development of new negative -tone molecular resists based

8
1 Development of New Negative Development of New Negative-tone Molecular tone Molecular Resists Based on Phenylcalix[4] Resists Based on Phenylcalix[4] resorcinarene resorcinarene for EUVL. for EUVL. Investigation of correlation with the Investigation of correlation with the octanol octanol water water partition coefficient and the sensitivity of negative partition coefficient and the sensitivity of negative- tone molecular resists tone molecular resists Masatoshi Echigo , Masako Yamakawa, Yumi Ochiai, Yu Okada and Masaaki Takasuka Mitsubishi Gas Chemical Company, Inc. 2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 2 Motivation for N Motivation for Negative egativeTone one Resist Resist Negative egative‐tone tone resists are limitedly influenced by flare. resists are limitedly influenced by flare. We believe Negative We believe Negative-tone resist can achieve these required properties. tone resist can achieve these required properties. MPU gate in resist length (nm) 2007 ITRS Roadmap LWR (3sigma) <8% of CD 1.7 21 2.4 30 MPU gate in resist length (nm) MPU gate in resist length (nm) 2007 ITRS Roadmap LWR (3sigma) <8% of CD 1.7 21 2.4 30

Upload: others

Post on 16-Oct-2021

2 views

Category:

Documents


0 download

TRANSCRIPT

1

Development of New NegativeDevelopment of New Negative--tone Molecular tone Molecular Resists Based on Phenylcalix[4] Resists Based on Phenylcalix[4] resorcinareneresorcinarenefor EUVL.for EUVL.

Investigation of correlation with the Investigation of correlation with the octanoloctanol water water partition coefficient and the sensitivity of negativepartition coefficient and the sensitivity of negative--tone molecular resiststone molecular resists

Masatoshi Echigo, Masako Yamakawa, Yumi Ochiai,Yu Okada and Masaaki Takasuka

Mitsubishi Gas Chemical Company, Inc.

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 2

Motivation for NMotivation for Negativeegative‐‐TTone one ResistResist

NNegativeegative‐‐tone tone resists are limitedly influenced by flare.resists are limitedly influenced by flare.We believe NegativeWe believe Negative--tone resist can achieve these required properties.tone resist can achieve these required properties.

MPU gate in resist length (nm)

2007 ITRS Roadmap

LWR (3sigma) <8% of CD 1.7

21

2.4

30MPU gate in resist length (nm)MPU gate in resist length (nm)

2007 ITRS Roadmap

LWR (3sigma) <8% of CD 1.7

21

2.4

30

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 3

Aromatic aldehyde

Resorcinol

ConceptsDemands

Low molecular weightLow molecular weightUniformityUniformity

Branch structure

Easy manufactureEasy to get raw materialsNo metal contamination

Chemical amplified type

High density of C atom

High resolutionSmaller LER

High sensitivity

High Tg

Coating ability(amorphous)

Etching durability

New New PhenylcalixPhenylcalix[4]resorcinarene [4]resorcinarene

DerivativesDerivatives

Manufactured by the reactionbetween Aromatic aldehyde

and Resorcinol

Materials

Productivity

Suppressedoutgassing

Rigid cyclic structureRigid cyclic structure(as a (as a CalixareneCalixarene))

HydrophobicityHydrophobicity(No swelling)(No swelling)

Design Concepts for New NegativeDesign Concepts for New Negative--tone tone Molecular Resist MaterialMolecular Resist Material

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 4

Motivation for negativeMotivation for negative‐‐tone molecular resisttone molecular resist

Polymer Molecular Resist

Low LERLarge LER

40nmhp

LER(3σ)= 1.5nmLER(3σ)= 7.3nm

90nmhp

-- Phenylcalix[4]resorcinarenes are smallPhenylcalix[4]resorcinarenes are small--size and highsize and high--TgTg molecules,molecules,enough for patterning highenough for patterning high--resolution and lowresolution and low--LER.LER.

Our proposal for molecular resist materials.Our proposal for molecular resist materials.Our proposal for molecular resist materials.Our proposal for molecular resist materials.M. Echigo et al., 5th International EUV Symposium, 01010101‐‐‐‐RERERERE‐‐‐‐27 27 27 27 (2006)

OH

n

Mw = 8000

OH

OHOH

HO

Mw = 692

EBEB

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 5

Previous Data Previous Data (Negative(Negative--tone resist using MGR108)tone resist using MGR108)

-- Patterns were well defined at Patterns were well defined at ≦≦30 30 nmhpnmhp. .

44

MGR108

HO OH

12.86.124.026

Esize(mJ/cm2)LWR (nm)

CD (nm)

nZ(32)

EUV

LS Pattern

By courtesy of SEMATECH

EB 30nm hp,60nmtLER=--nm,52μC/cm2

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 6

Previous Data Previous Data (Negative(Negative--tone resist using CRAtone resist using CRA--02)02)

44HO OR1

OH

CRA-02

EBEBEBEBEBEBEBEB 40nm hp,55nmt40nm hp,55nmt40nm hp,55nmt40nm hp,55nmt40nm hp,55nmt40nm hp,55nmt40nm hp,55nmt40nm hp,55nmtLERLERLERLERLERLERLERLER=3.4nm,90=3.4nm,90=3.4nm,90=3.4nm,90=3.4nm,90=3.4nm,90=3.4nm,90=3.4nm,90μμμμμμμμC/cmC/cmC/cmC/cmC/cmC/cmC/cmC/cm22222222

EBEBEBEBEBEBEBEB 30nm hp,55nmt30nm hp,55nmt30nm hp,55nmt30nm hp,55nmt30nm hp,55nmt30nm hp,55nmt30nm hp,55nmt30nm hp,55nmtLERLERLERLERLERLERLERLER=3.0nm,90=3.0nm,90=3.0nm,90=3.0nm,90=3.0nm,90=3.0nm,90=3.0nm,90=3.0nm,90μμμμμμμμC/cmC/cmC/cmC/cmC/cmC/cmC/cmC/cm22222222

EBEBEBEBEBEBEBEB 25nm hp,55nmt25nm hp,55nmt25nm hp,55nmt25nm hp,55nmt25nm hp,55nmt25nm hp,55nmt25nm hp,55nmt25nm hp,55nmtLERLERLERLERLERLERLERLER=4.1nm,90=4.1nm,90=4.1nm,90=4.1nm,90=4.1nm,90=4.1nm,90=4.1nm,90=4.1nm,90μμμμμμμμC/cmC/cmC/cmC/cmC/cmC/cmC/cmC/cm22222222

-- Patterns were well defined at 40Patterns were well defined at 40--25 25 nmhpnmhp. .

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 7

The purpose of this studyThe purpose of this study

Investigation of correlation with Investigation of correlation with the the octanoloctanol water partitionwater partitioncoefficient (coefficient (ClogPClogP)) and and the sensitivity at a dose of 50 the sensitivity at a dose of 50 nmhpnmhp of of negativenegative--tone molecular resists.tone molecular resists.

The values of the The values of the octanoloctanol water partition coefficient werewater partition coefficient were measured measured by by ChemPropChemProp Pro for Pro for ChemChem 3D3D..

The octanol water partition coefficient logP is used in QSAR studies and rational drug design as a

measure of molecular hydrophobicity. Hydrophobicity affects drug absorption, bioavailability,

hydrophobic drug-receptor interactions, metabolism of molecules, as well as their toxicity.

LogP has become also a key parameter in studies of the environmental fate of chemicals.

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 8

General synthesis of HPGeneral synthesis of HP--CRACRA

H+

+

44HO OR1

OH

CHO

OH n

HO OR1HO OH R1-BrOH

OH n

n = 0 or 1

Six HPSix HP--CRA derivatives as a mixture of various isomers were CRA derivatives as a mixture of various isomers were synthesized in high yields(99%).synthesized in high yields(99%).

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 9

General synthesis of APGeneral synthesis of AP--CRACRA

H+

+

44HO OH

R2

R2

CHO

HO OH

H+

+

44HO OH

R2

R2

CHO

HO OH

Two APTwo AP--CRA derivatives as a mixture of various isomers were CRA derivatives as a mixture of various isomers were synthesized in high yields(99%).synthesized in high yields(99%).

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 10

Experiment (Resist composition)Experiment (Resist composition)

PAGPAG--1 1 : : sulfoniumsulfonium sulfonatesulfonateHMMMHMMM : : hexamethoxymethylmelaminehexamethoxymethylmelamineQQ--11 : amine: aminePGMEPGME : propylene glycol : propylene glycol monomethylmonomethyl etherether

Q-1

Quencher

PGMEHMMMPAG-1

HP-CRA-01Resist A

HP-CRA-02Resist B

HP-CRA-03Resist C

HP-CRA-04Resist D

AP-CRA-08Resist H

AP-CRA-07Resist G

HP-CRA-06Resist F

HP-CRA-05Resist E

SolventCross-LinkerPAGMatrix

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 11

Experiment (EB Patterning Evaluations)Experiment (EB Patterning Evaluations)

Apparatus: Apparatus: UltraUltra--High Precision EB Lithography System High Precision EB Lithography System (ELS(ELS--7500 ; Acceleration Voltage 50 7500 ; Acceleration Voltage 50 keVkeV))at Mitsubishi Gas Chemical (MGC)at Mitsubishi Gas Chemical (MGC)

Process Conditions:Process Conditions:Substrate: Organic layer (UL)Substrate: Organic layer (UL)Film Thickness: 30Film Thickness: 30--60nm 60nm PBPB&&PEB: 110PEB: 110℃℃/90s/90sDev.: TMAH 0.26N 60sDev.: TMAH 0.26N 60s

Analysis Conditions:Analysis Conditions:SEM: S4800SEM: S4800

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 12

Characteristics of CRAs(1/2)Characteristics of CRAs(1/2)

8017.85> 50HP-CRA-04

5020.24> 50HP-CRA-03

12015.78> 50HP-CRA-02

8418.16> 50HP-CRA-01

Sensitivity

(μC/cm2)

ClogPDissolution

rate(nm/min)

Model

Structure

Matrix

44HO O

OH

44HO O

OH

44HO O

OHOH

44HO O

OHOH

44HO O

OH

44HO O

OH

44HO O

OHOH

44HO O

OHOH

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 13

Characteristics of CRAs(2/2)Characteristics of CRAs(2/2)

7815.35> 50AP-CRA-08

4820.12> 50AP-CRA-07

6019.97> 50HP-CRA-06

2022.36> 50HP-CRA-05

Sensitivity

(μC/cm2)

ClogPDissolution

rate(nm/min)

Model

Structure

Matrix

44HO O

OH

44HO O

OH

44HO O

OHOH

44HO O

OHOH

44HO OH

44HO OH

44HO OH

44HO OH

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 14

y = -14.647x + 347.08y = -14.647x + 347.08y = -14.647x + 347.08y = -14.647x + 347.08

RRRR2222 = 0.9874 = 0.9874 = 0.9874 = 0.9874

0000

20202020

40404040

60606060

80808080

100100100100

120120120120

140140140140

15151515 17171717 19191919 21212121 23232323

Octanol Water Partition Coefficient ; ClogPOctanol Water Partition Coefficient ; ClogPOctanol Water Partition Coefficient ; ClogPOctanol Water Partition Coefficient ; ClogP

Sensit

ivit

y (

μC

/cm

2)

Sensit

ivit

y (

μC

/cm

2)

Sensit

ivit

y (

μC

/cm

2)

Sensit

ivit

y (

μC

/cm

2)

Correlation between the Correlation between the octanoloctanol water partition water partition coefficient and the sensitivitycoefficient and the sensitivity

The sensitivity of resists were higher as the value of the The sensitivity of resists were higher as the value of the octanoloctanolwater partition coefficient got smaller.water partition coefficient got smaller.

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 15

Highlight Data Highlight Data ((New ResistNew Resist) ) -- Update Update --

EB 15nmhp48μC/cm2

EB 10nmhp44μC/cm2

EB 20nmhp52μC/cm2

44

calix[4]resorcinarenederivative

YO OX

Z n

-- By using new calix[4]resorcinarene derivative,By using new calix[4]resorcinarene derivative,sub 30nm hp patterns were resolvedsub 30nm hp patterns were resolved at the high sensitivity at the high sensitivity

2012.10.1 2012 International Symposium on Extreme Ultraviolet Lithography 16

SummarySummary

-- We invested of correlation with the We invested of correlation with the octanoloctanol water partition coefficient water partition coefficient and the sensitivity of negativeand the sensitivity of negative--tone molecular resists based on tone molecular resists based on calix[4]resorcinarene (CRA) by Electron Beam Lithography (EBL). calix[4]resorcinarene (CRA) by Electron Beam Lithography (EBL).

-- The sensitivity of negativeThe sensitivity of negative--tone molecular resists were higher as the tone molecular resists were higher as the value of the value of the octanoloctanol water partition coefficient got smaller. water partition coefficient got smaller.

-- It was confirmed that the It was confirmed that the octanoloctanol water partition coefficient was useful water partition coefficient was useful to the guess of sensitivity of negativeto the guess of sensitivity of negative--tone molecular resists. tone molecular resists.

-- Furthermore, we have developed new calix[4]resorcinarenes showiFurthermore, we have developed new calix[4]resorcinarenes showing ng wellwell--defined sub 20nm halfdefined sub 20nm half--pitch patterns. pitch patterns.

-- Future study is underway to improve resist performance through Future study is underway to improve resist performance through material material and process optimization to evaluate resist performance by EUV and process optimization to evaluate resist performance by EUV lithography (EUVL).lithography (EUVL).