ESH ITWG

April 7, 2006 Vaals, Netherlands

Summary of Environmental, Health and Safety Chapter

ITRS 2006

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Agenda

• 2005 (Seoul) Summary

• Technical Work– Cross-thrust Analysis– 2006 Overall ESH needs– Objectives and work assignments for July meeting

• Have Fun at the ITRS

• IRC Issues?

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2006 ITRS Update ESH Focus Issues-1• Chemicals – MATERIAL CHOICE

• Material in devices vs precursor/starting materials• ALD/MOCVD/PVD • Process By-Products (e.g. – RuO4, Al(CH3)3 )• Pb-Free Roadmap

• Materials for Manufacturing Only• Non-aqueous immersion fluids• PFOS moving to PFAS/PFOA

• ERM• Proposed ERM Table would map ERD’s material classes• ESH assess for future potential risks (of each class)• Nano Infrastructure Dialog (e.g. – metrology)

• Energy• EUV (Lithography)• Energy Goals (Interconnect)• Who Owns Setting/Driving Energy Reduction Needs• Sleep State Technology (Factory Integration)• Green Fab Definition (Factory Integration)

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2006 ITRS Update ESH Focus Issues-2

• Recycle Systems

• Chemical• Definition of Recycle, Reuse, Reclaim • Conflict with technology performance• Energy penalty due to dilute chemicals

• Water • Conflict with technology performance

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ESH Chapter ITWG AttendeesESIA – Shane Harte (ESIA)

- Francesca Illuzzi (ST Microelectronics)

- Harry Thewissen (Philips)

JSIA –- Shigehito Ibuka (TEL)

- Takayuki Oogoshi (NEC Electronics)

- Tetsu Tomine (Seiko-Epson)

SIA – Jim Jewett (Intel)

- Walter Worth (Sematech)