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Product End-of-Life Disassembly InstructionsProduct Category: Notebooks and Tablet PCs

Marketing Name / Model[List multiple models if applicable.]

Compaq Mini CQ10

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment1.1 Items listed below are classified as requiring selective treatment.1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.

Item Descrip tion Notes

Quantityof itemsincludedin product

Printed Circuit Boards (PCB) or Printed CircuitAssemblies (PCA)

With a surface greater than 10 sq cmMother board,Touch pad,RAM

3

Batteries All types including standard alkaline and lithium coinor button style batteries Battery pack, Coin cell

battery

2

Mercury-containing components For example, mercury in lamps, display backlights,scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greaterthan 100 sq cm

Includes background illuminated displays with gasdischarge lamps LCD Panel

1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuringgreater than 2.5 cm in diameter or height

0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardantsweighing > 25 grams (not including PCBs or PCAsalready listed as a separate item above)

0

Components and parts containing toner and ink,including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, ventchambers, and service stations.

0

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Components and waste containing asbestos 0

Components, parts and materials containingrefractory ceramic fibers

0

Components, parts and materials containingradioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where componentsand materials requiring selective treatment can be removed.

Tool Descript ion Tool Size (ifapplicable)

Description #1

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassemble Battery2. Disassemble service door3. Dis-fasten Bottom cover(R/L) screws*24. Remove Bottom cover (R/L5. Dis-fasten HDD BKT screw6. Remove HDD BKT module7. Dis-fasten HDD screw*48. Dis-fasten keyboard screw*29. Pull out Keyboard FFC cable10. Remove Keyboard11. Pull out LCD cable

12. Pull out Antenna cable13. Dis-fasten hinge screw*114. Remove LCD module15. Remove PMMA bezel16. Dis-fasten hinge screw*617. Remove Panel with hinge18. Dis-fasten Hinge screw*419. Remove hinge20. Dis-fasten WLAN card screw*121. Dis-fasten WWAN screw*122. Remove WLAN card23. Remove WWAN card24. Dis-fasten base screw*7

25. Dis-fasten TOP screw*526. Pull out Power FFC27. Pull out Camera cable28. Remove TOP29. Remove Speaker30. Dis-fasten TP PCB screw*231. Remove TP PCB32. Dis-fasten TP holder screw*2

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33. Remove DC cable34.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the itemscontained in the product that require selective treatment (with descriptions and arrows identifying locations).

LCD panel disassembly procedure

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