he910 hardware user guide - telit · he910 hardware user guide 1vv0300925 rev. 29 page 3 of 112...

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Mod. 0805 2017-01 Rev.6

HE910 HW User Guide

1VV0300925 Rev. 29 – 2017-01-27

HE910 Hardware User Guide

1VV0300925 Rev. 29 of 112 2017-01-27

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.


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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.


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APPLICABILITY TABLE

PRODUCTS

HE910 (*)

HE910-D

HE910-GL

HE910-EUR

HE910-EUD

HE910-EUG

HE910-NAR

HE910-NAD

HE910-NAG

(*)HE910 IS THE “TYPE NAME” OF THE PRODUCTS MARKETED AS HE910-G & HE910-DG


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Contents

NOTICE ……………………………………………………………………………2

COPYRIGHTS ................................................................................................ 2

COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3

I. License Agreements ..................................................................... 3

II. Copyrighted Materials ................................................................... 3

III. High Risk Materials ....................................................................... 3

IV. Trademarks .................................................................................. 3

V. Third Party Rights ......................................................................... 3

APPLICABILITY TABLE ................................................................................ 4

CONTENTS .................................................................................................... 5

1. INTRODUCTION .......................................................................... 9

Scope ........................................................................................... 9

Audience....................................................................................... 9

Contact info and Support .............................................................. 9

Text Conventions ........................................................................ 10

Related Documents .................................................................... 11

2. OVERVIEW ................................................................................ 12

3. HE910 MODULE CONNECTIONS ............................................ 13

Pin-Out ....................................................................................... 13

3.1.1. LGA Pads Layout (HE910) ......................................................... 26

3.1.2. LGA Pads Layout (HE910-D) ...................................................... 27

3.1.3. LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and HE910-GL) ................................................................................. 28

3.1.4. LGA Pads Layout (HE910-EUG and HE910-NAG) ..................... 29

4. HARDWARE COMMANDS ........................................................ 30

Turning ON the HE910 ............................................................... 30

Turning OFF the HE910 .............................................................. 35

HE910 Unconditional Shutdown ................................................. 37

5. POWER SUPPLY ....................................................................... 40


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Power Supply Requirements ....................................................... 40

Power Consumption ................................................................... 41

General Design Rules ................................................................. 43

5.3.1. Electrical Design Guidelines ....................................................... 43

5.3.1.1. + 5V input Source Power Supply Design Guidelines ................... 43

5.3.1.2. + 12V input Source Power Supply Design Guidelines ................. 44

5.3.1.3. Battery Source Power Supply Design Guidelines ........................ 45

5.3.2. Thermal Design Guidelines ......................................................... 46

5.3.3. Power Supply PCB layout Guidelines ......................................... 47

6. GSM/WCDMA RADIO SECTION ............................................... 49

HE910 Product Variants ............................................................. 49

TX Output Power ........................................................................ 50

Sensitivity ................................................................................... 50

GSM/WCDMA Antenna Requirements ....................................... 51

GSM/WCDMA - PCB line Guidelines .......................................... 52

PCB Guidelines in case of FCC certification ............................... 54

6.6.1. Transmission line design ............................................................ 54

6.6.2. Transmission line measurements ............................................... 55

GSM/WCDMA Antenna - Installation Guidelines ......................... 57

Antenna Diversity Requirements ................................................. 57

7. GPS RECEIVER ......................................................................... 59

GPS Performances ..................................................................... 59

GPS Signals Pinout .................................................................... 60

RF Front End Design .................................................................. 61

7.3.1. RF Signal Requirements ............................................................. 61

7.3.2. GPS Antenna Polarization .......................................................... 62

7.3.3. GPS Antenna Gain ..................................................................... 63

7.3.4. Active versus Passive Antenna ................................................... 63

7.3.5. GPS Antenna - PCB Line Guidelines .......................................... 64

7.3.6. RF Trace Losses ........................................................................ 64

7.3.7. Implications of the Pre-select SAW Filter .................................... 64

7.3.8. External LNA Gain and Noise Figure .......................................... 65

7.3.9. Powering the External LNA (active antenna) ............................... 65

7.3.10. External LNA Enable .................................................................. 65

7.3.11. Shielding ..................................................................................... 66

7.3.12. GPS Antenna – Installation ......................................................... 66


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8. LOGIC LEVEL SPECIFICATIONS ............................................. 67

Unconditional Shutdown ............................................................. 69

9. USB PORT ................................................................................. 70

USB 2.0 HS Description .............................................................. 70

10. SPI PORT ................................................................................... 71

SPI Connections ......................................................................... 72

11. USB HSIC .................................................................................. 73

12. SERIAL PORTS ......................................................................... 75

MODEM SERIAL PORT 1 (USIF0) ............................................. 76

MODEM SERIAL PORT 2 (USIF1) ............................................. 79

RS232 level translation ............................................................... 80

13. AUDIO SECTION OVERVIEW ................................................... 82

Electrical Characteristics ............................................................. 82

13.1.1. CODEC Examples ...................................................................... 82

14. GENERAL PURPOSE I/O .......................................................... 83

GPIO Logic levels ....................................................................... 84

Using a GPIO Pad as INPUT ...................................................... 85

Using a GPIO Pad as OUTPUT .................................................. 85

Indication of network service availability ..................................... 86

RTC Bypass out .......................................................................... 87

External SIM Holder Implementation ........................................... 87

VAUX Power Output ................................................................... 87

ADC Converter ........................................................................... 88

14.8.1. Description .................................................................................. 88

14.8.2. Using ADC Converter ................................................................. 88

15. MOUNTING THE HE910 ON THE APPLICATION ..................... 89

General ....................................................................................... 89

Module finishing & dimensions .................................................... 89

Recommended foot print for the application ................................ 91

Stencil ......................................................................................... 92

PCB pad design .......................................................................... 92

PCB pad dimensions .................................................................. 93

Solder paste ............................................................................... 95

15.7.1. HE910 Solder reflow ................................................................... 95

Packing system (Tray) ................................................................ 97


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Packing System (Reel) ............................................................... 99

15.9.1. Carrier Tape Detail ..................................................................... 99

15.9.2. Reel Detail ................................................................................ 100

15.9.3. Packaging Detail ....................................................................... 101

Moisture sensitivity ................................................................... 101

16. SAFETY RECOMMANDATIONS ............................................. 102

17. CONFORMITY ASSESSMENT ISSUES .................................. 103

1999/5/EC Directive .................................................................. 103

FCC/IC Regulatory notices ....................................................... 108

18. DOCUMENT HISTORY ............................................................ 110


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1. INTRODUCTION

Scope

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module.

Audience

This document is intended for Telit customers, who are integrators, about to implement

their applications using our HE910 modules.

Contact info and Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

[email protected]

[email protected]

[email protected]

[email protected]

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments

and suggestions for improvements.

Telit appreciates feedback from the users of our information.

mailto:[email protected]



http://www.telit.com/support

http://www.telit.com/


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Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.


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Related Documents

Digital Voice Interface Application Note, 80000NT10050A

SPI Port Application Note, 80000NT10053A

Product description, 80378ST10085A

SIM Holder Design Guides, 80000NT10001A

USB HSIC Port Application Note, 80000NT10071A

AT Commands Reference Guide, 80378ST10091A

Telit EVK2 User Guide, 1vv0300704


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2. OVERVIEW

The aim of this document is the description of some hardware solutions useful for

developing a product with the Telit HE910 module. In this document all the basic functions

of a mobile phone will be taken into account; for each one of them a proper hardware

solution will be suggested and eventually the wrong solutions and common errors to be

avoided will be evidenced. Obviously this document cannot embrace the whole hardware

solutions and products that may be designed. The wrong solutions to be avoided shall be

considered as mandatory, while the suggested hardware configurations shall not be

considered mandatory, instead the information given shall be used as a guide and a

starting point for properly developing your product with the Telit HE910 module. For

further hardware details that may not be explained in this document refer to the Telit

HE910 Product Description document where all the hardware information is reported.

The information presented in this document is believed to be accurate and reliable.

However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any

infringement of patents or other rights of third parties which may result from its use. No

license is granted by implication or otherwise under any patent rights of Telit

Communications S.p.A. other than for circuitry embodied in Telit products. This document

is subject to change without notice.

NOTE:

(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA HE910 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

(HE)


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3. HE910 MODULE CONNECTIONS

Pin-Out

Pad Signal I/O Function Type Comment

USB HS 2.0 COMMUNICATION PORT

B15 USB_D+ I/O USB differential Data (+)

C15 USB_D- I/O USB differential Data (-)

A13 VUSB I Power sense for the internal USB transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15 C103/TXD I Serial data input from DTE

CMOS 1.8V

M15 C104/RXD O Serial data output to DTE

CMOS 1.8V

M14 C108/DTR I Input for (DTR) from DTE

CMOS 1.8V

L14 C105/RTS I Input for Request to send signal (RTS) from DTE

CMOS 1.8V

P15 C106/CTS O Output for Clear to Send signal (CTS) to DTE

CMOS 1.8V

N14 C109/DCD O Output for (DCD) to DTE

CMOS 1.8V

P14 C107/DSR O Output for (DSR) to DTE

CMOS 1.8V

R14 C125/RING O Output for Ring (RI) to DTE

CMOS 1.8V


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Asynchronous Auxiliary Serial Port (USIF1)

D15 TX_AUX O Auxiliary UART (TX Data to DTE)

CMOS 1.8V

E15 RX_AUX I Auxiliary UART (RX Data from DTE)

CMOS 1.8V

USB HSIC

A12 HSIC_USB_DATA

I/O USB HSIC data signal CMOS 1.2V

A11 HSIC_USB_STRB

I/O USB HSIC strobe signal CMOS 1.2V

H15 HSIC_SLAVE_WAKEUP

I Slave Wake Up CMOS 1.8V Shared with SPI_MRDY

F15 HSIC_HOST_WAKEUP

O Host Wake Up CMOS 1.8V Shared with SPI CLK

K15 HSIC_SUSPEND_REQUEST

O Slave Suspend Request CMOS 1.8V Shared with GPIO08

J15 HSIC_HOST_ACTIVE

I Active Host Indication CMOS 1.8V Shared with SPI_SRDY

D13 VDD_IO1 I VDD_IO1 Input To be connected to E13

E13 1V8_SEL O 1V8 SEL for VDD_IO1 To be connected to D13

SIM card interface

A6 SIMCLK O External SIM signal – Clock

1.8 / 3V

A7 SIMRST O External SIM signal – Reset

1.8 / 3V


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A5 SIMIO I/O External SIM signal – Data I/O

1.8 / 3V

A4 SIMIN I External SIM signal – Presence (active low)

CMOS 1.8

A3 SIMVCC - External SIM signal – Power supply for the SIM

1.8 / 3V

Digital Voice Interface (DVI)

B9 DVI_WA0 I/O Digital Audio Interface (WA0)

1.8V 16K pull down (typical at 1.8V) when in Input

B6 DVI_RX I Digital Audio Interface (RX)

1.8V Input with 16K pull down (typical at 1.8V)

B7 DVI_TX I/O Digital Audio Interface (TX)

1.8V 16K pull down (typical at 1.8V) when in Input

B8 DVI_CLK I/O Digital Audio Interface (CLK)

1.8V Input with 16K pull down (typical at 1.8V)

SPI

D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX

E15 SPI_MISO O SPI_MISO CMOS 1.8V Shared with RX_AUX

F15 SPI_CLK I SPI Clock CMOS 1.8V Shared with

H15 SPI_MRDY I SPI_MRDY CMOS 1.8V HSIC_HOST_WAKEUP


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J15 SPI_SRDY O SPI_SRDY CMOS 1.8V Shared with HSIC_SLAVE_WAKEUP

DIGITAL IO

C8 GPIO_01 I/O GPIO_01 /STAT

LED

CMOS 1.8V Alternate Function STAT LED

C9 GPIO_02 I/O GPIO_02 CMOS 1.8V



B14 GPIO_05 I/O GPIO_05 CMOS 1.8V



K15 GPIO_08 I/O GPIO_08 CMOS 1.8V Shared with HSIC_SUSPEND_REQUEST

L15 GPIO_09 I/O GPIO_09 CMOS 1.8V

G15 GPIO_10 I/O GPIO_10 CMOS 1.8V

ADC

B1 ADC_IN1 AI Analog / Digital converter input

A/D Accepted values 0 to 1.2V DC

RF SECTION

K1 ANTENNA I/O GSM/EDGE/UMTS Antenna (50 ohm)

RF


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F1 ANT_DIV I Antenna Diversity Input

(50 ohm)

RF See NOTE 1

GPS SECTION (see NOTE1)

R9 ANT_GPS I GPS Antenna (50 ohm) RF

R7 GPS_LNA_EN O Output enable for External LNA supply

CMOS 1.8V

Miscellaneous Functions

R13 HW_SHUTDOWN*

I HW Unconditional Shutdown

1.8V Active low

R12 ON_OFF* I Input command for power ON

1.8V Active low

C14 VRTC I VRTC Backup capacitor Power backup for the embedded RTC supply (1.8V)

R11 VAUX/PWRMON

O Supply Output for external accessories / Power ON Monitor

1.8V

Power Supply

M1 VBATT - Main power supply (Baseband)

Power

M2 VBATT - Main power supply (Baseband)

Power

N1 VBATT_PA - Main power supply (Radio PA)

Power

N2 VBATT_PA - Main power supply (Radio PA)

Power

P1 VBATT_PA - Main power supply (Radio PA)

Power


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P2 VBATT_PA - Main power supply (Radio PA)

Power

E1 GND - Ground Power

G1 GND - Ground Power

H1 GND - Ground Power

J1 GND - Ground Power

L1 GND - Ground Power

A2 GND - Ground Power


F2 GND - Ground Power

G2 GND - Ground Power

H2 GND - Ground Power

J2 GND - Ground Power

K2 GND - Ground Power

L2 GND - Ground Power

R2 GND - Ground Power

M3 GND - Ground Power

N3 GND - Ground Power

P3 GND - Ground Power


D4 GND - Ground Power


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B13 GND - Ground Power



RESERVED


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C1 RESERVED - RESERVED

D1 RESERVED - RESERVED

B2 RESERVED - RESERVED






E3 RESERVED - RESERVED

F3 RESERVED - RESERVED

G3 RESERVED - RESERVED

H3 RESERVED - RESERVED

J3 RESERVED - RESERVED

K3 RESERVED - RESERVED

L3 RESERVED - RESERVED







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N7 RESERVED - RESERVED

P7 RESERVED - RESERVED



A10 RESERVED - RESERVED














L13 RESERVED - RESERVED


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Warning – Reserved pins must not be connected.


M13 RESERVED - RESERVED












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NOTE 1:

The following table is listing the main Pinout differences between the HE910 variants

Product GPS Antenna Diversity

Notes

HE910 (*) YES YES

HE910-D NO YES Reserved Pads: R7, R9

HE910-GL NO NO Reserved Pads:,F1, R7, R9

HE910-EUR NO NO Reserved Pads:,F1, R7, R9

HE910-EUD NO NO Reserved Pads:,F1, R7, R9

HE910-EUG YES NO Reserved Pads: F1

HE910-NAR NO NO Reserved Pads: F1, R7, R9

HE910-NAD NO NO Reserved Pads: F1, R7, R9

HE910-NAG YES NO Reserved Pads: F1

(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG


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NOTE:

If not used, almost all pins should be left disconnected. The only

exceptions are the following pins:

PAD Signal Notes

M1,M2,N1,N2,P1,P2 VBATT & VBATT_PA

E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,J2,K2,L2,R2,M3,N3,P3,R3,D4,M4, N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,R8,P9,P10,R10,M12,B13,P13,E14

GND

R12 ON/OFF*

R13 HW_

SHUTDOWN*

B15 USB_D+ If not used should be connected to a Test Point or an USB connector

C15 USB_D- If not used should be connected to a Test Point or an USB connector

D15 TXD_AUX If not used should be connected to a Test Point

E15 RXD_AUX If not used should be connected to a Test Point

D13 VDD_IO1 It has always to be connected to 1V8_SEL


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E13 1V8_SEL It has always to be connected to VDD_IO1

K1 MAIN ANTENNA

F1 ANT_DIV (if supported by the product)

If not used it could left unconnected but has to be disabled by the related AT Command (AT#RXDIV); please refer to the At User guide for the related syntax

R9 ANT_GPS (if supported by the product)

If the GPS is not used it could be left unconnected

RTS pin should be connected to the GND (on the module side) if flow

control is not used.

The above pins are also necessary to debug the application when the

module is assembled on it so we recommend connecting them also to

dedicated test point.


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3.1.1. LGA Pads Layout (HE910)

TOP VIEW

A B C D E F G H J K L M N P R

1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_P

A VBATT_P

A

2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_P

A VBATT_P

A GND

3 SIMVC

C RES RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN RES RES GND GND GND GND GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GND

7 SIMRST DVI_TX RES RES RES GPS_LN

A_EN

8 RES DVI_CLK GPIO_01 RES GND GND

9 RES DVI_WA0 GPIO_02 RES GND ANT_GP

S

10 RES RES GPIO_03 RES GND GND

11 HSIC_USB_ST

RB RES GPIO_04 RES RES

VAUX/PWRMON

12 HSIC_USB_DA

TA RES GPIO_06 RES GND RES RES ON_OFF*

13 VUSB GND GPIO_07 VDD_IO1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SHUTDOWN*

14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT

S C108/DT

R C109/DC

D C107/DS

R C125/RIN

G

15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MRD

Y SPI_SRD

Y GPIO_08 GPIO_09

C104/RXD

C103/TXD

C106/CTS

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the application.

HE910 is the “type name” of the products marketed as HE910-G & HE910-DG.


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3.1.2. LGA Pads Layout (HE910-D)

TOP VIEW


1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_P

A VBATT_P

A


A VBATT_P

A GND

3 SIMVC





7 SIMRST DVI_TX RES RES RES RES


9 RES DVI_WA0 GPIO_02 RES GND RES


11 HSIC_USB_ST


VAUX/PWRMON

12 HSIC_USB_DA




S C108/DT

R C109/DC

D C107/DS

R C125/RIN

G


Y SPI_SRD

Y GPIO_08 GPIO_09

C104/RXD

C103/TXD

C106/CTS

NOTE:



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3.1.3. LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and HE910-GL)

TOP VIEW


1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_P

A VBATT_P

A


A VBATT_P

A GND

3 SIMVC





7 SIMRST DVI_TX RES RES RES RES


9 RES DVI_WA0 GPIO_02 RES GND RES


11 HSIC_USB_ST


VAUX/PWRMON

12 HSIC_USB_DA




S C108/DT

R C109/DC

D C107/DS

R C125/RIN

G


Y SPI_SRD

Y GPIO_08 GPIO_09

C104/RXD

C103/TXD

C106/CTS

NOTE:



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3.1.4. LGA Pads Layout (HE910-EUG and HE910-NAG)

TOP VIEW


1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_P

A VBATT_P

A


A VBATT_P

A GND

3 SIMVC





7 SIMRST DVI_TX RES RES RES GPS_LN

A_EN


9 RES DVI_WA0 GPIO_02 RES GND ANT_GP

S


11 HSIC_USB_ST


VAUX/PWRMON

12 HSIC_USB_DA




S C108/DT

R C109/DC

D C107/DS

R C125/RIN

G


Y SPI_SRD

Y GPIO_08 GPIO_09

C104/RXD

C103/TXD

C106/CTS

NOTE:



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4. HARDWARE COMMANDS

Turning ON the HE910

To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then released.

The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.

A simple circuit to do it is:

Figure 4-1 – Turning ON the HE910 1

NOTE:

Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper power on/off of the module. The line ON_OFF* must be connected only in open collector or open drain configuration.

NOTE:

In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with”#",”*” or with a bar over the name.

TIP:

To check if the device has powered on, the hardware line PWRMON should be monitored.

NOTE:

It is mandatory to avoid sending data to the serial ports during the first 200ms of the module start-up.


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A flow chart showing the proper turn on procedure is displayed below:

“Modem ON Proc”

START

Y

Y

GOTO

“HW SHUTDOWN unconditional”

GOTO

“Start AT CMD.”

N PWMON = ON ?

PWMON = ON ?

N

Delay 1s

ON_OFF* = LOW

Delay = 5 Sec

ON_OFF* = HIGH

“Modem ON Proc”

END

VBATT > 3.22V ?

Y

N


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A flow chart showing the AT commands managing procedure is displayed below:

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition

AT answer in

1 sec ?

N

Y

“Start AT CMD.”

START

DELAY 300msec

Enter AT<CR>

“Start AT CMD.”

END

GOTO

“HW SHUTDOWN unconditional”

GOTO

“Modem ON Proc.”


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For example:

1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

Figure 4-2 Turning ON the HE910 2

2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button:

Figure 4-3 ON the HE910 3

Warning

It is recommended to set the ON_OFF* line LOW to power on the module only after VBATT is higher than 3.22V.


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In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF * line.

An example of this is described in the following diagram:

After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on the module


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Turning OFF the HE910

Turning off of the device can be done in two ways:

via AR command (see HE910 Software User Guide, AT#SHDN)

by tying low pin ON_OFF*

Either ways, the device issues a detach request to network informing that the device will

not be reachable any more.

To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 3 seconds and

then released.

TIP:

To check if the device has been powered off, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.


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The following flow chart shows the proper turn off procedure:

Modem OFF Proc.

START

AT

Y

N PWMON = ON ?

OFF Mode

ON_OFF* = LOW

Delay >= 3 Sec

ON_OFF* = HIGH

“Modem OFF Proc”

END

PWRMON=ON?

Y

N

Key

AT#SHDN

GOTO

“HW Shutdown

Unconditional”

Looping for more

Y

N


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HE910 Unconditional Shutdown

The Unconditional Shutdown of the module could be activated using the HW_SHUTDOWN* line (pad R13).

Warning

The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure

To unconditionally shutdown the HE910, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released.

NOTE:

Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper functioning of the module. The line HW_SHUTDOWN* must be connected only in open collector configuration.

The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an automatic restart.

The module will shutdown, but will NOT perform the detach from the cellular network.

To proper power on again the module please refer to the related paragraph (“Powering ON the HE910”)

TIP:

The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.


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A typical circuit is the following:

Figure 4-4 Tipical circuit 1

For example:

Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):

Figure 4-5 Tipical circuit 2

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition


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In the following flow chart is detailed the proper restart procedure:

“HW SHUTDOWN

Unconditional”

START

HW_SHDN = LOW

Delay 200ms

HW_SHDN = HIGH

PWRMON = ON

Delay 1s

Y

N

Disconnect VBATT

“HW SHUTDOWN

Unconditional”

END


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5. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements:

POWER SUPPLY

Nominal Supply Voltage 3.8 V

Normal Operating Voltage Range

3.40 V÷ 4.20 V

Extended Operating Voltage Range

3.10 V÷ 4.50 V

NOTE:

The Operating Voltage Range MUST never be exceeded; care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop.

If the voltage drop is exceeding the limits it could cause a Power Off of the module.

The Power supply must be higher than 3.22 V to power on the module

NOTE:

Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded;

The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions


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Power Consumption

HE910

Mode Average (mA) Mode description

SWITCHED OFF

Module supplied but Switched Off

Switched Off 40uA

IDLE mode (WCDMA)

AT+CFUN=1 12.2 Normal mode: full functionality of the module

AT+CFUN=5 1.2 Full functionality with power saving; DRX7;

Module registered on the network can receive incoming calls and SMS

IDLE mode (GSM/EDGE)

AT+CFUN=1 19 Normal mode: full functionality of the module

AT+CFUN=4 16.5 Disabled TX and RX;

module is not registered on the network

AT+CFUN=5 0.8 Full functionality with power saving;

DRX9 (1.3mA in case of DRX5).

Operative mode (WCDMA)

WCDMA Voice 152 WCDMA voice call (TX = 10dBm)

WCDMA HSDPA (0dBm) 187 WCDMA data call (Cat 14, TX = 0dBm)

WCDMA HSDPA (22dBm) 494 WCDMA data call

(Cat 14, TX = 22dBm)


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The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop.

NOTE:

The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.

Operative mode (EDGE)

EDGE 4TX+2RX

EDGE Sending data mode GSM900 PL5 495

DCS1800 PL0 484

Operative mode (GSM)

CSD TX and RX mode

GSM VOICE CALL GSM900 CSD PL5 220

DCS1800 CSD PL0 167

GPRS 4TX+2RX

GPRS Sending data mode GSM900 PL5 580

DCS1800 PL0 438


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General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

the electrical design

the thermal design

the PCB layout

5.3.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

+5V input (typically PC internal regulator output)

+12V input (typically automotive)

Battery

5.3.1.1. + 5V input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the HE910, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion.


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An example of linear regulator with 5V input is:

Figure 5-1 Linear regulator

5.3.1.2. + 12V input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the HE910.

When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.

For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.


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An example of switching regulator with 12V input is in the below schematic:

Figure 5-2 switching regulator

5.3.1.3. Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cel power to the Telit HE910 module.l battery type is suited for supplying the power to the Telit HE910 module.

Warning

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the HE910 and damage it.

NOTE:

DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910. Their use can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.


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5.3.2. Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

Average current consumption during HSDPA transmission @PWR level max : 600 mA

Average current during idle: 1.5 mA

NOTE:

The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls.

If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 600mA maximum RMS current, or even could be the simple chip package (no heat sink).

Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 600mA, being usually around 150mA.

For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating.

For the heat generated by the HE910, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during GPRS upload.

This generated heat will be mostly conducted to the ground plane under the HE910; you must ensure that your application can dissipate it.


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5.3.3. Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

The Bypass low ESR capacitor must be placed close to the Telit HE910 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the HE910 is wide enough to ensure a dropless connection even during the 2A current peaks.

The protection diode must be placed close to the input connector where the power source is drained.

The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit HE910, then this noise is not so disturbing and power supply layout design can be more forgiving.

The PCB traces to the HE910 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible.

The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

The use of a good common ground plane is suggested.

The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose.


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The below figure shows the recommended circuit:

Figure 5-3 Circuit


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6. GSM/WCDMA RADIO SECTION

HE910 Product Variants

The following table is listing the main differences between the HE910 variants:

Product Supported 2G Bands

Supported 3G bands

Antenna Diversity

HE910 GSM 850, GSM 900, DCS1800, PCS 1900

FDD B1, B2, B4, B5, B8

FDD B1, B2, B5, B8 GSM 850, GSM 900, PCS 1900

HE910-D GSM 850, GSM 900, DCS1800, PCS 1900

FDD B1, B2, B4, B5, B8

FDD B1, B2, B5, B8 GSM 850, GSM 900, PCS 1900

HE910-GL GSM 850, GSM 900, DCS1800, PCS 1900

FDD B1, B2, B4, B5, B8

NO

HE910-EUR GSM 850, GSM 900, DCS1800, PCS 1900

FDD B1, B5, B8 NO

HE910-EUD GSM 850, GSM 900, DCS1800, PCS 1900

FDD B1, B5, B8 NO

HE910-EUG GSM 850, GSM 900, DCS1800, PCS 1900

FDD B1, B5, B8 NO

HE910-NAR GSM 850, GSM 900, DCS1800, PCS 1900

FDD B2, B4, B5 NO

HE910-NAD GSM 850, GSM 900, DCS1800, PCS 1900

FDD B2, B4, B5 NO

HE910-NAG GSM 850, GSM 900, DCS1800, PCS 1900

FDD B2, B4, B5 NO


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TX Output Power

Band Power Class

GSM 850 / 900 4 (2W)

DCS1800 / PCS 1900 1 (1W)

EDGE, 850/900 MHz E2 (0.5W)

EDGE, 1800/1900 MHz Class E2 (0.4W)

WCDMA FDD B1, B2, B4, B5, B8 Class 3 (0.25W)

Sensitivity

Band Typical

(without Diversity)

Note

GSM 850 -109.5 dBm BER Class II <2.44%

GSM 900 -109 dBm BER Class II <2.44%

DCS1800 -110 dBm BER Class II <2.44%

PCS 1900 -109.5 dBm BER Class II <2.44%

WCDMA FDD B1 -111 dBm BER <0.1%






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GSM/WCDMA Antenna Requirements

The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

The antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the following requirements:

ANTENNA REQUIREMENTS

Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth (GSM/EDGE) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band

Bandwidth

(WCDMA)

70 MHz in WCDMA Band V

80 MHz in WCDMA Band VIII

460 MHz in WCDMA Band IV

140 MHz in WCDMA Band II

250 MHz in WCDMA Band I

Impedance 50 ohm

Input power > 33dBm(2 W) peak power in GSM

> 24dBm Average power in WCDMA

VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)

VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements)

When using the HE910, since there's no antenna connector on the module, the antenna must be connected to the HE910 antenna pad (K1) by means of a transmission line implemented on the PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector.


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This transmission line shall fulfil the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Characteristic Impedance 50 ohm

Max Attenuation 0,3 dB

Coupling with other signals shall be avoided

Cold End (Ground Plane) of antenna shall be equipotential to the HE910 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall comply with the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. If antenna is installed with a separation distance of less than 20 cm from all persons or is co-located or operating in conjunction with any other antenna or transmitter then additional FCC/IC testing may be required. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance.

Antennas used for this OEM module must not exceed the gains for mobile and fixed operating configurations as described in “FCC/IC Regulatory notices” chapter.

GSM/WCDMA - PCB line Guidelines

Make sure that the transmission line’s characteristic impedance is 50ohm;

Keep line on the PCB as short as possible, since the antenna line loss shall be less than around 0,3 dB;

Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves;

Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used for implementing the printed transmission line afferent the antenna;

If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model;

Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;

It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal tracks facing directly the antenna line track.

Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;


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The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line track;

Place EM noisy devices as far as possible from HE910 antenna line;

Keep the antenna line far away from the HE910 power supply lines;

If EM noisy devices are present on the PCB hosting the HE910, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a Stripline having same length;


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PCB Guidelines in case of FCC certification

In the case FCC certification is required for an application using HE910, HE910-D, HE910-NAx, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on module’s interface board and described in the following chapter.

6.6.1. Transmission line design

During the design of the interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line.

The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.

A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below:

Figure 6-1 Trasmission line designed


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6.6.2. Transmission line measurements

HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load.

Return Loss plot of line under test is shown below:

Figure 6-2 Return Loss Plot

Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure:

Figure 6-3 Line input impedence


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Insertion Loss of G-CPW line plus SMA connector is shown below:

Figure 6-4 Loss of G-CPW


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GSM/WCDMA Antenna - Installation Guidelines

Install the antenna in a place covered by the GSM signal.

If the device antenna is located greater then 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product

If the device antenna is located less then 20cm from the human body or there are no co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused)

Antenna shall not be installed inside metal cases

Antenna shall be installed also according Antenna manufacturer instructions.

Antenna Diversity Requirements

This product is including an input for a second RX antenna to improve the radio sensitivity. The function is called Antenna Diversity.

ANTENNA REQUIREMENTS

Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth (GSM/EDGE)

70 MHz in GSM850, 80 MHz in GSM900 & 140 MHz PCS band

Bandwidth

(WCDMA)

70 MHz in WCDMA Band V

80 MHz in WCDMA Band VIII

140 MHz in WCDMA Band II

250 MHz in WCDMA Band I

Impedance 50 ohm

When using the HE910, since there's no antenna connector on the module, the antenna must be connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector.

The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application.


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NOTE 1:

The Diversity is not supported on DCS 1800 in 2G and FDD BAND IV in 3G

NOTE:

If the RX Diversity is not used/connected, disable the Diversity functionality using the AT#RXDIV command (ref to the AT User guide for the proper syntax) and leave the pad F1 unconnected.


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7. GPS RECEIVER

The HE910 module is integrating a GPS receiver that could be used in Autonomous or in A-GPS (assisted GPS) mode.

With the help of advanced digital signal processing algorithms and the use of A-GPS data, the receiver is capable to achieve sensitivity values of better than -165 dBm as is required for indoor applications.

The following table is listing the HE910 variants that support the GPS receiver:

Product GPS Receiver

HE910 YES

HE910-D NO

HE910-GL NO

HE910-EUR NO

HE910-EUD NO

HE910-EUG YES

HE910-NAR NO

HE910-NAD NO

HE910-NAG YES

GPS Performances

Advanced real time hardware correlation engine for enhanced sensitivity (better than -165 dBm for A-GPS).

Fast Acquisition giving rapid Time-to-First-Fix (TTFF)

Capability to monitor up to 28 channels

Stand Alone and Assisted mode

Integrated LNA


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The following Table is listing the main characteristics:

Characteristic Typical Values

GPS RX Sensitivity -164dBm

GPS Cold Start Autonomous -147dBm

GPS Hot Start Autonomous -161dBm

GPS tracking mode -166 dBm

GPS Accuracy 3m

TTFF from Cold Start 42 sec

TTF from Warm Start 30sec

TTF from Hot Start 1.8 sec

Power Consumption in Acquisition 46.4 mA @3.8V

Power Consumption in Tracking 37.8 mA @3.8V

Power Consumption in Low Power Tracking

25.7 mA @3.8V

GPS Signals Pinout

The Pads related to this function are the following:

PAD Signal I/O Function Type

R9 ANT_GPS I GPS Antenna (50 ohm) RF

R7 GPS_LNA_EN O Output enable for External LNA supply

CMOS 1.8V


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RF Front End Design

The HE910 Module contains an integrated LNA and pre-select SAW filter. This allows the module to work well with a passive GPS antenna. If the antenna cannot be located near the HE910, then an active antenna (that is, an antenna with a low noise amplifier built in) can be used.

7.3.1. RF Signal Requirements

The HE910 can achieve Cold Start acquisition with a signal level of -147 dBm at its input. This means the GPS receiver can find the necessary satellites, download the necessary ephemeris data and compute the location within a 5 minute period.

In the GPS signal acquisition process, downloading and decoding the data is the most difficult task, which is why Cold Start acquisition requires a higher signal level than navigation or tracking signal levels. For the purposes of this discussion, autonomous operation is assumed, which makes the Cold Start acquisition level the important design constraint. If assistance data in the form of time or ephemeris aiding is available, then even lower signal levels can be used to compute a navigation solution.

Each GPS satellite presents its own signal to the HE910, and best performance is obtained when the signal levels are between -125 dBm and -117 dBm. These received signal levels are determined by :

GPS satellite transmit power

GPS satellite elevation and azimuth

Free space path loss

Extraneous path loss such as rain

Partial or total path blockage such as foliage or building

Multipath caused by signal reflection

GPS antenna

Signal path after the GPS antenna

The first three items in the list above are specified in IS-GPS-200E, readily available multiple sources online. IS-GPS-200E specifies a signal level minimum of -130 dBm will be presented to the receiver when using a linearly polarized antenna with 3 dBi gain.

The GPS signal is relatively immune to rainfall attenuation and does not really need to be considered.

However, the GPS signal is heavily influenced by attenuation due to foliage such as tree canopies, etc., as well as outright blockage caused by building, terrain or other items in the line of sight to the specific GPS satellite. This variable attenuation is highly dependent upon GPS satellite location. If enough satellites are blocked, say at a lower elevation, or all in a general direction, the geometry of the remaining satellites will result is a lower accuracy of position. The HE910 reports this geometry in the form of PDOP, HDOP and VDOP.

For example, in a vehicular application, the GPS antenna may be placed embedded into the dashboard or rear package tray of an automobile. The metal roof of the vehicle will cause significant blockage, plus any thermal coating applied to the vehicle glass can attenuate the GPS signal by as much as 15 dB. Again, both of these factors will affect the performance of the receiver.

Multipath is a phenomena where the signal from a particular satellite is reflected and is received by the GPS antenna in addition to or in place of the original line of sight signal. The multipath signal has a path length that is longer than the original line of sight path and can either attenuate the original signal, or if received in place of the original signal add


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additional error in determining a solution because the distance to the particular GPS satellite is actually longer than expected. It is this phenomena that makes GPS navigation in urban canyons (narrow roads surround by high rise buildings) so challenging. In general, the reflecting of the GPS signal causes the polarization to reverse. The implications of this are covered in the next section.

7.3.2. GPS Antenna Polarization

The GPS signal as broadcast is a right hand circularly polarized signal. The best antenna to receive the GPS signal is a right hand circularly (RHCP) polarized antenna.

Remember that IS-GPS-200E specifies the receive power level with a linearly polarized antenna. A linearly polarized antenna will have 3 dB loss as compared to an RHCP antenna assuming the same antenna gain (specified in dBi and dBic respectively).

An RHCP antenna is better at rejecting multipath than a linearly polarized antenna.

This is because the reflected signal changes polarization to LHCP, which would be rejected by the RHCP antenna by typically 20 dB or so. If the multipath signal is attenuating the line of sight signal, then the RHCP antenna would show a higher signal level than a linearly polarized antenna because the interfering signal is rejected.

However, in the case where the multipath signal is replacing the line of sight signal, such as in an urban canyon environment, then the number of satellites in view could drop below that needed to determine a 3D solution. This is a case where a bad signal may be better than no signal. The system designer needs to make tradeoffs in their application to determine which is the better choice.


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7.3.3. GPS Antenna Gain

Antenna gain is defined as the extra signal power from the antenna as compared to a theoretical isotropic antenna (equally sensitive in all directions).

For example, a 25mm by 25m square patch antenna on a reference ground plane (usually 70mm by 70mm) will give an antenna gain at zenith of 5 dBic. A smaller 18mm by 18mm square patch on a reference ground plane (usually 50mm by 50mm) will give an antenna gain at zenith of 2 dBic.

While an antenna vendor will specify a nominal antenna gain (usually at zenith, or directly overhead) they should supply antenna pattern curves specifying gain as a function of elevation, and gain at a fixed elevation as a function of azimuth. Pay careful attention to the requirement to meet these specifications, such as ground plane required and any external matching components. Failure to follow these requirements could result in very poor antenna performance.

It is important to note that GPS antenna gain is not the same thing as external LNA gain. Most antenna vendors will specify these numbers separately, but some combine them into a single number. It is important to know both numbers when designing and evaluating the front end of a GPS receiver.

For example, antenna X has an antenna gain of 5 dBiC at azimuth and an LNA gain of 20 dB for a combined total of 25 dB. Antenna Y has an antenna gain of -5 dBiC at azimuth and an LNA gain of 30 dB for a combined total of 25 dB. However, in the system, antenna X will outperform antenna Y by about 10 dB (refer to next chapter for more details on system noise floor).

An antenna with higher gain will generally outperform an antenna with lower gain. Once the signals are above about -130 dBm for a particular satellite, no improvement in performance would be gained. However, for those satellites that are below about -125 dBm, a higher gain antenna would improve the gain and improve the performance of the GPS receiver. In the case of really weak signals, a good antenna could mean the difference between being able to use a particular satellite signal or not.

7.3.4. Active versus Passive Antenna

If the GPS antenna is placed near the HE910 and the RF traces losses are not excessive (nominally 1 dB), then a passive antenna can be used. This would normally be the lowest cost option and most of the time the simplest to use. However, if the antenna needs to be located away from the HE910 then an active antenna may be required to obtain the best system performance. The active antenna has its own built in low noise amplifier to overcome RF trace or cable losses after the active antenna.

However, an active antenna has a low noise amplifier (LNA) with associated gain and noise figure. In addition, many active antennas have either a pre-select filter, a post-select filter, or both.


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7.3.5. GPS Antenna - PCB Line Guidelines

Ensure that the antenna line impedance is 50ohm.

Keep the antenna line on the PCB as short as possible to reduce the loss.

Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves.

Keep one layer of the PCB used only for the Ground plane, if possible.

Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other signal tracks facing directly the antenna line of track.

The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least.

Place EM noisy devices as far as possible from HE910 antenna line.

Keep the antenna line far away from the HE910 power supply lines.

Keep the antenna line far away from the HE910 GSM RF lines.

If you have EM noisy devices around the PCB hosting the HE910, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

If you do not have EM noisy devices around the PCB of HE910, use a strip-line on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one.

7.3.6. RF Trace Losses

RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF simulation software to estimate what the losses would be. A good rule of thumb would be to keep the RF traces as short as possible, make sure they are 50 ohms impedance and don’t contain any sharp bends.

7.3.7. Implications of the Pre-select SAW Filter

The HE910 module contains a SAW filter used in a pre-select configuration with the built-in LNA, that is, the RF input of the HE910 ties directly into the SAW filter. Any circuit connected to the input of the HE910 would see complex impedance presented by the SAW filter, particularly out of band, rather than the relatively broad and flat return loss presented by the LNA. Filter devices pass the desired in band signal to the output, resulting in low reflected energy (good return loss), and reject the out of band signal by reflecting it back to the input, resulting in high reflected energy (bad return loss).

If an external amplifier is to be used with the HE910, the overall design should be checked for RF stability to prevent the external amplifier from oscillating. Amplifiers that are unconditionally stable at the output will be fine to use with the HE910.

If an external filter is to be connected directly to the HE910, care needs to be used in making sure neither the external filter nor the internal SAW filter performance is compromised. These components are typically specified to operate into 50 ohms impedance, which is generally true in band, but would not be true out of band. If there is extra gain associated with the external filter, then a 6 dB Pi or T resistive attenuator is suggested to improve the impedance match between the two components.


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7.3.8. External LNA Gain and Noise Figure

The HE910 can be used with an external LNA such as what might be found in an active antenna. Because of the internal LNA, the overall gain (including signal losses past the external LNA) should not exceed 14 dB. Levels higher than that can affect the jamming detection capability of the HE910. If a higher gain LNA is used, either a resistive Pi or T attenuator can be inserted after the LNA to bring the gain down to 14 dB .

The external LNA should have a noise figure better than 1 dB. This will give an overall system noise figure of around 2 dB assuming the LNA gain is 14 dB, or if higher the low gain mode is automatically managed by the HE910 with its internal AGC.

The external LNA, if having no pre-select filter, needs to be able to handle other signals other than the GPS signal. These signals are typically at much higher levels. The amplifier needs to stay in the linear region when presented with these other signals. Again, the system designer needs to determine all of the unintended signals and their possible levels that can be presented and make sure the external LNA will not be driven into compression. If this were to happen, the GPS signal itself would start to be attenuated and the GPS performance would suffer.

7.3.9. Powering the External LNA (active antenna)

The external LNA needs a source of power. Many of the active antennas accept a 3 volt or 5 volt DC voltage that is impressed upon the RF signal line. This voltage is not supplied by the HE910, but can be easily supplied by the host design.

7.3.10. External LNA Enable

The HE910 is already provided by an internal LNA. In case the Application needs to include an additional LNA stage, the module is provided by a digital signal usable to enable the power supply of the external amplifier. The signal is set to High only when the GPS receiver is active.

The electrical characteristics of the GPS_LNA_EN signal are:

Level Min Max

Output high level 1.6V 1.9

Output low level 0V 0.2V


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An example of GPS Antenna Supply circuit is shown in the following image:

Figure 7-1 GPS Antenna Suply circuit

NOTE:

The maximum DC voltage applicable to the ANT_GPS pin is 5V. In case this is exceeded, a series capacitor has to be included in the design to avoid exceeding the maximum input DC level.

7.3.11. Shielding

Shielding the RF circuitry generally is ineffective because the interference is getting into the GPS antenna itself, the most sensitive portion of the RF path. The antenna cannot be shielded because then it can’t receive the GPS signals.

There are two solutions, one is to move the antenna away from the source of interference or the second is to shield the digital interference to prevent it from getting to the antenna.

7.3.12. GPS Antenna – Installation

The HE910 due to its characteristics of sensitivity is capable to perform a Fix inside the buildings. (In any case the sensitivity could be affected by the building characteristics i.e. shielding).

The Antenna must not be co-located or operating in conjunction with any other antenna or transmitter.

Antenna must not be installed inside metal cases.

Antenna must be installed also according to the Antenna manufacturer instructions


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8. LOGIC LEVEL SPECIFICATIONS

The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V

Input level on any digital pin (CMOS 1.2) with respect to ground -0.3V 1.4V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9V



Level Min Max



Output high level 1V 1.3V



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Current characteristics

Level Typical

Output Current 1mA

Input Current 1uA


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Unconditional Shutdown

Signal Function I/O PAD

HW_SHUTDOWN* Unconditional Shutdown of the Module I R13

HW_SHUTDOWN* is used to unconditionally shutdown the HE910. Whenever this signal is pulled low, the HE910 is reset. When the device is reset it stops any operation. After the release of the line, the HE910 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the HW_SHUTDOWN* signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response.

The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up.

It may only be used to reset a device already on that is not responding to any command.

NOTE:

Do not use this signal to power off the HE910. Use the ON/OFF signal to perform this function or the AT#SHDN command.

Unconditional Shutdown Signal Operating levels:

Signal Min Max

HW_SHUTDOWN* Input high 1.5V 1.9V

HW_SHUTDOWN* Input low 0V 0.35V

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.


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9. USB PORT

The HE910 includes one integrated universal serial bus (USB 2.0 HS) transceiver.

USB 2.0 HS Description

This port is compliant with the USB 2.0 HS.

The USB FS is supported for AT interface and data communication.

The following table is listing the available signals:

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.

The signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential.

In case there is a need to add an ESD protection the suggested connection is the following:

Figure 9-1 ESD8V0L2B-03L

NOTE:

VUSB pin should be disconnected before activating the Power Saving Mode.

In case of a Firmware upgrade using the USB port, it could be done only using an USB 2.0 HS device.

PAD Signal I/O Function Type NOTE

B15 USB_D+ I/O USB differential Data (+)

3.3V

C15 USB_D- I/O USB differential Data (-)

3.3V

A13 VUSB AI Power sense for the internal USB transceiver.

5V Accepted range:

4.4V to 5.25V


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10. SPI PORT

The HE910 Module is provided by one SPI interface.

The SPI interface defines two handshake lines for flow control and mutual wake-up of the modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).

The AP has the master role, that is, it supplies the clock.


The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this digital section.

NOTE:

Due to the shared functions, when the SPI port is used, it is not possible to use the AUX_UART port.

PAD Signal I/O Function Type COMMENT

D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX

E15 SPI_MISO O SPI MISO CMOS 1.8V Shared with RX_AUX

F15 SPI_CLK I SPI Clock CMOS 1.8V

H15 SPI_MRDY I SPI_MRDY CMOS 1.8V

J15 SPI_SRDY O SPI_SRDY CMOS 1.8V


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SPI Connections

Figure 10-1 SPI Connections


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11. USB HSIC

The HE910 Module is provided by one USB HSIC interface.

The USB HSIC (High Speed Inter Processor) Interface allows supporting the inter-processor communication between an application processor (AP) – the host, and the modem processor (CP) – the HE910


The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this digital section.

For the detailed use of USB HSIC port please refer to the related Application Note

PAD Signal I/O

Function Type COMMENT

A12 HSIC_USB_DATA I/O

USB HSIC data signal

CMOS 1.2V

A11 HSIC_USB_STRB I/O

USB HSIC strobe signal

CMOS 1.2V

H15 HSIC_SLAVE_WAKEUP I Slave Wake Up CMOS 1.8V Shared with SPI_MRDY

F15 HSIC_HOST_WAKEUP O Host Wake Up CMOS 1.8V Shared with SPI CLK

K15 HSIC_SUSPEND_REQUEST O Slave Suspend Request

CMOS 1.8V Shared with GPIO08

J15 HSIC_HOST_ACTIVE I Active Host Indication

CMOS 1.8V Shared with SPI_SRDY

D13 VDD_IO1 I VDD_IO1 Input To be connected to E13

E13 1V8_SEL O 1V8 SEL for VDD_IO1

To be connected to D13


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NOTE:

Due to the shared functions, when the USB_HSIC port is used, it is not possible to use the SPI and the GPIO_08.

The USB_HSIC is not active by default but it has to be enabled using the AT#PORTCFG command (refer to the AT User guide for the detailed syntax description).


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12. SERIAL PORTS

The HE910 module is provided with by 2 Asynchronous serial ports:

MODEM SERIAL PORT 1 (Main)

MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

RS232 PC com port

microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

microcontroller UART @ 5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work.

The electrical characteristics of the Serial ports are explained in the following tables:


Parameter Min Max

Input level on any digital pin (CMOS 1.8) with respect to ground

-0.3V 2.1V


Level Min Max






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MODEM SERIAL PORT 1 (USIF0)

The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals.

It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

RS232

Pin #

Signal HE910

Pad Number

Name Usage

1 C109/DCD N14 Data Carrier Detect Output from the HE910 that indicates the carrier presence

2 C104/RXD M15 Transmit line *see Note

Output transmit line of HE910 UART

3 C103/TXD N15 Receive line *see Note

Input receive of the HE910 UART

4 C108/DTR M14 Data Terminal Ready

Input to the HE910 that controls the DTE READY condition

5 GND M12, B13, P13, E14 …

Ground Ground

6 C107/DSR P14 Data Set Ready Output from the HE910 that indicates the module is ready

7 C106/CTS P15 Clear to Send Output from the HE910 that controls the Hardware flow control

8 C105/RTS L14 Request to Send Input to the HE910 that controls the Hardware flow control

9 C125/RING R14 Ring Indicator Output from the HE910 that indicates the incoming call condition


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The following table shows the typical input value of internal pull-up resistors for RTS DTR and TXD input lines and in all module states:

STATE

RTS DTR TXD

Pull up tied to

ON 5K to 12K 1V8

OFF Schottky diode

RESET Schottky diode

POWER SAVING 5K to 12K 1V8

The input line ON_OFF and RESET state can be treated as in picture below

Figure 12-1 Input Line ON_OFF

NOTE:

According to V.24, some signal names are referred to the application side, therefore on the HE910 side these signal are on the opposite direction:

TXD on the application side will be connected to the receive line (here named C103/TXD)

RXD on the application side will be connected to the transmit line (here named C104/RXD)


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NOTE:

For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.

NOTE:



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MODEM SERIAL PORT 2 (USIF1)

The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX signals.

The signals of the HE910 serial port are:

The signal 1V8_SEL must be connected to the VDD_IO1 input pin in order to use this port.

NOTE:

Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI functions.

NOTE:


PAD Signal I/O Function Type COMMENT

D15 TX_AUX O Auxiliary UART (TX Data to DTE)

CMOS 1.8V SHARED WITH SPI_MTSR

E15 RX_AUX I Auxiliary UART (RX Data from DTE)

CMOS 1.8V SHARED WITH SPI_MRST


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RS232 level translation

In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:

invert the electrical signal in both directions;

Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards).

By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART.

In order to translate the whole set of control lines of the UART you will need:

5 drivers

3 receivers

An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218)

In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).

Figure 12-2 RS232 Level


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The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

Figure 12-3 RS232 serial port lines


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13. AUDIO SECTION OVERVIEW

The Audio of the HE910 Module is carried by DVI digital audio interface.

The audio port can be directly connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).

Electrical Characteristics

The product is providing the Digital Audio Interface (DVI) on the following Pins:

13.1.1. CODEC Examples

Please refer to the HE910 Digital Audio Application note

Digital Voice Interface (DVI)

PAD Signal I/O Function Note Type

B9 DVI_WA0 I/O Digital Audio Interface (Word Alignment / LRCLK)

CMOS 1.8V

B6 DVI_RX I Digital Audio Interface (RX)

CMOS 1.8V

B7 DVI_TX O Digital Audio Interface (TX)

CMOS 1.8V

B8 DVI_CLK I/O Digital Audio Interface (BCLK)

CMOS 1.8V


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14. GENERAL PURPOSE I/O

The HE910 module is provided by a set of Digital Input / Output pins

Input pads can only be read; they report the digital value (high or low) present on the pad at the read time.

Output pads can only be written or queried and set the value of the pad output.

An alternate function pad is internally controlled by the HE910 firmware and acts depending on the function implemented.

The following table shows the available GPIO on the HE910:

PAD Signal I/O Function Type Drive strength

Default State

Note

C8 GPIO_01 I/O Configurable GPIO

CMOS 1.8V

1 mA INPUT Alternate function STAT LED


CMOS 1.8V

1 mA INPUT


CMOS 1.8V

1 mA INPUT


CMOS 1.8V

1 mA INPUT

B14 GPIO_05 I/O Configurable GPIO

CMOS 1.8V

1 mA INPUT


CMOS 1.8V

1 mA INPUT


CMOS 1.8V

1 mA INPUT

K15 GPIO_08 I/O Configurable GPIO

CMOS 1.8V

1 mA INPUT VDD_IO1 has to be connected to 1V8_SEL

L15 GPIO_09 I/O Configurable GPIO

CMOS 1.8V



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GPIO Logic levels

Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.

The following table shows the logic level specifications used in the HE910 interface circuits:


Parameter Min Max

Input level on any digital pin (CMOS 1.8) with respect to ground

-0.3V 2.1V


Level Min Max





G15 GPIO_10 I/O Configurable GPIO

CMOS 1.8V



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Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO.

If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V.

NOTE:


Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.


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Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command).

In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED.

Therefore, the status indicated in the following table is reversed with respect to the pin status.

Device Status LED status

Device off Permanently off

Not Registered Permanently on

Registered in idle Blinking 1sec on + 2 sec off

Registered in idle + power saving It depends on the event that triggers the wakeup (In sync with network paging)

Voice Call Active Permanently on

Dial-Up Blinking 1 sec on + 2 sec off

A schematic example could be:

Figure 14-1 State_Led


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RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off.

To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.

In order to keep the RTC active when VBATT is not supplied it is possible to back up the RTC section connecting a backup circuit to the related VRTC signal (pad C14 on module’s Pinout).

For additional details on the Backup solutions please refer to the related application note (xE910 RTC Backup Application Note)

External SIM Holder Implementation

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

VAUX Power Output

A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON indication) function.

This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

Level Min Typical Max

Output voltage 1.78V 1.80V 1.82V

Output current - - 60mA

Output bypass capacitor

(inside the module)

1uF


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ADC Converter

14.8.1. Description

The HE910 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.

The following table is showing the ADC characteristics:

Min Typical Max Units

Input Voltage range 0 - 1.2 Volt

AD conversion - - 10 bits

Input Resistance 1 - - Mohm

Input Capacitance - 1 - pF

The input line is named as ADC_IN1 and it is available on Pad B1

14.8.2. Using ADC Converter

An AT command is available to use the ADC function

The command is AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.


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15. MOUNTING THE HE910 ON THE APPLICATION

General

The HE910 modules have been designed in order to be compliant with a standard lead-free SMT process.

Module finishing & dimensions

Figure 15-1 Module finishing

Pin B1

Dimensions in mm

Bottom view

Lead-free Alloy:

Surface finishing Ni/Au for all solder pads


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Figure 15-2 Module dimensions


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Recommended foot print for the application

TOP VIEW

Figure 15-3 Foot print

In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm placement inhibit area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

NOTE:

In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.


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Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm.

PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

Figure 15-4 PCB

PCB

Copper Pad Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)


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PCB pad dimensions

The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm)

Figure 15-5 PCB pads dimensions


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It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure).

Figure 15-6 PCB pads

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer thickness [µm] Properties

Electro-less Ni / Immersion Au

3 –7 / 0.05 – 0.15 good solder ability protection, high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.


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Solder paste

Lead free

Solder paste Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly

15.7.1. HE910 Solder reflow

Recommended solder reflow profile:

Figure 15-7 HE910 Solder reflow


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Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

150°C

200°C

60-180 seconds

Tsmax to TL

– Ramp-up Rate

3°C/second max

Time maintained above:

– Temperature (TL)

– Time (tL)

217°C

60-150 seconds

Peak Temperature (Tp) 245 +0/-5°C

Time within 5°C of actual Peak

Temperature (tp)

10-30 seconds

Ramp-down Rate 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

NOTE:

All temperatures refer to topside of the package, measured on the package body surface

Warning:

The HE910 module withstands one reflow process only.


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Packing system (Tray)

The HE910 modules are packaged on trays of 36 pieces each. These trays can be used in SMT processes for pick & place handling.

Figure 15-8 Packing system 1


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Figure 15-9 Packing system 2


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Packing System (Reel)

The HE910 can be packaged on reels of 200 pieces each.

See figure for module positioning into the carrier.

Figure 15-10 Packing System 3

15.9.1. Carrier Tape Detail

Figure 15-11 Carrier tape detail


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15.9.2. Reel Detail

Figure 15-12 Reel detail 1

Figure 15-13 Reel detail 2


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15.9.3. Packaging Detail

Figure 15-14 Packaging detail

Moisture sensitivity

The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).

b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.

c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH f) or more


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16. SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc

Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm


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17. CONFORMITY ASSESSMENT ISSUES

1999/5/EC Directive

The HE910, HE910-D, HE910-EUG, HE910-EUR, HE910-EUD, HE910-NAG, HE910-NAR, HE910-NAD modules have been evaluated against the essential requirements of the 1999/5/EC Directive.

Bulgarian С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на съществените изисквания и другите приложими изисквания на Директива 1999/5/ЕС.

Czech Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Danish Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Dutch Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.

English Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC.

Estonian Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele.

German Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.

Greek ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΤΙ 2G/3G module ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.

Hungarian Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.


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Finnish Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen.

French Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.

Icelandic Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC

Italian Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.

Latvian Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.

Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Maltese Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.

Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.

Polish Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC

Portuguese Telit Communications S.p.A. declara que este 2G/3G module está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.

Slovak Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.

Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.


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Spanish Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.

Swedish Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.

In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910, HE910-EUG modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EN 301 908-1 V4.2.1

EN 301 908-2 V4.2.1

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.8.1

EN 301 489-3 V1.4.1

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-NAG modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.8.1

EN 301 489-3 V1.4.1

EN 301 489-7 V1.3.1



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The HE910-D, HE910-EUR, HE910-EUD modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.02

EN 301 908-1 V4.2.1

EN 301 908-2 V4.2.1

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.8.1

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1


The HE910-NAR, HE910-NAD modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.02

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.8.1

EN 301 489-7 V1.3.1


The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body:

AT4 wireless, S.A.

Parque Tecnologico de Andalucía

C/ Severo Ochoa 2

29590 Campanillas – Málaga

SPAIN

Notified Body No: 1909


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Thus, the following marking is included in the product:

The full declaration of conformity can be found on the following address:


There is no restriction for the commercialisation of the HE910, HE910-D, HE910-EUG, HE910-EUR, HE910-EUD, HE910-NAG, HE910-NAR, HE910-NAD modules in all the countries of the European Union.

Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit Communications S.p.A. recommends carrying out the following assessments:

RF spectrum use (R&TTE art. 3.2) It will depend on the antenna used on the final product.

EMC (R&TTE art. 3.1b) Testing

Health & Safety (R&TTE art. 3.1a) Testing

Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a) essential requirements can be done against the essential requirements of the EMC and the LVD Directives:

Low Voltage Directive 2006/95/EC and product safety

Directive EMC 2004/108/EC for conformity for EMC



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FCC/IC Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:

Frequency band HE910, HE910-D HE910-NAR, HE910-NAD, HE910-NAG

GSM 850/FDD V 5.22 dBi 5.29 dBi

PCS 1900/FDD II 3.31 dBi 4.02 dBi

FDD IV 6.45 dBi 6.32 dBi

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.


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Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

Frequency band HE910, HE910-D HE910-NAR, HE910-NAD, HE910-NAG

GSM 850/FDD V 5.22 dBi 5.29 dBi

PCS 1900/FDD II 3.31 dBi 4.02 dBi

FDD IV 6.45 dBi 6.32 dBi

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.


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18. DOCUMENT HISTORY

Revision Date Changes

0 2011-03-31 Preliminary Version

1 2011-05-19 Updated pinout on UART1

2 2011-05-25 Update chapter 13

3 2011-07-25 Added DVI app note references; chapter 4.1

4 2011-07-29 Updated audio, on_off/reset and digital sections

5 2011-10-18 Added STAT_LED info, Updated SPI pinout

Pads A8, A9, D14, A14 now reserved

Power supply extended to 3.3 V

par 4.3 renamed as “unconditional shutdown”

6 2011-12-22 USIF0 USIF1 names added to Main and AUX serial ports

Updated IO logic levels

Updated module’s mechanical drawing

IO levels selection 1.8/1.2 removed (now only 1.8)

7 2012-01-16 Added HE910-GA and –D; added Conformity assessment chapter

8 2012-02-03 Chapter 5.1 updated

9 2012-02-07 Chapter 4.2 updated

10 2012-03-16 Added ADC in pinout description; added GPS specification; updated Chapter 13 and 14;

11 2012-03-26 Chapter 2.1, 2.1.2, 3.3, 5.4, 14.9

12 2012-03-27 Added HE910-EU and NA products

13 2012-03-28 Updated paragraph 14.9

14 2012-05-08 Added EUR, EUD, NAR, NAD variants; added Sensitivity and TX Power Class specifications. Updated par 14.7.1 and 14.3

15 2012-05-30 Updated Chapter 16.2; 7.3.8

16 2012-06-06 Pin R13 renamed as HW_SHUTDOWN*, Pin P11 renamed


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17 2012-06-14 Updated RTT&E info on HE910-NAG, NAR, NAD

18 2012-06-15 Updated RTT&E info on HE910-NAG, NAR, NAD ; updated par 3.1;

19 2012-06-26 Pin P11 now reserved; updated par 3.1; par 4.2

20 2012-08-09 Updated par 9,1 5.3.2, 13.4, 3.1, 13.5

21 2013-04-29 Updated par 3.1, 5.1, 5.3.2, 6.4, 7, 9.1 ; added 14.8

22 2013-08-02 Updated Chapter 4, 13.4

23 2013-08-30 Updated Chapter 3.1, 4.1, 5.2, 5.3.3, 8, 9.1, 11, 13.1

24 2013-12-20 Updated Chapter 4.1, 4.2, 5.3.1.1, 5.3.1.2, 8; added USB_HSIC, Updated the Stat Led schematic example; updated packaging tray drawing; added PCB Guidelines for FCC.

25 2015-03-03 Add new product HE910-GL

26 2015-04-09 Removed product HE910-GA

27 2015-05-25 Updated Chapter 15.8 Packing system (Tray)

28 2015-09-03 Updated Chapter 6.1 on HE910-GL product

29 2017-01-27 2017 template applied

[01.2

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Mod. 0805 2017-01 Rev.6