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Digi Embedded Training

Technical Training

November 2012

Session take away

• Understand Digi Embedded Benefits & Advantages

• Know which modules are available – Most important features

– Application selection

• Where to get product info

• How and where to get support from Digi

Solutions on Module

Core modules with wired and wireless

network connectivity

Pre-certified secure 802.11a/b/g/n wireless

Long-term availability

Future-proof embedded M2M gateway module

Pre-certified solution, universal 3G connectivity,

GPS and Ethernet

Ultra-compact wired and wireless

embedded device servers

Plug-and-play or C/C++

functionality, extended set of on-chip interfaces

Digi Wired and Wireless Solution-on-Modules

ConnectCore™ for Freescale i.MX ConnectCore™ 3G Digi Connect®

1-3 months design cycle 2-4 months design cycle 3-6 months design cycle 3-9 months design cylce

Complexity of Design / Time to market

100Ku+

- >10Ku

Module

Chip

Simple Ser. to Ethernet Simple dig. I/O NS9210 Based

ARM7 Based 32 bit processors NS7520 (not for new designs)

3-6 months design cycle 6-12 months design cycle 9-15 months design cycle

Rabbit 8/16 bit processors

Pro

duct

Volu

me

5Ku+

- 2Ku - <

500u

Rabbit Minicore/SBC R4000/R5000/R6000 Based

ARM9 Based 32 bit processors NS9210/9215

XBee PTP / ZigBee / DigiMesh Modules

ConnectCore 9P NS9215 Based

ConnectCore

Wi-i.MX51/53

Digi Embedded Solutions

ConnectCard

Wi -i.MX28

• Combine common embedded components • Simplify embedded product design • Eliminate placement of fine pitch BGA components • Reduce overall cost of board

• Pre-configured software support • Totally eliminate HW/SW Integration step

• Development Kit with Software Tools • No additional tools to buy

• Add-on Application Kits • Support for common applications

• Drastically reduce: • Initial NRE costs • Time to market

Embedded Module Benefits

Partners

Design Services

Products

Manufacturing

Company Founded in

1985 Global

Presence

Publicly Traded (NASDAQ: DGII)

Stable, No Debt

Strong Cash Position

Low-Volume / Specialty: In-House Manufacturing

High-Volume: Contract Manufacturers

(ISO 13485 Certified)

Out-of-Box Solutions

Software Support

Long-Term Availability

Pre-Certified Hardware

Design Reviews

Product Customization

Custom Development

Channel Services Technology Suppliers

Technology iDigi Scalable Device Cloud Platform

Application Development Services Wireless

802.11abgn

ZigBee, Bluetooth

Cellular

Satellite

Process Control ISO 9001 Certified

Design Control

Quality Control

Product Change Control

Customer Approval

Customer Notification

5-Year Warranty

Digi Embedded Products Digi Value Proposition

Total Val

Antenna Design

Certification Support

Embedded Product Lifecycle Product Availability Goals

Launch 1 year

Production 3-5 years

Not For New Designs

2-3 years

Last Time Buy

1 year

7-10 Years

Digi Embedded Processor Product Line

NET+ARM Microprocessors

• ARM processors with integrated Ethernet MAC for on-board solutions

• Complete Development Kits available for high-volume applications

• Used in Digi Embedded modules to provide long-term availability

JTAG Test and Debug

4K

ARM926EJ-S

Up to 150 MHz

4k I-Cache / 4k D-Cache

ARM

I/O Hub

10 Timers/ Counters

or 4 PWM

IRQ

ADC

12b-8ch Boot SPI

GPIO

Bus Arbiter

Ext. Peripheral Controller

GP

IO

Memory Controller

UA

RT

I2C

Flexible

Interface

Module

Pro

gra

m

Mem

ory

Data

Mem

ory

Flexible

Interface

Module

Pro

gra

m

Mem

ory

Data

Mem

ory

Power Management

Vectored Interrupt Controller

Qu

ad

ratu

re

Deco

der

75 MHz AHB Bus

32-Bit A/D

Real-Time Clock

NVRAM 64 Byte

UA

RT

UA

RT

UA

RT

PLL CLK Generator

AES Accelerator

10/100 Ethernet MII MAC

10/100 Ethernet MII MAC G

PIO

NS9215 265-pin BGA package, 15x15 mm, 0.18µ process

JTAG Test and Debug

4K

ARM926EJ-S

75-150 MHz


ARM

I/O Hub


9 Timers/ Counters

or 4 PWM

IRQ

Boot SPI

GPIO

Bus Arbiter


GP

IO

Memory Controller

UA

RT

I2C

AES Accelerator

Flexible

Interface

Module

Pro

gra

m

Mem

ory

Data

Mem

ory

Flexible

Interface

Module

Pro

gra

m

Mem

ory

Data

Mem

ory

Power Management


Qu

ad

ratu

re

Deco

der

75 MHz AHB Bus

32-Bit A/D

UA

RT

UA

RT

UA

RT

PLL CLK Generator

JTAG Test and Debug

4K

ARM926EJ-S

Up to 150 MHz


ARM

I/O Hub


10 Timers/ Counters

or 4 PWM

IRQ

Boot SPI

GPIO

Bus Arbiter


GP

IO

Memory Controller

UA

RT

I2C

AES Accelerator

Flexible

Interface

Module

Pro

gra

m

Mem

ory

Data

Mem

ory

Flexible

Interface

Module

Pro

gra

m

Mem

ory

Data

Mem

ory

Power Management


Qu

ad

ratu

re

Deco

der

75 MHz AHB Bus

32-Bit A/D

UA

RT

UA

RT

UA

RT

PLL CLK Generator

GP

IO

NS9210 177-pin BGA package, 13x13 mm, 0.18µ process

NS9210/NS9215 Feature Overview

• ARM926EJ-S @ up to 150 MHz • 4k data/4k instruction cache • Can operate at 1x or 2x AHB bus speed • and change on the fly

• Industrial operating temperature

• -40 to 85°C

• 2 x Flexible Interface Modules • DRPIC1655X CPU Cores

• 8-bit, x4 bus clock (300 MHz max) • 192 Bytes Data RAM • 1 KB Program RAM

• Low-power modes

• Sleep mode • Low-speed operation • Configurable wake-up events

• 10 Timers/Counters or 4 PWM

• Timers/counters with external I/O

• Quadrature Decoder

• 10/100 Ethernet MAC

• 4 x UARTs • Up to 1.8 Mbps

• Real-Time Clock and NVRAM

• 64 Bytes, battery backup

• A/D Converter • 12 Bit, 8 MHz sample • 8 channels, 1 MHz sample

• NIST-certified AES Encryption Engine

• 128-, 192-, 256-bit keys • ECB, CBC, CFB, OFB, CTR, CCM cipher

modes

• I2C Fast-Mode Interface

• SPI with serial boot

• 4 External Level/Edge IRQ Inputs

• 2 External DMA Channels

Digi Embedded Modules Product Line

Digi Embedded • Network-enabled System-on-Module Solutions

• Integrated 802.11abgn networking options • Additional Bluetooth options on upcoming modules • Dual-Ethernet (2 x MAC) options

• Designed for long-term availability (7-10 years) • Freescale i.MX automotive application processors • Selected wireless LAN radio components • Long lifecycle connectors with multiple supplier options

• Easy design integration and quick time-to-market • Design flexibility without the traditional design complexity • Complete out-of-the-box software platform support

• Windows Embedded CE, Linux, Android, 3rd Party • Pre-certified system on module solutions

• Emissions, immunity, safety, vibration, shock, etc. • High quality and reliable process control

• Industrial operating temperature supported • Including strong five-year hardware warranty

Module Certifications • Module certifications for unintentional radiation,

immunity, and safety minimize design risk and significantly accelerate product development cycle – FCC Class B, IC, CE, VCCI, UL/UR

• Entirely pre-certified WLAN radio further simplifies product development and integration process – Eliminates intentional radiation (radio) related certification cost

• Estimated cost of combined 802.11a/b/g approval for North America, EU and Japan is ≥ US$50k

– No radio design or homologation expertise required

– No approval maintenance or monitoring of worldwide regulatory changes

– Customers able to add antenna options to existing Digi certifications with only minimal extra cost

Module Architecture CPU Clock

(Max)

Digi Connect ME / Wi-ME ARM7 55 MHz

Digi Connect ME 9210 ARM9 75 MHz

Digi Connect Wi-ME 9210 ARM9 75 MHz

Digi Connect EM / Wi-EM / SP / Wi-SP ARM7 55 MHz

Digi Connect Wi-Wave Rabbit 6000

ConnectCore 9P 921x Family ARM9 150 MHz

ConnectCore 9P 9360 ARM9 155 MHz / 177 MHz

ConnectCore 9C / Wi-9C ARM9 155 MHz

ConnectCore for i.MX5x Cortex-A8 600 MHz / 800 MHz

800 MHz / 1 GHz

ConnectCard i.MX28 ARM9 454 MHz

Digi Embedded Modules Overview

Digi Embedded Modules Application / Performance Index

Connect ME 9210 Connect Wi-ME 9210

ConnectCore Wi-9P9215 / 3G

ConnectCore Wi-i.MX51

ConnectCard for Wi-i.MX28


Low-end networking

Industrial Automation (incl. CAN)

“Workhorse” Networking

High-Performance

HMI

Ultra Performance

HMI

Modules with CAN support for IA applications: • Connect ME9210 / Wi-ME9210 (FIM) • ConnectCore 9P9215 / Wi-9P9214 (FIM) • ConnectCore i.MX28 / Wi-i.MX28 • ConnectCore i.MX53 / Wi-i.MX53

ConnectCore V (2H2013)

Cortex A5 / M4

ConnectCore 6 (2013)

Quad-Core Cortex A9

Digi Connect

Connect ME Connect Wi-ME

Low-end networking



High-Performance

HMI

Ultra Performance

HMI

Digi Connect ME / Wi-ME 9210

High-performance, ultra-compact wired and wireless modules combine Ethernet networking, on-chip security and interface flexibility.

• Instant secure network connectivity

• Pre-certified 802.11bgn wireless module

• ARM9 application processing

• Compact RJ-45 form factor

• Pin-compatible family of module solutions

• Support for Digi NET+OS and Linux

Medical Devices

Power Distribution

Security/Surveillance

Industrial/Building Automation

Key Verticals/Applications

Key Features / Benefits

• Digi Connect ME® 9210,

Digi Connect® Wi-ME 9210

• Digi Connect ME®, Digi Connect® Wi-ME

Models Digi Connect® Modules

Digi Connect ME / Wi-ME 9210 Needs Solution Benefits

• Network connectivity for legacy medical equipment

• Digi Connect ME 9210 or • Digi Connect® Wi-ME 9210

• Cost-effective network connectivity solution

• Interchangeable wired/wireless solution

28

• Digi Connect ME form factor and pin-out compatibility

• Fully 802.3af compliant power pass-thru

• Performance improvements

• 75 MHz NS9210

• AES accelerator

• 921k UART

• Additional interface flexibility

• SPI port available

• FIM/PIC interfaces, without losing primary UART

• UART, 1-Wire, USB device, CAN, others

Connect ME 9210 Benefits

Digi Connect Wi-ME 9210 Benefits

• Digi NS9210 processor

– Up to 75 MHz clock speed

• Up to 8 MB flash / 16 MB SDRAM

• Digi Connect ME 9210 form factor

• Integrated 802.11bgn WLAN

– Up to 65 Mbps data rates

– Same radio technology as ConnectCore i.MX51

• Power management capabilities

– Digi NS9210 clock scaling

– Reduced Wi-Fi radio current draw

– Full proceed speed with 54 Mbps Wi-FI transmit: 483mA @ 3.3V

• Operating temperature -40 to 80C

– Higher possible with thermal management (HRM will provide guidance)

• Software platform support

– NET+OS 7.x

– Digi Embedded Linux 5.7

– Currently no plans to support Digi Plug-and-Play firmware

30

Simplified JSK Development Board

Support for Connect ME / Wi-ME / ME 9210 Will be used in entire Connect ME family

Improved Usability

Connector placement Fewer switches Descriptive silk screening

Functional Enhancements

Prototype area

Transceiver on/off

Power switch

PoE through external PoE module

Connect ME NS9210 Development Board

Exclusive Advantages Pin-compatible family of wireless and wired modules

Connect Wi-ME is 0.5 inches (1.27cm) longer Connect Wi-ME 9210 has the same size as Connect ME All other dimensions identical Ultra-compact form factor

Digi ConnectCore 9P/9C

ConnectCore Wi-9P9215 / 3G

Low-end networking



High-Performance

HMI

Ultra Performance

HMI

• Compact design for space-efficient designs

• Wide range of processor peripheral signals available on connectors

• Precisely designed processor & memory subsystem for optimum performance

• Digi NS9215 ARM9 processor and software drivers for long-term availability

Compact core for powerful, flexible embedded design

ConnectCore 9P9215 Features and Benefits

A powerful ARM9 core module with application processing, secure networking and

real-world interface capabilities.

ConnectCore 9P 9215 Overview

• NET+ARM NS9215 Processor – ARM926EJ-S ARM core – 150 MHz, 32-bit – Bus Speed 75 MHz max – 4K data/instruction caches

• Application Memory – 8/16/32 MByte SDRAM – 2/4/8/16 MByte NOR Flash

• Integrated Software Support – Digi NET+OS 7.5 – Digi Embedded Linux

ConnectCore 9P 9215 Application Processing

• 10/100 Ethernet on Module

– MAC on NS9215

– PHY on module

– Optional RJ-45 with magnetics

• AES Encryption Engine

– Hardware on NS9215

– NIST certified

– 128, 192 and 256-bit keys

– Range of encryption methods

• NET+OS Secure Networking

– SSL Support improved

– SSHv2 encryption protocol support

– Automatically detects AES Engine

ConnectCore 9P 9215 Secure Networking Support

• Memory Bus – 17 bit address, 16-bit data

• Digital System Peripherals – Up to 4 serial UARTs (1.8 Mbps max) – I2C Fast-Mode Interface – SPI with Boot Support – 4 External IRQ Inputs – 2 External DMA channels – Up to 64 GPIO – Real-Time Clock

• Analog Input Capabilities – A/D Converters

• 12 bit, 8 MHz Sample • 8 channels, 1 MHz sample

– 10 Timers/counters or 4 PWM channels – Quadrature decoder

ConnectCore 9P 9215 Real-World Interface Capabilities

• Industrial Temperature Range

– -40 to +85 C

• Compact Form Factor

– 48mm x 48 mm

– 2 x 80 pin connectors

• Certifications

– Emissions/Immunity

• FCC Class B, CE

– Reliability

• NEMA Vibration/Shock

ConnectCore 9P 9215 Additional Module Features

• Available:

– Flexible Interface Modules

– SSHv2 with AES Acceleration Engine

– Power Management Features

– LCD controller through memory bus interface:

• Color 320x240 – Himax controller

• B&W 320x240 – Epson controller

ConnectCore 9P 9215 Additional Features and Benefits

• Flexible Interface Modules (2)

– DRPIC1655X CPU Cores

• 8-bit, x4 bus clock

• 192 Bytes data RAM

• 2 KB Program RAM

– Digi-provided Interfaces

• Dynamically loaded by NET+OS/Linux

– SD/SDIO

– Additional UARTS

– CAN Support (available on request)

– USB Low speed

– 1-wire

– Others (e.g.: I2C, Wiegand)

Flexible Interface Modules offer UNIQUE interface flexibility for a wide variety of

applications and connectivity

ConnectCore 9P 9215 Real-World Interface Capabilities

• Power Management Features – Low-power modes – Sleep mode – Low-speed operation – Configurable wake-up events

• RTC • ADC • IRQ • Others

– On-the-fly Clock Scaling

• Power Profiles/Typical Performance to follow • Default: 554 mA max @ 3.3V DC

ConnectCore 9P 9215

ConnectCore Wi9P9215

• Wired/Wireless Modules

– ConnectCore Wi-9P

• Pin-compatible

• U.FL antenna connector

• Digi-developed radio

• Supports 802.11a/b/g

ConnectCore 3G

• Complete cellular gateway on embedded module solution

– Easy and quick design integration without cellular certification effort

– Functionality of Digi ConnectPort gateways in module form factor

• IPv4/IPv6, VPN (IPsec with IKE/ISAKMP, multiple tunnels, DES/3DES/AES encryption, VPN pass-through, GRE forwarding), SSL/SSH, SMS, ZigBee (via off-module Digi Xbee)

– Python scripting support for customer-specific application logic

• Embedded extensions such as power management (sleep mode), GPIO control/access,. and configuration strapping options

– Built-in private labeling (web interface, product name, etc.) options for OEM customers

– Future support for Digi Embedded Linux platform

• Extended operating temperature and small form factor

– -30 to 70°C, 70 mm (L) x 50 mm (W) x 15.4 mm (H)

• Truly global 3G cellular communication engine (Gobi 3000)

– Including active GPS antenna support and dual-SIM capabilities

• 10/100 Ethernet and high-speed USB host interface

– Available through board-to-board connector

– USB host for flash memory and WatchPort camera integration

• General availability October 2011

– Verizon certification November 2011

ConnectCore 3G Overview

ConnectCore 3G

Pre-certified 3G embedded cellular router

enables secure, scalable solutions with global

network connectivity.

• Integrated 3G cellular/Ethernet connectivity

• PTCRB certified – AT&T, Sprint and Verizon

• ARM9 application processing

• High-speed USB host interface

• Rich set of peripherals and off-module

connector options

Utilities

Transportation

Digital Signage





• ConnectCore™ 3G

Embedded 3G cellular router

(CC-9P-V527UJ-S)

Models ConnectCore™ 3G

Digi ConnectCore 3G

Digi ConnectCore 3G • Data Rate (Downlink/Uplink)

– HDSPA/HSUPA: 7.2 Mbps/5.76 Mbps, WCDMA: 384 kbps – GSM: 14.14kbps, GPRS: 85.6 kbps/42.8 kbps, EDGE: 236.8

kbps/118.4 kbps – EV-DO: 3.1 Mbps/1.8 Mbps, CDMA 1xRTT: 153 kbps

• Power Class – HSPA/WCDMA: Class 3, GSM/GPRS 850/900 MHz: Class 4 – GSM/GPRS 1800/1900 MHz: Class 1, EDGE: Class E2

• Dual Diversity (Receive) – HSPA/UMTS/EV-DO/CDMA modes

• Antenna Connectors – 1 x SMA (2 x U.FL optional)

• SIM Card Slots – 2 on module (off-module SIM slots optional)

• Network Interface – 10/100 Base-T, 10/100 Mbps (auto-sensing), full-/half-duplex

(auto-sensing)

Digi Confidential 49

ConnectCore 3G Module and JumpStart Kit

XBee Socket

Cellular Antenna Connectors (SMA)

USB Host

ConnectCore 3GJumpStart Kit Development Board Revision

ConnectCore 3G Needs Solution Benefits

• Access to temperature and environmental information in real-time

• ConnectCore 3G cellular gateway module

• XBee-enabled sensors • iDigi® Device Cloud™

• Secure, scalable solution ties remote device to applications

• Anywhere accessibility

Digi ConnectCore Wi-i.MX28

ConnectCard for Wi-i.MX28

Low-end networking



High-Performance

HMI

Ultra Performance

HMI

ConnectCard for i.MX28

What is it? • High-performance, cost-effective System-

On-Module based on Freescale i.mX280/287 processor

• Scalable, small form factor

• Focused interface/peripheral availability

• 802.1a/b/g/n Wi-Fi with Bluetooth 4.0

• Ethernet – single or dual MAC/PHY, 10/100 Mbit/s

• Integrated power management for battery powered devices

Target Availability: January 2013

Lab Equipment

Patient Monitoring

Telehealth

Security

Energy Gateways


ConnectCard for i.MX28 Module Block Diagram (Preliminary)

U.FL

802.11 a/b/g/n + BT 4.0

Up to 2 GB NAND

(SLC)

Up to 256 MB DDR2

PHY PHY

52-Position Edge Connector

LCD

/Tou

ch

Co

nn

ecto

r

Population Option

ConnectCard for i.MX28 Overview (Preliminary)

• High-performance, cost-efficient System-on-Module solution

- Freescale i.MX280/i.MX287 @ up to 454 MHz

- Pre-defined clock rate options below 454 MHz

- Up to 2 GB NAND Flash, up to 256 MB DDR2 @ 200 MHz

• Scalable, small form factor, low cost module platform

- 52-pin edge connector module design, 0.8 mm pitch, 30 x 51 mm

- Mating to inexpensive and widely available PCIe Mini Card connector

• Focused interface/peripheral availability

- Availability depending on i.MX28 variant populated

- UART, CAN, SPI, I2C, I2S, ADC, SD, USB, GPIO, PWM, JTAG/ETM

- 24-bit LCD/Touch through dedicated on-module connector (population option)

• 802.11a/b/g/n Wi-Fi with Bluetooth 4.0 (HCI) option

- Up to 150 Mbps data rate (MCS 7) at 5 GHz and optionally 2.4 GHz

- Dual-diversity option available for 2.4 GHz operation

- Wi-Fi Logo certification ready and CCXv4 certification ready

- Wi-Fi Direct and Wi-Fi AP mode (hotspot – up to 10 clients) support

• Ethernet – Single or dual MAC/PHY, 10/100 Mbit/s


UART Min 2, max 5 Inter-component communication within the customer’s design (MCUs, peripherals, etc.)

USB 2.0 OTG 1 USB connectivity for configuration, storage, data exchange, or inter-component communication within the customer’s design USB 2.0 Host Up to 1

SPI Up to 3 Inter-component communication within the customer’s design (MCUs, peripherals, etc.)

I2C Up to 2 Inter-component communication within the customer’s design (MCUs, peripherals, etc.)

I2S Up to 1 Low-cost, high-quality audio feedback (3-5 wire)

PWM Up to 4 Primary use for audio feedback (piezo buzzer, etc.)

SD/MMC/eMMC Up to1 Data storage/logging option

FlexCAN Min 1, max 2 Inter-component/inter-device connectivity bus

GPIO Up to 30 General purpose I/O, with interrupt/wake-up capability for power managed devices as well as tamper proofing

ADC • Up to 6-channels of LRADC, single HSADC (min 1)

1-Wire Up to 1 1-Wire device connectivity with parasitic power support (strong pull-up); population option

JTAG/ETM • On-module connector option (development only)

LCD / Touch (4/5-Wire) On-Module Connector

(Population Option) 5-Wire touch screen option for increased reliability, endurance (x20-30), no need for frequent recalibration

Integrated networking • 802.11abgn Wi-Fi with dual diversity, Bluetooth 4.0 connectivity option, Ethernet MAC/PHY (min 1, max 2)

Power 5VDC, Battery 5VDC, or 3.7~4.2V Li-Ion

Actual interface availability depending on module variant (i.MX280 vs. i.MX287) and application-specific muxing setup


Approvals

Radio US, Canada, EU,

Japan, Australia/NZ Pre-certified through modular approval process - eliminates regulatory approvals for customers

Emissions

FCC Part 15 Class B, EN 55022 Class B,

EN 61000-3-2, EN 61000-3-3,

ICES-003 Class B, VCCI Class II,

AS 3548, FCC Part 15 Subpart C

Section 15.247, IC (Industry Canada), RSS-

210 Issue 5 Section 6.2.2(o), EN 300 328,

EN 301 489-17

Related unintentional radiation, immunity, and safety test results provided as design support for customers

Immunity EN 55024, EN 301 489-3

Safety UL/UR, or equivalent

Environmental

Operating Temperature -40 to 75C Higher temperature ceiling possible through thermal management (lower speed, thermal pad, airflow, etc.)

Temperature Tests IEC 60068‐2‐1 IEC 60068‐2‐2

IEC 60068‐2‐78 Product reliability and quality

Vibration/Shock Tests IEC 60068‐2‐6

IEC 60068‐2‐64 IEC 60068‐2‐27

Design Tests HALT

Digi Confidential Information – NDA required

ConnectCard for i.MX28 Module and Development Board

(v2 Version)

Digi ConnectCore i.MX5x



Low-end networking



High-Performance

HMI

Ultra Performance

HMI

Core modules provide fast application processsing and up to 1080p/720p video capabilities.

• Freescale i.MX5x microprocessor

• Integrated 802.11a/b/g/n on module

• Power management IC for low-power mobile

applications

• All peripherals on module connectors

Medical Devices

Kiosk Systems

Digital Signage



Transportation



• ConnectCore™ i.MX53 / Wi-i.MX53

1 GHz Cortex-A8 module

• ConnectCore™ i.MX51 / Wi-i.MX51

800 MHz Cortex-A8 module

Models ConnectCore™ for i.MX

ConnectCore for iMX51 and iMX53

180-Pin Connector

180-Pin Connector

Security

SAHARA v4

Trust Zone

RTIC

SCC v2

SRTC

System Control

Secure JTAG

Power Mgmt

PLL x 3

Clock Reset

Timers

Watch Dog x2

Timer x3

PWM x2

Memory

ROM 32KB

RAM 96KB

Fast IrDA

1-Wire

I2C x2

GPIO

Keypad

Multimedia

OpenGL ES 2.0 + VG1.1

HW Video Codecs

HD720 TV-Out

Imaging Processing Unit

Image Signal Processor

Resizing & Blending

Inversion / Rotation

Image Enhancement

Dual-Camera Interface

Dual-Display Controller

External MemoryInterface

mDDR 200 MHzDDR2 200 MHz

600/800 Cortex-A8

Neon ETM

32KBI-Cache

32KBD-Cache

256KBL2-Cache

Vector FloatingPoint Unit

ARM Core

HS MMC/SDIO x4

SSI/I2S x3

UART x3

ATA-6

CSPI HS x2 / LS x1

SPDIF Tx

10/100 Ethernet

AXI / AHB Switch Fabric

USB OTG HS

USB HS x3

PHY

Smart DMA

Fuse BoxSeri

al E

EPR

OM

Up to8 GB Flash

Up to512 MBDDR2

2 x U.FL

10/100 (/1000)

Ethernet MAC

PHY

802.11a/b/g/n

MC1

3892

P

MIC

PHY

Acc

eler

om

eter

Population Option

ConnectCore for i.MX51 Module Block Diagram

• Feature-complete System on Module solution

– All Freescale i.MX51 peripherals/interfaces available

– Module design allows parallel use of dual camera, dual display and Ethernet

– Wired and wired/wireless LAN module variants available

• High-end core performance

– 600/800 MHz Freescale i.MX515 Cortex-A8 CPU

• 32K L1 I/D cache, 256k L2 cache, NEON, VFPU

– Cortex-A8 core performance 2.0 DMIPS per MHz

• Versus about 1.1 DMIPS per MHz for ARM9 cores

• Memory

– Up to 512 MB DDR2 (200 MHz) memory, up to 8 GB NAND flash

• Operating Temperature

– 0 to 70°C (800 MHz) and -40 to 85°C (600 MHz)

• Power management

– Advanced on-chip power management (CPU and accelerators)

– Integrated MC13892 Power Management IC

ConnectCore for i.MX51 Overview

• Integrated wired and wireless networking

– 802.11a/b/g /n WLAN

– 10/100 Ethernet (up to two)

• Second Ethernet port available in dual-display setup!

• Extensive security platform features

– Integrated SAHARAv4 encryption engine with support for AES/DES/3DES/RC4/C2, RSA/ECC, MD5/SHA-x

– RNG, Secure RTC, Secure RAM, Fuse Box, Tamper detection

• Integrated 3-Axis Accelerometer

– Freescale MA7455L

• On-chip multimedia support

– 2D/3D graphics hardware acceleration

– Multi-format video encoding/decoding hardware

– Image processing hardware, dual-camera interface

– I2S/AC97/SSI audio, optional SPDIF (Tx)


• Complete connectivity options

– UART, IrDA, GPIO, SPI, I2C, SD/SDIO/MMC, P-ATA, USB 2.0 HS Host, USB 2.0 OTG+PHY, 1-Wire, ISO 7816, ADC, PWM, Keypad

• External memory bus

– 16-bit data/28-bit address in non-multiplexed address/data mode

– 16-bit or 32-bit data/28-bit address in multiplexed address/data mode

• Development debug options

– ETM/ETB, JTAG, Secure JTAG

• Common module footprint for wireless/wired variants

– 82 mm (L) x 50 mm (W) x 8 mm (H) / 6.5 mm (H)

– 180-position board-to-board connector

• FCI P/N 61082-181409LF (mating FCI P/N 61083-184409LF)

– Connector pitch 0.8 mm for simplified manufacturing on customer side


Population Option

ConnectCore for i.MX53 Module Block Diagram

• High performance System-on-Module solution

- Freescale i.MX53 @ up to 1 GHz

- Up to 1 GB on-module DDR2 @ 400 MHz

• ConnectCore for i.MX51 form factor compatible

- Pinout similar, allowing common carrier board designs

- Digi will provide guidance in White Paper outlining design approach for common carrier boards – December 2011

• Improved video performance

- Up to 1080p video decode, up to 720p video encode

• On-chip LVDS and parallel LCD interfaces

• 802.11abgn Wi-Fi and Bluetooth 4.0 option

- Initial release with 802.11abgn (65 MBps)

- Up to 150 Mbps data rate (MCS 7) + BT via future release (TBD)

• Dual Ethernet MAC option

- On-chip Ethernet MAC provides IEEE1588 support

• IEEE1588 and dual-CAN bus controller

- Engage with local partners such as IXXAT to enable IA customers with respect to IEEE1588 and CAN



Freescale iMX51 vs. iMX53

Digi Overview

i.MX53 also provides dual-CAN (2.0b) on-chip Digi Confidential

Key Differences i.MX51 vs. i.MX53

78

ConnectCore for i.MX51 Final JumpStart Kit Development Board Design


ConnectCore for i.MX53 Development Board

ARM Embedded Module Roadmap

Development Released Definition Planning

January 2010

ConnectCore® for i.MX51

Freescale i.MX515 600/800 MHz Speed Grades Up to 8 GB NAND, 512 MB DDR2 Integrated MC13892 PMIC On-module 802.11a/b/g /n (65 Mbps) option Dual-Ethernet option Industrial operating temp available JTAG and ETM support

ConnectCore® for i.MX53

Freescale i.MX53 800/1000 MHz Speed Grades Up to 8 GB NAND, 2 GB DDR2 Integrated Dialog DA9053 PMIC On-module 802.11a/b/g /n (65 Mbps), 802.11abgn (150 Mbps) with BT 4.0 (follow-up) Dual-Ethernet option Industrial operating temp available JTAG and ETM support

January 2012

ConnectCore® 3G • ConnectCore Wi-9P compatible form factor • Qualcomm Gobi 3000 module (3G/GPS) - CDMA, EVDO (Rev A), WCDMA, GSM, GPRS, EDGE, DTM, HSPDA 7.2, HSUPA 5.76 - CDMA 800/1900, UMTS/HSPA 850/1900/2100/900, GSM/GPRS/EDGE 850/900/1800/1900 MHz - GPS, AGPS, gpsOneXTRA • Pre-certified any network, anywhere solution • Support for additional GSM and GSM-R options • -30 to 70C max (w/Gobi 3000) • Digi PnP Firmware

October 2011

Digi Connect® Wi-ME 9210 802.11bgn • NS9210 @ 75 MHz • Up to 8 MB flash / 16 MB SDRAM • Digi Connect ME® 9210 form factor • 802.11bgn WLAN • Power management • -40 to 80C (higher possible with thermal management) • NET+OS® 7 (Sept) , DEL 5.7 (Jan)

September 2011

ARM Embedded Module Roadmap


April 2013

ConnectCard™ for i.MX28

Freescale i.MX280/287 variants Initial i.MX28 module offering Focus on low cost and small form factor (~30 x 51 mm, edge connector, 0.8 mm pitch) On-module 802.11a/b/g/n, Bluetooth 4.0 option Dual-Ethernet option UART, CAN, SPI, I2C, I2S, SD, USB, PWM, ADC, 1-Wire, GPIO, LCD, JTAG/ETM (some via population options) -40 up to 85C, active/passive thermal management may be needed

ConnectCore 6

Freescale i.MX6x, Cortex-A9 dual/quad core LPDDR2/DDR3, NAND (SLC), Gigabit Ethernet Small form factor, cost-effective SMT module design (LGA) Development kits including 10” LCD panel w/P-CAP touch - Development board with PCI Express Mini Card Half-Size slot for 802.11n Wi-Fi (2x2) and 3G/4G Cellular Connectivity - Initial: DEL; Follow-up: Android, Windows Embedded Freescale launch participation 11/2012 (announcement only) Carrier PCB options for CC i.MX5x module compatibility, others

FQ413

ConnectCore V

Freescale Vybrid VF6xx (Cortex-A5 + Cortex-M4) Up to 256 MB LPDRR2/DDR3 (TBD), up to 2 GB flash On-module 802.11a/b/g/n and BT 4.0 option Integrated 3G/4G cellular option (SMT) On-module Dual-Ethernet connectivity w/L2 switch Operating temperature -40 to 85C Initial: DEL; Follow-up (TBD): Android Freescale launch participation Q1/CY2013 (announcement) Next-generation ConnectCore 4G

FQ413

FQ32013

iDigi Connector

Freescale Kinetis K60 Surface mount, small form factor, very low cost, low power Instant and secure iDigi integration for new/existing products - Custom application logic without native coding effort - Optional CodeWarrior/MQX custom development available

802.11abgn Wi-Fi, Ethernet, cellular connectivity options Device connectivity via UART, CAN, SPI, I2C, SPI, ADC, USB, GPIO Operating temperature range -40 to 85C Carrier PCB options for retro-fitting, including Xbee form factor (TBD)

ConnectCore V

What is it? • Highly flexible, high-performance core module

solution built on Freescale Vybrid 6xxx processor (heterogeneous dual-core)

• Combines application processor and microcontroller (Cortex-A5 processor and Cortex-M4 microcontroller enabled/disable independently)

• Ideal platform for power-efficient designs

• Complete set of integrated connectivity options and peripherals

• Common footprint for all connectivity options

• Replacement for ConnectCore 9C/9P platforms

Target Availability: FQ313

ConnectCore V Overview (Preliminary)

80-Pin Connector

4 x U.FL

Up to 2 GB Flash

Up to 512 MB DDR3

802.11 a/b/g/n

PHYs

Bluetooth

4.0

80-Pin Connector

2G/3G/ 4G

Cellular

ConnectCore V Overview (Preliminary)

• Uniquely flexible, high-performance core module solution

- Freescale Vybrid VF6xx processor (heterogeneous dual-core)

- Cortex-A5 (1.6 DMIPS/MHz) application processor at up to 500 MHz, with DP-FPU

- Cortex-M4 microcontroller at up to 167 MHz, with SP-FPU

- Up to 2 GB NAND Flash, up to 512 MB DDR3

• Combines application processor and microcontroller - Cortex-A5 application processor and Cortex-M4 microcontroller enabled/disabled independently

- Both cores share access to available peripherals and allow data exchange w/software applications

• Ideal platform for power-efficient designs - 40nm process, next-generation ARM Cortex application processor and microcontroller

- Wide range of power and wake-up modes targeting low-power applications

- Independent operation of cores allows unique low-power operation and power gating

• Complete set of integrated connectivity options and peripherals available - 802.11a/b/g/n Wi-Fi, Bluetooth 4.0, 2G/3G + Future 4G cellular, Dual 10/100 Ethernet

- I2C, SPI, QuadSPI, UART, CAN, USB host/OTG, SD/SDIO, GPIO, ADC, audio, LCD, crypto/security, JTAG

• Common module footprint for all connectivity options - Simple component population options on common footprint – true cross-product platform solution

• Out-of-box software support - Digi Embedded Linux (initial) and Digi Plug-and-Play Firmware (follow-up) for Cortex-A5

- Freescale MQX RTOS with CodeWarrior/IAR tools support for Cortex-M4

ConnectCore 6

What is it? • High-end multi-core System-on-module based on

Freescale i.MX 6 Dual/i.MX Quad multi-core processors

• Low-profile, small footprint module solution

• Multiple display support with full video acceleration

• Complete set of integrated connectivity options and peripherals available

• Platform for new and existing customers – new surface mount option offers cost-efficient differentiated offering

• Carrier PCBs allowing existing ConnectCore i.MX5x customers to migrate to i.MX6 platform

Target Availability: End 2013

ConnectCore 6 Overview (Preliminary)

Up to 8 GB Flash

Up to 4 GB

64-bit DDR3

802.11 a/b/g/n

Gigabit PHY

Accelerometer

Bluetooth 4.0

PF0100 PMIC

ConnectCore 6 Overview (Preliminary)

• High-end multicore System-on-Module solution

- Freescale i.MX 6Dual/i.MX 6Quad multicore processors

- Up to 4 Cortex-A9 (2.5 DMIPS/MHz) cores at up to 1 GHz each

- Up to 8 GB NAND Flash, up to 4 MB 64-bit wide DDR3

• Cost-efficient, low-profile, small-footprint module solution

- LGA module, max size 50x50 mm allowing machine placement

- Memory and PMIC provided on module, connectivity off-module (TBD)

- Reliable connector-less mounting ideal for ruggedized applications

• Multiple display support with full video acceleration

- Up to four displays, 720p/1080p resolution, multiple video and 2D/3D graphics accelerators

- On-module HDMI 1.4, LVDS, 24-bit RGB, MIPI DSI/CSI (display/camera) video interfaces

• Complete set of integrated connectivity options and peripherals available

- I2C, SPI, SATA, UART, CAN, USB host/OTG, SDXC/SD/SDIO, GPIO, touch, audio, crypto/security, JTAG

- 802.11a/b/g/n Wi-Fi, Bluetooth 4.0, Gigabit Ethernet on carrier PCBs

• Platform solution for new and existing customers

- New surface mount option offers cost-efficient and differentiated offering

- Carrier PCBs allowing existing ConnectCore i.MX5x customer to migrate to i.MX6 platform

- Future SOM standard form factor options viable (Qseven, others)

• Out-of-box software support

- Digi Embedded Linux (initial), Android 4.0 (ICS), Timesys LinuxLink, Windows Embedded (TBD)

iDigi Connector Overview (Preliminary)

CAN I2C UART SPI

USB

GPIO

AD

C

802.11 a/b/g/n

Cellular 3G/4G

ARM Cortex-M4

Flash SRAM

Eth

ern

et

DA

C

256-Bit AES Hardware

Encryption

Tamper Detect

iDigi Connector Overview (Preliminary)

• Instant iDigi integration for any device

- Small form factor, low profile, low power, low cost

- Built-in iDigi connectivity for management, programming, device data

- Custom application logic without native coding requirement

• Secure wired and wireless IPv4/IPv6 network connectivity

- SSL/TLS, WPA2 Personal and WPA2 Enterprise security

- FIPS 197 certified AES encryption capabilities

• Common SMT footprint with integrated wireless and wired connectivity

- 10/100 Mbit/s Ethernet, 802.11a/b/g/n Wi-Fi, 3G/4G Cellular

• Interface options for universal device integration flexibility

- UART, SPI, I2C, CAN, USB, GPIO, ADC/DAC

• Simplified retro-fitting of existing products

- Off-the-shelf carrier module with through-hole connectors (form factor TBD)

• Custom development option

- MQX development option for fully custom firmware

• Industrial operating temperature

- -40 to 85°C

802.11b/g

Digi Connect Wi-Wave

• Embedded radio card in compact form factor • 30 mm x 50.95 mm x 5 mm • 52-pin edge connector

• 802.11b/g connectivity • 2.4 GHz • Data rates up to 54 Mbps

• Long-term availability for embedded designs • Built using Digi’s own baseband processor technology

• Industrial operating temperature range • -40 to 85C

•Easy design integration through internal USB connectivity • USB 2.0 full-speed and high-speed support

• Broad embedded platform support for complete software integration flexibility

• Microsoft Windows CE 5.0/6.0 (ARM, MIPS, x86) • Linux, Microsoft Windows XP (Embedded)

Digi Connect Wi-Wave Overview

• Strong WPA2 wireless LAN security support • Seamless enterprise network integration • AES hardware encryption engine off-loads host CPU

• Dual-diversity option improves receive performance • Two on-board U.FL antenna connectors

• Receive Sensitivity • -68 dBm @ 54 Mbps

• Transmit Power • -12dBm @ 54Mbps

• Typical power consumption • Receive only: 250 mA @ 3.3V • Continuous transmit: 430 mA @ 3.3V

•Pre-certified in North America, Europe, and Japan • Significantly reduced time-to-market and design risk/cost • Antenna options 2 dBi (2.4 GHz), 3.6 dBi and 5.5 dBi (2.4/5 GHz)

Digi Connect Wi-Wave Overview

Part Number Availability

Digi Connect Wi-Wave 802.11b/g Evaluation/Development Kit

DC-WWV-EKIT Now

(802.11b/g)

Digi Connect Wi-Wave 802.11b/g Single Unit

DC-WWV-2A Now

(802.11b/g)

Digi Connect Wi-Wave 802.11b/g 25-Unit Bulk

DC-WWV-2A-B Now

(802.11b/g)

•Certification Status • 802.11b/g certifications US, Canada, EU complete

• Migration • Migration from previous to next-generation Digi Connect Wi-Wave through new common Windows CE driver supporting both variants

• Additional software platform support • Linux (Kernel 2.6.32 and lower) • Windows XP Embedded

• Part Numbers

Digi Connect Wi-Wave Status and Availability

Embedded Wi-Fi Radio Modules Roadmap

June 2010

July 2010

December 2010

Digi Connect Wi-Wave 802.11bg • Software platform support - Microsoft Windows XP (Embedded)

• 2nd Generation module only

Digi Connect Wi-Wave 802.11bg • Windows CE 5.0 / 6.0 • Common driver for 1st and 2nd Generation module

Digi Connect Wi-Wave 802.11bg • Linux kernel 2.6.29-32 • Platform support for 2nd generation module only


Digi JumpStart Kits and Software for

Digi Embedded Products

Powerful, easy to use and a great value! Ethernet and 802.11b/g support All hardware and tools included

– Module and Development baseboard – NET+OS 7 with Digi ESP

Integrated Microcross GNU Tools Digi JTAG Link USB Debugger

– Power supply and all cables needed – Full documentation and baseboard schematics

Linux and Windows Embedded CE 6 Available – Currently without Digi JTAG Link USB Debugger

Digi JumpStart™ Kits

ConnectCore (Wi-)9P9215 Development board

• Networking Connectors – Ethernet RJ-45 w/magnetics – 2 x RP-SMA via U.FLs for Wi-modules

• 1 x MEI Serial Port, 1 x RS232 Console Port • LCD connector • I2C, SPI, ADC, UART C/D Header • Digital I/O - (I2C GPIO expander)

– 10 GPIOs on screw terminal

• RTC w/battery backup – Battery on development board

• Small Prototyping Area • Peripheral Application Header

– Standard pin out across all JSKs

• Signals Rails – Including PIC signals

• JTAG Connector • 9-30VDC Power Supply including PoE option

Typical JumpStart Kit Content

• Digi JTAG Link USB Debugger

– Segger J-Link Digi brand labeled

– Download Speeds 200 KBytes/Second

– USB 2.0 Support

– Powered through USB

– Optional Flash programming software

– Available as accessory for ~$300.

– Currently supplied with all NET+OS kits, planned for future Linux kits

Jump Start Kit Components

• Application Kit documention

Application Kits

http://www.digi.com/support/identifyfamily.jsp?tp=3

http://www.digi.com/support/identifyfamily.jsp?tp=3

Application Kit Roadmap ARM


June 2011

Camera Application Kit • Micron MT9V111 sensor (VGA) • 2.1 mm lens (Mini-S), f/2.0, 170˚h • Hardware platform support - ConnectCore for i.MX51 • Software platform support - Windows Embedded CE, Linux

CY2012

Ubuntu Technology Pack • Ubuntu build for ConnectCore for i.MX53 - Based on Freescale LTIB • Window manager, desktop, Firefox browser, etc. • Wi-Fi, Ethernet, VPU/GPU, LCD panel and HDMI monitor (1080p) • Free binary and source code distribution (online only) • Native build environment (TBD) • Additional services through Spectrum Design or partners

March 2012

iDigi Telehealth Application Kit • Freescale i.MX28 based reference design • Wi-Fi, Ethernet, ZigBee, Sub-GHz, Bluetooth, NFC • Windows Embedded Compact 7 and Android UI • iDigi Device Cloud integration • Design services provided through Spectrum Design http://www.digi.com/hhh

December 2012

7” TFT LCD Application Kit Update • Support for direct LVDS display connections • Added native support for Touch Revolution Fusion 4/7/10 LCD panels with bonded projective capacitive (PCAP) touch screen (multi-touch gesture support depending on available Digi software platform support on target systems) – reference display only http://www.touchrev.com/products/fusion

http://www.digi.com/hhh

http://www.touchrev.com/products/fusion


Q & A

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