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Affordable Technology and Manufacturing LeadershipAffordable Technology and Manufacturing Leadership

Hamid R. Azimi, Ph. D.hamid.azimi@intel.com

Materials Technology Development Manager

Houssam W. Jomaa, Ph.DHoussam.jomaa@intel.comSenior Packaging EngineerSenior Packaging Engineer

ATTD, Intel CorporationOct, 2009

Halogen Free Component Halogen Free Component …………Transition ChallengesTransition Challenges

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Agenda

Intel HF Progression/History HF and Non-HF Component Material Comparison HF Component Conversion Challenges & Solutions Component Summary & Call to Action HF PCB Conversion Challenges Summary

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130nm Wire bondLead-frame

HF MoldCompound

90nm Flip-ChipHF Via PlugHF UnderfillH Build-up

H Solder ResistH Core

Volu

me

/ Com

plex

ity

45nm Flip-ChipHF Build-upHF Solder

ResistHF Via PlugHF Underfill

HF Core

65nm Flip-ChipHF Build-upHF Solder

ResistHF Via PlugHF Underfill

H Core

Time

Intel’s Halogen Free Technology Progression

* Applies to components containing flame retardants & PVC only. Halogens are below 900 PPM bromine, 900 PPM chlorine, and 1500 PPM combined bromine andchlorine.

2008/9

Intel’s Phased Approach to a LF Compatible HF Technology….. Shipped over 200M units from 45nm technology

Build-upBuild-up

CoreCorePTH PlugPTH Plug

Solder ResistSolder Resist

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HF & Non-HF Material Comparison

Build up DielectricSolder ResistCore

Build-upBuild-up

CoreCorePTH PlugPTH Plug

Solder ResistSolder Resist

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HF Build-up and Solder Resist Comparison

HF Build up and HF Solder Resist with better or equivalentproperties to Non-HF were developed in 2006.

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HF Core Material …. What is changed?

BrR R Br+

Br H R+

Br H + R

OH + H BrH

OH Br+

M

OHOH M

O

LF Reflow Temp

+

Biggest Challenge with HF Cores … Thermal Stability at LF Reflow

... It took Intel over 4 years of continous work with supply chain to develop the right HF corematerial compatible with substrate manufacturing and Intel LF assembly

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HF Core Material ComparisonTg

TM

A (°

C)

CTE

x1/

y1 (<

Tg,

ppm

/°C

)

CTE

x2/

y2(>

Tg,

ppm

/°C)

CTE

z1

(< T

g, p

pm/°

C)

Die

lect

ricC

onst

ant

(@ 1

GH

z)

Dis

sipa

tion

Fac

tor

(@ 1

GH

z)

Moi

stur

eA

bsor

ptio

n(%

)

CTE

z2

(>Tg

, ppm

/°C

)

Mod

ulus

@ 2

5°C

(GPa

)

Mod

ulus

@ 2

60°C

(GPa

)

Peel

Str

engt

h(k

N/m

)

Halogenated core material properties: MaximumHalogenated core material properties: Maximum

Halogenated core material properties: MinimumHalogenated core material properties: Minimum

HF Material Property ValueHF Material Property Value

• HF and non-HF Cores are mostly comparable.• Lower CTEz1 is preferred.

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PACKAGE COPLANARITY Comparison

Ball coplanarity:

13X14mm thin (400 um) core

Ball coplanarity

Pkg. C

opla

narity

(m

ils)

1

2

3

4

5

6

7

HF nHF

HF/ nHF

Variability Chart for Coplanarity (mils)

Pkg. C

opla

narity

(m

ils)

3

4

5

6

7

8

9

10

11

HF nHF

HF/nHF

Variability Chart for Max CO

Ball

copl

anar

ity (m

ils)

Ball

copl

anar

ity (m

ils)

H H

Equivalent BGA/LGA coplanarity

Ball coplanarity:

25X27mm thin (400 um) core

LGA coplanarity:

42.5X45mm thin (400 um) core

Land coplanarity

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HF Package Failure Mechanisms / Challenges

Internal Delam / Blister

SR DelamCu

UF fillet crack

Key Solutions to a LF-compatible HF package:• Core material…. thermally stable > 260C

• Substrate Design & Mfging …. better metal to polymer adhesion• Substrate and Assembly environment … moisture exposure control

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Factors Impacting Reliability

Product 1: Fail rate after 85/85 20hrs + 4x reflow @ 260oC.

Design can significantly impact blistering failure rate.

Fail mode: Blister

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SR DelamCu

Product 2: Time to fail at 260oC isothermal hold.

Factors Impacting Reliability

Fail mode: SR Delam & UF crack

UF fillet crack

Both Design and Core can significantly impact SR delam and UF fillet crack rate.

betterbetterdesigndesign

Direct moisture path / Chimney No Direct moisture path / No Chimney

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HF Component Summary

Successfully eliminated BFRs from Intel products through a phasedapproach.

HF Conversion completed with 45nm technology; since then Intel hasshipped over 200M HF units.

To meet the LF assembly requirements, a co-optimization of materials,design and mfging along with close collaboration with the supply chain is amust

Call to Action:– Accelerate development of new component material sets for improved thermal

stability to meet future DR requirements– Accelerate industry wide adoption of HF component material sets

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Agenda

Intel HF Progression/History HF and Non-HF Component Material Comparison HF Component Conversion Challenges & Solutions Component Summary & Call to Action HF PCB Conversion Challenges Summary

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Data Source: S. O’Connell, Dell

Halogen Free PCB

• Requires Industry Standards & Verification Criteria• New Materials & Validation of Performance

• Business Implications – Cost, Capacity

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Industry Concerted Efforts: iNEMI Initiative Halogen-Free Materials

Stephen Tisdale, Chair HFR-FreeLeadership Program

HFR-Free PCB Materials(Chair: John Davignon – Intel)

HFR-Free Signal Integrity(Chair: Stephen Hall - Intel

Co-Chair: David Senk - Cisco)

Identify key mechanical performancecharacteristics and determine if they are in thecritical path for the HFR-free PCB materialtransition.

Define the critical electrical requirements for eachproduct type, characterize the properties of availabledielectrics, and create a design data base to helpensure signal integrity does not roadblock the use ofHFR-free PCB’s

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Halogen Free PCB Challenges

There are many different Flame Retardant options available

Challenges being worked out include:– Higher Dk – high speed signaling design improvements– Cost – needs work across supply chain and better design

– higher layer to compensate for x-talk and higher matl/mfging cost– Stiffer/higher modulus -- shock, vibe, cold ball pull impact considerations

Need a concerted effort across the industry on driving tradeoffs acrossdesign, fabrication, and materials to derive solutions

Effort to improve the laminate properties have begun and requires continuedcollaboration across the entire supply chain to make it successful.

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Thank You!

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