disassembly notebo 201111320166

EL-MF877-00

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.]

HP Slate 2

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

1

Batteries All types including standard alkaline and lithium coin or button style batteries

2

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

1

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing refractory ceramic fibers

Components, parts and materials containing radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Description #1 Motor-screw-driver “+”

Description #2 Motor-screw-driver “*”

Description #3 Motor-screw-driver “-”

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached). 2. If parts can be removed without using a tool, remove it first. 3. Use correct screwdriver and torque value before unlock the screw 4. 5. 6. 7. 8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY

审核：制表： Alicia Chien

MODEL : Akashi 2.0

A. Current station version list

B. Version Modify list

Revision Date Station Content Ver. Design

0.1 2011/09/19 ALL 首份 SOP 制作 0.1 李文正

Sub-assembly name: Akashi 2.0 FA DIS ASS’Y

Document No.: Akashi 2.0 FA DIS ASS’Y

Written by: 李文正 Revision: 0.1

Date: 2011/09/19 Page: 1

Station Ver. Station Ver. Station Ver. Station Ver.

1 0.1 8 0.1 15 0.1

2 0.1 9 0.1 16 0.1

3 0.1 10 0.1 17 0.1

4 0.1 11 0.1 18 0.1

5 0.1 12 0.1 19 0.1

6 0.1 13 0.1 20 0.1

7 0.1 14 0.1 21 0.1

Standard Operation Procedure

Document No. : Akashi 2.0 FA DIS ASS’Y SOP Station :

Name : Ver. : Date :

Step：

Notes : If finding anything uncommon, notice foreman or assistant at once.

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Tabulator： Issue department：Alicia Chien NPSU-SE

1. Disassemble Housing (PN:6070B0427802),

and put it in the material box.

Disassemble Housing in order (Fig.1), the

details see Fig.2 and Fig.3.

Slide the power button to the mark “ lock”.

(Fig.4)

Disassemble Housing

1(1/1)

2011/09/190.1

Step 1

Step 4

3 1

24

Fig.1

Fig.2

Fig.3

Fig.4




Step：




Electric cross screwdriver (Low speed) 1

Lock screw fixture 1

1. Put the tablet on the lock screw fixture.

2. Loosen screws--M2*2.5(6052B0120801)*4.

(Fig.1)

3. Loosen screws- M2*2.5(6052B0120801) *2.

(Fig.2)

Loosen screws

Front

Back

2(1/1)

2011/09/190.1

Fig.2

Fig.1

http://www.iec.inventec/sites/NPI/NPISE/Shared Documents/工具及標準表格/SOP Process.ppt




Step：




1. Pull out the Sensor FFC & LCDS cable.

(Fig.1/Fig.2/Fig.3)

2. Disassemble panel set and BTCB completely.

3. Put panel set & LCDS cable in material box.

Pull FFC & disassemble TPCB and BTCB

3(1/1)

2011/09/190.1

Fig.1

Fig.3Fig.2




Step：




4(1/1)

1. Rip the acid tape on Power/B. (Fig.1)

2. Rip the gasket * 2 and sponge *1. (Fig.2)

3. Rip the gasket on CR/B. (Fig.3)

Rip gaskets 2011/09/190.1

Fig.3Fig.2

Fig.1




Step：




5(1/1)

1. Rip the gasket * 3 on battery. (Fig.1)

2. Rip the gasket on docking CNTR bracket.

(Fig.2)

3. Rip the gasket on Power/B. (Fig.3)

Rip gaskets 2011/09/190.1

Fig.3Fig.1

Fig.2

1

32




Step：




6(1/1)

1. Rip AL Foil. (Fig.1)

2. Pull out the USB/B FFC ,Home/B FFC

from left to right. (Fig.2)

Pull FFC & Cable 2011/09/190.1

Fig.2

Fig.1

USB/B

FFCHome/B

FFC




Step：




7(1/1)

1. Pull out the CR/B , MIC/B, Volume/B,

FFC from left to right. (Fig.1)

2. Rip the acid tape * 2. (Fig.2)

Pull FFC & Cable 2011/09/190.1

Fig.1

Fig.2

CR/B MIC/B Volume/B




Step：




8(1/1)

1. Loosen SPK screw * 4 form right to left.

(Fig.1)

2. Pull out the SPK cable from M/B CNTR.

(Fig.2)

Disassemble SPK

Electric cross screwdriver 1

2011/09/190.1

Fig.2

Fig.1

124 3





Step：




1. Rip the gasket marked in red. (Fig.1)

2. Rip the gasket on red cable. (Fig.2)

3. Disassemble WWAN antenna. (Fig.3)

4. Loosen WWAN screw * 2. (Fig.4)

Ignore above procedures for

the sku w/o WWAN

Disassemble WWAN

9(1/1)


2011/09/190.1

Fig.3Fig.4

Fig.2

Fig.1





Step：




1. Disassemble WLAN antenna. (Fig.1)

2. Loosen Card Reader/B screw * 2, and put the

CR/B in material box. (Fig.2)

Loosen CR/B screws

Fig.2

10(1/1)

2011/09/190.1


2

1

Fig.1





Step：




Disassemble WLAN card

1. Loosen WLAN card screw * 2, and put the

WLAN card in material box. (Fig.1)

11(1/1)


2011/09/190.1

Fig.1

1

2





Step：




12(1/1)

1. Loosen SSD screw * 2, and put the SSD in

material box. (Fig.1)

2. Pull out the Power/B cable. (Fig.2)

Disassemble SSD 2011/09/190.1

Fig.2

Fig.1


1

2





Step：




1. Loosen M/B screw * 4. (Fig.1)

2. Take out the COVER,PHONE,JACK. (Fig.2)

13(1/1)

Loosen M/B screws 2011/09/190.1

Fig.2

1 2

3

4Fig.1






Step：




1. Loosen Docking CNTR BRKT screw * 2.

(Fig.1)

2. Loosen M/B screw * 2. (Fig.2)

14(1/1)

Loosen M/B screws 2011/09/190.1

Fig.2


Fig.1

1 2

1

2





Step：




15(1/1)

1. Disassemble the battery CNTR from M/B,

take out the battery and then put it in material

box. (Fig.1)

Disassemble M/B 2011/09/190.1

Fig.1




Step：




16(1/1)

For the sku with WWAN 1. Rip the WWAN(MAIN) antenna. (Fig.1)

For the sku w/o WWAN2. Take out the dummy. (Fig.2)

3. Loosen Home/B screw * 2, put the Home/B

in material box. (Fig.3)

Disassemble Home/B, antenna 2011/09/190.1

21

Fig.3

Fig.1


Fig.2





Step：




17(1/1)

1. Loosen Volume/B screw * 1. (Fig.1)

Disassemble Volume/ B 2011/09/190.1

Fig.1






Step：




1. Loosen camera screw * 1. (Fig.1)

2. Loosen USB/B screw * 2, put the USB/B

in material box. (Fig.2)

3. Put the USB cover in material box. (Fig.3)

Disassemble USB/B

18(1/1)

2011/09/190.1


Fig.1

Fig.2

Fig.3

1

2





Step：




1. Rip the gasket. (Fig.1)

2. Disassemble WWAN(AUX) antenna. (Fig.2)

19(1/1)

Disassemble WWAN(AUX) antenna 2011/09/190.1

Fig.1

Fig.2




Step：




Disassemble WLAN cable

20(1/2)

2011/09/190.1

1. Disassemble WLAN ,BT cable. (Fig.1)

Fig.1




Step：




Disassemble M/B

20(2/2)

2011/09/190.1

1. Loosen battery screw * 1, take out the

MIC/B，Power/B，WWAN(AUX), put the

battery in material box. (Fig.1)

2. Take out the label tray, put it in material

box. (Fig.2)

Fig.1

Fig.2






Step：




Disassemble WLAN antenna


21(1/1)

2011/09/190.1

1. Loosen WLAN (MAIN) screw * 1, take out

the antenna. (Fig.1)

2. Disassemble WLAN (AUX) antenna. (Fig.2)

3. Put the BTCB in material box.

Fig.1

Fig.2
