Oxford InstrumentsPlasma TechnologySystems & Process Solutions forEtch, Deposition & Growth

The Business of Science®

Process tools and leading-edgeprocesses for the precise,controllable and repeatableetching, deposition and growthof micro- and nano-structures

Plasma Etch & Deposition

Atomic Layer Deposition

Ion Beam Etch & Deposition

Nanoscale Growth Systems

Hydride Vapour Phase Epitaxy

Oxford Instruments Plasma Technologyprovides a range of high performance,flexible tools to semiconductor andelectronic processing customers in both R&D and production

Plasma Etch andDeposition

Si step coverage with 170nm Si2 TEOSPECVD

Plasma Etch

• ICP

• RIE

• RIE/PE switchable

• DRIE

Plasma Deposition

• PECVD and ICP CVD

• ALD (PE & thermal)

• DLC

• PVD

Oxford Instruments’ process tools offer a powerfulrange of stand-alone and clusterable processmodules to enable the widest range of applications:

Oxford Instruments has a process library of over6,000 recipes developed in our process laboratories

Our processes are backed by processguarantees for key parameters andrepeatability such as rate and uniformity to ensure rapid start-upduring installation.

• Compound Semi (III-V) processes

• Micro/Nano Applications

• Si front-end processes

• Si back-end processes

ICP etching of InP withCH4/H2/Cl2 chemistry

Low stress SiN film (400nm)

Polycrystaline Si etch 34nm gates Courtesy of AMO Aachen

System100

Thermal and/or plasma chemistries including:

Oxides: HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5

Nitrides: TiN, SiN, HfN

Metals: Ru, Pt

Atomic Layer Deposition

Flexibility and capability in the engineering ofNanoscale structures and devices

FlexAL® automatic insertion load locked ALD system

• Plasma and thermal ALD in one tool

• Can be clustered to other modules using hex handler withrobot and 25 wafer cassette for 4”,6” or 8” wafers (no tools requiredto swap between wafers).

• 100% conformal coatings of up to 200mm wafers handling andpieces on carrier plate

OpALTM open-load ALD System

• Thermal ALD system with easyupgrade route to plasma

• Fits in compact space of 1 x 1.5m

• Up to 200mm wafers and piecesdirectly on stage

Plasma ALD of 80 nm Al2O3 from TMA and O2 plasma in a 10:1 aspect ratio deep trenchcapacitor structure. Courtesy of Eindhoven University of Technology and Philips Research

FlexAL

OpAL

Thin film magnetic heads (left)Night vision security equipment (below)

Ion Beam Etch andDeposition

Oxford Instruments’ Ion Beam technology offersunique abilities in etch and deposition

Etch and Deposition tools

• Maximise system utilisation

• System specifications closely tuned to applications

• Faster & repeatable process results

Multiple mode functionality

• Ion Beam Etch (IBE)

• Reactive Ion Beam Etch (RIBE)

• Chemical Assisted Ion Beam Etch (CAIBE)

• Ion Beam Deposition (IBD)

• Reactive Ion Beam Deposition (RIBE)

Ionfab300Plus – Etch & deposition in one tool

Optofab3000 – Specifically developed for high qualityoptical applications

Ionfab500Plus – Ion beam sputter deposition, meetshigh throughput demands

Processes Including:

IBE/RIBE: InP/InGaAsP, CMT, SrTiO3, LaAlO3, MgO,NiFeCo,m Au, Pt, TaN

IBD/RIBD: Al, Au, Ti, Mo, SiO2, Al2O3, Si3N4, VOx

Ionfab300Plus Tool images produced with the cooperation of theOptoelectronics Research Centre, University of Southampton, UK

Nanoscale Growth

Nanoscale features can be formed by growthtechniques (‘bottom up’) and etching (‘top down’).The NanofabTM system is targeted at growth tosatisfy the nanotechnology markets

Nanoscale growth processes encompass:

• Nanotubes/nanowires

• Nanoscale thin films

Nanofab700 & Nanofab800Agile

• Can accommodate variable sample sizes up to 200 mm waferwith excellent temperature uniformity

• Compatible growth of nanotubes and nanowires with flexibletemperature up to 700°C and 800°C respectively

• Nanofab700 is compatible with Oxygen and other processatmospheres

• Nanofab800Agile can give agile heating and cooling for rapidturn round with its exceptional electrode features

Nanofab800Agile

Vertically aligned ZnO nanowires on GaN-coated sapphire. Courtesy of theNanoscience Centre, University of Cambridge

Hydride Vapour PhaseEpitaxy

A world leader in the development of Hydride VapourPhase Epitaxy (HVPE) processes and techniques forthe production of novel compound semiconductors,such as GaN, AlN, AlGaN, InN and InGaN

CrystalFlex® – a multi-wafer HVPE reactorproviding superb epitaxial growth control

Oxford Instruments’ leading CrystalFlex HVPE tool allows longlasting, high growth rate processes for high quality GaN andAlGaN single crystal materials.

CrystalFlex Key Features:

• Wide range of growth rates from 1 to 100 microns/hour

• Flexible wafer size configuration from 50 to 150 mm

• High quality, crack free epitaxial films with excellent thicknessuniformity

• Customized source configurations to allow material growth ofGroup III nitrides for different applications

• Low operating cost and excellent uptime

CrystalFlex

Proven Cassette to Cassettehandling technology with fullwafer tracking is available forboth single wafer and multi-wafer platen configurations

HBLED

Production processes and tools for HBLEDmanufacture offering exceptional Batch and SingleWafer capability

• Family of batch productionsolutions

- PECVD Batch Deposition

- ICP Batch Etch

• Single wafer processes andsystems

- ICP Etch

- ICPCVD and PECVD

• Highest possible throughput

• Proven e-chuck clampingcapability

AlGaInP Etching 20 x 2” and 5 x 4”batch or single wafer

GaN Etching 27 x 2” and 5 x 4”batch or single wafer

Sapphire Etching 18 x 2” and 5 x 4”batch or single wafer

800Plus

System133 ICP380

Oxford InstrumentsMarket Sectors

Oxford Instruments Plasma Technology’s hightechnology tools are used in a wide range ofapplications and markets

Display and Lighting

Information Communications Technology

Energy

Semiconductor Electronics

Niche & Emerging Technologies

The Business of Science®

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www.oxford-instruments.com

WorldwideService andSupport

Oxford Instruments is committed to supporting ourcustomers’ success. We recognise that this requiresworld class products complemented by world classsupport. Our global service force is backed byregional offices, offering rapid support whereveryou are in the world.

We can provide:

• Tailored service agreements to meet your needs

• Comprehensive range of structured training courses

• Immediate access to genuine spare parts andaccessories

• System upgrades and refurbishments

Email: plasma@oxinst.comTel: +44 (0) 1934 837000 (Head Office)

For worldwide office contact information please visit our website