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  • Intelligent Sensing and Communicating

    Textile

    EURIPIDES

    FORUM in HelsinkiJune 15th-16th, 2011

    • Development of a new generation of printing process: ultra thin filmdeposition below 1 µm, printing on alumina, silicon and textilesubstrates.

    • Development of functional building blocks of the smart micro systemfor intelligent working clothing, beds, and similar applicationsincluding system communication.

    • Smart system application in firemen clothing and other workingclothing.

    TESLA BLATNA, a. s. Czech Republic – project leader

    G.BOPP + CO. AG, Switzerland

    BVK Hradec Kralove, s. r. o. Czech Republic

    CEA Leti, France

    Kissel + Wolf GmbH, Germany

    Microcircuit International, France

    University of West Bohemia, Czech Republic

    Project objectives

    Kick off meeting: 17. - 19. 05. 2010 Project start: 01. 05. 2010

    2nd Progress meeting: 25. - 26. 05. 2011 Project duration: 4 years

    Abstract

    Keywords

    Intelligent textile, advanced screen printing, gas sensors, vapour sensors.

    Personalised health and safety care, integrated sensor modules for textile products and intelligent beds.

    Fields of application

    • Very fine line prints obtained using innovative screens.

    • Non-conventional stainless steel meshes and new emulsions.

    • Integrated low cost sensor elements on organic and inorganic basis for smart textile.

    • Technological platform for industrial exploitation in place.

    Project results

    IDE high (w): 3 mm

    Length of fingers (l): 3 mmNumber of fingers (n): 3 – 150

    Gap width (s): 10 – 500 mm

    Width of fingers (wp): 10 – 500 mm

    Substrate thickness (h): 0,635 mm

    Relative permittivity of substrate (εr): 10

    [ ]mFw

    t

    kK

    kKC

    P

    w

    t

    efSP /

    2265,13,2

    )(

    )( 18

    0

    +⋅+

    ′⋅⋅=

    ⋅−

    εε

    Fig. 1: UWB sensor structure design based

    on the conformal mapping method.

    Fig. 2: UWB printed

    organic sensing film

    on the TESLA

    interdigital electrodes

    structure.

    Fig. 5: MCI advanced screen with BOPP

    precision mesh and KIWO emulsion.

    Fig. 4: CEA-Leti silicon wafer with

    Bulk Acoustic Waves (BAW)

    resonators using screen printing

    procedures for gas sensitive

    polymers deposition.

    Fig. 3: 25 µm circle lines and lineswith sharp corners - KIWO

    emulsion.

    Consortium overview

    Key project achievements

    Fig. 6: BOPP non-conventional stainless

    steel precision mesh in comparison to

    square mesh.

    Fig. 7: Screen printing on alumina

    substrate in TESLA.