fujitsu microelectronics america, inc€¦ · device solutions technology solutions ubiquitous...

2006 Executive BriefingFujitsu Microelectronics America, Inc

209/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006

Introduction Emi Igarashi

Corporate Overview Kazuyuki Kawauchi

Business Updates Keith Horn

Summary / Q&A Keith Horn

ProgramProgram

Kazuyuki Kawauchi

President and CEO


Fujitsu at a GlanceFujitsu at a GlanceHeadquarters: Tokyo, JapanPresident: Hiroaki KurokawaEstablished: June 1935Net Sales: 4,791.4 billion yen (US$40.6 billion)Net Income: 68.5 billion yen (US$581 million)R&D Expenditure: 241.5 billion yen (US$2.0 billion)Employees: 158,000 worldwidePrincipal Business Areas: Technology Solutions, Ubiquitous

Product Solutions, Device SolutionsStock Exchange Listings: Tokyo (Code: 6702), Osaka, Nagoya,

Frankfurt, London, Swiss

Note: Consolidated net sales, net income and R&D expenditure for fiscal year ended March 31, 2006. US$1 = ¥118. WW employees as of Mar. 31, 2006.


Device Solutions

Technology Solutions

Ubiquitous Product Solutions

Principal Services and ProductsPrincipal Services and Products

IT ConsultingSystems Integration(System Construction, Application Management, Application Integration)IT Infrastructure Management(Outsourcing, Managed Services) Network Services

Personal ComputersMobile Phones* Hard Disk Drives and Other Storage Devices

Note: *Japan market only

Servers Enterprise Storage SystemsNetwork Systems (Optical, IP, Mobile, Submarine)Software(Middleware, Applications/ Packages, Network Management)Retail and Financial Systems

Document Imaging and Other PeripheralsOptical Modules

Semiconductors(ASICs, MPUs/MCUs, System Memory,

ASSPs)Media Devices

Foundry Services(front-end / back-end services)Electronic Components


FY 2005 Revenue by Business SegmentConsolidated Net Sales by Business Segment, Including Intersegment Sales

Technology Solutions

Ubiquitous Product Solutions

Device Solutions

Other Operations

Business CompositionBusiness Composition

¥2,983.9 billion(US$25.3 billion)

¥1,059.9 billion(US$9.0 billion)

¥707.5 billion(US$6.0 billion)

¥447.3 billion(US$3.8 billion)

• LSI Devices• Electronic Components• Others

• PCs/Mobile Phones• Hard Disk Drives• Others

• System Platforms• System Products• Network Products

• Services

8.6%13.6%

20.4%57.4%

Note: Percentage breakdown for each segment is calculated as segment’s net sales / ( total consolidated net sales + elimination). US$1 = ¥118. FY 2005 is fiscal year ended March 31, 2006.


Global Presence / R&D and Design Centers

Regional HeadquartersRegional Headquarters

ccAmerica, Inc.America, Inc.


Fujitsu’s Successful IDM Business Strategy

Foundry Foundry

System Arch / DesignSystem Arch / Design

TechnologyTechnology

ASICASIC

SoCSoCLogic DesignLogic Design

System Arch / DesignSystem Arch / Design

ManufacturingManufacturing

New IDM Conventional Business

Logic DesignLogic Design

Physical DesignPhysical Design

As we move to 65nm process technology, design and manufacturing become more complex while time-to market schedules continue to compress. The solution for companies developing new ASICs, SoCs and ASSPs is to work very closely with their foundry and fab partners.


FujitsuFujitsu’’s 300mm (90nm/65nm) s 300mm (90nm/65nm) Wafer Plant in MieWafer Plant in Mie

Building 1Building 2

(under construction)

0

5,000

10,000

15,000

20,000

25,000

Capacity(300mm)

(wafers / month)

Sept 2006 March 2007 Sept 2007 March 2008

Building 1

Building 2

(8/25/06)


Technological InnovationsTechnological Innovations

Design for Manufacturing – Statistical Static Timing Analysis (SSTA)

The industry’s first comprehensive environment for Statistical Static Timing Analysis for submicron designs for COT and ASIC customersTiming optimization turn-around times will be reduced by up to 30 percent Available now

New FeRAM MaterialJoint development by Fujitsu and Tokyo Institute of Technology of new material for 256M FeRAM using 65-nanometer technology Provides very low power, high speeds for mobile electronic productsEngineering sample shipments are planned for 2009


Key Market Segments

NetworkingEnterprise / AccessStorageWireless

AutomotiveConsumerIndustrialSecurity

Key Product Groups and Services

Custom LSIIDM Services COT / ASICs / AccelArray™

Wireless SolutionsWiMAX SoCsGPS

Networking Solutions10Gbps Ethernet Switch ICs

Embedded SolutionsMCUsGraphic Display ControllersBiometric Sensor ICs

Other ASSPsFRAMMemory

Market Segment and Application FocusMarket Segment and Application Focus


Fujitsu is now accepting ASIC designs for production using its 65nm process for its North American customers 10 products under development High-performance Products

PC CPU Large scale FPGA Graphics

Low-power ProductsImage processorsDigital AV products

65nm Custom LSI Products (CS200/CS200A)65nm Custom LSI Products (CS200/CS200A)

SRAM Chip

Logic Chip


WiMAX – Fujitsu’s End-to-End AdvantageWiMAX – Fujitsu’s End-to-End Advantage


Industry's Most Powerful 20-port 10Gigabit Ethernet Switch ICIndustry's Most Powerful 20-port 10Gigabit Ethernet Switch IC

MB8AA3020 Evaluation Board

Industry Firsts10GbE serial – direct XFP compatible interfaceCongestion management – BCN and priority pauseOn-chip micro-engine

Reduces S/W development timeVLAN virtualization

ApplicationsBlade-server switching bladeATCA carrier node blade

Mesh configurationCentralized switch

Micro-TCA hubEnterprise switchingHigh-performance computing


MBF320 with USB2.0 Compatibility and PreBoot Authentication (PBA)MBF320 with USB2.0 Compatibility and PreBoot Authentication (PBA)

PC Security from Boot

Turnkey SolutionIntegrated PBA modulesEase of use and integration Convenience

Secure Fingerprint ID Logon Pre-boot (BIOS)Windows O/S client Network authentication

SecurityEndpoint securityHardened authenticationIdentity theftUnauthorized network access


Moving Forward – FMA VisionMoving Forward – FMA Vision

Successful business collaborations / partnerships with the IDM business modelFocus on major market areas

NetworkingAutomotiveConsumerIndustrialSecurity

Focus on major product linesCustom LSI (COT and ASIC)Wireless Solutions (WiMAX, GPS)Networking Solutions (10GbE switch)Embedded Solutions (MCUs, GDCs, biometrics)

Keith Horn

Senior Vice President Chief Operating Officer


Announcements and HighlightsAnnouncements and HighlightsASIC

Fujitsu is now accepting ASIC designs for production using its 65nm process for its North American customers New ASIC macros – PCI Express, 10G SerDes, Serial ATA

WiMAXFujitsu and Hopling Technologies bring Linux-based WiMAX board support packages to market – MOU signed

10GbEIndustry’s first 20-port, Ethernet switch IC with 10Gbps Ethernet serial interface for blade server, advanced TCA, micro TCA, and data center switching

EmbeddedNew high-speed 8-bit MCU for consumer electronics and appliance applicationsMBF320 Sweep Sensor™ IC featuring USB2.0 compatibility, pre-boot authentication for PCs, notebooks and tablets

New Technologies Design for Manufacturing – new Statistical Static Timing Analysis toolNew FeRAM material


Key Market Segments

NetworkingEnterprise / AccessStorageWireless

AutomotiveConsumerIndustrialSecurity

Key Product Groups and Services

Custom LSIIDM Services COT / ASICs / AccelArray™

Wireless SolutionsWiMAX SoCsGPS

Networking Solutions10Gbps Ethernet Switch ICs

Embedded SolutionsMCUsGraphic Display ControllersBiometric Sensor ICs

Other ASSPsFRAMMemory

Market Segment and Application FocusMarket Segment and Application Focus


Custom LSI Solutions

FoundryASIC


Full Turnkey – Foundry through ASICFull Turnkey – Foundry through ASIC

Customers can select service and business model

Turnkey Foundry ServiceTraditional Foundry Service

WaferProcess

MaskDesign

Assembly / Test

IPs

Design/Verification

Support

Total coordinationTotal coordination

WaferProcess

MaskDesign

Assembly / Test

IPs

Design/Verification

Support


Fujitsu CMOS Technology RoadmapFujitsu CMOS Technology Roadmap

1000

100

10

500

50

20

200

1998 2000 2002 2004 2006 2008 2010Year (Production Start)

Phys

ical

Gat

e Le

ngth

(nm

)

45-nm45-nm65-nm65-nm

90-nm90-nm130-nm130-nm180-nm180-nm

CS100A

CS200

CS100HP

CS80 / 80A

CS90A

CS200ACS90

CS100/CS100A (90nm)L actual = 40-80nmSiOC (k:2.9) low-kDual Damascene Cu

CS200/CS200A (65nm)L actual = 30-50nmNCS (NanoNano--Clustering Clustering Silica)Silica)

CS300/CS300A (45nm)CS300

CS300A


90nm Products and Beyond90nm Products and Beyond

65nm products10 products under development

90nm productsMore than 80 products in production High-performance, low-power products

PC / server CPUs FPGA GraphicsMultimedia processorsDigital AV productsWireless (RFCMOS)Ethernet switches


3.125Gbps SerDesPOS-PHY Level 3POS-PHY Level 410/100 MAC8b/10 Encdec10/100/1GMACXAUI PHY (90nm)HDLC3-port Ethernet Switch

Networking & Communication

ARM1176JZF-SARM926J-E ARM 946 E-SARM7TDMI-SARC Tangent-A4 (+DSP)ARC3 (+DSP extensions)

Fujitsu IP LibraryProcessors &

DSP

USB2.0 Host Controller USB2.0 Device ControllerUSB2.0 PHYUSB2.0 OTG PHY (90nm)USB1.1 Device ControllerUSB1.0 Host ControllerPCI (2.1) Controller – 33 MHZPCI-XPCI ExpressPCI Host ControllerSATA Host ControllerSATA PHYSATA Target Controller

Std. Bus Controllers

Memory Controllers

PCI-AHB BridgeARC-AHB Bridge ARM-AHB BridgePCMCIA-PCI

Bus Bridges Other Peripherals

Multimedia Access

VoiP Core (4-channel)JPEGNTSC/PALMJPEGVideo Encoder

IrDAUWB802.16 (MAC & PHY)

Wireless

ARM7 Cache ControllerARM7 EDRAM ControllerFCRAM ControllerSDR SDRAM ControllerDDR SDRAM controller Mobile DDRARM7 SRAM ControllerExternal Memory ControllerMemory Stick ControllerSD/SDIOSRAM ControllerFlash Controller

ADK ModulesAMBA Bus Macros

ARM Peripherals

DMA Controller (2,4,8-Ch)UARTI2CPCMCIAMemory Stick IFSD Card IFSPIRTCIDE66F_CAL

DES/3DESAES CAN2.0

* Partial listing


High-Speed IO Macro RoadmapHigh-Speed IO Macro Roadmap

CY2003 20052004 2006 2007

UGPHY

0.5-3.125GbpsXAUI, S-RapidIO, FC,

SGMII, Backplane SONET

GPON0.155-2.488Gbps

OC-3/12/48

0.155-2.488Gbps

SATA1.5 & 3Gbps

Gen1/21.5 & 3Gbps

Gen1/2

6.4/10G

6.4G, 10GCEI6, XFI

1-10GCEI6, XFI, XAUI, GbE 3.125/5/6.4Gbps

PCIe Gen2, XAUI, Backplane

PCIe2.5Gbps-3.125G

PCIe Gen12.5Gbps-3.125G

PCIe Gen1 SATA

3-6.4G

PCIe

CS200HP

CS200A_LL

2.5Gbps-3.125GPCIe Gen1

CS200A_LL

CS100A_LL

SATA

PCIe

1-10G6.4/10G

130nm

1-10G

90nm 65nm

PCIe

CS100A_LL

CS100HP

1.5 & 3GbpsGen1/2


WirelessSolutions

WiMAX

RangeCoverage

WiMAX Evolution


WiMAX Forum EvolutionWiMAX Forum Evolution

CarriersSystems/Equipment

Makers

SemiconductorVendors

WiMAX Forum

+ More

+ More+ More

Currently more than 340 member companies


Fixed WiMAX – A Solid Foundation for Fixed-to-Mobile Broadband

Subscriber Station Reference Board

Base Station Reference Board

Fujitsu Fixed WiMAX SoC

Point-Point Backhaul Point-Multipoint Access

Mesh Network Connectivity

Enterprise & Residential Terminals

Public Safety &Disaster Recovery

Next-GenerationGateway Plug-in Card

5.xGHz

2.xGHz

3.xGHz


Mobile WiMAX Applications

Target Product Roadmap

UbiquitousBroadband

MobileVoIP & Data

UbiquitousQuad Play

Feat

ures

+

+


Fujitsu’s End-to-end Commitment

Integrated Services onHigh BW Dynamic Pipe Metro Fiber IP, ATM Core

Enterprise

ISP

PSTN

DNSDHCPTFTP

OAM&PT1 / AnalogVoice

Customer Premise Equipment (CPE) Cell SiteAccess ShelfPA, Antennas

Alarms

Service Provider Metro & Core Network Service Providers (NSP)NOC Management Servers

(DHCP, DNS, TFTP)

NOC


NetworkingSolutions

10Gigabit Ethernet


Next-Generation Switch Chip –MB8AA3020Next-Generation Switch Chip –MB8AA3020

Industry Firsts10GbE serial – direct XFP compatible interfaceCongestion management – BCN and priority pauseOn-chip micro-engine

Reduces S/W development timeVLAN virtualization

Key FeaturesSingle-chip, 10GbE switch Number of 10GbE ports: 20Throughput: 400+GbpsPHY interfaces

XAUI/CX4/KX4(3.125Gbps x 4)

Power and physical size15 to 20WFCBGA1156 (35mm x 35mm)

TechnologyCMOS 90nm process

BenefitsFewer interconnects Reduced chip count and costs in having direct XFP interfaceEnhanced QoSFast firmware developmentNon-blocking wire-speed operationLow latency (300 ns)Board area savingsLow power requirement

ApplicationsBlade-server switching bladeATCA carrier node blade

Mesh configurationCentralized switch

Micro-TCA hubEnterprise switchingHigh-performance computing


The Fujitsu 20-port 10GbE Switch as a Managed SwitchThe Fujitsu 20-port 10GbE Switch as a Managed Switch

MB8AA302020-port Switch

PORT (0-9) PORT (10-19)

2 X GbE LinksCopper Cable Copper Cable

CX4

CX4

CX4

CX4

XAUI

XAUI

CX4

CX4

CX4

CX4

XFI XFI

XENPAK Optical Module

XFPModules

Control Plane Interface

Eliminates the need for XAUI to XFI conversion SerDesBenefits:Eliminates cost of conversion – $ 100 per chip x 20 portsBoard area savingsFewer connectionsReduced latency – otherwise introduced by conversion (130ns)Reduced power consumption


Embedded Solutions

BiometricsMicrocontrollerFlexRayIDB-1394GDC


Fingerprint Sensor IC OfferingsFingerprint Sensor IC OfferingsSensor ICs Features / Benefits Applications

MBF320PBT-GE1: USB/SPI Sweep Sensor™ PC notebooks & tablets8x256 pixel array, 500 dpi, AFD Computers & networksLow cost, power, size USB embedded/mobile

MBF310PBT-GE1: MCU/SPI Sweep Sensor Cell phones, lock boxes8x256 pixel array, 500 dpi, AFD Access control2KB FIFO, low cost, power, size MCU/SPI embedded

MBF200PFW-LP-G: USB/MCU/SPI Touch Sensor PC peripherals300x256 pixel array, 500 dpi Passport/Visa, POSAuto Finger Detect (AFD) Computers & networksLow power, 8-bit gray-scale SecurityConvenience (single touch)

SPF200-USB-E1 USB PCB mounted assembly Access control, kiosksusing MBF200 for rapid Integrated fingerprintdeployment & prototyping solutions, mobile,

Lock boxes

Fingerprint Dev Kits Fingerprint SDKs and MCU ports Integrated FP solutions


MBF320 PC Notebook Preboot Solution Using Phoenix TrustedCore BIOSMBF320 PC Notebook Preboot Solution Using Phoenix TrustedCore BIOS

x86 Hardware

TrustedCore Secure Firmware

PBA Biometric Agent

FingerprintSensorDriver

MatchingEngineDriver

BIOS Extensions for GINA Credential Transfer

WindowsGINA Interface

BioTrust ID Client

WindowsLog On

FileEncryption

PasswordManager

No Companion Chip• USB integrated controller• Cost saving ($3-$5)• Power saving

OS Level• Industry-leading matching algorithm (using Cogent Systems) • End-to-end turnkey solution• Provides secure fingerprint logon to Windows and network domains

PBA Biometric Agent• Matching engine and biometric sensor driver• No development time (turnkey)• Standardized pre-boot solution (not vendor specific)• Integrated with TC secure environment and platform initiatives


MCU Roadmap – ExpansionMCU Roadmap – Expansion8-bit F2MC-8FX: Further expansion of low-end MCU family

High-performance 8-bit CISC CPU and low power consumptionImproves 10MHz single-cycle operation to 16MHz single-cycle operation

16-bit F2MC-16LX and -16FX: New products for mid-range MCUs Technology migration to 0.18µm16FX series provide more than 20MIPS, five times the performance of the predecessor 16LX, or one fifth of the power consumption for the same task

FR60: New family of high-end MCUsTechnology migration to 0.18µm, while supporting 5V power supplyUp to 4MB of Flash100MHz operation up to 105ºC, automotive environmentUp to 6 CAN I/F with support for 128-message buffer per channel


1MIPS

10MIPS

100MIPS

F2MC-8L(8-bit CISC)

0.5µm 0.35µm 0.25µm 0.18µm 90nm

F2MC-16LX

(16-bit CISC)

F2MC-8FX(8-bit CISC)

FR30(32-bit RISC)

FR60(32-bit RISC)

FR60Lite(32-bit RISC)

Automotive

Companion ChipHome Appliances

Automotive

Digital AV

FA

Digital AV

FR70(32-bit RISC)

FR80(32-bit RISC)

Automotive

Digital AV

F2MC-16LX/FX

(16-bit CISC)

FR80x(32-bit RISC)200MIPS

MCU – Target MarketsMCU – Target Markets

AutomotiveEmbedded FlashHigh-end CAN / LIN FlexRay

Industrial / home appliances Embedded FlashSecurity featuresLow powerMotor controller

ConsumerEmbedded FlashHigh performance Low powerDisplay controller


FlexRay™ ASSP – MB88121AFlexRay™ ASSP – MB88121A

FlexRay Evaluation Kit

Fujitsu FlexRay: a part of full support for automotive networksSupport FlexRay Protocol Spec 2.1

Deterministic time-trigger protocol, max 10Mbps x 2chRedundancy for safety, suitable for x-by-wire applicationsSupport for flexible topology – bus, star, hybridFlexible segment structure of the date – static and dynamic segment

Provides total support covering MCUs, software, transceivers, and analysis tools required for development


IDB-1394™ ASSP – MB88387IDB-1394™ ASSP – MB88387Fujitsu IDB-1394: full support for automotive networks Provide automotive multimedia infrastructure at 400Mbps using 1394b standard

Scheduled to support direct BT.601 I/F at next-generation ASSP MB883xxNear loss-less compression technology SmartCODEC will provide full use of 1394 bandwidth for video applications

VGA [640 x 480 YUV(4:2:2) 30fps] ; 147.5Mbps/3 x 4

85%

4-camera data Transfer

with SmartCODEC

VGA [640 x 480 YUV(4:2:2) 30fps] ; 147.5Mbps

64%

1-camera Transfer

Bandwidth used@S400

Bandwidth used@S400

V

D RR

A

AV Head Unit

Rear Display Rear Display

Audio ReceiverAmplifier

DVD Video(Max. 36.09Mbps@MPEG2-TS)

DTV(Max. 23.23Mbps@MPEG2-TS)

DVD Audio([email protected] Linear Audio)

30%DVDVideo DTV DVD

Audio

Bandwidth used@S400

Rear-seat Entertainment System Example Efficiency of SmartCODEC


Product family continues to expandNew product announcement at ConvergenceSignificant announcements to follow

Fujitsu GDCs are high-powered 3D GPUs that include many special display-control capabilities Co-processor architecture completely off-loads graphic and display operations from the MCU

Fujitsu Graphic Controllers (GDC)


Fujitsu Solutions for Automotive EntertainmentFujitsu Solutions for Automotive Entertainment

GDC & MPEG GDC & MPEG DecoderDecoder

MPEG MPEG EncoderEncoder



MPEG MPEG EncoderEncoder

IDB 1394IDB 1394

Aaaaa


Summary: Moving ForwardSummary: Moving Forward

Commitment to the leading-edge process technology development and fabricationCommitment to IDM model for flexible customer partnershipsStreamlining business

Emphasis on customer-driven key market segments

Industry-leading product groupsCustom LSI solutions – Foundry and ASICWireless – WiMAX, GPSNetworking – Ethernet switchEmbedded solutions – MCU, GDC, biometric sensors

fujitsu microelectronics america, inc€¦ · device solutions technology solutions ubiquitous...

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