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1 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
FY2016 ended Dec. 2016
Financial Results
Security code: 6640
February 15, 2017
Dai-ichi Seiko Co., Ltd.
2 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
Trade Name Dai-ichi Seiko Co., Ltd.
Founded July 10, 1963 (Fiscal year end in December )
Stock Exchange
Listings The Tokyo Stock Exchange First section, stock code: 6640
Paid-in-capital 8,522 million yen
Issued Share 16,722,800 shares
Business
Ⅰ. Connectors & Electronics Components Business
Ⅱ. Automotive Electronics & Associated Components Business
Ⅲ. Semiconductor Mfg. Equipment and Other Business
Board President: KONISHI Hideki, 10 Other Directors (2 External Directors), 4 Statutory Auditors (External Statutory Auditors)
Stockholders Holding Company: 43.05%, Employee Holding Association: 4.17%, The Master Trust Bank of Japan, Ltd.: 3.82%, KONISHI Hideki: 2.97%, CBNY DFA INTL SMALL CAP VALUE PORTFOLIO 1.68% (As of Dec. 31, 2016)
Head Office Kyoto-City, JAPAN
Plants in Japan 6 places (3 in Fukuoka, 1 in Yamanashi, 1 in Kyoto , 1 in Shimane)
Overseas Plants 11 places (2 in Singapore, 1 in Indonesia, 2 in Malaysia, 1 in Philippines, 1 in Thailand,
2 in China, 1 in Vietnam and 1 in U.S.A.)
Subsidiaries
Matsue Dai-ichi Seiko Co., Ltd. (100% share),
DJ Precision Co., Ltd. (70% share, 30% shared by JAE Co., Ltd.), IGM TECH SDN. BHD. (51% share)
16 overseas companies (100% share),
No. of Employees 5,932 (1,908 in Japan and 4,024 in Overseas) Compared with Aug. 31, 2016, our employees increased by 15 in Japan and decreased by 36 in overseas.
■ Corporate Overview as of Dec. 2016
3 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
✔ Record-high sales in the automotive components
business for four consecutive years!
✔ Actions for more growth
■ FY2016 Topics
・Entire business: 103% YoY 17.97 billion yen
・Own brand: 1.7 times YoY 1.83 billion yen
・ New business: ESTORQ → Incorporated in industrial robots
HDD → Started building a new business model
・ Up-front capital expenditures for growth in the future
✔ A recovery in performance started from 2H! ・Full shield connectors grew in 2H.
・Foreign exchange losses down due to the yen-depreciation at the end of the year
(Hundred million yen) 1H 2H Full-year Sales 220.8 237.5 458.3
Ordinary income -12.4 20.4 8.0
4 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ FY2016 Topics
Hundred million yen
Full-year Plan
1H Actual
2H Actual
Full-year Actual
Ver. Plan
Sales 470.0 220.8 237.5 458.3 ×
Gross Profit 126.5 56.0 65.1 121.1 ×
Operating Income 4.0 -4.1 8.1 4.0 〇
Ordinary Income 3.0 -12.4 20.4 8.0 〇
Net Income Attributable
to Owners of Parent 1.0 -13.9 15.5 1.5 〇
FY2016
(Rounded down to the nearest million yen)
5 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ FY2016 Actual Consolidated Financial Highlights
Million yen FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.) Amount
Change (%)
Sales 48,749 45,834 - 2,915 - 6.0%
Gross Profit 13,633 12,116 - 1,517 - 11.1%
Operating Income 1,723 401 - 1,322 -76.7%
Ordinary Income 2,344 800 - 1,544 -65.9%
Net Income Attributable to
Owners of Parent 2,355 157 - 2,198 -93.3%
◆ Connector business: slow growth of micro-coax connectors, etc. due to deceleration of growth of PCs and smartphones,
and the effect of sharp yen rise from 1Q through 2Q decreased sales, although there were some signs of recovery trend in 4Q.
◆ Automotive business: in addition to continued steady market acceptance of automobiles mainly in North America and
China, development of automotive electronics contributed to a steady growth in sensor sales, and more adoption by different types of vehicles contributed to a steady growth in automobile connectors.
◆ Semiconductor equipment business: overall, continued lower demands for capital expenditures by semiconductor
manufacturers and back-end process contractors impacted sales, although demands for manufacturing facilities of automotive semiconductors remained relatively firm.
◆ Decrease in gross profit due to sales decline and the effect of foreign exchange fluctuation caused by the sharp yen rise in
1H significantly impacted all income items, although it has recovered from 3Q and 4Q.
✔ Sales were sluggish due to slow growth of connectors.
✔ All income items were down.
6 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
Million yen FY2015
(Jan.-Dec.) Ratio
FY2016
(Jan.-Dec.) Ratio
Change
(%)
Sales 48,749 100.0% 45,834 100.0% - 6.0%
Cost of Sales 35,116 72.0% 33,717 73.6%
Gross Profit 13,633 28.0% 12,116 26.4% - 11.1%
Selling Administratio
n Exps 11,909 24.4% 11,715 25.6%
Operating Income 1,723 3.5% 401 0.9% -76.7%
Non-operating Income
712 1.5% 602 1.3%
Non-operating Expense
90 0.2% 202 0.4%
Ordinary Income 2,344 4.8% 800 1.7% -65.9%
Extraordinary Income - - - -
Extraordinary Expense - - 84 0.2%
Net Income before Tax 2,344 4.8% 716 1.6% -69.5%
Taxation -18 0.0% 550 1.2%
Net Income Attributable to
Non-controlling Interests
7 0.0% 8 0.0%
Net Income Attributable to
Owners of Parent 2,355 4.8% 157 0.3% -93.3%
No. of
Employees 5,923 5,932
✔ Higher automotive division sales was unable to offset
decline in connector division sales affected by the
foreign exchange fluctuation; gross profit was down
despite recovery in 4Q.
✔ Growth in fixed costs such as depreciation expenses,
etc. also affected the performance.
✔ Overall gross margin ratio decreased by 1.6 points to
26.4% YoY.
■ FY2016 Actual Consolidated Statements of Income
✔ SG&A expenses decreased YoY but operating income
was lower due to the significant decrease in gross profit.
✔ The yen weakened rapidly in 4Q, but this was unable to
fully offset the downturns in 1Q and 2Q.
✔ Net income sharply decreased to 157 million yen YoY.
Decrease in sales of connectors
largely affected performance
FY2015 (Jan.-Dep.)
Actual
FY2016 (Jan.-Dec.)
Plan
FY2016 (Jan.-Dec.)
Actual
FY2017 (Jan.-Dec.)
Plan
5,119 5,200 5,477 5,500
Gross Margin Ratio: 26.4%
Operating Income: 401 million yen
< Depreciation > ( Million yen )
7 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
2,201 324 668 1,156 1,623
17,370
4,714
8,962
13,464
17,974
29,178
5,897
12,453
19,212
26,237
1Q-4Q 1Q 1Q-2Q 1Q-3Q 1Q-4Q
コネクタ及びエレクトロニクス機構部品
自動車電装・関連部品
半導体設備・その他
■ FY2016 Actual Sales per Segment
45,834
(Million yen)
10,935
48,749
22,083
33,832
✔ Connector & Electronics: sales increase in
2H was unable to fully offset the downturn in 1H.
✔ Automotive Components: record-high sales
thanks to the continued favorable orders for
sensors and connectors.
✔ Semiconductor Equipment & Others: orders
were below the plan mainly because customers pushed back capital expenditure plans, etc.
Sales downed YoY
due to sluggish orders
for connectors.
Million yen FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.)
Change
(%)
Connectors & Electronics
29,178 26,237 -10.1%
Automotive Components
17,370 17,974 +3.5%
Semicon Equip.
& others
2,201 1,623 -26.3%
Total 48,749 45,834 -6.0%
+12,002
+11,148
+11,749
Connectors and Electronics Components
Automotive Components
Semicon Equip. and others
FY2015 FY2016 FY2016 FY2016 FY2016
8 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ FY2016 Actual Gross Profit
31.5%
26.9% 26.4%
29.4%
31.1%
24.5% 24.3% 24.1% 24.3% 24.3%
28.5%
25.5% 25.3%
26.9% 27.9%
FY2015 4Q FY2016 1Q FY2016 2Q FY2016 3Q FY2016 4Q
コネクタ及びエレクトロニクス機構部品 自動車電装・関連部品 全社
Million yen
FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.) Change
Amount Ratio Amount Ratio
Connectors & Electronics
8,970 30.7% 7,497 28.6% -1,473
Automotive Components
4,272 24.6% 4,358 24.2% +86
Semicon Equip. & others
391 17.8% 261 16.1% -130
Total 13,633 28.0% 12,116 26.4% -1,517
Gross margin ratio has recovered as the factory
utilization rate increased because of increase in
connector sales due to a recovery in orders in
3Q and 4Q.
Gross Margin Ratio / Two Main Businesses and Company Total
Connectors and Electronics Components
Automotive Components
Total
Connectors and Electronics Components
Automotive Components
Sales steadily increased due to strong
automobile sales, but the gross margin ratio
almost remained flat due to higher fixed costs.
9 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
1,363 314
716 1,029 1,313
4,316
1,007 1,998
2,942 3,940
2,587
620
1,466
2,562
4,019
9,059
1,590
3,359
5,173
6,913
11,853
2,366
4,914
7,506
10,052
1Q-4Q 1Q 1Q-2Q 1Q-3Q 1Q-4Q
Others HDD Components FPC/FFC etc
Micro-Coax Connectors RF Coax Connectors
■ FY2016 Actual Connectors & Electronics Components
Quarterly sales increased but total sales downed YoY due to downturn in 1H.
19,212
26,237
12,453
5,897
29,178
(Million yen) ✔ Sales of RF Coax Connectors and Micro-
Coax Connectors were weak due to sluggish sales of smartphones and PCs.
✔ Sales of the newly developed full shield
board to board connector grew as its mass production has been started from 2H. Adoption of FPC for liquid crystal panels, etc. grew.
Million yen FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.)
Change (%)
RF Coax
Connectors 11,853 10,052 -15.2%
Micro-Coax
Connectors 9,059 6,913 -23.7%
FPC/FFC
Board to Board 2,587 4,019 +55.4%
HDD
Components 4,316 3,940 -8.7%
Others 1,363 1,313 -3.7%
Total 29,178 26,237 -10.1%
+7,025
+6,556
+6,759
【Sales by products】
FY2015 FY2016 FY2016 FY2016 FY2016
10 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
1,156 221
524 837 1,121
4,316
1,007 1,998
2,942 3,940
2,858
728
1,735
2,745
3,729
8,995
1,575
3,282
5,182
7,395
11,853
2,366
4,914
7,506
10,052
1Q-4Q 1Q 1Q-2Q 1Q-3Q 1Q-4Q
Others HDD Components DA etc PC W/less Network
29,178 39%
28%
14%
15%
4%
40%
31%
10%
15%
4%
■ FY2016 Actual Connectors & Electronics Components
【 Component Ratio 】
FY2015
【 Sales by Applications 】
FY2016 19,212
26,237
12,453
5,897
Million yen FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.)
Change (%)
W/less Network 11,853 10,052 -15.2%
PC 8,995 7,395 -17.8%
DA, Smart Phone 2,858 3,729 +30.5%
HDD
Components 4,316 3,940 -8.7%
Others 1,156 1,121 -3.0%
Total 29,178 26,237 -10.1%
+7,025
+6,759
+6,556
(Million yen)
FY2015 FY2016 FY2016 FY2016 FY2016
W/less
Network
PC
HDD
DA & Smartphone
11 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
2,205 606
1,161 1,591 1,994
3,293
820
1,715
2,833
3,905
11,872
3,288
6,086
9,040
12,075
1Q-4Q 1Q 1Q-2Q 1Q-3Q 1Q-4Q
Associated Components Electronics Automotive sensors
■ FY2016 Actual Automotive Components
【Sales by products】
Automotive components business steadily expanded
and achieved the record-high sales.
(Million yen)
17,370
13,464
17,974
4,714
8,962
✔ Orders for automotive sensors increased.
Some angle sensors, etc. are in full production to fill orders from customers.
✔ Own brand electronics parts for LED
headlights are adopted for more types of cars.
Million yen FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.)
Change (%)
Automotive
sensors 11,872 12,075 +1.7%
Electronics parts 3,293 3,905 +18.6%
Associated
Components 2,205 1,994 -9.6%
Total 17,370 17,974 +3.5%
+4,510
+4,502
+4,248
Without price revisions for parts purchased from
components makers, sales would be equivalent
to 18.8 billion yen.
Record-high
FY2015 FY2015 FY2016 FY2016 FY2016
12 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
38%
36%
19%
7%
1,671 2,892 2,953 3,321 3,010
8,522 8,881 10,607 10,569
8,794
13,488 13,439
14,197 15,709
16,832
17,493 16,189
18,784 19,149
17,646
FY2012 FY2013 FY2014 FY2015 FY2016
Others Other Asian Countries Japan China
Million yen FY2015
(Jan.-Dec.)
FY2016
(Jan.-Dec.)
Change (%)
China 19,149 17,646 -7.8%
Japan 15,709 16,832 +7.1%
Other Asian Countries
10,569 8,794 -16.8%
Others 3,321 3,010 -9.4%
Total 48,749 45,834 -6.0%
【Component Ratio】
39%
32%
22%
7%
FY2015 FY2016
41,174 41,401
(Million yen) 46,541
48,749 45,834
China
Japan
Other Asian Countries
Others
■ FY2016 Actual Sales by Destination
13 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ FY2016 Actual Consolidated Balance Sheet
Million yen FY2015 FY2016 Change
Current Assets 32,163 31,094 - 1,069
Cash & Deposit 12,932 11,111 - 1,821
Notes & Accounts Receivable
10,815 10,665 - 150
Inventories 7,131 8,131 + 1,000
Fixed Assets 27,019 28,081 + 1,062
Tangible Fixed Assets
25,884 26,710 + 826
Intangible Fixed Assets
419 378 - 41
Investments and Other Assets
716 992 + 276
Total Assets 59,183 59,175 - 8
Million yen FY2015 FY2016 Change
Current Liabilities 9,498 9,112 - 386
Notes & Accounts Payable
2,409 2,378 - 31
Short-term Debt 3,330 3,250 - 80
Long-term Liabilities
3,869 5,381 + 1,512
Long-term Debt 1,897 3,033 + 1,136
Total Liabilities 13,367 14,494 + 1,127
Shareholders’ Equity
44,293 44,199 - 94
Total Net Assets 45,815 44,681 - 1,134
Total Liabilities & Net Assets
59,183 59,175 - 8
Our interest-bearing debt & bonds increased 1,056 million yen versus FY2016 as planned.
Equity Ratio: 77.3% (FY2015) ⇒ 75.3%
Turnover
Period
(Unit:month)
FY2015 FY2016 Change
Accounts
Receivable 2.66 2.79 +0.13
Inventories 2.44 2.89 +0.45
Acquisition of fixed assets : 6,914 million yen
【 Assets 】 Favorable turnover periods of accounts receivable
and inventories have been continuously maintained.
Extremely healthy condition with over 70% equity ratio has been maintained!
【 Total Liabilities & Net Assets 】
14 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
Million yen FY2015
(Jan.-Dec.) FY2016
(Jan.-Dec.)
Operating CF 6,448 4,535
Investment CF - 7,028 -6,400
Free CF - 580 -1,865
Financial CF - 549 497
Change in Cash &
equivalents -1,318 -1,759
Beginning balance on
cash & equivalents 14,042 12,724
Ending balance of
cash & equivalents 12,724 10,964
Increase in interest-bearing debt was to provide funds
for long-term capital expenditure plans
million yen FY2016
(Jan.-Dec.) Change
Cash equivalent 11,111 -1,821
Borrowed money,
bond 6,283 +1,056
Equity ratio 75.3% -2.0%
Financial Situation: remains sound
13,395
15,440
12,932
11,111
5,512 5,252 5,227 6,283
76.1% 76.4%
77.3%
75.3%
60.0%
62.0%
64.0%
66.0%
68.0%
70.0%
72.0%
74.0%
76.0%
78.0%
0
5,000
10,000
15,000
20,000
25,000
FY2013 FY2014 FY2015 FY2016
Cash equivalent Borrowed money, bondEquity ratio
¥¥ ¥¥
■FY2016 Actual Consolidated Statements of Cash Flows & Financial Situation
【 Cash Flow】
① Operating Cash Flow: 4,535 million yen
② Investment Cash Flow: -6,400 million yen
③ Financial Cash Flow: 497 million yen
⇒ Free cash flow: -1,865 million yen
【 Financial Situation 】
(million yen)
15 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ FY2017 Plan Brief Overview of Consolidated Business Budget for FY2017
(計画レート112円/$)
Million yen
FY2016 Actual FY2017 Plan
Full-year Ratio Full-year Ratio YoY
Sales 45,834 100.0% 50,000 100.0% +4,166
Connectors & Electronics Components
26,237 57.2% 28,800 57.6% +2,563
Automotive Components 17,974 39.2% 18,900 37.8% +926
Semiconductor Mfg equipment & Others
1,623 3.5% 2,300 4.6% +677
Gross Profit 12,116 26.4% 14,293 28.6% +2,177
Overhead Expenses 11,715 25.6% 12,293 24.6% +578
Operating Income 401 0.9% 2,000 4.0% +1,599
Ordinary Income 800 1.7% 2,200 4.4% +1,400
Net Income Attributable to Owners of Parent
157 0.3% 1,500 3.0% +1,343
Dividends per Share 15 15
16 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
Business Strategies for FY2017
■ FY2017 Plan Business Strategies
① Connectors & Electronics
Pursue high-speed transmission technologies to
create highly value-added business.
② Automotive Electronics & Associated Components
Focus resources on this sector to expand
automotive business.
③ New Business
Catch new business opportunities and create more
“DANTOTSU” (Outstanding) products.
17 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
✔ 1.7 times YoY. Increase the use of connectors that prevent high
frequency noises in PCs and mobile phones.
・ Used in new smartphone models made in Korea
and China. ・ Target new applications involving IoT.
・ Expand sales of full shield connectors for PCs.
・ Target new applications involving robots,
medical equipment and other products.
1,313 1,300
3,940 4,000
6,913 6,500
10,052 10,000
4,019 7,000
0
5,000
10,000
15,000
20,000
25,000
30,000
35,000
16/12期 17/12期
FY2017 Full-year plan
・ Start using a new business model.
Establish a company “IGM TECH”.
1,313
NOVASTACK®35-HDP
Micro-Coax Connectors
■ FY2017 Plan Connectors & Electronics Components
28,800
26,033
FY2016 Actual
4,019
6,913
10,052
3,940
26,237 Board to Board Connectors
High-frequency interference prevention connectors
CABLINE®-CAⅡ
✔ 新規ビジネス本格供給開始
エストルク/産業用ロボットに採用
Pursue high-speed transmission technologies to create highly value-added
business.
RF Coax Connectors
Micro-Coax Connectors
FPC/FFC
Board to Board etc.
HDD Components
(Million yen)
18 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
1,156 1,363 1,313 1,300
4,094 4,316 3,940 4,000
2,025 2,587 4,019
7,000
8,523 9,059 6,913
6,500
12,917 11,853
10,052
10,000
FY2014 FY2015 FY2016 FY2017
Others HDD Components
FPC/FFC etc Micro-Coax Connectors
RF Coax Connectors
(Million yen)
Million yen FY2016
(Jan.-Dec.) FY2017
(Jan.-Dec.) Change
(%)
RF Coax
Connectors 10,052 10,000 -0.5%
Micro-Coax Connectors 6,913 6,500 -6.0%
FPC/FFC
Board to Board 4,019 7,000 +74.2%
HDD
Components 3,940 4,000 +1.5%
Other 1,313 1,300 -1.0%
Total 26,237 28,800 +9.8%
26,237
28,715 29,178 28,800
【Points for FY2017】
✔ FPC and board-to-board connector sales
significantly grew.
1.7 times YoY.
✔ Create highly value-added business.
Initiatives for entering new markets and business sectors.
■ FY2017 Plan Connectors & Electronics Components
印刷のみ
【 Sales by Products 】
19 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
39%
28%
14%
15%
4%
1,101 1,156 1,121 1,300
4,094 4,316 3,940 4,000
2,150 2,858 3,729 4,800
8,435 8,995 7,395
8,700
12,935 11,853
10,052
10,000
FY2014 FY2015 FY2016 FY2017
Other HDD Components
Digital Appliance, Smart Phone PC
■ FY2017 Plan Connectors & Electronics Components
Million yen FY2016
(Jan.-Dec.)
FY2017
(Jan.-Dec.)
Change
(%)
W/less Network 10,052 10,000 -0.5%
PC 7,395 8,700 +17.6%
DA, Smart Phone 3,729 4,800 +28.7%
HDD
Components 3,940 4,000 +1.5%
Others 1,121 1,300 +16.0%
Total 26,237 28,800 +9.8%
35%
30%
17%
14%
4%
28,800 28,715 29,178
26,237
HDD (Million yen)
【 Sales by Applications 】 【 Component Ratio 】
FY2016 FY2017
W/less
Network
PC
DA &Smartphone
20 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
✔ Orders were received for all
next-model products!
✔ Target 30% YoY increase!
Urgent need to boost production capacity!
1,994 1,600
3,905 5,200
12,075 12,100
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
16,000
18,000
16/12期 17/12期
■ FY2017 Plan Automotive Components
(Million yen)
Increase sales of our own brand connectors
18,900 17,974
12,075
1,994
3,905
4,019
4,019
Focus resources on this sector for more growth of automotive business.
Existing products are being produced
at full capacity.
・Focus resources → Organizational restructuring
・Increase ability to produce equipment
→ Established the Shanghai Technical Center
・Boost production capacity
→ Planning to enlarge factories in Japan and other countries
FY2017 Full-year
plan FY2016 Actual
【SMT Connector】
【Angle Sensor】 【Pressure Sensor】
Sensor
Electronics
21 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
2,318 2,205 1,994 1,600
2,766 3,293 3,905 5,200
10,790 11,872 12,075
12,100
FY2014 FY2015 FY2016 FY2017
Associated Components Other electronics Sensors
■ FY2017 Plan Automotive Components
Million yen FY2016
(Jan.-Dec.) FY2017
(Jan.-Dec.) Change
(%)
Automotive
Sensors 12,075 12,100 +0.2%
Other Electronics 3,905 5,200 +33.2%
Associated
Components 1,994 1,600 -19.8%
Total 17,974 18,900 +5.2%
【Points for FY2017】
✔ Target record-high sales.
Goal is sales of 18.9 billion yen, a new record-high
for five consecutive years.
15,874
18,900
17,370 17,974
Estimated sales excluding effect of price
revisions for purchased parts.
(18,800) (20,000)
印刷のみ
✔ Expand the automotive components business.
Initiatives for increasing production capacity and
developing new business.
【Sales by Products】
(Million yen)
22 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
✔ Expand sales by leveraging strengths as the
market leader. Automatic taping machines for specialty packages.
✔ More progress with ultra-thin molding
technology. Increase sales of encapsulation machinery for thin
packages.
2,201
1,623
2,300
FY2015 FY2016 FY2017
✔ Reinforce sales activities in Asia. Conduct sales activities closely linked with each region and
build stronger ties with agents.
■ FY 2017 Plan Semiconductor Mfg. Equipment & Others
(Million yen)
【GP-PRO SP170】
【TS-PRO】
Promote sales activities using technology proposals that match customers’ requirements!
No. 1 Market share Auto Taping System for MAP-QFN
Semiconductor Molding Machine
For large densely molded frame
Semiconductor Molding
Machine
Other Related
Equipment
23 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
Full-scale production has started! “Electrostatic Capacitance Torque Sensor” That Realizes Human-Robot Coexistence.
Used in robots made by YASKAWA Electric Corporation.
Industrial robots and people can work in the
same location without safety fences.
ESTORQ will be installed in “Tree”, an assist robot for walking rehabilitation made by “Reif Co., Ltd.”
To be installed in rehabilitation robots.
【HC10】
■ FY 2017 Plan New Business Introduction ①
Service Medical・Nursing Care
R T
Robot Technology
Manufacture
Key Parts Application Field
*The world’s first ”Electrostatic Capacitance Method”
This sensor is used for robots’ joints to detect and control
force to rotate and twist things.
*Based on our survey
24 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ FY 2017 Plan New Business Introduction ②
with 3-Axis Acceleration Sensors Using Piezoelectric Thin Films
First MEMS Device - “Seismic Wave Detectors”
MEMS sensors
“Seismic wave detectors” equipped with 3-Axis Acceleration
MEMS Sensors
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■ FY 2017 Plan New Business Introduction ③
Second MEMS Device – “The Mirror Device”
This MEMS mirror device reduces the size of the laser scanners that are needed for the
safe operation of self-driving vehicles. This device is also suitable for all other detection
units that use lasers (e.g., virtual keyboard input).
We are now working on using this device to create products for sale in the automobile,
information and communications, environmental, medical, and other industries.
【 Examples of how the MEMS mirror devices can be used 】 Virtual Keyboard Input Laser Scanner
*Image
The Industry’s Smallest Class MEMS Mirror (3.0 mm×4.6 mm) with Piezoelectric Thin Film
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■ FY 2017 Plan New Business Introduction ④
Third MEMS Device – "High Acceleration Sensor" New MEMS sensor with piezoelectric thin film for automobile crash test!
We have developed a sensor that can detect high acceleration of up to 2,000G. They
are attached to dummies to assess damages during automobile crash tests. Samples
are currently being evaluated by prospective users.
The 2000G Acceleration Sensor
MEMS Sensor
*Image
Acceleration Sensors
27 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ 2017 Plan Capital Expenditures
Continue aggressive capital expenditures in new businesses, etc.
to build a powerful foundation for sustained growth.
1,819
-697 -1,234
1,246 2,355
157
1,500
3,689 5,042 5,208
4,944
5,119
5,477
5,500 4,568
6,490 6,382
5,017
8,826
6,910 7,500
FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017
Hundred million yen
FY2013 Actual
FY2014 Actual
FY2015 Actual
FY2016 Actual
FY2017 Plan
Production M/C 60 43 62 56 60
Expansion of Plants - 4 10 2 5
New Businesses for MEMS, etc. - - 10 6 3
R & D 2 2 2 2 2
Others 1 1 4 3 5
Plan
< for 9 months >
(Million yen) Capital
Expenditures
Depreciation
Net Income
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Reference
29 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
(Sales Ratio 57.2%) Connectors & Electronics Components
GP-PRO SP170 TS-PRO GP-PRO sf40
(Sales Ratio 39.2%) Automotive Electronics & Associated Components
■Reference Main Products
MHF® MINIFLEX175-ST CABLINE
®-CAⅡ NOVASTACK
®35-HDP
Note: sales ratios are based on
financial results for FY 2016.
RAMP
【RF Coax Connectors】 【Micro-Coax Connectors】 【Board to Board Connectors】 【FPC/FFC Connectors】 【HDD Components】
【Sensor】 【 Connector for Automobile】 【Electronics】 【Associated Components】
Angle Sensor Pressure Sensor SMT Connector PCB Connector Control Unit Smart Entry Key Ignition Coil
(Sales Ratio 3.5%) Semiconductor Mfg. Equipment and Others
【Semiconductor Molding Machine】 【Other Related Equipment】 【Peripheral Device for Injection Molding】
Gate Cut Robot
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3,151 1,634 2,057 1,776 1,952 2,201 1,623 2,300
12,523
8,911
13,559 14,920 15,874 17,370 17,974
18,900
31,133
21,175
25,558 24,705
28,715 29,178
26,237 28,800 6,716
3,247
1,042 1,328
3,098 2,344
800
2,200
0
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
0
10,000
20,000
30,000
40,000
50,000
60,000
FY3/11 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017
Semicon Equip. and others Automotive Components
Connectors and Electronics components Ordinary Income
50,000 46,807
31,720
41,174 41,401
46,541 48,749
45,834
■Reference Transition of Business Performance
Plan
(Million yen)
<for 9 months>
31 (C) Copyright DAI-ICHI SEIKO Co., Ltd. All rights reserved.
■ Reference Business Model ① -No overlap in business process-
● 2004 business integration with I-PEX
● 2006 listed on the JASDAQ securities exchange
● 2011 listed on the first section of the Tokyo Stock Exchange
● 2012 started new connector business organization
● 2012 set up our own automotive connector brand “I-PEX AUTOMOTIVE”
● 2014 started sensor business
Detect and control motions of human-like robots and
auto-assembling machines, etc.
Corporate history
● 1963 started as a precision tooling company
● 1976 started precision plastic molding
● 1979 started overseas operation
● 1980 started semicon mfg. equipment business
● 1982 started integrated production strategy
● 1994 started business with I-PEX
● 2000 started automotive business
Provides mold tooling &
assembly system technology
OEM Subcontractor
Fabless
Design & Sales
OEM
R&D plus Production
No overlap in business process
Fabless connector maker
<2004 ~Business integration>
New connector maker with a strong mold engineering origin.
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■ Reference Business Model ② -Integrated production system-
(In-house tooling and machinery) (Production of connectors)
(1)Fast R&D
capability
(2)Production system
design + tooling ability (3)Integrated Production Sites
(Design & development
of connectors)
R&D to create the world’s first products
Fast product design
Stamping Mold
Injection Mold
Machines for Injection, Assy., Inspection and Packing
Molding Raw material
Injection
Molding M/C
Mold for plastic parts
Stamping & Plating
Stamping Mold
Stamping Plant Plating Plant
Stamped metal terminals
Plated metal terminals
Molding Plant Plastic Parts Assembly
FAM for Assy.
Completion
Integrated in one company
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■ Reference Business Model ③ -Source of competitive edge: precision mold-
1.0mm
Super precise mold
Comparison with razor edge
Enlarged
0.25 mm thick
0.25 mm thick
0.3 mm or less fine process
1/1,000 mm precision
Connector mold
Around 200 parts assembled
1.DAI-ICHI SEIKO: ONE and ONLY connector company born as a Mold Origin company.
(1) Final product R&D capability
+ (2) Production system design and Tooling capability + (3) Integrated production sites in Multiple countries
【 Differentiates Dai-ichi Seiko from its competitors 】
● Speedy product supply on the market with our internally-developed products and production facilities.
2.Production Technology company born as a Mold Origin company.
(1) Production system design and Tooling capability + (2) Integrated production sites in multiple countries = Spreads widely across other industries
【 Providing various precision parts and devices targeting customers’ needs 】
● Produce precise molds for various industries by focusing our resources on high value-added products.
Diversified products of parts for automobile and hard disk drive, and equipments for semiconductors.
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■ Reference Dai-ichi Seiko and its Group Companies
Production 19
Sales 12
IGM
マレーシア追加
YAMANASHI PLANT
FUKUOKA OFFICE Ogori Plant DJ Precision
FUKUOKA OFFICE Onojo Plant
FUKUOKA OFFICE Tachiarai Plant
TOKYO
SHINAGAWA OFFICE
OSAKA BRANCH
HEAD OFFICE KYOTO PLANT
SHIZUOKA OFFICE
Matsue Dai-ichi Seiko
TOKYO MACHIDA OFFICE
U.S.A. Alabama
Plant
U.S.A. Texas
U.S.A. San Jose
U.S.A. Detroit
Philippines Laguna Plant
China Shanghai Plant 2
China Shanghai Plant 1
FRANCE
China Dong Guan Plant
Thai Plant
Vietnam Plant
KOREA
TAIWAN
SHANGHAI
SINGAPORE
HONG KONG
Singapore Yishun Plant
Indonesia Bintan Plant
Singapore Woodlands Plant
Malaysia Plant
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Corporate Planning
Phone: + 81.942.75.5264
E-mail: [email protected]
Web: http://www.daiichi-seiko.co.jp
Contact
--- NOTE ---
This is a document for corporate
presentation purposes only and not for
solicitation of investment.
Terms and conditions may change without
prior notice.