ECE 2799 ECE 2799

Electrical and Computer Electrical and Computer Engineering DesignEngineering Design

““Prototyping Techniques”Prototyping Techniques”

Prof. BitarProf. Bitar

Prototyping TechniquesPrototyping Techniques Solderless BreadboardsSolderless Breadboards

w/ Jumper Wires (Temporary)w/ Jumper Wires (Temporary)

Non-Copper Clad “Perf-Boards”Non-Copper Clad “Perf-Boards” w/ Pins and Point-to-Point Wiring, Soldering w/ Pins and Point-to-Point Wiring, Soldering and/or Wire-Wrappingand/or Wire-Wrapping

Prototyping Boards Prototyping Boards (w/ Copper (w/ Copper Patterns)Patterns)

Point-to-Point Wiring, Soldering and/or Wire-Point-to-Point Wiring, Soldering and/or Wire-WrappingWrapping

Custom Printed Circuit BoardsCustom Printed Circuit Boards w/ Copper Traces, Copper Pads and Solderingw/ Copper Traces, Copper Pads and Soldering

Solderless BreadboardsSolderless Breadboardsbyby

3M, RSR Electronics, & Global Specialties3M, RSR Electronics, & Global Specialties

Solderless BreadboardsSolderless Breadboards

Pro’sPro’s ConvenientConvenient QuickQuick Easy to ChangeEasy to Change

Con’sCon’s Not Very PermanentNot Very Permanent Contact Wear OutContact Wear Out IIMAXMAX ≈≈ 100-200mA 100-200mA ffMAX MAX ≈≈ 1-10MHz 1-10MHz Through-Hole Through-Hole

Components Only*Components Only*

* May Use “Surfboards” for SMT * May Use “Surfboards” for SMT DevicesDevices

Solderless BreadboardsSolderless Breadboards

Good TechniqueGood Technique Components laid out in Components laid out in

a logical fashion a logical fashion Leads cut to avoid short Leads cut to avoid short

circuitscircuits Jumpers run either Jumpers run either

horizontally or verticallyhorizontally or vertically Correct length wire Correct length wire

usedused On-board bypass On-board bypass

capacitors across power capacitors across power connections and groundconnections and ground

Bad TechniqueBad Technique Components laid out Components laid out

haphazardlyhaphazardly Component leads Component leads

overstressedoverstressed Leads not cut, risking Leads not cut, risking

short circuitsshort circuits Leads cut too short, Leads cut too short,

not making board not making board contactcontact

Random length Random length jumpers usedjumpers used

Bypass capacitors Bypass capacitors missingmissing

Your boards look like this, Your boards look like this, RIGHT ?RIGHT ?

NON-Copper Clad PERF-orated NON-Copper Clad PERF-orated BoardsBoards

Vector Electronics, Twin Industries, and Keystone ElectronicsVector Electronics, Twin Industries, and Keystone Electronics

FR4 Glass Epoxy PhenolicFR4 Glass Epoxy Phenolic Typical Specifications (in)Typical Specifications (in)

0.062 Board Thickness0.062 Board Thickness 0.042 Hole Diameter0.042 Hole Diameter 0.1 x 0.1 Hole Pattern0.1 x 0.1 Hole Pattern Various Sizes Various Sizes $0.25 / in$0.25 / in22 (based on (based on

10”x10” size board)*10”x10” size board)*

* Increases considerably for copper patterned * Increases considerably for copper patterned boards.boards.

Prototyping Boards w/ Copper Prototyping Boards w/ Copper PatternsPatterns

bybyVector ElectronicsVector Electronics

www.vectorelect.com/Pattern.htm

Prototyping Boards w/ Copper Prototyping Boards w/ Copper PatternsPatterns

bybyVector ElectronicsVector Electronics

www.vectorelect.com/Pattern.htm

Prototyping Boards w/ Copper Prototyping Boards w/ Copper PatternsPatterns

bybyVector ElectronicsVector Electronics

www.vectorelect.com/Pattern.htm

Special Prototyping BoardsSpecial Prototyping Boardsbyby

RadioShack and RSR ElectronicsRadioShack and RSR Electronics

www.radioshack.com/product/index.jsp?productId=2102846

Special Prototyping BoardsSpecial Prototyping Boardsbyby

FuturlecFuturlec

www.futurlec.com/ProtoBoards.shtml

““Surfboards”Surfboards”byby

Capital Advanced TechnologiesCapital Advanced Technologies

www.capitaladvanced.com

DIP Sockets for Soldering DIP Sockets for Soldering byby

Mill-MaxMill-Max

www.mill-max.com

DIP Sockets for Wire-Wrapping DIP Sockets for Wire-Wrapping byby

Mill-MaxMill-Max

www.mill-max.com

SIP and DIP Headers for SIP and DIP Headers for InterconnectionInterconnection

bybyMill-MaxMill-Max

www.mill-max.com

Component Header / Component Component Header / Component CarrierCarrier

bybyMill-MaxMill-Max

www.mill-max.com

Component Header / Component Component Header / Component CarrierCarrier

bybyAires ElectronicsAires Electronics

www.arieselec.com/products/products.htm

Modules & Development Modules & Development BoardsBoards

http://www.sparkfun.com/http://www.sparkfun.com/ http://www.sparkfun.com/categories/20http://www.sparkfun.com/categories/20 http://www.sparkfun.com/products/http://www.sparkfun.com/products/

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