dry etching system

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Request for Proposal

Dry Etching System

August 2015

Government of India

Indian Space Research Organisation

Space Applications Centre

Ahmedabad-380015

INDIA

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Request For Proposal (RFP)

The Indian Space Research Organization (ISRO) requests your company to submit

quotation for Dry Etching System as detailed in this document.

The document is divided in three sections as below:

Section-A: Gives the general idea about SAC/ISRO and the intended use of the

proposed system in brief.

Section-B: Gives the general Guidelines to suppliers for preparing responses against this

RFP.

Section-C: Gives SAC’s technical requirements of the Dry Etching System in detail.

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Section – A

Space Applications Centre, Ahmedabad (hereafter called SAC) is an R&D Centre of Indian

Space Research Organisation and is responsible for development and realisation of ground

as well as space borne sub-systems for Indian Communication/Remote sensing Satellites.

To support this activity, SAC has been working in the field of microlithography and this RFP

is being floated keeping in mind the same.

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Section – B

Guidelines to Suppliers

I. Guidelines for preparing technical details:

1. Only those suppliers who have adequate exposure and experience in the

designing/manufacturing/maintenance/support of such equipments need to

quote. At the time of submission of quotation, suppliers should provide

necessary documentations explaining the heritage of the quoted system

wherein they should bring out its history in the market. The supplier should

mandatorily provide a list of their existing customer base in India (with their

full contact details such as name, telephone number, fax and email etc.) for

similar systems supplied, installed and operational in last 10 years.

2. The offered systems should completely be a brand new system.

Refurbished / old systems or parts are unacceptable.

3. 3rd party items in the system, if any, should be from reputed vendors only.

These should preferably have service support in India.

4. The supplier is requested to examine the RFP thoroughly and offer

compliance/non compliance point by point. The offered equipment shall

primarily cater to the applications given in Section – C(I). Typical

requirements of instrumentation is given in C(II). Complete technical

specifications of the offered model should be provided by vendor as per

Section – C (II) indicating deviations, if any, from the specified values along

with justifications of how the offered configuration can still meet the SAC

requirements in C(I).

5. It is necessary for the supplier to furnish complete information as required

in various sections of this RFP for proper evaluation, assessment and

consideration of the proposal.

6. The statements in the compliance sheet must duly be supported with facts

in the original brochures / literature / computations (to be supplied along

with the Technical Bid) of the equipment. Plain compliances without

adequate supporting documents are liable to be rejected.

7. The supplier should attach additional information pertaining to the quote

system such as application notes, papers published, copyrights and

patents, if any, to provide more insight.

8. To assess the capabilities of the quoted system, SAC reserves the right to

request the vendor to etch a SAC supplied sample wafer/substrate. The

participating suppliers must comply to this point.

9. If the bid has been made by an Agent (other than the manufacturer), an

authorisation certificate must be submitted along with the technical bid.

10. A pre-bid conference shall be arranged. Interested vendors may participate.

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II. Guidelines for preparing quotations:

1. The quotation should consist of two parts:

i. PART-1: ‘Technical Bid’

Giving all technical details as required in the document, delivery

schedule and un-priced replica of Price Bid including all applicable

taxes, commercial and payment terms etc.

ii. PART-2: ‘Price Bid’

All break-up prices along with the commercial terms.

Note: Part-2 should be submitted separately as per the EGPS guidelines.

This requirement should be strictly adhered to. Bid shall not be considered

if this requirement is not met.

2. The quotation should include, in addition to unit cost, all the prices towards

optional items wherever indicated, on-site installation charges, training

charges etc. Cost break up is essential in deciding the inclusion/exclusion

of any items depending on the cost and schedule constraints.

3. The deliverables and the delivery schedule should be clearly mentioned.

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Section – C

Dry Etching System:

(I) Application Requirements:

S.N. Application

Substrate Material / Size

Mask Material

Material to be Etched

Etch Depth

Etching Rate

Selectivity (to PR)

Uniformity

Reproducibility

Surface Roughness

Anisotropy

Remarks

1. Micro Optics / Diffractive Optical Elements Fabrication (3D Patterns)

Quartz / Fused Silica / Si. Substrate Sizes: 100mm X 100mm or their non-standard piece parts. Substrate Thickness: Within 1mm to 10mm for Planar as well as non-planar (plano-convex) substrates

PMMA / AZ9260 / AZ4620

Quartz / Fused Silica / Si.

300nm - 20µm

Quartz / Fused Silica ≥100nm / minute Si ≥300nm / minute

1 : 1 ≤±5% ≤±5% ≤5nm -- Mandatory Requirement. Grey Scale patterns on resist are to be transferred 1:1 on the underlying substrates.

2. Cr-Mask Lithography

Quartz / LE Glass coated with Anti Reflection Coating / Cr. Mask Sizes: 3” X 3”,

PMMA / AR-N7700.18 / AR-P6200 / AR-P3110 / AR-

Anti Reflection Coating / Cr

Cr: 70 to 120nm

≥10nm / minute

(≥0.5):1 ≤±5% ≤±5% ≤5nm Sidewall angle ≥ 80°.

Mandatory Requirement. Binary patterns on resist are to be defined in ARC

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S.N. Application


Mask Material


Etch Depth

Etching Rate

Selectivity (to PR)

Uniformity

Reproducibility

Surface Roughness

Anisotropy

Remarks

4” X 4”, 5” X 5”, 6” X 6” Mask Thickness: Within 1.5mm to 6.35mm

N4340 / AZ1500

/ Cr coated on the substrates. Min. line dimension with required tolerance = 100nm±10%

3. SAW Devices Lithography

Quartz / LiNbO3 / LiTaO3. Coated with NiCr-Al Wafer Sizes: 3” / 4” dia wafer or their piece parts. Wafer Thickness: Within 0.5mm to 2mm.

AR-N7700.18 / AR-P6200 / AR-P3110 / AR-N4340

NiCr / Al NiCr: 10 to 30nm Al: 100nm to 600nm

≥10nm / minute ≥100nm / minute

(≥0.3):1 (≥2):1

≤±5% ≤±5% -- Sidewall angle ≥ 65° for both.

Mandatory Requirement. Binary patterns on resist are to be defined in NiCr-Al coated on the substrates. Min. line dimension = 250nm±10%

4. Others Si/SiC/ Saphhire

PMMA / AR-N7700.18 / AR-P6200 / AR-P3110 / AR-N4340 / AZ1500 /

GaN

50 to 200nm

≥150nm / minute

(≥0.7):1 ≤±5% ≤±5% -- Sidewall angle: Controllable preferably > 70°.

Mandatory Requirement.

GaAs GaAs 2-50µm ≥2000nm / minute

(≥15):1

Si Si / Si (poly)

2µm ≥150nm / minute

(≥3):1 Desirable Requirement. Si SiO2

3µm ≥150nm /

minute SiO2:Cr 30:1

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S.N. Application


Mask Material


Etch Depth

Etching Rate

Selectivity (to PR)

Uniformity

Reproducibility

Surface Roughness

Anisotropy

Remarks

Si

Metal Masks

Si3N4

0.5µm to 1.5µm

≥100nm / minute

(≥1):1

Si Wafer Sizes: from 3” dia wafer to 8” dia wafer or their non-standard piece parts. Wafer Thickness: Within 0.5mm to 2mm

SiC

-- -- ( ≥0.5):1 SiC:Cr (>5):1

Supplier should clearly bring out capabilities of the offered system to perform all the above tasks in their quote and show these as part of the

acceptance test if they are selected. They may quote for multiple chambers / guns, if needed to meet the above requirements. In order to have

compatibility with the system, the supplier may submit quotations for various resists suitable as the masking material in our applications and

suitable substrate adapters and wafer carriers to process the above mentioned sizes of wafers / substrates as optional items.

Supplier should provide a comprehensive list of gases and purity required for above applications mentioning the requirement of corresponding

MFC capacity and heated lines.

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(II) Typical Requirements of Instrumentation to meet the Application Requirements:

The system should consist of RF supplies for plasma source, substrate electrode;

vacuum as well as gas delivery systems for the reactor chamber with single substrate

load lock; end point detection; control computer and software along with the required

utilities.

1. Plasma Source & Power Supply

S.N. Parameter Specifications SAC Remarks Vendors’ Compliance

1.1 Plasma Source / Power Supply

Inductively Coupled Plasma Source with suitable 2MHz / 13.56MHz switched power supply.

Complete source details to be furnished.

1.2 Power Range Continuously adjustable from 100W to ≥1000W in steps of ~1W.

A plot between ion density and ICP power should be provided.

1.3 Power Matching Automatic with manual override.

Each process step should have the option to have Automatic / Manual match or park positions to vary the etch rate during a run. Return power levels should not be more than 5% of input.

1.4 Plasma Source / Power Supply Cooling

Air / Water cooled. If it’s water cooled, suitable chiller unit to be quoted as an optional item.

1.5 Working Pressure Range

Typically 0.07 - 0.001torr

1.6 Effective Source Diameter

Suitable to achieve specified uniformity over 6” X 6” samples (maximum).

1.7 Plasma Non-uniformity

5% or lower across working area

1.8 RF Coupling to Plasma

Through Alumina dielectric with suitable provision for attachments like end-point detection.

2. Substrate Electrode RF Power Supply

S.N. Parameter Specifications Vendors’ Compliance

2.1 Power Supply Up to (minimum) 600W, 13.56MHz Switched Power

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Supply

2.2 Control Forward power continuously variable (step ~ 1W) over the range. & Substrate bias control.

2.3 Power Matching Automatic with manual override.

Each process step should have the option to have Automatic / Manual match or park positions to vary the etch rate during a run.

2.4 Power Supply Cooling

Air / Water cooled. If water cooled, suitable chiller unit to be quoted as an optional item.

3. Substrate Electrode


3.1 Electrode Size Suitable for loading sample sizes specified in Section - C(I).

3.2 Wafer / Substrate Mount & Edge Exclusion

Mechanical clamping of wafers / substrates with maximum allowable 5mm edge exclusion.

3.3 Electrode Temperature Range

0°C to 80°C settable (Step 1°C) with a stability of 1°C or better.

3.4 Temperature Control Dynamic cooling / heating by fluid and additional resistance heating as required.

3.5 Heat Transfer from Substrate Adapter / Wafer Carrier to electrode

Through Helium back side circulation. The mechanism used should be such that it is flexible to support a variety of sample sizes and should avoid sticking / breakage of wafers / substrates.

3.6 Wafer Handling Details to be specified by the vendor.

4. Vacuum System & Gauges

4.1 Suitable separate anti-corrosive dry pumps for process chamber as well as load-lock. Maintenance free turbo pumps must be used for high vacuum.

4.2 Suitable calibrated gauges must be provided for monitoring vacuum in process chamber as well as load-lock and providing feedback for controlling process pressure in the chamber.

4.3 Ultimate vacuum in Process Chamber should be better than 1X10-6 torr.

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4.4 Time taken to evacuate the chamber to ultimate vacuum (from ambient) should be specified and should preferably be ≤ 12 hour.

4.5 The process pressure control in the reactor chamber should be automatic and closed loop – through software controlled throttle valves.

4.6 The load-lock pump down time should be less than 10 minutes. Load-lock vacuum ~ 10-2 torr.

4.7 Detailed information (including make and model of pumps, gauges etc.) of the vacuum system offered must be provided by the supplier. Besides, all the pumps must be easily accessible / removable for ease of servicing / maintenance / replacement.

5. Gas Delivery System

5.1 The system should have adequate (as per SAC applications in C(I)) number of software controlled MFCs for inlet of various process gases. Digital display for actual flow rate of gases, in terms of sccm should be provided.

5.2 Each gas line has to be fitted with ≤2µm particle filters and pneumatic cut-off valves.

5.3 Additional MFCs to be quoted as optional item. 5.4 N2 purging of gas lines carrying corrosive gases is mandatory. 5.5 All the components such as MFCs, valves, etc. should be fitted in a way so

that they can be easily removed for servicing / replacement. 5.6 On-site gas line piping shall preferably be the responsibility of the supplier.

The piping costs should be quoted as optional item. The utility area (where the gas cylinders must be kept) will be within 20-25m of the equipment. However, the vendor may quote for the required attachments (or per unit basis) and piping (on per meter basis). (Details as per Annexure - A). One time supply of required gases along with the system (to demonstrate applications mentioned in Introduction) shall preferably be the responsibility of the supplier and the same should be quoted as optional items. The vendor may also suggest an alternate approach for this with complete details.

5.7 Vendors should specify the purity of gases required to meet the requirements. They should also give specifications of materials, regulators, fittings etc. in their technical bid.

5.8 The supplier has to ensure all required safety precautions so as to ensure safe handling and disposal of hazardous gases.

6. Reactor Chamber & Load Lock


6.1 Chamber Construction

Machined from a single metal block with suitable ports for Plasma source, pumping unit, load-lock, viewing (with RF shielding) and end point detection attachment.

6.2 Anti-corrosive elements / fittings

The chamber should have anti-corrosive elements / fittings (e.g. electrodes etc.) that are compatible with the etching chemistry to be used for mentioned applications (mentioned in Introduction).

6.3 Chamber Heating System should have

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Arrangement electrical heating kit for chamber heating.

6.4 End Point Detection To be fitted with the system.

6.5 Load Lock Single substrate automatic load-lock with gate valve arrangement for software controlled and fully automated loading / unloading of substrate between the load-lock and process chamber during a process.

6.6 Load Lock Venting Fully automated software controlled nitrogen venting on user command. Suitable high purity nitrogen (4N or better) generator to be quoted as optional item.

6.7 Chamber Cleaning Provision for plasma cleaning of the chamber required.

Detailed description of the procedures involved while switching chemistry must be furnished.

7. Control Computer & System Software: The system must be supplied with a state of

the art Windows / Linux based PC along with the required system software for the

system operation.

7.1 System monitor (continuously updated mimic diagram). 7.2 Data logging (ASCII file).

7.3 Recipe editor.

7.4 Parameter display.

7.5 Manual and automatic process control.

7.6 Software interlocks.

7.7 Parameter controlled process step execution

7.8 Extended user management, including administrator level and password

protected access. Each user’s access should be customisable by selecting

from a list of permissions to be granted.

8. Documentation:

8.1 The supplier to provide installation manual, user manual, operation and

troubleshooting manuals in hard copies on clean room papers.

8.2 All the manuals must be in English language only. Supplier to provide soft

copy of these manuals in a DVD also.

8.3 All troubleshooting manuals must have drawings at module and card level

giving complete description of the components used.

8.4 Suppliers to provide a pre-installation guide explaining the pre-requisites of

the installation of the system.

8.5 Supplier to bring out the safety measures to be adopted for different etching

chemistries.

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9. Miscellaneous:

9.1 Operation: Suitable for continuous use.

9.2 Environmental conditions:

8.5.1 Operating:

i. Temperature range 23±3°C.

ii. Relative Humidity 50±20%.

iii. Cleanliness: Class 1000 or Class 10000.

8.5.2 Storage:

i. To be specified.

9.3 Power: 230V AC, 50Hz, Single phase or 440V AC, 50Hz, 3 Phase.

9.4 Size & Weight: Compact preferable. Details to be provided by the vendor.

9.5 Utilities requirement to be brought about as per attached Annexure – B.

Separate sheets may be attached, where more details are to be provided.

10. Warranty, Services and Spares Support:

10.1 Warranty: The complete supply and its associated hardware / software

(including 3rd party items) should have a standard on-site warranty of 3

year from the date of installation & acceptance of the system at SAC. 2

years extended on-site warranty may be quoted as an option. Vendor

should clearly bring out the consumable parts not covered under warranty

with their prices.

10.2 The supplier should clearly bring out the maintenance / calibration

requirements, methods and schedules along with supporting literature /

documents.

10.3 Post warranty service support: The supplier must quote as option for the

different modes of AMCs viz. Comprehensive / Labour only (preventive

maintenance and breakdown visits) for 3 years after the warranty period is

over.

10.4 The supplier should have an India based service support for complete

system including 3rd party items. Complete details to be specified by the

vendor.

11. Factory Acceptance Test, Site Acceptance Test & Training

11.1 Factory Acceptance Test & Training: If required, at manufacturer’s site, in

accordance with the acceptance test plan, which will be mutually agreed

upon and finalised.

11.2 Site Acceptance Test and Training: At SAC, after installation as per the

acceptance test plan.

11.3 Suppliers must submit their standard test plan with the technical bid. The

acceptance plan should include the tests specified in Annexure – C.

12. Installation and Demonstration of Performance:

It will be the responsibility of the supplier to install the system with all its

utilities and demonstrate its quoted performance according to mutually agreed

upon acceptance test plan.

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ANNEXURE – A: GAS LINES & PIPING DETAILS

On-site gas line piping for all required gases shall preferably be the responsibility of the

supplier. The piping costs must be quoted as optional item. The utility area (where the gas

cylinders must be kept) will be within 20-25m of the equipment. However, the vendor may

quote for the required attachments (on per unit basis) and piping (on per meter basis).

The supplier must ensure a completely safe and fool-proof mechanism for storage and

supply of inert as well as process gases that may be highly corrosive, flammable and

hazardous in nature. Hence, the work has to be handled only by an experienced vendor /

sub-vendor.

The vendor willing to take up this work should submit full contact details of customers for

whom they have completed similar work during the past 3-4 years.

The items used should follow some reputed international safety standard, preferably SEMI

S2 standards.

It will also be the responsibility of the vendor to test, validate and demonstrate the installed

gas storage and supply system for various parameters such as pressure decay (0psi in 24

hours), He leak test (less than 1 X 10-9 Litre/sec), trace moisture and oxygen (below 1 ppm),

particle tests (less than 10 particles of 0.1µm size) etc.

Following is a summary of requirement on gas cabinet, supply panel and piping. Any other

requirement for ensuring safe operation may be brought out in the technical bid and the

same may be quoted in the price bid.

1. Gas Cabinet & Supply Panel: The gas cabinet and supply panel should be equipped

with the following features:

i. Suitable primary pressure regulator with inlet and outlet pressure gauges

as well as isolation valves.

ii. Venturi operated purge-vacuum system to remove entrapped moisture

before charging corrosive gases and suitable provision to ensure impurity

free delivery of high purity gases to the process without any

contamination.

iii. Necessary isolation valves for Pneumatic, Purge and Process gases.

iv. Emergency shut off valve at the outlet that can be activated during any life

safety warnings coming from process and facility conditions. The

emergency shut off valves shall be pneumatically operated with external

solenoid.

v. The supply panel should be monitored for life safety situations. It should,

in the event of gas leak, exhaust failure and fire etc. take necessary

actions to prevent damage and shutdown during any exigency.

vi. All the internals of components should be electro polished with surface

roughness of 10μ or better.

vii. The enclosure should be made of Cold Rolled Steel (min 12 SWG) and

designed for fire resistance.

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viii. The enclosure should come with an exhaust port to meet the

recommended exhaust flow rate.

ix. All joints in panel shall be either orbital welded or face seal (VCR)

connections.

x. All panels shall be tested for particle content (less than 10 particles for

size above 0.1 micron).

xi. Panel shall be tested and certified for Trace moisture & Trace oxygen

content for less than 1 ppm.

xii. All panels shall be assembled in class 100 clean room.

xiii. Vendor should quote for any other utility that is essential.

2. Tubing Material / Type:

i. SS316L, electro-polished, coaxial tubing for corrosive gases.

ii. SS316L, electro-polished tubing for flammable and inert gases.

iii. SS316L, bright annealed tubing for compressed dry air.

iv. SS304 material for exhaust ports and cooling water connections.

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ANNEXURE – B: UTILITY REQUIREMENTS FOR EQUIPMENT

S.

No

.

UTILITY

SPECIFICATIONS END/ FINAL

CONNECTION

DETAILS

(For Tool Hook-

up)

FLOW

(SLPM/

SCCM)

PRESSURE

OTHERS

(PURITY

/ TEMP.)

1 Environmental Conditions

- Clean Room Class

- Temp.

- RH

2 UHP Water.

(Please specify Hot Water

reqmt., if any)

3 BULK Gases

- Process Nitrogen

- General Nitrogen

- Oxygen

- Hydrogen

- Argon

- Helium

4 Speciality Process Gases

(Pl. specify reqmt for all the

process gases)

5 Process Cooling Water

6 Compressed Dry Air

7 Process Vacuum

8 Exhaust

- Acid Exhaust

- Solvent Exhaust

- General Exhaust

9 Drains for

- Acid/ Alkalies #

- Organic Solvent #

- CMP etc #

10 City Water

11 Special Flooring/ Foundation

reqmts, if any (Anti Vibration

pads etc.)

12 Vacuum Wands/ N2 guns.

13 Dimensions/Foot-Print &

Weight.

-Equipment Foot-Print.

-Equipment weight

-Support Equipment.

14 Electrical Supply ( 50 Hz)

- Normal Supply. - UPS

(Load) (Voltage) (phase)

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* Specify Impurity levels in ppm /ppb.

# please mentions composition of effluent, if discharged from the equipment.

Any other Utility requirement shall also be specified.

- Emergency back-up

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ANNEXURE – C: ACCEPTANCE TESTS

The selected vendor should demonstrate at least the following (in addition to their standard

Acceptance Tests):

1. Dry Etching of Quartz / Si, having AZ4620 / PMMA Micro Lens Array / Blazed Grating

structures over them as per Application Requirements No. 1.

2. 6” X 6” Cr Mask Etching: Cr/ARC (Anti Reflection Coating) etching as per Application

Requirements No. 2 for defining 100nm lines.

dry etching system

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