi-diO. an ideal solution will implement Osi Layer-2 (Link Layer) functional-ity for each protocol and additional Osi Layer-1 physical layer functional-ity in hard logic as efficient commu-

nication engines.The primary benefit of using hard-

wired communication engines is a dramatic reduction in power con-sumption. an average two-input nanD gate consumes power in nanowatts, whereas a four-input look-up table (LUT4) in FPgas consumes power in hundreds of nanowatts. But the FPga LUT4 performs the function of at least 10 standard cell gates — and therefore a standard cell gate imple-mentation yields a net power reduc-tion of a factor of 10.

The hardwired implementation of popular communication protocols also reduces the required semiconduc-tor die area by a factor of 30, which leads to lower cost. The logic fabric in

typical midrange FPgas runs at speeds up to 250 MHz. The hard implementa-tion of communication protocols al-lows the same FPgas to process data at speeds up to 600 MHz. Thus, the hard-wired communication engines enable low-cost midrange FPgas to process high-speed data.

FPGA implementationan example FPga family with avail-able hard-coded logic is the recently

announced LatticeECP4 FPga family, with up to four 6 gbit/s sErDEs (see Fig. 1). Each com-munication engine offers up to a tenfold power and cost re-duction over similar FPga im-plementations. The 6-gbit/s sErDEs channels take less than 175 mW each. They are designed and characterized to meet the rigorous data and control plane timing require-ments of each protocol.

The configurable commu-nication engines can be cus-tomized by embedding propri-

etary code in the surrounding FPga logic fabric. The complete solution also includes an easy-to-use software tool to connect the communication engine with the surrounding logic fabric and with high-speed serial in-terfaces. Designers can also access net-work control and statistics vectors within the engines.

an FPga-based design platform with efficient communication engines allows design engineers to build so-phisticated networking equipment with lower power and lower cost. and, though the communication engines are hardwired, they can be configured using the soft logic in the FPga fabric. This approach permits designers to en-joy the best of both worlds.

Fig. 1: The LatticeECP4 FPGA has 4 to 16 SERDES organized in quads of four each and up to 22 hard-wired communication engines.

FPGA cost and power consumption can be reduced using hard standard cell logic gates


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The iPhone 4S is, as it implies, a souped-up iPhone 4 ver-sion, just as the 3GS was a souped-up version of the

iPhone 3G. In fact, with the introduction of the 4S, Apple now has a portfolio of 3 iPhone 4Ss, two downgraded iPhone

4s (8GB configuration only), and a downgraded iPhone 3GS. Murata makes the module, Broadcom makes the chip. In the past

these always included the ubiquitous-most-popular-chip-seen-in-tear-downs BCM4329, and now Broadcom’s newer BCM4330 chip is implement-

ed which upgrades Bluetooth functionality to Rev 4.0. Texas Instruments maintains their touchscreen controller slot – but now that chip is naked (flip-chip), helping further reduce the size. It appears to offer very similar function-

ality as the touch control IC they supplied in the iPhone 4.

Product Teardown: Apple iPhone 4S (16GB) Mobile Handset

% of Total Cost by Function

Integrated Circuit

40.27 %

Display

12.39 %

% of Total Cost by Assembly

Display

12.67%

Mechanical 11.48%

% of Total Cost by Component type

The information in this feature represents a small sample of the data available from the iSuppli Teardown Analysis service. This service provides complete, detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown analyses on products including wireless handsets, digital still cameras, PDAs, and laptop computers. ISuppli delivers complete assessments of all electronic, electro-mechanical, and mechanical components in such products, from semiconductors to passives to displays. Component data includes parts and estimated pricing and is broken down by assembly, function, component family, and type.

For more information on the IHS iSuppli Teardown Analysis service, e-mail iSuppli at [email protected]

For more information on the IHS iSuppli Teardown Analysis service, e-mail iSuppli at [email protected]

To get the complete teardown analysis and parts list of the Apple iPhone 4S, including datasheets, go to...www2.electronicproducts.com/whatsinside.aspx

Integrated Circuit 41.18%

Camera 9.70%

Discrete Semiconductor 0.15%

Optical Semiconductor 0.39%

Passive 2.20%

Battery 3.41%

Module 4.61%

Electro-Mechanical 6.50%

Touchscreen 7.71%

Mechanical 11.22%

Camera 9.48%

Discrete Semiconductor 0.15%

Optical Semiconductor 0.38%

Passive 2.15%

Accessories 2.23%

Battery 3.33%

Module 4.50%

Electro-Mechanical 6.36%

Touchscreen 7.54%


WHAT’S INSIDE?


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There is no doubt that the role of unmanned aerial vehicles (UAVs) in military and commer-

cial applications is increasing beyond reconnaissance and attack, to new ar-

eas such as fire fighting and provid-ing supplies and munitions to troops in battlefield (see Fig. 1). Over the last decade, UAVs have finally evolved from lab testing to field-tested proven technologies.

In a recent study, the Teal Group estimated that overall UAV expendi-tures will double within a decade

from $5.9 billion annually to $11.3 billion, with more than $94 billion spent over the next 10 years. In addi-tion to the cost savings of unmanned flights and real time intelligence, sur-veillance and reconnaissance benefits they bring, the move to UAVs reduces fatalities of the pilots and support personnel that would normally man such aircraft.

Since UAVs allow for a more pre-cise and targeted attack, they also re-sult in fewer civilian casualties. The “always on” sensing elements in such aircrafts make it easier to provide proof to refute claims of undesired military action. With the growing presence of hyper spectral imaging systems as part of the payload, UAVs

Multicore DSPs are for reducing size, weight, cost and power, as well as

developing very high-performance systems

Multicore DSPs support

power-efficient, high-performance

UAVs

BY SANDEEP KUMAR, Product Line Manager, Multicore and Media InfrastructureTexas Instrumentswww.ti.com

also provide the additional benefit of monitoring for biohazards and mali-cious chemical agents.

On-board processingAs more manned aircrafts transition to UAVs, expectations are growing that these aircrafts will be able to take advantage of automated air traf-fic management systems, as well as automated navigation and landing systems, while following flight pro-cedures. Thus, the appetite for great-er onboard processing will increase, while the power envelope continues to stay the same or shrink.

With growing interest in credit-card-sized board form factors and computing platforms, the strain on power budget does not appear to be letting up anytime soon. Power effi-cient, software programmable solu-tions like multicore digital signal processors (DSPs) will play a key role in providing solutions to this power-performance dilemma.

Multicore DSPs have been around for a long time, but recent advances have helped them evolve into SoCs that pack a performance punch with-out losing touch with their legacy of power efficiency. In UAVs, they play a vital role in providing support for data acquisition and processing from various sensor types and establish-ing secure ground communications.

UAV developers, particularly those focusing on military applica-tions, are constantly striving for lon-ger endurance units with greater functionality and lower fuel con-sumption. This results in very tight size, weight, power and cost (SWaP-C) requirements as combat pressures dictate that UAVs integrate an in-credible array of subsystems, includ-ing sensors, mission compute sys-tems, radio communications and navigation systems.

The tight, confined spaces and small form factors coupled with smaller modular enclosures make power a particularly challenging problem, with some smaller systems having sub-200-W power budgets. Today, this is solved by having large onboard power generation systems to relieve the energy challenge and exotic materials as well as heat col-lection and heat rejection technolo-

PRODUCT application

Fig. 1: Unmanned aerial vehicle are finding uses for military reconnaissance, fire-fighting, and supporting ground troops with supplies.

Military/Aerospace Electronics


Military tough. Medically precise.

Power inductors that meet spec, even when operating conditions don’t.

Whether your mission-critical application is military, medical or something else, new Coilcraft CPS ML563PKA high-reliability power inductors should be in your sights. These low-profile surface mount induc-tors provide a very high performance-to-size ratio for utmost design flexibility.

High-temperature materials exceed the requirements of most military, aerospace and medical applications, such as DC link, DC-DC converters, and switching power supplies. Ferrite core and exclusive geometry provide

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gies to handle heat dissipation. Rather than providing a short term fix, the use of power efficient multi-core DSPs can reduce the reliance on large onboard power generation sys-tems and eliminate costly heat sinks and other power dissipation materi-al, leading to a very attractive SWaP-C for such systems. For example, Fig. 2 shows a half-length PCI Express (PCIe) board (smaller than 5 x 7-in.) that is available with 500 or more GFLOPs of performance at 54-W of total power consumed.

Multicore DSPs for UAVsMore and more, UAVs are being dominated with a plethora of sen-sors that are generating a vast amount of raw data. Infrared and visible imaging, coupled with full motion video, create hours and hours of footage. In many instances, there is growing demand for high-defini-tion video and images with greater detail and resolution. With lower cost CMOS cameras improving in characteristics, there can be any-where from 10 to 100 cameras per UAV, with image capturing resolu-tion going up to several hundred megabytes per camera.

Once the image has been ac-quired, the system must perform im-age stabilization and compression on board. If the image is being further processed in the air, image enhance-ment, and analytics must also be performed. Multicore DSPs excel at high-data-rate signal processing in-tensive functions such as image sta-bilization, noise reduction, image enhancement and restoration.

Also, multicore DSPs with a lot of distributed real time processing ca-pability coupled with large memory and interchip and intrachip band-width can significantly reduce the latency in analyzing and categoriz-ing images. This can prove especially critical in getting real-time responses from the ground decision maker in case an imminent threat is detected.

If further analysis means simply transmitting images to the ground in a lossless fashion, advanced co-decs such as JPEG2000 allow for best possible image quality, low latency and no inter-frame dependencies. With multicore DSPs, UAV designers can quickly and efficiently imple-

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ment codecs like JPEG2000 in the software or start by using off the shelf proven building blocks such as those in vision, imaging and signal processing libraries.

For full-motion video, in addition to support for existing video stan-dards such as H.264, the added ben-efit of using a multicore processor is that its programmable nature allows support for proprietary video for-mats and emerging standards such as H.265.

Another important consideration is IO bandwidth and the ability to support packetized compresses vid-eo. A typical HD video needs up to 10-Mbps, so the Ethernet interface required to support multiple com-pressed video channels should be a Gigabit Ethernet or higher port. But GigE is not the only choice for trans-porting video as both PCIe and RapidIO are both good choices for high-bandwidth video.

For example, if PCIe lanes are used to carry video, then each PCIe Gen2 can carry 5-GB of data, which is enough for four channels of 1080i60, 24 channels of D1, or more than 300 channels of QCIF at 30 fps. RapidIO, designed for embedded sys-tems, allows for more payload and the creation seamless scalable fabric of processing capability for video and image processing.

Another application on board UAVs is radar, generally synthetic ap-erture radar (SAR) that provides an additional mechanism for picking up objects not visible to electro-opti-cal or infrared cameras. When com-bined with a ground moving target indicator (GMTI), such systems can be beneficial in locating and track-ing targets in environments such as deserts and densely forested areas, as well as in adverse weather condi-tions, such as rain or fog.

The greater precision of output re-quired in such systems, along with the need for larger dynamic range, make these functions perform sig-nificantly better on a floating point machine. Variable size, floating point, Fast Fourier Transforms (FFT) are all key in SAR processing and perform very well on advanced mul-ticore DSPs. Some multicore DSPs are also architected to provide a very ef-ficient mechanism for performing

PRODUCT application


‘corner-turns’ or matrix transpose, which can be a significant part of an efficient SAR algorithm.

The UAV communications dat-alink is a critical subsystem and provides two-way communication through a low data rate channel for ‘commands’ and “status”’ and a high-data-rate channel for payload such as SIGINT, video, and radar. The datalink should have protec-tion against threats including, jam-ming, interference, interception, radiation etc.

In addition, it is important the communication link be always avail-able which translates to support of non-line-of-sight, multiple bands, multiple waveforms and other ad-vanced capacity and coverage en-hancement techniques. DSPs have long been used in commercial com-munications, more specifically in providing secure, low latency, real-time communications. They are well suited for UAV communications that require support for low bandwidth, proprietary channels all the way up to commercial broadband wireless air-interfaces such as LTE, WCDMA, and WiMAX.

Multicore DSPs make the system easy to reconfigure through a sim-plified programming model (usu-ally C based). Today’s multicore processors provide a good combi-nation of software programmable cores and hardware acceleration to cost effectively meet the stringent requirements of such communica-tions systems.

In a defense market with shrink-ing budgets, the use of multicore DSPs also provide for software in-vestment protection through soft-ware compatibility and portability as well as through the use of open tools such as GNU C Compiler, open oper-ating systems such as Linux and open multicore programming mod-els such as OpenMP.

Fig. 2: Advantech PCIe

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Military/Aerospace Electronics


ProductUPDATEProductUPDATE

Connectors and sockets

Itt (www.itt.com) developed the Nemesis Series Space Saver connector designed for wearable and portable mili-

tary equipment used in today’s warfare. the connector withstands harsh conditions in the field, and features anti-reflective roHS-compliant salt-spray-resistant plat-ing and Pogo Pin/Pad and breakaway design. Maximum current rating for the Nemesis Series connector is 2 A and

the voltage rating is 50 Vdc with a minimum insulation resistance of 5,000 MΩ. operating temperature ranges are from –40° to 100°c, and the connectors have a life span of more than 2500 cycles. Portable computers, weapons, vision systems, headsets, radios, and GPS equipment are applications for the Nemesis series.

ErNI Electronics’ (www.erni.com) dual-row Microcon se-ries SMt connector family with 0.8mm pitch addresses de-manding applications in industrial, medical, lighting, auto-motive, and consumer seg-ments. the 50-pin male con-nectors are only 24.2 x 4.7 mm, and fea-ture reinforced side walls and b l i n d - m a t e guide align-ments for secure mating. A double-sided spring contact en-ables installation in space-limited applications. the connec-

C onnectors provide the glue that enables a variety of technologies to work together effectively and efficiently. From connectors used in rugged or toxic environments to those that span consumer and industrial applications, con-nectors adhere to a multitude of standards and specifications. they are not only necessary, but they are also an

enabling technology and gains in connector miniaturization, strength, life span and flexibility further electronics ad-vances across a wide range of applications.

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Change is what drives your business... and it’s also what can drive you crazy when it comes to designing new devices into your existing products or replacing obsolete chips.That's precisely why Aries Correct-A-Chip™ technology is so popular with designers who are always looking to upgrade or to avoid the problems of chip obsolesence: it lets them (and you) take advantage of device enhancements without board rework, redesign or delays.

Change is good. With Correct-A-Chip, it’s also easy!With Correct-A-Chip, you can change from one footprint or package type to another, from surface mount to through-hole, from one pinout to another, from one…you get the picture. If there’s a way to upgradeyour product with a new chip, there‘s a Correct-A-Chip that lets you do it quickly and economically. With Correct-A-Chip, you can even add additional componentry and circuitry while you upgrade to a new device – all in the same space!Now available in both standard and RoHS compliant versions!

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tors offer a high mating tolerance with allowed misalignment tolerances of longitudinal and transverse axes of ±0.7 mm and an allowed angular incli-nation tolerance of ±4°. the class 1 connectors are specified for. 500 mat-ing cycles and current capacity per contact is up to 0.5 A at 20°c.

API technologies’ new API Spec-trum control Firewall Series (www.

apitechnologies.com) is designed to prevent fire or sparks from penetrat-ing sealed bulkheads in high-perfor-mance aircraft, aircraft engines, and military ships. capable of operating up to 260°c/500°F, the connectors adhere to a variety of such military specifications as MIL-dtL-38999, MIL-dtL-836723, and MIL-dtL-5015.

Supporting total bandwidth of 120 Gbits/s through 12 channels of 10 Gbits/s, tE connectivity’s en-hanced-footprint cXP pluggable connector and cage are housed in a one-piece convenient press-fit as-

sembly. targeting high-speed data environments, the cXP assembly supports the latest high-speed In-finiBand cXP 12XQdr standard and IEEE 100-Gbit/s Ethernet specifica-tions. the one-piece design prevents EMI leakage at the bezel opening and at the cage-to-plug interface and allows for quick and easy placement onto PcB boards, eliminating the extra steps involved with connector and cage assembly. An enhanced, dual-sourced footprint increases space between vias for cross-talk re-duction and improved electrical per-formance. options include lightpipe and EMI/dust plug and three high-sink heights for a variety of thermal applications. Belly-to-belly mount-ing options for use on both sides of pc boards are also offered.

IP 67 Bayonet Style rJ45/Ether-net field wireable connectors by turck (www.turck.us.com) provide su-

perior protection in washdown and high impact applications. the bayo-net style of mating prevents over or under tightening that typically

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The right connection for your appWhatever your application need, FCI offers innovative connectors and cable assemblies for high speed, power, board-to-board, wire-to-board, input/output, fl exible circuit, or storage connections – whether in communications, data, industrial, or consumer electronics. Quickly fi nd the right interconnect solution for your app at www.fciconnect.com/electronics

Visit booth 414 at the DesignCon Show to see innovative high speed and power connector and cable assembly solutions … and more

damages connectors and pins. Wa-ter resistant to depths of 1 meter for up to 30 minutes, the CAT 5e per-formance of the connectors allows data transmission at 1,000 Mbits/s and performance in harsh environ-ments including toxic chemicals. Available in plastic and metal mod-els, the connector works in all Eth-ernet applications.

Miniature microwave coax con-tact assemblies that fit into small

standard Size 20 contact cavities of D-Subminiature connectors and Size 20 and larger contact cavities for standard MIL-DTL-38999 circu-lar connectors are addressed by a family of SSBP microwave connec-tors by Southwest Microwave (www.southwestmicrowave.com). The SSBP-20 connectors can be used inter-changeably with non-coax sig-nal contact assemblies in such applications as airborne, medi-cal, test, mobile communica-tions, missiles, and space.

Features include minia-turization, increased reliabil-ity, reduced system cost, and resistance to vibration and shock. The SSBP-20 interface, al-though targeted for miniaturized packaging, can be used in RF and extreme millimeter-wave applica-tions and combinations thereof in the same connector. Connectors are RoHS compliant, lead free, and have DFARS steel and raw material trace-ability.

Horizontal and vertical blade in-sertion and increased flexibility are two of the features of Yokowo Amer-ica’s (www.yokowoconnector.com) two-piece battery connectors. Dual-beam contact in both insertion directions improves reliability,

while two tabs are fitted on the re-ceptacle providing a secure grip around the blade for insertion. Bi-axial torsion and floating function absorb the batter gab, reducing in-termittent power outage risk. Used in devices where uninterrupted power is critical, the connector fea-tures a 30-mΩ max contact resis-tance, –40° to 85°C operating tem-perature range, and a 2,000-cycle operational durability. The blade is

11.5 x 5.4 x 18 mm, and the recep-tacle is 9.1 x 5.5 x 19.1 mm. Each blade consists of six contacts with a 3-mm pitch.

The RFA-4013-WB 7-16 DIN adapter kit from RF Connectors (www.rfindustries.com) is now avail-able in white bronze plating in ad-dition to silver. Applications in PCS, cellular, GPS, and digital communications are finding great-er use for 7-16 DIN adapters. The 7-16 DIN connector interface can

carry high power at high frequency, are larger and extremely precise, and offer stable electrical and me-chanical connections with tight tol-erances. White bronze plating offers a way to bridge type N devices to 7-16 DIN interfaces. All white bronze 7-16 DIN adapters are machined to exact specifications. In comparison, silver plating offers exceptional electrical performance and low pas-sive intermodulation (PIM) perfor-mance. The foam-lined zippered kit contains six adapters.

Carolyn Mathas


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Southwest Microwave SSBP-20 microwave connectors

SFP+, QSFP+ and Mini-SAS/SATA cable systems FCI’s new SFP+ and QSFP+ direct-attach copper cable assemblies, connectors and cages enable 10 Gb/s or 4x10 Gb/s pluggable links to support 8G Fibre Channel, 10G Ethernet, FCoE, 40G Ethernet, or 40G Infiniband QDR applications. The cable assemblies include EEPROM memory map capability per the SFF specifications. FCI’s external Mini-SAS/SATA cable solutions meet INCITS T10 SAS or SATA-IO and SFF requirements.For more information please visit www.fciconnect.com/hsio

TwinMezz™ Mezzanine Connector System FCI’s TwinMezz™ connector system provides industry-leading signal integrity performance for 20+ Gb/s mezzanine applications and the highest signal density with 25 differential signal pairs/cm2, or 161 pairs/in2. The efficient hermaphroditic design supports stack heights ranging from 12mm to 40mm with 200-800 total contacts. The versatile open pin field design allows for mixed differential, single-ended or power pin assignments. Proven FCI BGA termination technology enables reliable, SMT-compatible attachment. For more information please visit www.fciconnect.com/twinmezz

AirMax VS® High-Speed ConnectorsInnovative crosstalk optimization and edge-coupling technology enable differential pairsto support data rates to beyond 12.5 Gb/s without the use of interleaving metal shields. The versatile AirMax VS system features a broad range of signal module options, including receptacles and headers in both right-angle and vertical orientations, power modules, and accessories. The available connector options support backplane, orthogonal midplane, coplanar, mezzanine and cabling applications.www.fciconnect.com/airmax

fw593 EP 03/10 Sat Strip AF.indd 1 1/29/10 12:10:05 PM

PRoDUCTUPDATE

ADveRtISeMeNt


HIGHLIGHTS

Next-gen ECP4 FPGAs up performance profile Featuring up to 250 KLUTs that operate 30% faster than the previous version and cost less, the Lat-ticeECP4 FPGA family steps up to higher-perfor-mance applications. The ICs come in six versions starting at 30 KLUTs and have 1.2 to 10.6 Mbytes of memory, 1,066-Mbit DDR3 memory interfaces, and up to 576 DSP blocks — 7x the previous version.

The chips up their communication profile with sixteen 6-Gbit/s SERDES channels that take less than 175 mW each and forty 1.25-Gbit/s CDRs. They feature MACO lower-power hard-IP communication engines for many pro-tocols, including SRIO 2.1, PCIe 2.1, and 10G Ethernet. The devices are available in 485 to 1,152-pin low-cost wire-bond or flip-chip BGA packages. (ECP4-130, $20 ea/100,000 — samples 2nd qtr 2012.) Lattice Semiconductor , Hillsboro , OR Sales 503-268-8000 [email protected] www.latticesemi.com

SPDT switches offer 50-Ω terminated outputs The SKY13348-374LF and SKY13370-374LF 0.5 to 0.6-GHz SPDT switches are high power 50-Ω terminated, single-pole, double throw devices that are ideal for high power access points and router applica-tions given their matched ports which reduce low noise ampli-fier pulling and deliver better system performance. Addi-tional features include low insertion loss, high isolation and high lineari-ty for improved data throughput.

Housed in a 6-pin DFN package, the SKY13370-374LF features an in-sertion loss of 0.7 dB at 2.5 GHz, an isolation of 31 dB at 2.5 GHz, and an IP1dB of 39 dBm. Housed in a MLPD package, the SKY13348-374LF offers an insertion loss of 0.6 dB at 2.5 GHz, an isolation of 27 dB at 2.5 GHz, and an IP1dB of 37 dBm.(Contact compa-ny for pricing and availability) Skyworks Solutions , Woburn , MA Sales 781-376-3000 [email protected] www.skyworksinc.com

SAR pseudo-dif ADC achieves 96.5-dB SNR The LTC2369-18, a serial 18-bit, 1.6 Msamples/s pseudo-differential SAR A/D converter, achieves 96.5 dB SNR and –120 dB THD while supporting a

0 to 5-V unipolar input range. Oper-ating from a 2.5-V supply, the part consumes only 18 mW, with a low power shutdown mode that con-sumes just 2.25 µW.

Additional features include, guan-ranteed 18-bit no missing codes, a maximum INL of ±2.5 LSB with no missing codes and guaranteed speci-fications over the –40° to 125°C tem-perature range. Housed in a 16-lead MSOP and 4 x 3-mm DFN package, the ADC offers a user-friendly SPI in-terface, explicit Busy and Chain pins, I/O voltages from 1.8 to 5 V, and an internal oscillator that simplifies digital timing and minimizes exter-nal component count. ($29.95 ea/1,000 — available now.) Linear Technology , Milpitas , CA Sales Office 408-428-2050 www.linear.com

Signal cond ICs process IR remote control signals Announced as the first signal condi-tioning ICs suitable for processing IR remote control signals from dis-crete photodiodes, the VSOP383 and VSOP584 signal conditioning ICs are offered in small QFN pack-ages measuring 2 x 2 x 0.76 mm. The parts are capable of processing continuous data transmission and feature a supply voltage range from 2.7 to 5.5 V and a supply current down to 0.35 mA.

Manufactured using CMOS tech-nology, the VSOP383 and VSOP584

feature a narrow band-pass filter for 36 and 38 kHz carrier frequencies and intelligent AGC to suppress dis-turbances from fluorescent lamps and other disturbing light sources. The devices are insensitive to supply voltage ripple and noise. The RoHS-compliant ICs operate over a temper-ature range of –25° to 85°C.(From $1 ea — available now.) Vishay Intertechnology , Malvern , PA Information 619-336-0860 [email protected] www.vishay.com

Electronic fuses provide adjustable protection The STEF05 and STEF12 are electron-ic fuses in 3 x 3–mm IC packages that provide overvoltage and overcurrent protection for 5– and 12–V electron-

ics. They can re-place larger con-ventional fuses or other protec-tion devices such

as transils or diodes. They do not cut the power suddenly or require re-placement like fuses.

The electronic fuses restrict the current supplied when a fault occurs, protects the connected circuitry, and turns the protected equipment off if the fault persists. It can be reset by a signal from the system or by restart-ing the power supply. The devices also integrate circuitry that limits voltage fluctuations applied to the protected load, and programmable startup time, allowing use in hot-swappable modules for equipment such as enterprise servers, storage or telecom systems. (From $0.75 ea/1,000 — available now.) STMicroelectronics , Lexington , MA Information 781-861-2650 www.st.com

Buck-boost converter offers 2.7 to 40-V range The LTC3115-1, a synchronous buck-boost dc/dc converter delivers up to 2-A continuous output for single-cell Li-ion, 24/28-V industrial rails, and 40-V automotive inputs. The con-verter’s 2.7 to 40-V input and output range provides a regulated output with inputs above, below, or equal to


NEWPRODUCTS

POWER MaNagEMENt

aNalOg/MiXED SigNal

edited by christinanickolas, jimharrison and paulo’shea See more online at electronicproducts.com/ic

Ethernet switch chip has advanced featuresThe VSC7418 Serval Ethernet switch engine is optimized for power and cost-sensitive applications at the net-work edge, and is said to provide 75% lower power and 50% lower BOM cost than competitive options. The device has nine 10/100/1,000-Mbit/s SGMII/SerDes ports and two 2.5-G SGMII/SerDes ports.

The IC features a 416-MHz MIPS

Low-cost 16-bit MCUs are AEC certifiedThe MSP430G2xx and MSP430F2xx 16- or 12-MHz microcontrollers offer AEC-Q100 certification for automo-tive applications. They have up to 32 Kbytes of flash and 128, 512, or 1,024 bytes of SRAM. The MCUs feature active mode current of 220 μA at 1 MHz, 2.2 V and standby current of only 0.5 µA.

The 430G2 series have optional capacitive touch and 8 channel 10-bit A/D converter and come in 14 and 20-TSSOP or 16-QFN packages. The 430F2 series have a 12-channel 10-bit A/D converter and come in a larger 38-TSSOP, 40-VQFN package. The devices wake-up from standby mode in less than 1 μs and operate from –40° to 105°C. (From $0.30 ea/50,000 — samples available now.)Texas Instruments, Dallas, TXInformation 800-477-8924www.ti.com

the regulated output.The buck-boost topology provides

a continuous, jitter-free transition between buck and boost modes, making it suitable for RF and other noise-sensitive applications. The switching frequency is user program-mable between 100 kHz and 2 MHz, and can be synchronized to an ex-ternal clock. The device incorporates four internal low RDS(on) n-channel MOSFETs to deliver efficiencies of up to 95%. A user-selectable burst-mode operation lowers quiescent current to 50 µA, to improve light load effi-ciency. (Ea/1,000: LTC3115EDHD-1, $5.35; thermally enhanced LT-C3115EFE-1, $5.55 — available now.)Linear Technology, Milpitas, CASales Office 408-428-2050www.linear.com

processor with DDR2/3 external memory and DMA-based frame ex-traction and insertion support. It also supports MPLS/MPLS-TP LER and LSR and LTE-advanced-ready IEEE 1588v2, along with advanced TCAM-based service SLA guarantees. The chip has full OAM in hardware and comes in a 24 × 24-mm thermal-

ly enhanced TQFP package. It takes 3 W typ over a –40° to 125°C operat-ing range. (Price not available — samples December.)Vitesse SemiconductorCamarillo, CASales [email protected]


Digital

Integrated Circuits

HIGHLIGHTS

Tri-axial accelerometers are half the size of previous devicesThe LIS2DH and LIS2DM ultra-low-power, high-per-formance three-axis MEMS accelerometers come in 2 x 2 x 1-mm packages, reducing the footprint by a factor of 2 over current-generation three-axis devic-

es, Consuming as little as 2 µA in normal operating mode, the units enable motion sensing on smaller and sleeker gadgets than currently available, as well as mobile phones, tablets, and gaming controls that can run longer.

Both devices provide highly accurate outputs across user-selectable rang-es of ±2, ±4, ±8, and ±16 g, and have an embedded temperature sensor to ensure excellent stability over temperature (0.01%/°C). The LIS2DM has a sensitivity of 16 mg/digit in low-power mode in the ±2 g range, and the LIS2DH has a high-resolution mode with sensitivity as low as 1 mg/digit in the same range.

The sensors have 4D/6D orientation detection and two programmable interrupt signals that enable immediate notification of motion detection, free fall, and other conditions. The units also feature power-down and sleep modes, a FIFO memory block for smarter power management, software-compatibility with the company’s current 3-axis accelerometers, and a self-test function that allows functional verification at the board level. (LIS2DH, $1.05 ea / 1,000; LIS2DM, $0.98 ea / 1,000 — available now.)STMicroelectronics, Lexington, MAInformation 781-861-2650www.st.com


NEWPRODUCTS

Pushbutton switch is splash-, vandal-proof Offering both splash- and vandal-proof construction, the DH series of panel-mount pushbutton switches is now available in 22- and 25-mm sizes. It is of-fered as momentary or latching in both SPST and DPST, nor-mally open and normally closed. Flush actuator styles offer non-illuminated, bi-color ring illumina-tion or dot illumination.

The electrical rating of the DH se-ries is 2 A at 24 or 125 Vac and 1 A at 250 Vac. Sealing is IP65. Additional features include an electrical life of 50,000 cycles with contact resistance of less than 50 mΩ and a dielectric strength of 2,000 Vrms contact to contact and 2,000 Vrms contact to LED. Insulation resistance is greater than 100 MΩ, and actuation force is 550 ± 50 gF with actuator travel of 2.0 ± 0.3 mm. Also operating and storage temperature is –25° to 70°C.

(Contact company for pricing — available now.) CIT Relay & Switch Minneapolis , MN Tony Schisler 763-535-2339 [email protected] www.citrelay.com

600-V IGBTs target UPS, solar apps The IRGP4067DPbF and IRGP-4066DPbF 600-V insulated gate bi-polar transistors (IGBTs) target unin-terruptible power supplies, solar, industrial mo-tor and welding appl ic at ions . They use trench wafer technolo-gy, are co-pack-aged with a soft-recovery diode, and are opti-mized for 8 to 30-kHz switching with 5-µs short-circuit rating.

The 600-V IGBTs suit a wide range of switching frequencies due to their low Vce(on) and low switching loss-es. They are offered as both die and packaged devices, and are available

for FREE PICO CatalogCall toll free 800-431-1064

in NY call 914-738-1400Fax 914-738-8225PICOElectronics, Inc.

143 Sparks Ave. Pelham, N.Y. 10803

E Mail: [email protected]

• Over 2500 Std. DC-DC Converters

• Surface Mount• From 2V to 10,000VDC Output

• 1-300 Watt Modules• Isolated/ Regulated/Programmable Models

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A29_EP_1-3V_2-06x9-5_A29.qxd 7/5/11 10:17 AM Page 1

Components & Subassemblies

edited by j.harrison, p.o’shea, c.nickolas, r.comerford and c.mathas See more online at electronicproducts.com/cs

EMI Filter

Line

Rectifier IC and Switches LEDs

IC

310

320

330

340

350

360

370

380

390

60

70

80

90

100

110

120

130

140

150

160

170

180

Curr

ent (

mA

)

Input Voltage

LED Current (mA)

LEDrivIR™

IRS2980

LEDrivLEDrivIR™IRLEDLEDLEDrivIRLEDLEDrivIR

IRS2980 Features• Internal high voltage regulator

• Hysteretic current control

• High side current sensing

• PWM dimming with analog or PWM control input

• Free running frequency with maximum limiting (150kHz)

IRS2980 Benefi ts• Low component count

• Off-line operation

• Very simple design

• Inherent stability

• Inherent short circuit protection

Demo Board Specifi cations• Input Voltage 70V to 250V (AC)

• Output Voltage 0V to 50V (DC)

• Regulated Output Current: 350mA

• Power Factor > 0.9

• Low component count

• Dimmable 0 to 100%

• Non-isolated Buck regulator

for more information call 1.800.981.8699 or visit us at www.irf.com

High-Voltage Buck Control ICs forConstant LED Current Regulation

PartNumber

Package VoltageGate

Drive CurrentStartupCurrent

Frequency

IRS2980S SO-8 450V +180 / -260 mA <250 µA <150 kHz

IRS25401S SO-8 200V +500 / -700 mA <500 µA <500 kHz

IRS25411S SO-8 600V +500 / -700 mA <500 µA <500 kHz

IRPLLED7 Demo Board LED Current vs Input Voltage

IRPLLED7 Demo Board

THE POWER MANAGEMENT LEADER

Disney’s Coronado Springs Conference Center

06-08 Feb 2012

Visit us at Booth 501

BODY ARMORFOR SWITCHES

Standard black or grayor matched to any color

IP66/68 Rated.High tear-strength hostile

environment-resistantsilicone rubber.

Temperature range-94°F to +400°F

Patented perimetersealing rib preventsleakage past mountinghole. No O-ringrequired.

Molded-in mounting nut100,000 min. actuations

Switch/CircuitBreaker housing

Back-up secondary seal

HEXSEAL® HERMETIC BOOTS DEFENDAGAINST HOSTILE ENVIRONMENTS

HEXSEAL boots increase reliability & prolong life byhermetically protecting unsealed switches, circuit breakers,potentiometers and encoders from hostile contaminants& actuator-function interference by blocking water, dust,dirt, ice, solvents, etc. Many HEXSEAL® sealing boots canalso suppress EMI/RFI. Meets MIL-DTL-5423 specs. Toggle,pushbutton, rotary, rocker & armored versions.

CUSUL Recognized

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Call/click for catalog & samples

The World’s Most Hostile EnvironmentsAre Our Proving Grounds®

800.498.9034 apmhexseal.com

APM_EP_BodyArmorJan2012 11/30/11 10:21 AM Page 13-phase filters suit renewable-energy appsThe HCWMGF series of filters targets renewable-energy equipment applications. The filters remove RF noise in

the 10-kHz to 30-MHz range and are available in three-phase-version L1, L2, and L3 (without neutral) from 150 to 2,500 A, with power losses of less than 0.02%.

The filters are designed specifically for windmill power generation, UPS, inverters, and power inverters, with a maximum operating voltage up to 720 Vac. (Contact company for price — available now.)PREMO, Barcelona, SpainRocio Arrupe [email protected]

Digital power module delivers 17 AThe ZL9117M encapsulated digital power module deliv-ers 17-A output current. It is configured using the point-and-click PowerNavigator GUI. Built-in auto-compensa-tion algorithms optimize transient response over varying load conditions. The modules operate from 4.5 to 13.2 Vin and provide outputs from 0.6 to 3.6 V, which

NEWPRODUCTS


with or without short-circuit rating. They have an operat-ing temperature of 175°C. (Ea/10,000: $5.58, IRGPS4067D; $4.80, IRGP4066DPbF — available now.)International Rectifier, El Segundo, CASales 310-252-7105 www.irf.com

Secure antenna fits space constraintsThe WRT-MON Series monopole antenna is compact and tamper-resistant, targeting such applications as wireless vending machines, traffic equipment, and power equip-ment where space is limited and security is important. The antenna takes up much less space than dipole alternatives. It installs through a small hole on the product and is an-chored by a threaded metal base connected to the coax ca-ble shield and requires a proximity ground plane.

Available in 2.4 GHz, the antenna is attached to an 8.5-in.-long coax cable with an RP-SMA-, SMA-, or U.FL/MHF-compatible connector on the other end. The RP-SMA and SMA connectors use an RG-174 coax, and the U.FL/MHF connector uses a 1.32-mm micro-coax. (Con-tact company for price and availability.)Antenna Factor, Merlin, ORInformation 800-489-1634 [email protected]

C-band amps are 43% more power efficientDesigned to be used in satellite earth stations, the MG-FC50G5867 and MGFC47G5867 gallium nitride (GaN) high-electron-mobility transistor (HEMT) C-band (4 to 8-GHz) am-plifiers feature power outputs of 100 and 50 W, respectively.

The internally impedance-matched amplifiers also fea-ture low distortion, with output power meeting third-or-der inter modulation (IM3) = 25 dBc of 46 dBm. (Contact company for pricing and availability.)Mitsubishi Electric USA, Cypress, CACustomer Service [email protected]

VCO offers excellent linearityThe CVCO55CW-3050-4250 voltage-controlled oscillator (VCO) operates from 3,050 to 4,250 MHz with a control voltage range of 1.5 to 18.5 V. The VCO has a typical phase noise of –84 dBc/Hz at 10 kHz offset. Output power

is typically 1.5 dBm.The part has an input voltage of 5 V

and a maximum current consumption of 16 mA, and comes in an industry-standard 0.5 x 0.5-in. SMT package. Pulling and pushing are at 5.0 MHz and

4.0 MHz/V, respectively. (Contact company for price — available now.)Crystek, Fort Myers, [email protected] www.crystek.com

can be set by external resistors or the PMBus.The power module features a low-profile 15 x 15–mm

QFN package that provides a power density of 1275 W/in.3 The 94% peak efficiency and thermal resistance of 11°C/W helps eliminate the need for a heat sink or air flow for most applications. The modules can be connect-ed in parallel for higher-current needs. ($19.11 ea/1,000 — available now.)Intersil, Milpitas, CASales 408-432-8888 www.intersil.com


Relay & Switch

CIT January.indd 1 12/8/2011 10:20:50 AM


Dc motor yields 150 mNm at 8,000 rpmThe 3863 CR dc micro motor has ZHN48 magnet material for torque performance of 150 mNm at 8,000 rpm. The motor is available for 12-, 18-, 24-, 36-, 48-V operation and can be equipped with a three-channel encoder and combined with a wide range of precision gearheads.

The motor’s low-friction torque and high thermal resistance allows for con-t i n u o u s operation at 6.9 A in the 12-V ve r s ion . No load current is 0.48 A in the 12-V version, with a stall torque of 1,200 mNm. The unit uses ball bearings preload-ed, and its weight is 400 g. ($295 ea/100 — available now.)MICROMO ElectronicsClearwater, FLSales [email protected]

Inrush current limiters extend rangeThe resistance range of EPCOS in-

rush current limit-ers is now expand-ed with the addition of a P11 series (B57211Px) that covers a resistance range from 4 to 25 Ω (R25) for currents from 2.5 to 5 A in the temperature range of 0° and 25°C. The P13 se-

ries (B57213Px) has a resistance range from 3 to 5 Ω and is designed for higher currents of 6 or 7 A.

The parts have disk diameters of 13 and 14.5 mm with coating. (Through distribution: P11 series, $0.30 each; P13, $0.32 each — available now.)TDK-EPC, Iselin, NJJames Borsh 732-906-4390www.epcos.com


NEWPRODUCTS

Chip resistors operate up to 240°CThe HTH series of ultra-high-preci-sion Bulk Metal Z1-Foil hybrid sur-face-mount chip resistors connect-ed using gold wire bonding targets high-temperature applications to 240°C. The series also offers im-proved heat dissipation, providing nearly a 100°C extension in operat-ing temperature range over preci-

Polyacene capacitors feature 0.9-mm heightPAS2126FR2R5504 polyacene ca-pacitors measure 26 mm x 20 mm with a maximum height of 0.9 mm. They have a high capacitance of 0.5 F.

The devic-es are suited for pulse cur-rent discharge of LED flash, enabling clear photographic images at low light conditions required by mobile phones, smartphones, digital still cameras and digital camcorders. (The sample price is $3.90 ea/sample — available now.)Taiyo YudenSchaumburg, ILSales [email protected]

sion thin-film chip resistors.The devices provide an order of

magnitude reduction in bulk metal foil element’s sensitivity to external and internal temperature changes, while providing long-term stability in high-temperature environments. HTH devices offer TCR of ±1 ppm/°C from –55° to 125°C and ±2.5 ppm/°C from–-55° to 220°C, 25°C ref. The resistors feature exception-al load-life stability to ±0.05% at 220°C for 2,000 hours at working power, long-term stability to ±0.05% at 240°C for 2,000 hours (no pow-er), and tight tolerances to ±0.02%. (Contact company for price and availability). Vishay Precision GroupMalvern, PAMarti Spalding [email protected]/foil-resistors/

Power capacitors aim at wind power plantsThe MKP AC HP B25360 power ca-pacitor series features high rated voltage, long operating life, and high current-handling capability, suiting them for renewable energy genera-tion applications, such as ac output filters in offshore wind turbines. The

Clare, Inc.78 Cherry Hill Drive Beverly, MA 01915 978-524-6768

For more information on Clare’s IGBT & MOSFET Gate Drivers visit:www.clare.com/Products/IGBT-MOSFETDvr.htm

Part Number Sink / Source Drive Current

(A)

Rise / Fall Times(ns)

Propagation Delay On / Off

(ns)

AvailablePackages

Low-Side Gate Drivers (Operating Voltage: 4V to 35V)

IXD_602 Family ±2 7.5 / 6.5 35 / 38 DFN, DIP, SOIC

IXD_604 Family ±4 9 / 8 29 / 35 DFN, DIP, SOIC

IXD_609 Family ±9 22 / 15 40 / 42 DFN, DIP, SOIC, TO-220, TO-263

IXD_614 Family ±14 25 / 18 50 / 50 DIP, SOIC, TO-220, TO-263

IXD_630 Family ±30 11 / 11 46 / 46 TO-220, TO-263

High-Side Gate Driver (Offset Voltage: -5V to +600V)

IX2127 0.5 / -0.25 23 / 20 100 / 73 DIP, SOIC

Optocoupler Gate Driver (3750Vrms Input to Output Isolation)

IX3120 ±2.5 100 / 100 300 / 300 DIP, Surface Mount

RoHS2002/95/ECPb e3

• Highest Drive Current Available• Highest Voltage Capability• Low-Side and High-Side Drivers• Automotive Temperature Range• Fast Rise & Fall Times• Very Low Quiescent Supply Current • Surface Mount & Power Packages

From 2A to 30A!Clare offers the largest line of Low-Side Gate Drivers

Industry’s Broadest Supplier of IGBT & MOSFET Gate Drivers

IN

VCC

GND

OUT


Power transformers are 50% lighterThe LW series of custom-designed power and isola-tion transformers is designed for 400-Hz frequency operations of up to 600 Vac onboard aircraft and in ma-rine applications of up to 10-kVA power rating for single phase, 30 kVA for three-phase systems.

It offers a 50% weight reduction over conventional C-core transform-ers. Weight of transformers in the series range from 4.5 lbs for 1,000 VA to 28 lbs for 10 kVA, and for three-phase systems from 13.5 lbs for 3 kVA to 84 lbs for 30 kVA. (Contact company for pricing — available now.)Bridgeport MagneticsBridgeport, CTInformation 203-954-0050salest@bridgeportmagnetics.comwww.bridgeportmagnetics.com

Hybrid caps have low ESR, wide temp rangeThe MXCPB and MXCPT Series alu-minum-polymer hybrid capacitors combine super-low equivalent series resistance advantages of polymer ca-pacitors with low leakage current characteristics of aluminum electro-lytic capacitor technology. Operat-ing temperatures range from –55º to 135ºC, and load life ratings are 2,000 hours. Devices have voltage options

ranging from 6.3 to 63 Vdc and ca-pacitance values from 10 to 560 µF. Dimensions are from 6.3 (Dia) x 7.7 (L) mm l to 10 x 12.5 mm.

The solvent-resistant products en-able low impedance at high frequen-cies, supporting excellent noise sup-pression and ripple absorption in a wide range of such consumer, indus-

trial, and automotive electronics ap-plications. (MXCPB, from approx. $0.35 to $0.45; MXCPT, from $0.55 to $0.95 — available now.)Tecate IndustriesSan Diego, CAInformation [email protected]

capacitors feature rated voltages from 550 to 1,000 Vrms ac and a capaci-tance range from 10 to 150 µF. High dielectric strength is enabled by a castor oil filling.

The capacitor design improves heat dissipation from the capacitor’s

interior to the alu-minum can, and hot spots reduc-tion and superior insulation proper-ties extend the op-erating life to 100,000 hours (to IEC 61071). The ca-

pacitors are designed for tempera-tures from –40° to 70°C. (Contact company for price and availability.)TDK-EPC, Iselin, NJSuresh Chandran 732-906-4318www.epcos.com


TEN-8WI Series 8 W in DIP 24 metal package

TEN-20WIR Series20 W in 2“ x 1“ metal package

• Single and dual output models• Excellent line load regulation• No minimum load required• Remote On/Off control• UL60950-1 approval

TEP-160WIR Series 160 W, half brick package

TEP-200WIR Series 200 W, chassis mount packagewith screw terminal blocks

• Very high efficiency up to 91% • No minimum load required • Adjustable output voltage +10/-20 %• Sense line• Remote On/Off control • Reverse input voltage protection • Over-temperature protection• UL60950-1 approval

TRACOPOWER launches new DC/DC converters that meet the stringent requirements for mobile and stationary railway applications in accordance to EN50155 standard.

Main upgrades for railway capability:Increased EMC immunity against surge, burst, radiated and conducted disturbancesInput voltage ranges cover the nominal 24, 36, 72 and 110 VDC with ±40 % toleranceShock and vibration / thermal shock in accordance to EN61373 and MIL-STD-810F

New DC/DC-Converters for Railway Applications

www.tracopower.comPOWERGATE LLC 866-588-1750 www.powergatellc.comPower Sources Unlimited 800-966-7784 www.psui.com/traco


NEWPRODUCTS

G l o b T e k ’ s expanded powerline now includesmultiple familiesof Wall Plug-in &Desktop Level VPower Supplies.Designs have reg-ulated outputsvoltage from: 3.3-48 Vdc in 0.1V increments, up to 120W. Features: O.C., S.C., O.V., Thermal Protection;meets multiple International Safety Agency forITE & Medical applications. All Models carryagencies’ logos and CE-Mark. GlobTek offers a 5-year warranty.GlobTek, Inc., N.J. Sales [email protected]://www.globtek.com

GlobTek’s series of Smart Li-On chargers offers a compact &cost effective, solution forcharging GlobTek* Lithium-Ion and Lithium

Polymer batterypacks. Features:single or multiplebay cradle, customcharging schemes,battery conditionbefore bulk charg-ing, programmablecharge timer back-up, charge status

LEDs. Multiple bay chargers have the option ofan MCU incorporated for battery identification,status & temperature using HDQ fromBQ27000. *or equalGlobTek, Inc., N.J. Sales [email protected]://www.globtek.com

GlobTek’s Li-On Battery Packs are comprisedof single or multiple cells rated 3.7V up to5200 mAh each. Cells can be packaged with Seiko S-8232AKFT-T2 control chip protection & TIBQ27000 basedfuel gauge circuitryincluded. Addi-tional features:protection fromShort Circuit, Overvoltage, Over cur-rent, Under Voltage, Overcharge, Over dis-charge, Over Temperature. The packs are aPolycarbonate/ABS mixture frame or case,contacts made of nickel & frames designs aresealed in an ET label material. Modified andCustom Designs available.

GlobTek, Inc., N.J. Sales [email protected]://www.globtek.com

Level V Ad 1.12 QR_Layout 1 12/7/2011 11:25 AM Page 1

70-W buck-driver powers LED-stringsThe RCD-48 series is a step-down con-stant current source for driving high-

power LED applica-tions. With input

voltage up to 60 Vdc and constant current outputs of 350, 500, 700 and

1,200 mA, the device provides power up to 70 W.

This enables a fixture using the full wattage to replace a conventional light that could have used up to 350 W.

The buck-driver suits long LED-chains and larger multi-chip arrays. The devices are dimmable down to zero with external digital (PWM) or analog control. The PWM control in-put can be directly connected to a microcontroller. Efficiency is rated at 96%, with an operating temperature range –40° and +85°C. The modules are available with pins for PCB mounting or with flying leads for non-PCB applications. (Samples available now.)Recom Power, Brooklyn, NYinformation 718-855-9710www.recom-power.com

350-W supplies feature 3 x 5-in. footprintThe EMH250 and EMH350 series of single output 250 W and 350 W ac/dc power supplies meet IT equipment safety specifications UL/TUV/EN 60950-1 and the medical safety stan-dards of UL/TUV/EN 60601-1. The 3 x 5 x 1.43 in supplies suit informa-tion technology, industrial, medical equipment, and surgical life support applications. They are also BF rated.

The ac/dc power supply series fea-ture an input range from 80 to 275 Vac and are available in four output models of +12, +18, +24 or +48 Vdc. A trim function allows adjustment of the output voltage to within ±10% of the stated nominal. A +12-Vdc, 0.6-A fan supply is also provided across the range. The EMH350 series also in-cludes a +5-Vdc, 2.0-A standby sup-ply. Full power is available from 90–Vac input, they do not derate until +50C, and require only 12–cfm

forced airflow to deliver full output power. (From $99.84 ea/500 — avail-able now.)XP Power, Sunnyvale, CADuane Darrow [email protected]

Convection-cooled supply offers active PFCThe XL375 series of single-output 260-W convection-cooled ac/dc power supplies has an area of 3.3 x 5 x 1.5 in. The single- and multiple-output versions have a universal active PFC 90 to 264-Vac input, and output voltages of 12, 24, 28, 36, 40, 48, 54, and 56 Vdc.

The ac/dc power supply can de-liver 375 W with 10–cfm of air. The

ADVERTISEMENT

Power Sources

edited by paulo’sheaSee more online at electronicproducts.com/ps

40-W dc/dc converters feature 2 x 1.6-in. footprintThe F4000RW series of 40-W dc/dc converters offer regulated output pow-er in a 2 x 1.6-in.case. They target ap-plications requiring high power densi-ty, robust performance and long term reliability. Seven standard models op-erate from 48-Vdc (36 to 75-V range) inputs, providing single outputs of 1.8, 2.5. 3.3, 5, 12, 15, or 24 Vdc.

Standard features of the dc/dc converters include line/load regula-

supplies feature up to 93% efficiency, have active current sharing for n, n+1 with an ORing Board option, and have remote on/off, and active in-rush current protection. ($190 ea/large qty — available now.)Power Sources UnlimitedWrentham, MASales [email protected]

Medical, ITE supplies meet Level V requirementsThe GT(M)91099 series of desktop power supplies feature IEC 320/C8,C6 changeable blades and have double-enforced insulation. The supplies offer reg-ulated outputs from 12 to 24 Vdc in 0.1–V incre-ments, up to 60–W of continuous output power. The enclosed power supplies are housed in an impact re-sistant non-vented polycarbonate case that provides thermal conduc-tion cooling, with dimensions 118.5

x 53.5 x 34.2-mm.The power supplies feature over-

current, over-voltage, short circuit, and thermal protection. They accept 90 to 264–Vac input, meet UL /cUL and IEC/EN 60950 & 60601.1 for ITE & medical applications, and they comply with EMI/RFI Regulations, EMC Directives/ CE and FCC Class B for ITE applications. ($16 ea/large qty — available now.)GlobTek, Northvale, NJSales [email protected]

tion <1.0%, input/output isolation of 1,600 Vdc, continuous short circuit protection, and a remote control in-put. The operating temperature range extends from –25° to +70°C. ($43.75 ea/100 — available now.)MicroPower DirectStoughton, MASales [email protected]

65-W switcher features 2 x 4-in. footprintThe MWS65 series 65-W open-frame, medical/ITE ac/dc power supply of-fers a 2 x 4-in. footprint, with a 1-in. profile, and features a 4-kVac rein-forced input-to-output isolation and output-to-ground isolation of 1,500 Vac. All models comply with UL/EN60601-1 editions 2 and 3 safety ap-provals for medical equipment and include onboard dual fusing, making them ideal for use in body and body-floating-type medical applications.

The medical/ITE power supply consumes <0.3 W under no-load conditions. The convection-cooled

To find your solution, go to:www.programmablepower.com

AMETEK Programmable Power9250 Brown Deer RoadSan Diego CA [email protected] © 2010 AMETEK Programmable Power – All rights reserved.

POWER of CHOICE

DC Bench Supplies DC High Power, Rack Mount Supplies DC Modular & Configurable Systems

AC Power Sources AC / DC Electronic Loads Compliance Test Systems


NEWPRODUCTS

unit is also suitable for light indus-trial point-of-sale terminals/displays, test and measurement, and broadcast

equipment applica-tions. It operates from 90 to 265-Vac input, and offers five models with nominal outputs of 5, 12, 15, 24, or 48

Vdc. All outputs are user adjustable by ±10%. The supply operates at full load from –20° to +50°C ambient temperature and up to +70°C with suitable derating. ($32 ea/50 — avail-able now.)TDK-Lambda AmericasSan Diego, CASales 619-575-4400FAX 619-429-1011www.us.tdk-lambda.com

10-W converter meets IEC60601 medical specThe JHM10 series of board-mounted compact isolated 10-W dc/dc convert-ers meet the ANSI/AAMI ES60601-1:2005, IEC60601-1 3rd edition medi-cal safety standard for patient

connected medical equipment. The converters have a maximum leakage current of 2 µA and have a reinforced input to output insulation at a working voltage of 250 Vac and provide an iso-lation of up to 4,000 Vac for up to 1 minute, and up to 5,000 Vac for up to 10 ms. They have an isolation capaci-tance of 20 pF.

The dc/dc con-verter series offers a 2:1 input range from 4.5 to 9 Vdc, 9 to 18 Vdc or 18 to 36 Vdc with either single or dual outputs. Single outputs are 5, 12, or 15 Vdc, and dual outputs provide ±5, ±12, or ±15 Vdc. The regulated outputs vary no more than ±0.3% under all input condi-tions and less than ±2.0% under all load conditions. Outputs can be trimmed up to ±10% of stated nomi-nal output. (Ea/500: single output, from $35.00; dual output, $38.22 — available now.)XP Power, Sunnyvale, CADuane Darrow [email protected]

A D V A N C E D P O W E R S O L U T I O N S

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Power Sources

HIGHLIGHTS

Module/software make iPhone a spectrum analyzer/ power meter Made in Taiwan by Oscium, the WiPry-Combo module and software turn an iOS device (iPad, iPod Touch, and iPhone) into an spectrum analyzer and dynamic power meter with a touch interface. Data is collected at up to 12 MSa/s and can be logged in csv for-mat, while screen-shot results can be emailed via an iPhone host.

In spectrum-analyzer mode, the instrument can identify interference or open channels in the 2.4-GHz ISM band (2.400 to 2.495 GHz), or unauthor-ized WiFi access points. It measures signals from −40 dBm to +20 dBm with an amplitude resolution of 2.0 dBm and a bandwidth resolution of 1 MHz with a 200-ms sweep. As a dynamic power meter mode, the device works as a 100 MHz to 2.7-GHz RF power meter graphically displaying RF power levels. Time scale is adjustable from 2 μs/div to 1 s/div and amplitude dis-play is from −45 dBm to +20 dBm with a resolution of 2.0 dBm.

Display configurations can be saved for on-the-go measurements, and iOS’s two finger “stretch” allows zooming in and out of scaling without the need for buttons or knobs. A demo package that does not require the mod-ule is available free at Apple’s AppStore. ($199.95 — available now in the U.S. from Saelig.) Saelig , Pittsford , NY Information 585-385-1750 [email protected] www.saelig.com


NEWPRODUCTS

©2012 Measurement Computing Corporation 10 Commerce Way, Norton, MA 02766

[email protected]

MEASUREMENTCOMPUTING

150 DAQ Products under $500

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For over 20 years Measurement Computing has offered quality DAQ solutions that are not only priced right, but are engineered to exceed the needs and expectations of our customers.

LOW-COSTDAQ

Engineered with Innovation.

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Contact us1.800.234.4232

PXIe modules simplify multi-chassis config The NI PXIe-8364 and -8374 remote-control modules let engineers inter-face multiple PXI Express chassis di-rectly to a single host computer using any expansion topology, elimi-nating the need for complex cus-tom solutions. By simplifying in-terconnect ion, the modules increase the efficiency of test system configuration in high-channel-count data acquisition and high-speed automated test applica-tions, including RF and semiconduc-tor test.

The modules support complex

USB daq haslow price Priced under $500, the OM-DAQ-USB-2401 USB 2.0 data acquisition (daq) module accepts thermocouple and voltage inputs on its 8-differen-tial/16-single-ended channels, se-q u e n t i a l l y reading in-puts at rates to 1,000 rdg/s with 24-bit r e s o l u t i o n . Users can pro-gram each channel independently for one of 10 voltage ranges — from ±30 mV to ±10 V — or for type J, K, T, E, R, S, B, or N thermocouple inputs.

The module has four cold-junc-tion-compensation temperature sen-sors built in, as well as open-thermo-couple detection. The unit can be powered using either the USB port or an optional external dc supply. Win-dows software, drivers for custom programming, and hardware for wall or DIN-rail mounting are included.

($495 — available now.) Omega Engineering Stamford , CT Information 203-359-1660 [email protected] www.omega.com

Test & Measurement

edited by richardcomerford and carolynmathasSee more online at electronicproducts.com/tm

Digital Oscilloscopes

DS4000

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A fast, versatile general purpose scope that sets a new standard for performance and value!Debugging and testing your latest design has never been easier or more affordable! New DS4000 series scopes, the latest addition to Rigol's family of fast, easy-to-use, ultra-modern test instruments, deliver a feature set unmatched by any scope in its class, at a fraction of the cost. Compare our 140 Mptsmemory depth, up to 200,000 frames of waveform recording and 4 GSa/s sample rate and you'll likewhat you see. These scopes come in 2 or 4 channels and feature a 9 inch WVGA display for excellent resolution. Rigol is quickly earning a reputation for fast, dependable, high performance test instruments...check us out, we guarantee you'll be satisfied!

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NEWPRODUCTS

Water treatment control system targets chemical automationThe CDCN 13 fully programmable water treatment con-troller is designed for complete chemical automation in-cluding conductivity, pH and ORP, and control of chem-ical additives, all with datalogging.

The controller handles cooling tower, boiler, industrial process wa-ter, food processing, and drinking and wastewater treatment applica-tions. Engineering units are dis-played in U.S. or metric values using a 16-button keypad and 8-line LCD readout with scroll-through menus. The CDCN13 has eight control relay outputs, for up to four chemical additives, fill valve, bleed valve, probe rinse, remote alarm, and NEMA 4X wall mount enclosures. (From $2,550 — available now.)Omega Engineering, Stamford, CTInformation 203-359-1660 [email protected]

star, line, or tree complex topologies, using cabled x1 (8364) or x4 (8374) MXI-Express links to provide 250-Mbyte/s and 1-Gbyte/s maximum data rates, respectively. All PXI modules in the downstream chassis appear as lo-cal devices in the upstream chassis and, since MXI-Ex-press links are software transparent, no additional pro-gramming is required. (From $799 — available now.)National Instruments, Austin, TXInformation 800-258-7022 [email protected]//mxiedc

Data converter handles BWs up to 240 MHzThe Model 71651 delivers more than twice the bandwidth of the company’s previous data converters, providing tun-ing bandwidths from 10 kHz to 240 MHz. A member of the Cobalt family of high-performance XMC modules, the convert-er is based on a Virtex-6 FPGA preconfig-ured with data acquisition and playback

IP, giving turnkey functionality as well as room for user customization.

The card features two input and two output RF chan-nels, transformer-coupled to allow direct connection to HF or IF radio stages. Input channels feature 12-bit, 500-MHz ADCs, while the output channels have a TI DAC5688 digital upconverter that translates real or complex base-band signals to any IF frequency up to 380 MHz. Dual

JTAG Embedded Test extends to i.MX51 processorsScanExpress JTAG Embedded Test (JET) support is now available for all Freescale i.MX51 applications processors, providing at-speed testing of embedded processor-based electronic PCBs and systems to detect, isolate, and diag-nose structural and functional defects.

ScanExpress JET controls the i.MX51’s ARM Cortex-A8 core through the JTAG debug port enabling binary and script test step execution using a GUI on the host PC. ScanExpress JET provides standardized interface tests for SDRAM memory, I2C, Ethernet, PMIC, and UART; fast in-system programming and testing of parallel and serial NOR and NAND Flash, and fully automatic test develop-ment for all supported peripherals. (Contact company for price and availability.)Corelis, Cerritos, CASales 888-808-2380 [email protected]

Temperature monitor is web basedThe iSD-TC series temperature monitor delivers web-based temperature monitoring in critical equipment and locations such as clean rooms, computer rooms, HVAC systems, pharmaceutical and food processing and stor-age, laboratories, semiconductor fabs, electronic assem-bly, and greenhouses.

The device accepts two thermocouple inputs types J, K, T, E, R, S, B, C, N, and L, triggering an alarm if tem-perature veers from the set point, which can be estab-lished remotely by e-mail. (From $495 — available now.)Omega Engineering, Stamford, CTInformation 203-359-1660 [email protected]

16-bit, 800-MHz DACs create real or in-phase (I) and quadrature (Q) analog outputs. PCIe, cPCI, VPX, and rug-gedized, extended-temperature versions are also avail-able. (From $13,745 — available 10-14 weeks ARO.)Pentek, Upper Saddle River, NJSales 201-818-5900 [email protected]

15 Jonathan Drive, Unit 4Brockton, MA 02301-5566

Tel: (508) 580-1660Fax: (508) 583-8989www.krohn-hite.com

“Quality inTest and Measurement

Since 1949”

o y6

Call T da (508) 580-1 60

Made in U.S.A.

General PurposeTunable Active Filter

Features Front Panel Channel ControlTwo Low-Pass, High-Pass

Cutoff Frequency: 0.1Hz to 200kHzAttenuation Slope: 48dB/Octave Response: Butterworth and BesselWideband Noise: <25µV at Max. Gain Input: Differential and Single-EndedMax Input/Output: ±10V Peak Pre-Filter Gain: 0dB to 50dBCrosstalk Between Channels: -80dB Post-Filter Gain: 0dB to 20dBBNC Input and Output Connectors AC/DC Coupling

• • •

• •• • • • • • • •

Independent Filter Channels One Band-Pass/Band-Reject Channel

The Model 3382 Filter provides the performance and flexibilityneeded for today’s production and laboratory. Tunable from0.1Hz to 200kHz, each channel provides independentcontrol of cutoff frequency, filter response, low-pass andhigh-pass functions, differential and single-ended input config-uration, pre and post filter gain, and ac/dc coupling. One(3381) and four (3384) channel models are also available.

One that can be configured your way.

Test & Measurement


NEWPRODUCTS

Cable system eliminates junction boxes, splicesThe ESG Flexible Power and Data Bus System is a family of multiconductor flat cables. It eliminates the need for

junction boxes, splices, and home run wir-ing when run-ning power and data to industri-

al and commercial equipment.The family is available with five

to seven conductors. The cables are PVC, polyethylene, or halogen-free sheaths. Power connection boxes are rated from 1 to 76 A and are based on IDC technology. (Contact company for price — available now.)Electrotech Direct, Colmar, PAInfo [email protected]

RJ45/Enet connector suits harsh environsThe IP 67 Bayonet RJ45/Ethernet field-wireable connector offers ro-bust housing for use in such harsh environments as washdown, toxic chemical, or high-impact applica-tions. Bayonet-style mating prevents damage causing over tightening and under tightening, requiring only a quarter turn to attach and lock.

The connector is water resistant in depths of 1 m for up to 30 min, and features CAT 5 performance for data transmission speeds of up to 1,000 Mbits/s. Available in plastic and metal, the connector works in all Ethernet applications. (Contact company for price and availability.)Turck, Minneapolis, MNTechnical Information [email protected]

Packaging & Interconnections

edited by richardcomerford and carolynmathas See more online at electronicproducts.com/in

Die-cast enclosures have uncommon shapesProviding a robust, environmentally sealed enclosures with good EMC screening, 1590 series TRP and STP models respectively provide octagonal

and trapezoidal housings made of die-cast aluminum alloy. The 1.54 x 5.23 in. octagonal unit can house a 5.0 in.-dia. circular PCB. Both trapezoidal units are 1.54 in. high; the portrait-format unit is 4.41 in. long, narrow-ing from 3.11 to 2.42 in.; the landscape-format one’s dimensions are 3.74 in., 5.95 to 4.79 in.

All three types are available in nat-ural finish or in black, cobalt-blue, green, light-gray, orange, or red gloss polyester powder paint. A lap joint seals the units to IP54. (Contact Ray Shatzel for pricing and availability.)Hammond ManufacturingCheektowaga, NYRay Shatzel [email protected]

USB 2.0 connectors are latched, sealedThe addition of latching and circular sealing to industrial USB 2.0 connec-tors provides 40 N of locking strength and 1,500 mating and unmating cy-

Paper Tube Company1033 S. Noel Ave., Wheeling, IL 60090

More Than 75 Years- The Original

To receive literature & details fast - www.pptube.comPhone: 847-537-4250 • Fax: 847-537-5777 • E-Mail: [email protected]

™ ® DuPont Co.

420°F, 720 VPM!High Temperature - High DielectricNOMEX® for Electrical/ElectronicTubing, Bobbins, Fabricated PartsWidely specified for its excellent electrical,thermal and mechanical properties…“Nomex” tubing is produced by Precisionwith an exclusive, special binder toprovide a thermallystable class “H”insulating tubing.U/L Recognized.


NEWPRODUCTS

Single-chip CMOS 100G optical interconnect debutsSaid to be the industry’s first such de-vice, a single-chip CMOS photonics-based 100G optical interconnect targets next-generation cloud computing, data centers, and high-performance comput-ing connectivity. The device comprises four 28-Gbit/s transmit and receive channels powered by a single laser.

Targeted applications include 100-Gbit/s Ethernet, OTN, InfiniBand, OIF Short Reach and Very Short Reach. (Sampling evaluation plat-forms to strategic partners and lead customers; contact company for pric-ing and availability.)Molex, Lisle, ILSales [email protected]


“…the supportthey’ve

given us…has been

exceptional.”Director of Engineering,

Medical Interconnect Manufacturer

To view our Design Guide, new product offeringsand request a datasheet with free samples,visit www.mill-max.com/EP608

Our connectors speak for themselves…so do our customers.

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MAXIMUMService

“…they make things simple. Where othersfind ways to complicate the process, Mill-Max

consistently delivers what’s needed, whenit’s needed, with little or no fuss.”

At Mill-Max we do everything we can to make yourjob easier — from our easy-to-use website to quick-turnaround quotes…responsive customer service and technical support…on-time delivery…free samples…and so much more.

“Quality is not open to compromise,and Mill-Max components meet our

very stringent standards.”

cles. Latching eliminates accidental unplugging for such mo-bile applications as handheld devices with controller-to-pe-ripheral interconnection.

The circular sealed version of USB 2.0 plugs and receptacles provide an environmentally protected USB for field data col-lection systems, keyboard, video mouse extensions, human-machine interfaces, and industrial control panels, protecting against water and dust ingress to IP67 level. Connector halves are durably interlocked and have a quarter-turn bayonet latch. (Contact company for price — available now.)TE Connectivity, Harrisburg, PAProduct Information Center 800-522-6752www.te.com/products/Industrial-USB-connectors

Cable wrap prevents binding, crushingStrap-It Cable Wrap is a hook and loop cable organizer that can be cut to length and reused for bundling fiber optic cables damaged from rigidity and overtightening of plastic ties.

Easily adjustable, the organizer comes in ½-, 3/5-, and 1-in.-wide sizes on 25-yard rolls. The nylon wrap features a micro hook on one side and low-profile loop on the other. Applications include audio-visual equipment, fiber optics, home stereo, medical instrumentation, telecom-munications cabling, and other cable systems. (Contact company for pricing — available now.)Eastex Products, Holbrook, MAJohn Kimball 781-767-4511 [email protected]

www.masterbond.com154 Hobart Street, Hackensack, NJ 07601 USA

right off the bat

High shear and peel strength Resists vibration and impact Non-drip Superior electrical insulator

One Part Epoxy Adhesive Has Exceptional Thermal Conductivity

Supreme 3ANHT

Packaging & Interconnections


Abracon Corporation ……………………………………………… 24Absopulse Electronics Ltd. ………………………………………… 71Advanced Interconnections Corp. ………………………………… 77Advanced Power Solutions ………………………………………… 73Agilent Technologies, Inc. ………………… Cover 2, 2, 3, 21, 51AKM Semiconductor, Inc. ………………………………………… 63Allied Electronics, Inc. ……………………………………… Cover 3Ametek Programmable Power ……………………………………… 72APM Hexseal ………………………………………………………… 66Aries Electronics, Inc. ……………………………………………… 57Avnet Electronic Marketing …………………………………… 29, 37Bel Fuse Inc. …………………………………………………………… 56Cirrus Logic, Inc. …………………………………………………… 7CIT Relay & Switch ………………………………………………… 68Clare, Inc. ……………………………………………………………… 69Coilcraft CPS ………………………………………………………… 53Coilcraft, Inc. ………………………………………………………… 10Cornell Dubilier Electronics ………………………………………… 25Digi-Key Corporation ……………………………………………… 1Epcos AG ……………………………………………………………… 41FCI Electronics …………………………………………………… 60, 61Floyd Bell Inc. ………………………………………………………… 80Garrett Electronics Corporation …………………………………… 20GlobTek, Inc. …………………………………………… Cover 1, 71Hammond Manufacturing Company Inc. ……………………… 78Harting, Inc. …………………………………………………………… 59Harwin ………………………………………………………………… 58Hittite Microwave Corporation …………………………………… 43Integrated Power Designs, Inc. …………………………………… 19International Rectifier …………………………………… Insert, 65Ironwood Electronics ………………………………………………… 80IXYS Corporation …………………………………………………… 34KOA Speer Electronics, Inc. ………………………………………… 55Krohn-Hite Corporation ……………………………………… 76, 80Linear Technology Corporation …………………………………… 13Master Bond Inc. ……………………………………………………… 79Maxim Integrated Products, Inc. ………………………… Cover 4Mean Well USA, Inc. ………………………………………………… 4Measurement Computing Corporation ………………………… 74Memory Protection Devices ………………………………………… 39MicroMo Electronics, Inc. ………………………………………… 35MicroPower Direct, LLC …………………………………………… 38Microtips Technology, Inc. ………………………………………… 20Mill-Max Manufacturing Corp. …………………………………… 79Mouser Electronics …………………………………… 16, 17, 27, 32MuRata Power Solutions, Inc. ……………………………………… 40National Instruments ………………………………………………… 15Newark/element14 …………………………………………………… 9OKW Enclosures, Inc. ……………………………………………… 77Panasonic Industrial Company …………………………………… 80PDuke Technology …………………………………………………… 73Pico Electronics, Inc. …………………………………………… 54, 64Positronic Industries ………………………………………………… 23Precision Paper Tube Company …………………………………… 78Rigol Technologies …………………………………………………… 75Statek Corporation …………………………………………………… 67TDK-Lambda Americas, Inc. ……………………………………… 30Total Power International, Inc. …………………………………… 72Traco Power …………………………………………………………… 70Voltage Multipliers Inc. ……………………………………………… 42Zilog Inc. ……………………………………………………………… 26

BGA & QFN SocketsQuick-Turn Custom Designs

Ironwood ElectronicsTel: (800) 404-0204 Fax: (952) 229-8201www.ironwoodelectronics.com

Voice-Capable Alarms Replace Ambiguous “Beep”Sometimes a “beep” or “whoop” doesn’t convey enough information.

audio message or voice instructions up to ten seconds

Floyd Bell [email protected]

Panasonic’s ECW-F(A) Series 250/450V Metallized Polypropylene CapacitorsThe ECW-F(A) Series features Panasonic’s new safety construction for increased capacitor safety. This patterned metallization technology allows current to flow past a failed point bypassing failed cells and therefore increasing capacitor safety. The ECW-F(A) Series miniaturized footprint is the choice for application downsizing where smaller case sizes are required.Panasonic Electronic Components1-800-344-2112piccomponentsmarketing@ us.panasonic.com www.panasonic.com/industrial/ electronic-components/

For Reprints contact Wright’s Media 877-652-5295

Fixed Frequency Active Filter ModulesKrohn-Hite’s Fixed Frequency Filter Modules and Module Boxesare a low cost customer defined solution for anti-aliasing andnoise reduction applications.

Krohn-Hite(508) 580-1660www.krohn-hite.com

advertiser indexThis index is provided as an additional service.

The publisher does not assume any liability for errors or omissions.

Product martElectronic Products Presented by the Manufacturer

Buy it your way from Allied Electronics.

1.800.433.5700© Allied Electronics, Inc 2012. ‘Allied Electronics’ and the Allied Electronics logo are trademarks of Allied Electronics, Inc. An Electrocomponents Company.

THINK ALLIEDSM

The Allied Catalog featuresthousands of products from 300+ world-class suppliers.

Choose from more than two million product solutions at alliedelec.com.

We are ready to assist you.Call your local sales rep. at1.800.433.5700.

Online Local ServiceCatalog

We Do Business Your Way

NOV11-MultiChannel Ad (EP).qxd:Ad Layout 12/7/11 11:08 AM Page 1

Imagine what you could do if you didn’t have to sacrifice size for efficiency. You could drive power densities to new levels in servers. Minimize heat in low-airflow base stations. And boost processing power in space-constrained notebooks. Maxim’s new point-of-load (POL) regulators integrate low-RDS(ON) MOSFETs into tiny wafer-level packages, so you don’t need external FETs to meet your efficiency goals. That’s imagination, unfettered.

Key Advantages• Wafer-level packages as small as 1.5mm x 1.5mm are 50% smaller than the nearest competition

• Low-RDS(ON) MOSFETs are integrated to save space and reduce conversion losses

• Up to 96% efficiency conserves power and eases thermal management

• Outstanding load transient response enables tighter regulation and reduces output capacitance

© 2012 Maxim Integrated Products, Inc. All rights reserved. Innovation Delivered, Maxim, and the Maxim logo are trademarks or registered trademarks of Maxim Integrated Products, Inc., in the United States and other jurisdictions throughout the world. All other company names may be trade names or trademarks of their respective owners.

See what you can do. Order a free sample today.www.maxim-ic.com/POL-Samples

Imagination. Unfettered.POL regulators offer high-efficiency FETs in wafer-level packaging

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Imagination. It’s in everything we do.

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