electroplating process
TRANSCRIPT
Ames can custom design your anodes with our extruding, casting and rolling techniques.
We specialize in fabrication of anodes for chromium plating, with an inventory of
antimonial/lead and tin/lead sheet, wire and pipe products
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ing having a major surface; a plurality of Painting Mask abrasive particles; a binder, which adheres U.S. Patenl5.667,590. SeFjf. 16. 1997 the plurality of abrasive particles to the A.E. Simons, 3, Eastover, SC.
" ^.... . major surtace ot the backing; and a penph- era1 coating comprising an antiloading component.
Cleaning Solent U.S. Patent 5,667,594. Sept. 16, 1997 K Omure et al., assignors to Daikin industries Ltd., Osaka, Japan
A cleaning process comprising dipping an object to be cleaned into a cleaning solvent composition to remove dirty com-
ponents wherein the solvent is an aliphatic fluorohydrocarbon.
A painting mask for use when painting a
rim that i, secured to a tire.
Black Oxide for Aluminum Alloys U.S. Patent $667,599. Sept. IS, 1997 R. Rungta et ai., assignors fo Genera/ Motors Corp., Deffolt
4 solution for formmg a black oxide on
a surface of an aluminum-containing metal,
the solution comprising per liter 5 to I2
grams of sodium phosphate dibasic, 5 to I2 grams of sodium benzoate, 0.5 to 1 gram of
sodium molybdate dihydrate, distilled wa- ter. chloride, sulfate, and bicarbonate so- dium salts. and a substance for maintaining
the pH at X.0 to 9.0 at a temperature of 80 to 90 ‘c’.
Method of Sputter Deposition U.S. Patent 5,667,645. Sept. 16. 1997 SF! Leipharf. assfgnor to Micron Technology Inc., Boise, Idaho
A method of sputter depositing a metal onto a substrate comprising placing a
substrate within a reaction chamber: pro- viding a metal target having an erodable
surface nsithin the reaction chamber; pro- viding a gaseous mixture comprising ar- gon gas and at least one of helium gas
and neon gas within the reaction cham- ber: forming a plasma; and contacting the
plasma wirh the surface of the metal tar- get to sputter deposit some of the metal onto the substrate.
Sputtering Device U.S. Patent 5,667,650. Sept. 16, 1997 0.W Face and KE Myers, assignors to E,l. Du Ponf de Nemours and Co.. Wilmington. Del.
A high-tlow gas manifold for high-rate.
off-axis sputter deposition.
Wire Plating U.S. Pafent5.667,661. Sept. 16, 1997 A. Hughes, assignor to United Wire Ltd., Edinburgh, Scotland
A method for the production of sur- face-treated. metal alloy pins of a prese- lected overall cross-sectional size, which
comprises continuously coating a con- ductive metal alloy substrate by drawing
the metal alloy substrate through at least one die so as to produce a cross-sectional siLe greater than thaw desired for the pins;
stress relieving the drawn alloy: electro- plating the drawn. metal alloy substrate to a thickness not exceeding approxi-
mately I micron in a continuous manner as it pasbes through an electroplating bath: drawing the plated, metal alloy sub-
strate through a final die to reduce the cross-sectional area to the predetermined pin size; and forming the pins.
Electroplating Process U.S. Patent 5,667,662 Sept. 16, 1997 !N Sonnenberg et al, assignors to Shipley Co. L.L.C., Mar/borough, Mass.
A method for electroplating the surface of a nonconductor comprising contacting
with an aqueous suspension of a conduc- tive polymer and metal plating the noncon- ductor.
84 METAL FINISHING l MAY 1998