european chance in industry & technologies...

Semicon Europa | Jean-René Lequepeys | 26-10-2016

EUROPEAN CHANCE IN INDUSTRY & TECHNOLOGIES

| 2Marie Semeria | ENF, Dec 2, 2015

20TH : THE “ELECTRICITY” CENTURY

| 3Marie Semeria | ENF, Dec 2, 2015

21ST: THE DIGITAL CENTURY

Report: Digital Transformation of European Industry and Enterprises, March 2015

DISRUPTIVE IMPACT ON MANY INDUSTRIAL SECTORS

| 4

21ST : THE DIGITAL CENTURYF

rees

cale

web

site

Sensing Situation awareness

Data deluge handling

High energy efficiency

Localization Data privacy & security

Virtual Imaging

A DIGITAL SOCIETY NEEDS KEY FUNCTIONALITIES IN SYSTEMS

Connectivity

DIGITAL SOCIETY ENABLED BY ADVANCED NANOELECTRONICS

| 5

EUROPE IS STILL IN THE RACE !

Inside the

From ITRS, Paolo GARGINISEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016

EUROPE STRENGTH IN THE SEMICONDUCTOR MARKET

| 7SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016

EUROPE HAS STILL 3 LEADERS IN THE TOP 20

SEMICONDUCTOR SALES LEADER

| 8

EUROPE HAS 37% OF AUTOMOTIVE SEMICONDUCTOR MARKET SHARE AND HAS STRENGTH IN ALL DOMAINS

http://www.eetimes.com/document.asp?doc_id=1329375Source: IHS

Source: Market Realist – Dec 2015

SEMICON Europa | Jean-René LEQUEPEYS | 26-10-2016

| 9Nom événement | Nom Prénom | Date

KEY MARKETS IN EUROPE

Automotive MicroControllers

Analog Power Smart Cards

MEMS

Opportunities

Further electrification of power train

Consumerization of Auto electronics

Vehicle connectivity and enhanced driving

European leadership with 44% of market

share

The three European IC

suppliers accounted for 15 % of the

analog market in

2015

Europe is an

undisputed leader

1.2.11.14.


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Suppliers

(Tier, 2, 3..)

Equipment

suppliers

OEM InfrastructuresSemiconductor Services

2000B$30B$ 150B$(Electronic)

>100B$(2030)

AUTOMOTIVE INDUSTRYEUROPE AT THE CORNERSTONE OF THE VALUE CHAIN

4 5

ADAS and EV fastest growing areas• Sensors Actuators • Power electronics

ADAS and EV fastest growing areas• Sensors Actuators • Power electronics

http

://w

ww

.bos

ch.c

o.jp

/en/

pres

s/gr

oup-

1306

-06.

asp


| 11

EUROPEAN SEMICONDUCTOR MANUFACTURING


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MANUFACTURING CAPACITY IS VERY WEAK IN EUROPEWITH VERY FEW 300MM FABS

http://evertiq.com/news/38813


| 13

POSITIONNING AND OPPORTUNITIES FOR EUROPE

Is well positioned on key promising

enabling technologies

Is in leading position for automotive

markets

Europe :

Has a lack of capacity of

production

SecurityAnalog IC

MEMS

Power Devices

IC for smart card


µcontroller

DIGITAL SINGLE MARKET: A STRONG OPPORTUNITY FOR EU

| 15

DIGITISING EUROPEAN INDUSTRY : EUROPEAN COMMISSION PROPOSAL

Source: Digitising European Industry: A key role for Europe'sdigital competence centres Max Lemke, PRACEdays2016 Prague - CZ, 11 May 2016


| 16

DIGITISING EUROPEAN INDUSTRY : EUROPEAN COMMISSION PROPOSAL

Source: Digitising European Industry: A key role for Europe's digital competence centres Max Lemke, PRACEdays2016 Prague - CZ, 11 May 2016


40% added value of cars from digital industry

+ 110 B€ annual revenue overs next 5 years

- 600 B€ annually if we don’tact

| 17

DIGITIZING EUROPEAN INDUSTRY STRATEGYPRIORITY OF COMMISSIONER OETTINGER (STRATEGIC PROGRAMMING 2018-2020)

« Europe's future is digital »Hanover Messe, March 25th, 2016

STRATEGIC PROGRAMMING 2018-2020


| 18

IOT BigData

AI

TECHNOLOGIES DRIVING THE CHANGE

Embedded software, sensors, 5G connectivity, actuators, low power ICT, … Data management & exploitation,

storage, Cloud, servers, HPC,..

Robotics, automation, machine learning, self-driving,..

Innovation in

products, processes and business models

Innovation in

products, processes and business models


| 19

"Pervasive fixed and mobile connectivity"

5G : A STRONG OPPORTUNITY FOR EU

| 20

• 5G PPP is a research program in Horizon 2020 of the EU dedicated to 5G system research

• Budget for 2014 – 2020 time frame– Up to 700 M€ public funding– Matched by private side including leveraging factor 5 of additional private

investment results in private value of about 3.5 B€

• Research program is addressing all building blocks of a future communication network and a huge number of huge cases from vertical sectors

• 5G Infrastructure Association vision paper published at Mobile World Congress 2015 in Barcelonahttp://5g-ppp.eu/wp-content/uploads/2015/02/5G-Vision-Brochure-v1.pdf

• First set of projects started on July 1, 2015

5G PPP in Horizon 2020 of the EU

| 21

"SINGLE MARKET" APPROACH TO EU 5G INTRODUCTION

2018 2020 2025

Commercial launch of 5G services in at least one major city in all MS

Early 5G launchin selected areas

5G in all urban areasand along main transport paths

Coordinated/quasi-simultaneous launch throughout single market

Aggressive roll-out with geographical and sectorial focus

CHANCE FOR EUROPE

| 23

EUROPEAN CHANCES

Innovation is where the manufacturing is. [A National strategic plan for advanced Manufacturing, USA 2012]

Co-location of design centers and manufacturing facilities is mandatory for semiconductor and electronics products.


| 24

EU market : 500 M consumers

Key industrial players :Systems : automotive, manufacturing, chemical : 20% of WW productionSemiconductor : 7% of WW production

Growing SMEs : 200 000 in technological sectors


ENSURING THE FUTURE (1/2)

| 25NEED TO STRENGHTEN THE SEMICONDUCTOR INDUSTRY

ENSURING THE FUTURE (2/2)

World class RTOs, used to collaborate and innovate with Industry

EC Incentives for cooperation and joint innovation

Common cultural and values baseline for innovation, for industry growth and for our society


| 26

STRATEGIC POSITIONING OF

RTOS IN THE INNOVATION CHAIN

EXAMPLE OF LETI


| 27

LETI TWOFOLD STRATEGY

Big data and cloud computing infrastructureDeep learningArtificial intelligence

Hyperconnectivity

Industry 4.0Connected Health

Mobile

scaling diversification

Automotive, aeronautics, spatial

FOR A DIGITAL SOCIETY


| 28

LETI DRIVERS

Strong asset of Platforms

Photonics

Medical Devices

IC Design center

Micro & nano electronics

Nanocharacterization

MINIATURIZATION

DESIGN

ENABLEMENT

LOW POWER

SECURITYSENSING

CONNECTIVITY


| 29

FIRST FDSOI PRODUCT


| 301980 1990 2000 2010 2020

Rad-hard (PD-SOI-HD) Fully-Depleted (FD-SOI)

1st FDSOItransistor

Rad-hard components

Rad-hard components DMILL for CERN detectors

1st prototype in FDSOI 28nm.

IP SOI: acquired by ARM in 2006

SiliconImpulse

IP FDSOI - MPW

1st 28FDSOI DSP (@ 0.4V, 460 MHz)100x faster than competitors

SOI STORY : EUROPEAN STRENGTH

Components

Silicon On Insultor (SOI)

Substrates

Simox Smart-cut™

Applications


| 31

MICROELECTRONICS ROADMAP

28 nm22 nm

7 nm

NanowiresFDSOI

Quantum

300 MM


12 nm

| 32

STRUCTURING PARTNERSHIPS

Core business, long term research• MEMS• Photonics

RFSOI• Next generations• Filters

FDSOI 28FD+ to 12FD• Substrates• Epitaxy• Characterization

Bernin


| 33


PassivesµbatteriesPower

Power electronicsSensorsMEMS

FD 28 nmImagersµcontrollers

Assignees WIP

ToursCrolles Catania

5 Eniac Kets projects2 under construction


| 34


Europe : IPCEI projectUnder construction

Chanel Asic PartnerFDX22, FDX12

Assignees WIP

Dresden


| 35

SILICON IMPULSE

PROTOTYPING• MPW Shuttle• Assembly• Test

DESIGN• IP Development• Circuit Design• System Design

CONSULTING• Feasibility analysis• System architecture• Solution evaluation• Benchmarking• Trainings

PRODUCTIONRAMP-UP

• Qualification• Transfer to foundry• Supply Chain

From concept to production ramp-up

PRODUCTION• (foundry)

CEA tech CEA tech & Partners Partners

Industrials

Help you to access LETI advanced technologiesmainly Ultra Low Power technologies

Easy access to advanced Technologies and R&D skills

| 36

9 RTO PARTNERS9 RTO PARTNERS

H2020 GATEONE PROJECT : A MARKET PLACE TO PUBLICIZE AND TRANSFER TECHNOLOGIES TO SMES

PrototypeGateone–project functionaldemonstrator

Gate 0

The demonstrator enables technology evaluation by SME

50 TECHNOLOGIES IN PORTFOLIO50 TECHNOLOGIES IN PORTFOLIO

TARGET : 50 DEMONSTRATORS

� 29 IN THE PIPELINE

� 9 ALREADY TRANSFERED

TARGET : 50 DEMONSTRATORS

� 29 IN THE PIPELINE

� 9 ALREADY TRANSFERED

OBJECTIVE : TO FACILITATE THE ADOPTION OF SMART TECHNOLOGIES AND

SMART SYSTEMS BY SMES THROUGH DEMONSTRATORS

http://www.gateone-project.eu/

A WINNING FORMULA : 1 RTO +1 SME = 1 DEMONSTRATOR


| 37

Equipment supplier

Design tools

Electronic CMOS drivers

300mm wafer CMOS photonicsfront end & back end fab

Photonics/electronicsintegration

Cmos 3D integrationprocess

Computing systems

S2 datacom systems

IRT NANOELEC :PLATEFORME COLLABORATIVE OUVERTE

Equipment & materialsupplier

IC Design tools

Devices design & manuf.

End usersPHOTONICS

ASSOCIATED PARTNERS

CONSORTIUM MEMBERS

PULSE(case studies with SMEs)

3D INTEGRATION

Laboratories

Fabless IDMs

System houses

IRT NANOELEC : A NEW MODEL OF COLLABORATION IN GRENOBLE ECOSYSTEM

| 38

LETI DRIVERS


MINIATURIZATION

DESIGN

ENABLEMENT

ADVANCED

COMPUTING


| 39

ADVANCED COMPUTING3 SHIFTS TOWARD EXASCALE

2016

>2020

• Quantum computing

• Neuromorphic architectures

• New memory materials and architecture• 3D VLSI and high-density 3D• Integrated silicon photonic dies• Neuromorphic for advanced chiplet architecture

• FDSOI• 3D integrated many-core circuits• Interposer Integrated Chiplets• Integrated photonic links


| 40

ExaNoDe investigates, develops and pilot:

• a highly efficient,

• highly integrated,

compute element aimed towards exascale computing.

Chiplet

Interposer

3D-ICMulti-Chip-

Module

Memory

device

FPGA bare dieTotal budget: 8.6M€

H2020 project coordinated by CEA-Leti,a many cores approach

EXANODE: A EUROPEAN SOLUTION

Results included in this document are CEA’s propert y. They cannot be disclosed without prior authoriza tion.

FOR HIGH PERFORMANCE COMPUTING

• high-performance,

• heterogeneous


| 41

LETI DRIVERS


MINIATURIZATION

DESIGN

ENABLEMENT

ADVANCED

COMPUTING

INTERNET

OF THINGS


| 42

SIGNATURE OF INTEL – LETI STRATEGIC PARTNERSHIP IN IO T

May 12, 2016 signature of the cooperation between Leti and Intel

Daniel Verwaerde , CEO CEARaj Hazra, VP Data center Group

Marie Semeria, CEO LETI

Raj Hazra said : “This announcement expands upon our long standing highperformance computing relationship with CEA to drive leading edgeinnovation in IoT, wireless, and security in the European co mmunity . Welook forward to the important innovations and discoveries to come from thiscollaboration.”


| 43

RELIABILITY, SECURITY, PRIVACY: KEYS OF IOT

Internet of things

Internet of Threats

e-healthConnected cars

SCADA

Industrial systems

e-home

Home appliances

50 billions of connected objects

1 trillion of sensors

monitoring

authenticationindustrial systems

reliabilityprivacy

cryptographyHacking

cyber-physical systemstraffic management

plants

biometrics

Source: Mobile Ecosystem Forum (MEF)

Security Interoperability Immaturity of the ecosystem

Obstacles to the development of the market

Source: L’usine digitalehttp://www.usine-digitale.fr/article/objets-connectes-les-chiffres-cles-du-marche-francais.N356834

Integration in advanced technology is required

Including Security primitives with intrinsic resistanc e


| 44

Secured ICs

New protection schemes

PUF, Shielding, Sensors,

Architectures…

ICs for IoT

Low Power, Low cost, Efficient

protections

Adapted cryptography« Zero Power »

Protections

Security IPs

Security by Design

Cyberphysicalsystems

System security

Safety, Security & Privacy by design

LETI : A RTO INVOLVED IN SECURITY

HARDWARE SECURITY & SECURITY BY HARDWARE

| 45

LETI DRIVERS


DM

MINIATURIZATION

ADVANCED

COMPUTING

INTERNET

OF THINGS

MEDICAL DEVICES

AND PROTOCOLS

DESIGN

ENABLEMENT


| 46

LETI’S GLOBAL APPROACH TO MEDICAL DEVICE R&D

INTERFACE CHEMISTRY

MICROFLUIDICS & BIOLOGY

HETEROGENEOUSPACKAGING

SILICON & PLASTICPLATFORMS

PHOTONICS PLATFORM

CLINICAL PLATFORM

USE CASES PLATFORM NANOSAFETYPLATFORM

NANOCHARACTERIZATIONPLATFORM

Excellence and Expertisein miniaturization and communication

technologies

Multidisciplinary skillsBiology, Engineering, Medicine, ICT

KOL & Medical Partners

Pre-IndustrialPlatforms

TechnologicalInnovation

Clinicalvalidation

PRECLINICAL PLATFORMDATA PROCESSING

BIOINTERFACE CHARACTERIZATION


| 47

LETI: YOUR CONNECTED HEALTH PARTNER FOR S SUCCESSFUL PRODUCT INNOVATION

Technological components

New validated medical functions

System design and integration

• Nanointerfaces with Living Matter

• MEMS/NEMS

• Optical sensors

• Surface functionalization

• ...

• Closed-loop and Automated Functions

• ASIC Design and Data Processing

• Miniaturization and 3D Packaging

• Microfluidics Protocol Integration

• Lensfree microscopy

• User-friendly Device Packaging

• ISO 13485 based processes for MD

• Low Power, Secure transmission

• Clinical validation


| 48

EIT HEALTH

https://eithealth.eu/

CORE PARTNERS

140 organisationsspanning key areas of healthcare such as Pharma and MedTech players, RTOs and Universities

2 B€

3 main investment areas

FOR AN INDEPENDENT LIFE AND MORE EFFICIENT HEALTH C ARE SYSTEMS


| 49

LETI DRIVERS


DM

MINIATURIZATION

ADVANCED

COMPUTING

INTERNET

OF THINGS

MEDICAL DEVICES

AND PROTOCOLS

TRANSPORTATION

DESIGN

ENABLEMENT


| 50

Met

ers

BMW (2010) Continental (2015) Leti (2016)

Perf 1 x0,47 x1

Conso 204W 95W 0,5 W

HWNvidia GeForce

268GTXIntel Core i5 @3.3 GHz

µC Cortex M7@200 MHz

AUTOMOTIVE : MULTI SENSOR FUSIONSOLUTION FOR A COMPREHENSIVE MONITORING OF CAR DRIV ING

Multi sensor fusionProbabilistic map data fusionFormal approach

100 times less computing needs200 to 400 lower energy consumption


CONCLUSION

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EUROPE HAS KEY PLAYERS TO BE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY

With large industrial companies, innovative SMEs and highly skilled RTOs

And the willingness to open the route to

innovation and growth for jobs, industrial leadership and

independence, and a bright future for young people, Europe is well positioned for the new

digital century


| 53


To maintain European manufacturing capabilities for critical and innovative components

To keep and improve its position and independence in the global competition, Europe needs :

| 54

To promote large scale technological platformsfor pre-industrial validation in Industrial Pilot Lines




| 55

To set up financial tools supporting necessary investments : CAPEX for industrial leadership and CAPEX for innovation in RTOs




| 56

HIGHLY SKILLED

PEOPLE

To keep and improve its position

and independence in the global competition

To maintain European manufacturing capabilities for

critical and innovative components

To promote large scale technological platforms

for pre-industrial validation in pilot lines

To set up financial tools supporting necessary

investments : CAPEX for industrial leadership and

CAPEX for innovation in RTOs


EUROPE WILL BE AT THE FOREFRONT OF THE NEW DIGITAL CENTURY

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SAVE THE DATE

2

1

50

LETI DAY AT GRENOBLEJUNE 28-29, 2017


THANK YOU

FOR YOUR ATTENTION

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