disassembly notebo 201151025454

7/27/2019 Disassembly Notebo 201151025454

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EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available atEL-MF877-01

Product End-of-Life Disassembly InstructionsProduct Category: Notebooks and Tablet PCs

Marketing Name / Model[List multiple models if applicable.]

HP ProBook 4730s Notebook PC

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment1.1 Items listed below are classified as requiring selective treatment.1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.

Item Descrip tion Notes

Quantityof itemsincludedin product

Printed Circuit Boards (PCB) or Printed CircuitAssemblies (PCA)

With a surface greater than 10 sq cm 2

Batteries All types including standard alkaline and lithium coinor button style batteries

2

Mercury-containing components For example, mercury in lamps, display backlights,scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greaterthan 100 sq cm

Includes background illuminated displays with gasdischarge lamps

1

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuringgreater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardantsweighing > 25 grams (not including PCBs or PCAsalready listed as a separate item above)

Components and parts containing toner and ink,including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, ventchambers, and service stations.

Components and waste containing asbestos
http://standards.corp.hp.com/elclass/AMF87701.htmhttp://standards.corp.hp.com/elclass/AMF87701.htmhttp://standards.corp.hp.com/elclass/AMF87701.htmhttp://standards.corp.hp.com/elclass/AMF87701.htm


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EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available atEL-MF877-01

Components, parts and materials containingrefractory ceramic fibers

Components, parts and materials containingradioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.Tool Descript ion Tool Size (if

applicable)

Description #1 Motor-screw-driver +

Description #2 Motor-screw-driver *

Description #3 Motor-screw-driver -

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached).2. If parts can be removed without using a tool, remove it first.3. Use correct screwdriver and torque value before unlock the screw4.5.6.7.8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the itemscontained in the product that require selective treatment (with descriptions and arrows identifying locations).
http://standards.corp.hp.com/elclass/AMF87701.htmhttp://standards.corp.hp.com/elclass/AMF87701.htmhttp://standards.corp.hp.com/elclass/AMF87701.htmhttp://standards.corp.hp.com/elclass/AMF87701.htm


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Standard Operation Procedure

Document No. : SS11 Ramones-17 FA DIS-ASSY SOP Station :

Name : Ver. : Date :

Step

Notes : If finding anything uncommon, notice foreman or assistant at once.

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Tabulator Issue departmentAlicia Chien NPI-SE

Disassemble Battery

1. Take out Battery. (Fig.1)

1(1/1)

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Fig.1


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Step




. Disassemble bottom cover

2(1/1)

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1. Push the latch, loosen the bottom cover. (Fig.1)

2. Take out the bottom cover from BTCB. (Fig.2)

Fig.1

Fig.2


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Step




Remove master label

3(1/1)

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1. Rip the master label from BTCB. (Fig.1)

Fig.1


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Step




4(1/1)

Electric cross screw driver #1 1

1.00 2011/04/07Loosen screw

1. Loosen ODD screw *1, and loosen K/B

screw *2. (Fig.1)

1

Fig.1

23


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Step




5(1/1)

1.00 2011/04/07Disassemble ODD

1. Take out ODD. (Fig.1)

Fig.1


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Step




Disassemble DDR

1. Take out the DDR from BTCB. (Fig.1)

6(1/1)

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Fig.1


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Step




Loosen HDD screw

1. Loosen screw *4. (Fig.1)

7(1/1)

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2

3

4

1

Fig.1


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Step




Disassemble HDD

1. Take out the HDD from BTCB.

8(1/1)

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Step




Disassemble WLAN antenna cable

1. Take out the WLAN cable from routing

through. (Fig.1)

9(1/1)

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Routing stick 1

Fig.1


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Step




Disassemble antenna cable

1. Disassemble WLAN antenna cable from

WLAN card.

10(1/1)

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21

Fig.1

Routing stick 1


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Step




Disassemble WLAN card & loosen screw


2. Take out the WLAN from M/B. (Fig.2)

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WLAN

2

1

Fig.1

Fig.2


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Step




Loosen BTCB screw

1. Loosen BTCB screw *4.

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1

2

3

4


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Step




Loosen BTCB screw


13(1/1)

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1

2 43


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Step




Loosen BTCB screw


14(1/1)

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Electric plum blossom screw driver 1

1

2

3


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Step




Loosen BTCB screw


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1 23

4


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Step




16(1/1)

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Loosen BTCB screw


1

3

42


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Step




17(1/1)

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Loosen BTCB screw


4

1

2

3


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Step




Disassemble K/B

1. Disassemble K/B from TPCB.

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Fig.1


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Step




Pull out K/B FFC

1. Pull out K/B FFC from M/B (through the

broken hole of TPCB).

19(1/1)

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K/B FFC


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Step




Pull out FFC

1. Pull out Power button/B FFC from M/B

CNTR. (Fig.1)

2.Pull out Finger/B FFC from M/B CNTR.

(Fig.2)

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Fig.2Fig.1


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Step




Pull out FFC from M/B

1. Pull out Speaker cable from M/B CNTR.

(Fig.1)

2. Pull out Launch/B FFC from M/B CNTR.

(Fig.1)

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Fig.1


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Step




1. Loosen screw *3. (Fig.1/Fig.2)

Loosen TPCB & BTCB screw

21(1/1)

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Fig.2


1

2

3

Fig.1


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Step




Disassemble TPCB

1. Disassemble TPCB from the base.

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Fig.1


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Step




Disassemble TPCB & Pull out FFC

1. Take out the TPCB, and then put it in the

kitting box. (Fig.1)

2. Pull out Card reader FFC from M/B. (Fig.2)

23(1/1)

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Fig.1

Card reader/B FFC

Fig.2


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Step




1. Take out the WLAN cable from routing

through. (Fig.1/2/3)

2. Disassemble WLAN cable. (Fig.1/2/3)

Disassemble WLAN cable

24(1/1)

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Fig.1

Fig.3

Routing through

Fig.2


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Step




Disassemble LCM cable

1. Disassemble LCM cable. (Fig.1/2)

25(1/1)

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LCM CNTR

Fig.1

Routing stick 1

Fig.2


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Step




Disassemble Camera cable

1. Disassemble Camera cable.

26(1/1)

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Camera CNTR


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Step




1. Loosen screw *2. (Fig.1/Fig.2)

Disassemble LCM ground wire

27(1/1)

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2

1

Fig.3

Fig.1

Fig.2


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Step





2. Take out the LCM. (Fig.1)

Disassemble LCM

28(1/1)

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Fig.2


Fig.1

12


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Step




1. Pull out ODD/B FFC from M/B CNTR. (Fig.1)

2. Take out the ODD/B. (Fig.2)

Disassemble ODD/B

29(1/1)

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Fig.2

ODD/B

Hook

Routing through

Fig.1


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Step




Fig.1

1. Open USB/B FFC CNTR cover.

2. Pull out USB/B FFC from M/B CNTR. (Fig.1)

Pull out USB/B FFC

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Step




1. Loosen screw *2 (Fig.1), and then take out

the USB/B.

Disassemble USB/B

31(1/1)

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Fig.1


Fig.2

1

2


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Step




1.00 2011/04/07

[With Modem]:

1. Remove tape *1, and disassemble RJ11

cable. (Fig.1)

[W/O Modem]:

No this operation.

32(1/1)

1.00 2011/04/07Disassemble RJ11 cable

Fig.1

Hook


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Step




33(1/1)

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[With Modem]:

1. Pull out the RJ11 from HDD Ext. board.

(Fig.2)

[W/O Modem]:

1. Disassemble RJII dummy cover. (Fig.1)

Disassemble RJ11 cable

Fig.1

Hook

Fig.2


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Step




With Modem:


2. Take out the Modem from M/B CNTR.

Disassemble Modem module

34(1/1)

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Fig.1

1

2



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Step




1. Remove the Mylar from the fan. (Fig.1)

2. Take out the Lid switch/B FFC from M/B

CNTR. (Fig.2)

3. Take out the Lid Switch/B.

Disassemble Lid Switch/B

35(1/1)

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Fig.1

Fig.2


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Step





2. Loosen the DC-IN Jack from BTCB. (Fig.1)

Disassemble DC-IN Jack

36(1/1)

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Fig.1


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Step




37(1/1)

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1. Loosen M/B screw *3. (Fig.1 )

2. Loosen HDD Ext. board screw *2. (Fig.2 )

Loosen M/B screw


Fig.2

Fig.1

21

3


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Step




38(1/1)

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1. Pull out DC-In cable from BTCB. (Fig.1)

2. Take out the M/B from BTCB. (Fig.2)

Disassemble M/B

Fig.2

Fig.1


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Step




Loosen BATT cable screw

1. Loosen BATT cable screw * 2. (Fig.1)

39(1/1)

1.00 2011/04/07


1 2

Fig.1


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Step




Disassemble SIM card Rubber

[W/O SIM card]:

1. Take out SIM card Rubber. (Fig.2)

* No iron bracket is no SIM card. (Fig.1)

[With SIM card]:

No this operation.

40(1/1)

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Fig.2

SIM card Rubber

Fig.1


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Step




Disassemble Battery cable & HDD Ext./B

1. Put the M/B on the Support fixture. (B

side upward)

2. Pull out Battery cable from M/B. (Fig.1)

3.Take out the HDD Ext. board from M/B

(Fig.2)

4. Put the M/B on production line.

41(1/1)

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Fig.2Fig.1

Pull out Battery cable

Support fixture (M/B B side) 1


45/50




Step




Disassemble FAN & pull out FAN cable

1. Put the M/B on the Support fixture. (B side

upward) (Fig.1)

2. Take out the FAN from M/B. (Fig.2)

3. Loosen screw *1, pull out FAN cable from

CNTR. (Fig.3)


42(1/1)

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Fig.2

Fig.1

Fig.3




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Step




Disassemble Thermal & loosen screw


upward) (Fig.1)

2. Loosen thermal screw.

* Discrete model screw *2. (Fig.1)

* UMA model doesnt have this operation.


43(1/1)

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Fig.1

1

2


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Step




Disassemble DC-IN cable

1. Put M/B on the Support fixture.

(B side upward)

2. Pull out DC-IN cable from M/B. (Fig.1)


45(1/1)

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Fig.1



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Step




Disassemble CPU


upward)

2. Loosen CPU socket screw by using one-line

screw driver (counterclockwise), and then

take out the CPU from socket by using

suction pen, and put it in the kitting box.

3. For 45w CPU: Remove Mylar *1. (Fig.2)


46(1/1)

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One-line screw driver 1

Suction pen 1

Fig.2

Fig.1

35W CPU :W/O Mylar

45W CPU: With Mylar


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Step



1. Pull out Modem module & cable from

Module CNTR. (Fig.1)

Pull out Modem

47(1/1)

1.00 2011/04/07

Fig.1

disassembly notebo 201151025454

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