efy design engineers conference 2012 heatsink design a practical approach sridevi iyengar global...
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EFY Design Engineers Conference 2012
Heatsink Design A practical ApproachSridevi Iyengar
Global Application Engineer
Sapa Profiles
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EFY Design Engineers Conference 2012
Agenda
Introduction
Heat sinks and Heat Transfer mechanisms Why use a heatsink
Some facts you (N)ever wanted to know about heatsink
Thermal Interface materials
Liquid coolers
Friction Stir Welding
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EFY Design Engineers Conference 2012
About Me – Sridevi ( Sri )
Joined Sapa in 2010
Have 10+ years of experience in electronics cooling and thermal design. Worked mostly at telecom/networking companies or consulted for projects in these areas.
Thermal Analysis, thermal testing – some of my key strengths, area of expertise
Icepak, Flotherm, and currently Flow Simulation are the tools I have used extensively for thermal simulations
Education– B.S – Chemical Engineering – NITK Suratkal ( Karnataka Regional Engg College)
– M.S - Computational fluid Dynamics – University of California San diego
Passionate about South Indian Classical Music. I learn, teach and perform regularly
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EFY Design Engineers Conference 2012
What is a heatsink
Heatsinks are devices that enhance heat dissipation from a component to a cooler ambient – usually air, but sometimes to other fluids as well.
The primary purpose of a heatsink is to maintain the temperature of the device being cooled within acceptable limits as specified by the component manufacturer.
Keeping the component temperature under the specified limits ensures proper operation of the device, and improves reliability and life of component.
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EFY Design Engineers Conference 2012
Factors to be considered while designing heatsinks
Power that needs to be dissipated
Maximum allowable component temperature
Available space/volume for heatsink
Power density
Air Flow parameters
Pressure Drop
Bypass effects
Manufacturability
Costs
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EFY Design Engineers Conference 2012
Heat sinks for air cooling
Aluminium alloys are the dominating materials for air-cooled heat sinks
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EFY Design Engineers Conference 2012
Thermal conductivity of Al-alloys
Copper (pure): 395 W/mK
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EFY Design Engineers Conference 2012
Principles of heat transfer
Heat transfer is “the science which seeks to predict the energy transfer which may take place between material bodies as a result of temperature difference
The three modes: Conduction: Energy transfer within solids
Convection: Transfer from a surface to a moving fluid
Radiation: transfer by electromagnetic radiation
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EFY Design Engineers Conference 2012
Convection Cooling
• Convection cooling achieved by two ways
• Forced Convection Air is forced over the components
with a fan or blower The velocity of air depends on the
fan and the local conditions
• Natural Convection or free The buoyancy effect forces hot air
to flow to the top and cold air to come to the bottom.
Typical velocity – 0.2 m/sec
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EFY Design Engineers Conference 2012
Conduction
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EFY Design Engineers Conference 2012
Convection
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EFY Design Engineers Conference 2012
Radiation
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EFY Design Engineers Conference 2012
Technical terms
Q = Total power that is dissipated by the device (s) being cooled – (W)
Tj = Junction temperature of the device
Tc = Case temperature of the device
Ts = Heatsink temperature - Maximum temperature of the heatsink at a location closest to the device
Ta = Ambient temperature
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EFY Design Engineers Conference 2012
The basic equation
The governing equation which correlates the total power, temperature difference and the thermal resistance can be expressed as
The thermal resistance is analogous to the electrical resistance used in Ohm’s law.
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EFY Design Engineers Conference 2012
Thermal Resistance
Rj-c is the Junction to case thermal resistance. Usually a parameter that is published by the component manufacturer
Rc-s is the thermal resistance across the thermal interface material between the heatsink and the component.
Rs-a is the thermal resistance of the heatsink.
=
=Junction to Ambient is the sum of the resistances
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EFY Design Engineers Conference 2012
Heatsink Selection
Tj, Rjc and Q will be provided by the component manufacturer.Rcs – Thermal resistance of the interface material Ta – Ambient temperature
Ta and Rcs are parameters that we can control to a certain extentRsa is the number that will help us identify a heatsink that will meet our criteria.
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EFY Design Engineers Conference 2012
Heatsink Design parameters
A heatsink can be optimised for performance by varying the different dimensions shown.
Of course, the optimised design should consider manufacturability.
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EFY Design Engineers Conference 2012
Air-cooled heat sinks forced convection - fan curve
Characteristic curve of the fan
Optimal operating region
High pressure-drop Low pressure-drop
Air flow ∝ n (rpm)Pressure drop n∝ 2
Noise n∝ 3
Fan law:
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EFY Design Engineers Conference 2012
Fin efficiencyApparent cooling area vs. effective cooling area
forced air-cooling, medium speed fin thickness t=0.7 mm
0
20
40
60
80
100
120
0 10 20 30 40 50 60
Fin height, mm
fin
are
a, m
m2
0
0,1
0,2
0,3
0,4
0,5
0,6
0,7
0,8
0,9
1
fin
eff
icie
ncy
apparent cooling area
effective cooling area
Fin efficiency
Heat flow
Low efficiency
T_fin => T_airq = h·A ·(Ths-Tair)
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EFY Design Engineers Conference 2012
Bypass Effects in Forced Convection
When there is a significant gap between the heatsink and the top surface of the enclosure air will bypass the heatsink. This reduces the performance of the heatsink. Bypass effect is more pronounced in heatsinks with closely packed fins.
Here the air is forced to go through the heatsink and in this case the performance of the heatsink is optimised.
HHeatsink Base
HHeatsink Fin
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EFY Design Engineers Conference 2012
α
Conical fins vs. rectangular fins
Heat source
Conical fins seems have some advantages when only heat flow is considered
Die casting always need a relief angle !
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EFY Design Engineers Conference 2012
Air flow in a conical channel
Temperaure increase vs. angles of conical fins
0%
2%
4%
6%
8%
10%
12%
14%
16%
0 1 2 3 4 5 6
angle of conical fins, degrees
tem
per
atu
re i
ncr
ease
, %
When both air flow and heat flow are considered, rectangular fins are better
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EFY Design Engineers Conference 2012
Cooling at Altitude
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EFY Design Engineers Conference 2012
Heat sink orientationnatural convection
gravity The buoyancy effects of air
forces hot air to move up and cold air to come down.
Orient the heatsink keeping in mind the direction of gravity
Fin thickness and fin pitch are important factors to consider while optimising the heatsink.
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EFY Design Engineers Conference 2012
Comments on heat sinks used for natural convection
Optimise the fin spacing according to temperature and height.
Proper orientation of the heatsink with respect to gravity is important.
Radiation heat transfer must be considered.
Proper surface treatment is often needed as this increases the emissivity.
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EFY Design Engineers Conference 2012
Heatsink OrientationForced convection
Fluid is forced to flow over the surface by external help (Fan)
Orient the heatsink in the direction of the Airflow. Sometimes when the flow is erratic, can use pin fin
heatsinks. In general, extruded plane fin heatsinks work better and
have lesser pressure drop across the Heatsink.
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EFY Design Engineers Conference 2012
Comments on Heatsinks used for forced convection
Design must take the fan curve (and by-pass flow) into account when appropriate.
Check the fin efficiency when the fin is fairly tall.
Avoid using conical fins.
Optimise the base thickness, fin thickness and fin spacing based on the expected air velocity through the channels.
Always remember that when you have more than one heatsink in the system, the airflow to the downstream heatsink will be affected by the upstream heatsinks and components.
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EFY Design Engineers Conference 2012
Conduction, contact surface
Heat sink
Heat source
Actual contact area < 2% of apparent contact area
Perfect contact can never be ensured between the heatsink and the package. This could lead to potential problems since trapped air acts as an insulator. The performance of the heatsink can be much lower than estimated leading to high component temperatures. To combat this problem, it is necessary to use a thermal interface material.
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EFY Design Engineers Conference 2012
Thermal interface materials –Different types
Double sided PSA Pressure sensitive adhesive is used to adhere the heatsink to the heat source
Easy to assemble with protective liner tabs
The component package type will determine the kind of tape to use – acrylic based or silicone based
The thermal conductivity of these tapes are moderate and depends on their thermal performance depends on the contact area that can be achieved between the bonding surfaces
Typically 0.005 -0.10 “ thick
Not recommended when the heatsink fins are oriented vertically – i.e along the direction of gravity
Single sided PSA Provides adhesion only to the heatsink.
Mechanical fastening of the heatsink to the component is needed.
Typically 0.05 – 0.01” thick
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EFY Design Engineers Conference 2012
Thermal interface materials –Different types
Phase Change Material Available as peel and stick pads at room temperature
When heated the material reflows to fill all the interface voids
Very good performance – high thermal conductivity
Conforms to minimize thermal path thickness
Mechanical fastening of heatsink is required
Could be messy during re-work
Gap Filler Soft, thermally conductive silicone elastomers. Used in places where a large and
variant gap exists between the components and heatsink
Typically used in places where a common heatsink is used for multiple components
Mechanical fastening of heatsink required
0.5mm – 5 mm thickness
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EFY Design Engineers Conference 2012
Thermal interface materials –Different types
Epoxy Room temperature vulcanizing materials which function both as thermal pathway
and mechanical attachment
Not favored by assemblers due to the possible prep work and inability to rework
Grease Excellent thermal conductivity and void filling capability
Mechanical attachment of heatsink to component required
Can be messy and not favored by assemblers
Can be as thin as 0.01”
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EFY Design Engineers Conference 2012
What Next
At some point one reaches the limit of Air cooling.
You may enhance the performance of the heatsinks with different techniques like, serrated fins, bonded fins, Skived fins.
Heatpipe heatsinks, Vapor chamber and Liquid cooled heatsinks are the next generation of thermal management products when Air cooled heatsinks just will not do the job for you.
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EFY Design Engineers Conference 2012
Heat pipe
Heat pipe
Heat out
Condensereturning(by capillary)Heat in
wick
Vapourflow
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EFY Design Engineers Conference 2012
Heat pipes
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EFY Design Engineers Conference 2012
What is “liquid cooling”?
Conventional definition in automotive analogy Circulating fluid driven by
pump
Heat absorbed at source by “cold plate! Or “water block”
Heat rejected to ambient by “heat exchanger” or “radiator”
Multiple heat sources possible in series or parallel
May also include two phase flow, evaporating at heat source, e.g. Heat pipe
Thermsyphon
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EFY Design Engineers Conference 2012
Liquid cooling: Channel design is important.
Heat source
30
Heat source
15
199
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EFY Design Engineers Conference 2012
Liquid cooling: temperature & flow
Sapa’s channel“Star channel”
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EFY Design Engineers Conference 2012
Disadvantages of liquid cooling:System becomes more complex
Add significant complexity: more parts and more units being involved
Pump reliability
Low heat flux parts still need cooling with heatsinks/Fans
Investment required for testing and verifying system performance
Still need to remove heat from liquid system to ambient air (or other liquid)
In general, liquid cooling units will require more real estate.
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EFY Design Engineers Conference 2012
Some comments on liquid cooling
Channel design is important.
Contact thermal resistance between component and heat sink may becomes significant.
The choices of liquid (coolant) depends on single phase or two phase.
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EFY Design Engineers Conference 2012
Friction stir welding
A rotating tool is plunged into the joint line and moved along the joint. Neither flux nor filler material are used.
Friction Stir welding method of joining is based on the fact that the metal is subjected to heavy plastic deformation at high temperatures, but lower than the melting point.
When the rotating tool is plunged into the metal, friction heat is generated. The tool produces severe plastic deformation under high pressure, during which the weld interfaces are stirred together and a homogenous structure is formed.
Process results in completely pore-free,tight joints with a high strength
Minimum heat influence on the material
Good mechanical properties
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EFY Design Engineers Conference 2012
Friction Stir Welding
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EFY Design Engineers Conference 2012
Final Thoughts
Global market for Electronic Thermal management is forecasted to reach $8.6 billion by 2015.
Miniaturization of products along with increase in features is leading to higher power dissipations and more importantly power density
Upfront, well thought out thermal design will eliminate thermal related problems at later stages. At this time there might be no recourse or if there is one, it might be an expensive one.
Working closely with your thermal solutions provider will ensure you have a solid thermal solution for your electronic product.
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EFY Design Engineers Conference 2012
Sapa’s offer to you...Sapa’s offer to you...
Customizedheat sinks Design
R&D andHeat
calculation
NDA, GlobalPurchase
Agreement
Prototyping &serial
production
Complexmachiningexpertise
All-in-one
FSW Globalsales
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EFY Design Engineers Conference 2012
Thank You
Feel free to contact me if you think I can be of any help.
91 – 99000 45726
Some websites that I visit for information on thermal design– www.coolingzone.com
– www.electronics-cooling.com