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1-Dec-2010 Jurriaan Schmitz - VLSI Photonics Workshop
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State of the art in MicrofabricationJurriaan Schmitz
[email protected] -- www.utwente.nl/ewi/sc
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TIPP 2014, Amsterdam
Contents
Microelectronics: Moore’s Law today Technology advances inside the microchip Other microfabricated devices Prospects for radiation imaging
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The beginning: 1960s
1961 Fairchild4T5R flip-flop
1962 RCA16T logic chip
1965 Fairchildopamp
Images:Computer history museum
1958 FairchildFirst planar transistor
1968 Fairchild2kT SRAM chip
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Gordon Moore 1965
Transistors keep getting cheaper! Smaller components Bigger chips & wafers Better skills“Moore’s Law”: The number of components on a chip doubles every year
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Moore’s Law – chips, accelerators, fusion…
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“technology driven progress”
+Brilliance of synchrotron sources, # channels in trackers…
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How is Moore’s Law keeping up?
1950 1960 1970 1980 1990 2000 2010 20201E+00
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
1E+09
1E+10Chart Title
Com
pone
nts
per c
hip
Year
Doubl
ing
per y
ear
Doubling per 2 years
GPU’s beat CPU’s
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Moore’s Law: perspective
Transistor gate length scaling is slowing down (10% per generation) 300 → 450 mm transition is delayed to 2020 ITRS roadmap: multiple breakthroughs required by 2018 … what happens next?
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Microchips keep getting better
Design gap Multicore processors Transistor performance boosters
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TIPP 2014, Amsterdam
Contents
Microelectronics: Moore’s Law today Technology advances inside the microchip Other microfabricated devices Prospects for radiation imaging
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TIPP 2014, Amsterdam
The CMOS chip
Complexity is more than transistors alone:
A cm2 chip may contain~20 km wires~1010 contacts
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Transistor evolution1970-2000: “the happy scaling era”
Keep everything the same, only miniaturize it: 1/√2 per generation
Poly Sigate
Inte
lSilicon
SiO2
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Transistor evolution (2)2000-present: new technologies to boost performance
Intel
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Another performance booster:Permanent strain → active strain modulation
Switch strain on and off Use piezoelectric material (e.g. PZT) High on-current & low off-current
T. Van Hemert et al.., IEEE Trans. El. Dev. 2013B. Kaleli et al., IEEE Trans. El. Dev. 2014
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The art of microchips today
1-nm precision manufacturing Atomary sharp interfaces High-purity materials Best mastered:
Aluminum, copper, tungsten Silicon; SiGe alloys SiO2, HfO2, Si3N4
Conventional wisdom:“If you can do it in CMOS, do it in CMOS”“If you can do it in silicon, do it in silicon”
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Emerging technologies in microelectronics:Replacing good old silicon
AIS
T
LETI
IBM
Selective GaN on Si Ultra-thin semi-on-insulator
Ge PMOS InGaAs NMOS
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Emerging technologies in microelectronics:Replacing FLASH memory
Competitors:• Resistive RAM• Phase-change RAM• STT Magnetic RAM
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But meanwhile, FLASH is going 3D
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Contents
Microelectronics: Moore’s Law today Technology advances inside the microchip Other microfabricated devices Prospects for radiation imaging
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Microtechnology: more than chips
Flat Panel Displays
PhotovoltaicsLight Emitting Diodes Semiconductor lasers
Microfluidics Sensors
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Microtechnology: more than chips
Flat Panel Displays
PhotovoltaicsLight Emitting Diodes Semiconductor lasers
Microfluidics Sensors
Steep market growthGaN-based technologyHetero-epitaxy
Haitz’ Law
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Microtechnology: more than chips
Flat Panel Displays
PhotovoltaicsLight Emitting Diodes Semiconductor lasers
Microfluidics Sensors
High potential:Point-of-care medicineInternet-of-thingsUses mainstream technology
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…and sensors for radiation imaging!
Microfabricated sensors in particle physics: Silicon detectors Charge-coupled devices Silicon photomultipliers CMOS-APS based detectors …Focus on semiconductors for signal generation. Scintillators? Gas?
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InGrid: a radiation imaging detector
Standard CMOS
SU-8 post
Al electrode
Imag
es: N
ikhe
f
TimePix
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Semiconductors on top of CMOS
“TFA detector”, Andrea Franco et al., IEEE Trans. Nucl. Sci. 2012
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Or vice versa?
Stack thin-film transistors on your sensor Monocrystalline: 3D electronics as developed e.g. by LETI (Batude et al.) Polycrystalline:
e.g. I. Brunets et al., IEEE Trans. El. Dev. 2009
Low temp fabrication (~400 °C) High interconnect density >> TSV’s
LETIU.Twente
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Advances in microfabrication:Consequences for Particle Physics
Miniaturized detector systems may boast Improved resolution and speed Reduced power consumption Less X0, lower mass Onboard intelligence “The interconnect benefit”
IC Future: new materials & lower-power circuits New semiconductor materials: GaN, InGaAs, Ge, … Performance in radiation imaging?
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TIPP 2014, Amsterdam
Thank you:
My coworkers at the University of Twente Nikhef Detector R&D group TIPP organizers Dutch Technology Foundation STW, Min. Economic Affairs, FOM and EU
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1-Dec-2010 Jurriaan Schmitz - VLSI Photonics Workshop
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Questions?
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TIPP 2014, Amsterdam
Semiconductor market: arguably the largest industry
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CPU clock frequency
The transistor count on a microprocessor has not increased since 2005. The clock frequency “ “ “ “ The transistor gate length has hardly reduced since 2005.
Chipworks: only 9% per generation lately, not 30% 90, 65, 45, 32, 22, 15 nm CMOS
RC bottleneck in the chip’s wiring
wikipedia
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Trends like Moore’s “Law” are not forever
Passenger airplanes
But airplanes got much better since 1960!
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Inside a TriGate chip
H5N1 virus(same scale)
chip
wor
ks