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Going Green CARE INNOVATION 2006

Conference Program

From WEEE / RoHS Implementation toFuture Sustainable Electronics

Sixth International Symposium and Exhibition

An event to discuss futures strategies, meet your clientsand form strategic partnerships

November 13 - 16, 2006Vienna, Austria

A Co-Operation of the World’s Leading Conferences

America Europe Asia

International Program Committee Andrew Baynes, Apple Joy Boyce, Fujitsu Martin Charter, CfSD Victor Duart Belloque, IBM Patrick Eagan, University of Wisconsin-Madison Gregor Eckerth, Interseroh Jürgen Ertel, BTU Cottbus Matthias Finkbeiner, Daimler Chrysler Georg Fröhlich, Electrocycling Hiroyuki Furukawa, ENE Hansjörg Griese, FhG-IZM Thomas Gutwinski, Gutwinski Management Joachim Hafkesbrink, AROEW Constantin Herrmann, PE Europe Klaus Hieronymi, HP Zsolt Istvan, BayLogi Bernd Kopacek, SAT

Peter Kopacek, Vienna Univ. of Technology Ruediger Kuehr, United Nations University Edorta Larrauri, Gaiker Peter R. Muscanelli, IAER Kay Nimmo, ITRI and Tin Technology Raymond Nyer, RNC Phär Oscár, Stena Technoworld Guillermo O´Shea, Indumetal Bob Pfahl, iNEMI Ferdinand Quella, Siemens Siegfried Schäper, Audi Lutz-Guenther Scheidt, Vienna Univ. of Technology Andreas Schneider, Sony Eelco Smit, Epson Aidan Turnbull, Environ Jan Visser, Coolrec Achim Winter, CCR

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Message from the Chair

On behalf of the International Program Committee and the Organising Committee it is a pleasure to welcome you to the Going Green – CARE INNOVATION 2006 conference and to Vienna in November 2006.

This four-day event is a continuation of the series CARE INNOVATION ‘96 (Frankfurt, Germany), CARE INNOVATION ’98 (Vienna, Austria), ELECTRONICS GOES GREEN 2000+ (Berlin, Germany), CARE INNOVATION 2002 (Vienna, Austria) and ELECTRONICS GOES GREEN 2004 (Berlin, Germany), devoted to all aspects of new directions and developments in environmental electr(on)ics. Going Green – CARE INNOVATION 2006 will provide a platform to discuss the latest progress on sustainable development, eco-efficient electr(on)ics and automotive products. An exciting Conference Program is offered that includes important and wide-ranging contributions covering state-of-the-art research results that address contemporary problems and provide new

insights into From WEEE / RoHS Implementation to Future Sustainable Electronics. The response to the Call for Papers was overwhelming, attracting submissions from some 32 countries. The International Program Committee has arranged a program that spans 31 sessions, organised in 3 parallel streams, where delegates will deliver over 130 presentations. The papers offer stimulating insights into emerging approaches to environmental electr(on)ics, green automotive products and sustainable services. Additional workshops address stimulating topics, delivered by professionals in the field. Along with the international congress, an environmental exhibition and excursions to selected enterprises in Vienna’s surrounding area will take place. In order to accelerate the networking between the huge numbers of participants, an extensive social program has been organized, including a Welcome Party at the wonderful Ceremony Hall of Vienna University of Technology, a Reception by the Mayor of Vienna in the magnificent, historical state rooms of the Viennese Town Hall and a Dinner at a typical Viennese “Heuriger” restaurant. Vienna – the bridge between East and West in the past and even more today – has been selected as the conference location in order to find synergies between economy and ecology. I hope that in addition to attending the Technical Program, you will take the opportunity to explore Vienna – the world famous metropolis of music, art and culture – and if possible extend your stay to include an enjoyable and memorable holiday. I would like to express my appreciation to all the keynote speakers, authors, session chairs, panellists, exhibitors and all participants for contributing to the success of the Conference and I am immensely grateful to the International Program Committee and the Conference Organisers – especially Elisabeth Guganeder, Christina Meglitsch, Stefan Steiner and all the other helping hands – for their support and help.

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Floor Plan Kursalon Vienna

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Program at a Glance SUNDAY, November 12, 2006 (Vienna University of Technology) 13.30 – 14.30 Registration (Favoritenstrasse 9-11, 1040 Vienna)

14.00 – 18.00 Tutorials (Favoritenstrasse 9-11, 1040 Vienna)

17.30 – 19.00 Registration (Karlsplatz 13, 1040 Vienna)

18.30 Welcome Party (Karlsplatz 13, 1040 Vienna)

MONDAY, November 13, 2006 (Kursalon)

9.00 – 18.00 Registration

10.30 – 12.00 Opening Ceremony & Keynote Presentations

14.00 – 16.00 1.1. Ecodesign I 1.2. Implications of the WEEE Directive 1.3. Communication to Consumers

16.30 – 18.30 1.4. Ecodesign II 1.5. Future Revision of the WEEE Directive 1.6. Legislation Driven Developments

20.00 Reception by the Mayor of Vienna at the City Hall of Vienna & The CARE Band

TUESDAY, November 14, 2006 (Kursalon) 8.00 – 18.00 Registration

8.30 – 10.30 2.1. SEES – Sustainable Electrical & Electronic System for the Automotive Sector

2.2. Electronics Recycling

2.3. Implications of the WEEE & RoHS Directives

11.00 – 13.00 2.4. Sustainability 2.5. Recycling of Monitors and Batteries 2.6. Implications of the RoHS Directive

14.00 – 16.00 2.7. EuP/IPP 2.8. Re-use/Remanufacturing 2.9. Practical Examples of RoHS Implementation

16.30 – 18.30 2.10. Product Assessment 2.11. Plastics Recycling 2.12. The Ecodesign of EuP Directive

18.30 Dinner at a typical Viennese Heuriger

WEDNESDAY, November 15, 2006 (Kursalon) 8.00 – 15.00 Registration

8.30 – 10.30 3.1. Beyond Legislation – Is Legislation a Starting Point for Life Cycle Thinking?

3.2. Transnational WEEE Solutions

3.3. Ecodesign Tools & Methodologies

11.00 – 12.30 3.4. Ecodesign Toolbox for Energy Using Products in the System House

3.5. ECOLIFE II

3.6. Energy Efficiency

13.30 – 15.30 3.7. StEP – Solving the E-Waste Problem

3.8. Future Vision of the European Electronics Industry: Roads Towards a Sustainable 2020

3.9. Life Cycle Analysis

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16.00 – 18.00 Plenary Discussion “Future Visions of the European Electronics Industry: Roads Towards a Sustainable 2020”

THURSDAY, November 16, 2006 8.00 – 18.00 Technical Tours

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Going Green – CARE INNOVATION 2006

November 13 – 16, 2006

Kursalon Vienna

Sunday, November 12, 2006 (Vienna University of Technology)

13.30 – 14.30 Registration (Vienna University of Technology, Favoritenstrasse 9–11, 1040 Vienna)

14.00 – 18.00 Tutorials (Vienna University of Technology, Favoritenstrasse 9–11, 1040 Vienna)

Ecodesign and the EuP Directive – Vital Criteria for Future Business Success C. Herrmann, A. Saraev, PE Europe, DE M. Held, University of Stuttgart, DE Maximizing Returns on Materials C. Slijkhuis, MBA Polymers, USA M. Wright, IAER, BAN, USA C. Hagelüken, UMICORE, DE K. Väänänen, CRT, FI

17.30 – 19.00 Registration (Vienna University of Technology, Karlsplatz 13, 1040 Vienna)

18.30 Welcome Party (Vienna University of Technology, Karlsplatz 13, 1040 Vienna)

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Monday, November 13, 2006 (Kursalon Vienna)


10.30 – 12.00 Opening Ceremony & Keynote Presentations Chair: T. Gutwinski, Gutwinski Management, AT Hall Lanner

Responsible for Mobility? W. Wilhelm, MAGNA STEYR Fahrzeugtechnik, AT Implementing WEEE in Europe – The View of a Multinational Electronics Company K. Hieronymi, Hewlett Packard, DE

12.00 – 14.00 Lunch & Opening of the Environmental Exhibition

Hall Lehar Hall Schubert Hall Lanner

1.1. Ecodesign I Chair: J. Boyce, Fujitsu Services, UK

1.2. Implications of the WEEE Directive Chair: H. Furukawa, ENE EcologyNet Europe, DE

1.3. Communication to Consumers 14.00 – 15.30

Chair: S. Alber, CIMA, HU

14.00 – 16.00 in Hall

Lehar & Schubert and

14.00 – 15.30 in Hall Lanner

The Asia Eco-Design Electronics Project: Supply Chain Implications M. Charter, The Center for Sustainable Design, UK Mass Customization Issues for Ecodesign T. Sakao, Darmstadt Univ. of Technology, DE M. Fargnoli, University of Tokyo, JP IT System Approach for Life-Cycle Eco-Design T. Sasaki, Y. Ichikawa, Hitachi, JP Eco-Design International Standardization for Electrotechnical Products Y. Ichikawa, Hitachi, JP

The WEEE Directive and the Transfrontier Shipment of Waste Regulations – A Practical Experience J. Hughes, J. Borrman, Datec Technologies, UK WEEE Activities in Austria – Practical Challenges and Experiences K. Lukitsch, ERA, AT Levelling the Playing Field for Individual Producer Responsibility: The Importance of a True Financial Guarantee for Future WEEE C. v. Rossem, N. Tojo, T. Lindhqvist, IIEEE, Lund University, SE WEEE: Reporting Compliance – Case Study on the Hungarian System E. Garamvölgyi, Z. István, Bay-Logi, HU Z. Tóth, Electro-Cord, HU Solutions for the Take-Back of WEEE in Germany – An Objective Comparison C. Hohaus, P. Meyer, Fraunhofer IML, DE

Greenpeace’s Benchmarking of Electronics Manufacturers on their Corporate Policies on Chemicals and Producer Responsibility for End-of-Life Products I. Kruszewska, M. Hojsik, Greenpeace, NL The Grand Challenge: Motivating Consumers to be Green P. Wiesner, IEEE, USA W. Rifer, Green Council, USA R. Caudill, New Jersey Inst. of Tech., USA Evaluation of Corporate Eco-Image Based on Visual Communication Design of Webpages Chen-fu Chen, Cho-ya Lee, Ming Chuan University, TW Chung-Hsing Yeh, Monash University, AUS TED – The Eco Declaration Standard S. Weeren, IBM, DE H. Wendschlag, Hewlett Packard, SE

15.30 – 16.30 Coffee Break

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1.4. Ecodesign II Chair: F. Quella, Siemens, DE

1.5. Future Revision of the WEEE Directive Chair: R. Nyer, RNC, FR

1.6. Legislation Driven Developments 16.00 – 18.00

Chair: W. Becker, Merck, DE

16.30 – 18.30 in Hall

Lehar & Schubert and

16.00 – 18.00 in Hall Lanner

Incentive-Based Approach for the Implementation of Ecodesign Methods J. Grossmann, H. Birkhofer, Darmstadt University of Technology, DE Survey on Environmentally Conscious Design in Japanese Electronics Industry K. Masui, Inst. of Adv. Indust. Science and Technology, JP T. Hata, Environ, JP Y. Umeda, Osaka University, JP A “Green Vehicle” Roadmap of Vehicle Manufacturers within Globalize Trend – In Case of Vehicle Manufacturers in Taiwan T. Chen, S. Huang, Industrial Economics & Knowledge Center, ITRI, TW H.-F. Yeh, C.-Y. Liu, B.-L. Chang, R.D.L. Lin, Ford Lio-Ho Motor, CN Modelling Framework of Innovation Diffusions Based on Multi-Agent Models M. Matsumoto, S. Kondoh, K. Masui, Inst. of Adv. Ind. Science and Technology, JP J. Fujimoto, University of Tokyo, JP H. Tsuchiya, System Techn. Res. Center, JP Y. Umeda, Osaka University, JP Lead Free (LF) Alloys for Electronics, Boon or Bane? M. Laentzsch, Balver Zinn, DE

The Implementation of WEEE Directive: Present Status and Future Options for Development and Simplification F. Magalini, Politecnico di Milano, IT J. Huisman, A. Stevels, Delft University of Technology, NL Th. Marinelli, Philips, NL Revision of the WEEE Directive E. Smit, Epson, NL F. Loen, Sony, DE G. Margetson, Samsung Electronics, UK Th. Marinelli, Philips, NL ITC Reuse and Refurbishment/ Remanu-facturing in the Context of WEEE Implementation – Do We Need Targets or other Framework Conditions? L. Scheidt, Vienna University of Technology, AT Panel Discussion Revision of the WEEE Directive – What should be Changed? Panelists: J. Huisman, Delft University of Technology, NL H. Guilcher, HP, FR L. Scheidt, Vienna Univ. of Technology, AT E. Smit, Epson, NL

Compliance Assurance Process – A Challenge for Industry Partnership R. Kurzknabe, Du Pont de Nemours, CH Myths, Misunderstandings, Miscommunications and Mistakes – Fact and In-depth Analysis of Product-Related Environmental Regulations on Electrical and Electronic Equipment in China, Japan and Korea DaeYoung Park, ENHESA-EPC, BE Environmental Legislation in the Electronics Industry A. Stevels, O. Pascual, J. Huisman, Delft University of Technology, NL The WEEE & RoHS Challenge to China P. Chen, Huawei Technologies, UK Financing in Respect of WEEE – Compliance in Member States L. Hofmann, AT

20.00 Reception by the Mayor of Vienna at the City Hall of Vienna & The CARE Band

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Tuesday, November 14, 2006 (Kursalon Vienna)


Hall Lehar Hall Schubert Hall Lanner Invited Session

2.1. SEES – Sustainable Electrical & Electronic System for the Automotive

Sector Chair: A. Greif, Technical University Berlin, DE

2.2. Electronics Recycling Chair: P. Muscanelli, IAER, USA

2.3. Implications of the RoHS Directives Chair: A. Turnbull, ENVIRON, UK

8.30 – 10.30

Introduction to the SEES Project A. Greif, Technical University Berlin, DE Disassembly Studies R. Poxhofer, Müller-Guttenbrunn, AT Shredding and Recycling Studies M. Larrañaga, Gaiker, ES Environmental & Economic Studies J. Rodrigo, Universitat Rovira i Virgili, ES SEES Software Presentation S. Alber, CIMA, HU Redesign of the Automotive Electrical & Electronic System N. Eikelenberg, Ford Research, DE

Improving Resource Recovery from Electronic Scrap Recycling – A Holistic Approach C. Hagelüken, T. v. Kerckhoven, Umicore Precious Metals Refining, BE Thermal End-of-Life Treatment of Printed Wiring Board Assemblies: What are the Environmental Consequences? W. Scharnhorst, EMPA, CH A New Sorting Process of Aluminum Scraps Using Surface Morphology after Laser Irradiation H. Nishikawa, S. Katayama, T. Takekmoto, K. Seo, Osaka University, JP RFID (Radio Frequency Identification Devices) – A New, Important Challenge for Future Electronic Waste Recycling P. Jacob, EMPA, CH

Standard for Test Methods Determining RoHS Substances in Electronics (IEC 62321) M. Stutz, Dell, DE, M. Loch, Motorola, USA Challenges for Industry against the Background of Requests for Exemptions Following Requirements of Article 5 (1) (B) RoHS Directive S. Zangl, C. Gensch, Öko-Institut, DE VECAP: Greening the Electronics Supply Chain through a Voluntary Emissions Reduction Program M. v. Kampen, Albemarle, BE, D. Buszard, Chemtura, UK, L. Tange, Eurobrom, NL, P. Adriaenssens, Qualipa, BE Beyond RoHS: iNEMI’s Activities to Strengthen the Electronics Manufacturing Supply Chain R. Pfahl, iNEMI, USA J. Johnson, Cisco Systems, USA An Analysis of the Introduction of RoHS Implementing Legislation in the EU’s Member States J. Boyce, Fujitsu Services, UK V. Herman, EUES, FR


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2.4. Sustainability Chair: J. Ertel, BTU Cottbus, DE

2.5. Recycling of Monitors and Batteries Chair: C. Ernst, Accerio, NL

2.6. Implications of the WEEE & RoHS Directive

Chair: A. Schneider, Sony, DE

11.00 – 13.00

Evaluation of Sustainability of Ubiquitous Networking Society J. Nakamura, M. Tsuda, K.I. Takahashi, S. Nishi, NTT Corporation, JP Electronic Systems from the Perspective of Sustainability and Reliability C. Oberender, H. Griese, Fraunhofer IZM, DE A. Middendorf, O. Bochow-Neß, H. Reichl, TU-Berlin, DE Reference Management Assistance Concepts for Sustainability Implementation D. Janz, M. Hornberger, Fraunhofer IPA, DE Concept of Design Support Technology for Global Environment Conscious Product Y. Hiroshige, T. Kumazawa, Y. Hamatsuka, T. Ohashi, Hitachi, JP O. Deubzer, H. Griese, Fraunhofer IZM, DE New Directions for Sustainable Electronics Packaging S. Ballantine, J. Krajewski, M. Skiba, Microsoft, USA

Discharging Treatment of Waste Lithium Ion Battery Z. Xia, Y. Shi, Y. Lei, F. Guo, Beijing University of Technology, CN J. Liu, A. Wang, Motorola, CN ReLCD – Recycling and Re-Use of LCD Panels S. Steiner, B. Kopacek, SAT, AT Functionality Test of End-of-Life TFT LCD Panels R. Ladányi, P. Miklósi, Bay-Logi, HU WEEE Challenges Matched with Recyclers Best Practice J. Zwart, Sims Mirec, NL

Deal or No Deal? – Supplier’s Edition the RoHS Directive M. Coopersmith-Gray, A. Sharma, ENVIRON, UK Efficient Product Compliance Management along the Corporate Supply Chain E. Bachmann, TechniData, DE Estimation of the Dissipated Amount of Rare Metals in Discarded Home Electric Appliances in Japan E. Yamasue, N. Duc Quang, H. Okumura, K. Ishihara, Kyoto University, JP K. Nakajima, Tohoku University, JP Renewable Materials for Electronics: Lignin-Based Polymers for Printed Circuit Boards J. Müller, N. Nissen, W. Scheel, R. Schmidt, Fraunhofer IZM, DE H. Nägele, Tecnaro, DE C. Lehnberger, Andus Electronic, DE H. Landeck, KEW Konzeptentwicklung, DE K. Birkner, Loewe Opta, DE Transparency and Quality Assurance in the Implementation of the WEEE Directive: The RAL Quality Mark for the Demanufacture of Refrigeration Equipment C. Becker, RAL, DE

13.00 – 14.00 Lunch

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2.7. EuP/IPP Chair: M. Stutz, Dell, DE

2.8. Re-Use/Remanufacturing Chair: L. Scheidt, VUT, AT

2.9. Practical Examples of RoHS Implementation

Chair: A. Baynes, Apple, USA

14.00 – 16.00

Insights on Integrated Product Policy (IPP) as a Policy Tool Framework – Experiences and Learnings from Nokia’s Pilot on Mobile Phones O. Mäkirintala, P. Singhal, Nokia, FI The Implementation of Integrated Product Policy in the Telecommunications Industry – The Case of IPP-TEL C. Koroneos, A. Dompros, Aristotle University Thessaloniki, GR A. Bourka, EPTA, GR M. Loizidou, Technical University Athens, GR How can the EUP Directive Facilitate Environments Improvements among Producers of Mobile Phones? K. Dirckinck-Holmfeld, C. Braun, J. Andersen, Roskilde University, DK Cost-Effective Compliance with EUP Directive and the New Eco-Design Requirements in IEC 60601-1-9 for Medical Electrical Equipment A. Turnbull, ENVIRON, UK Ecodesign towards Environmental Legislation Development M. Fargnoli, University of Tokyo, JP T. Sakao, Darmstadt Univ. of Technology, DE

Evaluation Method to Aid DfR (Design for Remanufacturing) Young-Do Jung, Eco-Frontier, KR Hong-Yoon Kang, Korea National Cleaner Production Center, KR End-of-Life Management of Automation Devices P. Kopacek, M. Han, Vienna University of Technology, AT B. Kopacek, SAT, AT Decision Making on the Alternatives for the End of Life Management of Electrical and Electronic Equipment N. Moussiopoulos, K. Bouzakis, E. Iakovou, C. Koroneos, H. Achillas, N. Michailidis, A. Xanthopoulos, M. Chantzipanagioti, Aristotle University Thessaloniki, GR Promoting Reuse – Legal and Technical Constraints H. Bröhl-Kerner, RREUSE, BE An On-Board Diagnostics System for PC Re-Use Analysis S. Hickey, C. Fitzpatrick, University of Limerick, IE

WEEE- and RoHS-Directives and Product Reliability of Semiconductor Devices – A Contradiction? K. Mayer, J. März, E. Riedl, Infineon Technologies, AT Developing Environmentally Friendly Technology C. McCarthy, EAGLE XG™, Corning Display Technologies, USA Leadfree Manufacturing in Semiconductor A. Sriyarunya, J. Tondtan, N. Ramungul, A. Kanjanavikat, Spansion, TH Sustainable Phosphorus Based Flame Retardants: A Case Study on the Environmental Profile in View of European Legislation on Chemicals and End-of-Life (REACH, WEEE, RoHS) A. Beard, Clariant, DE T. Marzi, Fraunhofer-Umsicht, DE Void Formation: Emerging Issues in Materials Compatibility and Reliability of PB-Free Assemblies C. Handwerker, K. Erk, A. Hess, A. Squire, M. Yarbrough, Purdue University, USA R. Parker, M. Webster, Delphi Electronics and Safety, USA


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2.10. Product Assessment Chair: B. Pfahl, iNEMI, USA

2.11. Plastics Recycling Chair: E. Smit, Epson Europe, NL

Invited Session 2.12. The Ecodesign of EuP Directive –

Theory and Practical Examples Chair: C. Herrmann, PE Europe, DE

16.30 – 18.00

16.30 – 18.30

Total Performance Analysis of Product Life Cycle Considering the Deterioration and Obsolescence of Product Value S. Kondoh, K. Masui, M. Hattori, N. Mishima, M. Matsumoto, Nat. Institute AIST, JP Environmental Performance Indicators for Personal Computers – Determining the Environmental Profile as First Step for EuP M. Stutz, M. Schaffer, Dell, DE A. Braune, University of Stuttgart, DE P. Frankl, E. Menichetti, Ambiente, IT Opportunities and Challenges for Connecting Environmental Assessment and CAD/PLM Software Tools: Example of Implementation by LEGRAND L. Lescuyer, CODDE, FR F. Mathieux, L. Roucoules, Troyes University of Technology, FR H. Davail, Legrand, FR Product Assessment by TPI and Cost Value Ratio Jahau L. Chen, Tai-Yu Kuo, Cheng Ming Chen, National Cheng Kung University, TW Sheng-Bou Yen, Chia Nan University, TW Jesse Chiou, S.F. Yeh, Chen-Yu Liu, Ford Lio Ho Motor, TW Successful Development and Implementation of Green Procurement – Electronic Product Environmental Assessment Tool (EPEAT©) M. Schaffer, M. Newton, W. Rifer, Dell, Green Electronics Council, USA

The Concept of Management System of Plastics Waste from WEEE M. Machnicka-Hławiczka, A. Rejman-Burzyńska, M. Hławiczka-Lis, Central Mining Institute Katowice, PL Closing the Loop for Plastics – Plastics from Durable Products to Durable Products C. Slijkhuis, D. Arola, B. Riise, M. Biddle, MBA Polymers, USA Using Spectroscopic Methods for Identification of Technical Plastics from E&E and ELV Sector W. Becker, N. Eisenreich, Fraunhofer ICT, DE Innovation in Plastics for Products of the Electrical Industry in their Life Cycle I. Sartorius, PlasticsEurope, DE

EuP and Ecodesign – What does it Mean and Examples from Industry and Projects C. Herrmann, PE Europe, DE Ecodesign of Energy Using Products (Eup) – Duties and Challenges for Siemens M. Melzer, Siemens, DE LCA for Ecodesign of Products and Complex Systems – At the Example of Personal Computers and Internet Data Transfer M. Held, N. Warburg, LBP, University of Stuttgart, DE

18.30 Dinner at a typical Viennese "Heuriger"

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Wednesday, November 15, 2006 (Kursalon Vienna)



Invited Session 3.1. Beyond Legislation – Is Legislation a Starting Point for Life Cycle Thinking

Chair: H. Griese, Fraunhofer IZM, DE

3.2. Transnational WEEE Solutions Chair: H. Guilcher, Hewlett Packard, DE

3.3. Ecodesign Tools & Methodologies Chair: E. Scimia, FEBE Ecologic, IT

8.30 – 10.30

Beyond Legislation – Is Legislation a Starting Point for Life Cycle Thinking H. Griese, Fraunhofer IZM, DE EU Legislation: RoHS, WEEE and EuP Status and Implications for Companies N. Nissen, K. Schischke, Fraunhofer IZM, DE Adaption to ROHS is Painful but Crucial for Company Survival in an Ever Green World K. Lee, Prosol-electronics, UK To be Ahead of Legislation – Legislation is not a Starting Point for Life Cycle Thinking R. Müller, Agfa-Gaevert HealthCare, DE

Designing B2B WEEE Systems to Gain Cost Savings from Ecodesign A. Turnbull, ENVIRON, UK EARN – A WEEE Solution for Europe E. Marijuan-Requeta, R. Cramer, B. Kopacek, K. Kramer, EARN Service, AT Possibilities of Individual Collection and Recycling of Electrical Devices to Reduce Municipal Obligations N. Michael, Hellmann, DE The European Transposition of the WEEE Directive from the Viewpoint of a Service Company resp. a General Contractor A. Winter, CCR, DE Establishing Transnational Take Back Services in CEE G. Eckerth, Interseroh, DE

Ecodesign of a Rice Cooker with the Twelve Step Procedure K.M. Lee, I.T. Jeong, Ajou University, KR W. Wimmer, Vienna Univ. of Technology, AT The ECODESIGN Toolbox for the Development of Green Product Concepts – First Steps for Product Improvement R. Pamminger, M. Huber, W. Wimmer, H. Osta, H. Ghorabi, Vienna Univ. of Technology, AT “UTeMa-Matrix” – A Practical Strategic Tool for the Integration of Ecodesign Considering Technical Feasibility and Market Issues U. Hermenau, C. Schendel, B. Kuhrke, E. Abele, H. Birkhofer, Darmstadt University of Technology, DE A Life Cycle Concept Based Eco-Innovative Method by TRIZ Tools J.L. Chen, Henry Lau Andrew, National Cheng Kung University, TW An Eco-Innovative Problem-Solving Design Process Combining TRIZ Su-Field Model and Standards H.-T. Chang, Tunghai University, TW Y.-C. Ko, Shu-Te University, TW


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Invited Session 3.4. Ecodesign Toolbox for Energy

Using Products in the System House Chair: C. Herrmann, PE Europe, DE

Invited Session 3.5. ECOLIFE II

ECO-efficient LIFE Cycle Technologies: From Products to Service Systems

Chair: B. Kopacek, SAT, AT

3.6. Energy Efficiency Chair: C. Handwerker, Purdue University, USA

11.00 – 12.30

Project Outline, Motivation for Ecodesign, Goals and Results C. Herrmann, PE Europe, DE How the Toolbox Works, Parameters and the Automated Report Template, what Users can Learn from the Toolbox H. de Keulenaer, European Copper Institute (ECI), BE Case Studies, Different Heating Equipment and the Role of Power Consuming Electronics in a Typical House B. Dome, Copper Benelux, BE

Welcome, Introduction and Presentation of the ECOLIFE II Project B. Kopacek, SAT, AT State-of-the-Art in Environmental Electronics K. Müller, Motorola, DE Best Practice Guide on Ecodesign Including Tools and Examples M. Held, University Stuttgart, DE From Products to Services: Threats and Opportunities P. Meyer, Fraunhofer IML, DE Challenges for the Electronics Industry in the Next 10 Years J. Hafkesbrink, ARÖW, DE Examples of Successful Business Models for Sustainable Services in Electr(on)ics Industry V. Herman, DAN-EUES, FR

Eco-Design Challenges beyond Substances and Recycling – A Vision for an Integrated Eco and Energy Efficiency Framework S. Weeren, J. Dietrich, IBM, DE J. Prisco, System and Technology Group, USA Research by Design: Feasibility of a DMFC Powered PDA S. Flipsen, E. v.d. Voort, Delft Univ. of Tech., NL The Buyers Influence on Energy Efficiency: Research Findings and Data Center Collaborations D. Sadowy, AMD, USA The Design of a Solar Powered Consumer Product, a Case Study M. Veefkind, S. Kan, S. Silvester, M. Verwaal, Delft University of Technology, NL B. Elzen, J. Jelsma, Univ. of Twente, NL E. Alsema, N. Reich, W. Sark, Utrecht Univ., NL

12.30 – 13.30 Lunch

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3.7. Invited Session StEP – Solving the E-Waste Problem

Chair: R. Kuehr, United Nations University, DE

Invited Session 3.8. Future Visions of the European

Electronics Industry: Roads Towards a Sustainable 2020

Chair: V. Herman, EUES, FR, A. Jönbrink, IVF, SE

3.9. Life Cycle Analysis Chair: N. Warburg, Continental, DE

13.30 – 15.30

Welcome: Method and Aims of this Event The “StEP” Initiative: Purpose, Concept, Status and Outlook Illustration of Some Concrete StEP Work Statements on Interests and Demands: OEMs, Recycler, Refurbisher, Governmental Organisations, NGOs, Academia Discussion, Sum-up, Next Steps K. Hieronymi, Hewlett Packard, DE C. Hagelücken, UMICORE, DE G. Sonnemann, UNEP, FR K. Schischke, Fraunhofer IZM, DE S. Kunz, 3P Consortium, DE J. Huismann, UNU/TU Delft, NL R. Widmer, EMPA, CH C. Maurer, UNU/StEP Secretariat, DE

Introduction V. Herman, DAN-EUES, FR 4 Visions of the Future of the European Electrical and Electronics Industry J. Sjögren, IVF, SE Road Maps for the European Electrical and Electronics Industry K. Geraghty, M. Goosey, UK Technological Paradigm Shifts J. Hafkesbrink, ARÖW, DE Towards 2020, Environmental Issues and Possible Solutions A. Jönbrink, IVF, SE Low-Carbon Society Scenario Toward 2050 J. Fujimoto, D. Poland, University of Tokyo, JP M. Matsumoto, National Institute of Advanced Industrial Science and Technology, JP

LCA of Electric Motors and their Design Based on the Expected Useful Life B. Kuhrke, S. Feickert, U. Hermenau, E. Abele, Darmstadt University of Technology, DE Life Cycle Assessment of an Innovative Uninterruptible Power Supply System to Investigate on Environmental Performance B. Sára, E. Scimìa, FEBE ECOLOGIC, IT F. Cappellaro, V. Maccallini, P. Masoni, ENEA Bologna Research Center, IT Strategy for the Second Phase of the UNEP/SETAC Life Cycle Initiative – Bringing Science-Based Life Cycle Approaches into Practice for Sustainable Electronics S. Valdivia, G. Sonnemann, UNEP DTIE, FR, A. Jensen, FORCE Technology, DK J. Fava, Five Winds International, USA Life Cycle Assessment and its Applicability for Electrical and Electronic Equipment N. Unger, S. Salhofer, BOKU-University Vienna, AT


16.00 – 18.00 Plenary Discussion

“Future Visions of the European Electronics Industry: Roads Towards a

Sustainable 2020”

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Evening Program Welcome Party Sunday, November 12, 2006 18.30 A Welcome Party will be held at Vienna University of Technology. Come and join the exhibitors, speakers, organizers and conference attendees for a buffet dinner. Do not miss the opportunity to network with your colleagues! Location: Vienna University of Technology Karlsplatz 13 1040 Vienna

Underground station “Karlsplatz” (U1, U2, U4), exit “Resselpark”

Reception by the Mayor of Vienna & CARE Band Monday, November 13, 2006 20.00 The Reception by the Mayor of Vienna will take place in the Vienna City Hall, one of the most splendid landmarks amongst the numerous monumental buildings along Vienna's Ring Road. Designed by Friedrich Schmidt (1825-1891), it was erected between 1872 and 1883. The architecture of the Ringstraße is dominated by Historicism. The City Hall was built in gothical style, with a tower similar to gothic cathedrals. Today the City Hall is the head office of Vienna's municipal administration. More than 2000 people work in the building. Visitors are stunned by the magnificent appointments of the state rooms, which frequently provide an atmospheric backdrop to various events such as concerts or balls.

After dinner, the world’s unique CARE Band will motivate you to shake your leg!

Attention: For entrance, special invitation cards will be handed out together with the conference package.

Location: Vienna City Hall Entrance: Rathauskeller Rathausplatz 1 1010 Vienna

Underground station “Rathaus” (U2) or tram 1, 2 or D “Burgtheater”

Dinner at a typical Viennese Heuriger Tuesday, November 14, 2006 19.00 There is a spray of pine branches hanging outside and next to the door a sign bearing the word “Ausg’steckt” – you are standing in front of a real Viennese Heuriger, which means that the wine served in the tavern is exclusively home-made wine from Viennese vineyards. However, the word “Heuriger” has another meaning, too: it is also the wine from the last harvest. Vienna is not just a throbbing city at the heart of Europe; it is also its own wine region. Around 700 hectares of vineyards can be found within the city limits – no other city in the world can make that claim! The wines grown in Vienna are primarily white wines. However, Viennese winegrowers are making more and more red wines – especially Blauer Zweigelt. The vinery Hengl-Haselbrunner is growing very traditional wines since the 16th century in the heart of the famous wine district Grinzing.

Location: Heuriger Hengl-Haselbrunner Iglaseegasse 10 1190 Vienna

Shuttle from Kursalon Vienna at 18.30 Shuttle-Service back to Kursalon Vienna between 22.00 and 23.30

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Technical Tours On November 16, 2006 our delegates can gain a practical insight into what is achievable and currently being achieved within industry during technical tours. The tour will lead the participants along the state-of-the-art recycling trail for WEEE and ELV. It will start at Müller-Guttenbrunn GmbH, where End-of-Life cars as well as electrical and electronic equipment are pre-shredded and the iron fraction is extracted. The visitors will also have the chance to see the unique Smasher to extract hazardous components from WEEE. The next stop will be Metran Rohstoff-Aufbereitungs GmbH, where all the non-ferrous metals are extracted. Finally at MBA Polymers Austria Kunststoffverarbeitung GmbH the delegates will watch the most modern plastics recycling facility. Attention: Please register or re-confirm until Tuesday, November 14, 2006 14.00 at our registration

desk! Departure: Thursday, November 16, 2006, 8.00 in front of Kursalon Vienna

Estimated arrival time in Vienna is 18.00 !

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Organized by International CARE Electronics Office

Austrian Society for Systems Engineering and Automation

Stutterheimstraße 16-18/Stg. 3/1.107 A – 1150 Vienna

T: +43-1-7890612-43 F: +43-1-7890612-77 Email: [email protected] Internet: www.care-electronics.net/ci06

In co-operation with

Partner

Thematic Network ECOLIFE II (supported by the EC Growth Program)

Sponsors

Supporter

IEEE EEC, Japan IEEE TCEE, USA IAER

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