atlas 46 novel negative tone photoresist which combines ...atlas 46 –novel negative tone...
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Atlas 46 – novel negative tone photoresist which combinesthe good properties of the established SU-8 and CAR 44
EIPBN, 30th Mai 2018
Dr. Christian Kaiser, Matthias SchirmerAllresist GmbH, Germany
Outline
• Short Introduction of Allresist GmbH
• Well-established CAR 44 for i-line and g-line
• Motivation/ Goal
• New development Atlas S and Atlas R
• PAG-variation to ensure h-line and g-line sensitivity
• 3D structures by variation of photoacid generator (PAG)
• 3D structures via double imprint lithography (University of Wuppertal)
• Fluorescent Atlas 46 S layers
206.06.2018
Short Introduction of Allresist GmbH
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• Founded 16th October in 1992, located in Strausberg, Germany
• Quality management system ISO 9001:2008 and ISO 14001:2004
• Since 2006 on the way of business of excellence
• Global player with competent support (> 50 % export)
• Full equipment of resist characterization and modern analytic methodes
• Intense scientific cooperations with universities, institutes and industrial partners
• 32 scientific projects completed successfully
• Customer specific, taylor-made resists, short lead times
Turbine wheel produced with AR-N 4400-50, thickness: 100 µm via double coating
3 µm resolution, pattern with AR-N 4400-10,thickness: 15 µm
Benefits
• High sensitivity, excellent resolution
• Suitable for g-line and X-ray as well
• Excellent properties for galvanic applications, vertical profiles, easy to remove
• Good plasma etching stability
Drawbacks
• Compared to SU-8 lower stability
• Highest single layer up to 50 µm, SU-8: 200 µm
Well-established CAR 44 for i-line and g-line
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Vertical profiles, AR-N 4400-50, thickness: 55 µm
Art work, pattern with AR-N 4400-10
Motivation / Goal
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• CAR 44 is a high quality negative resist but stability is insufficient for some applications
• Limitation of well-known SU-8: difficult to remove, low sensitivity at i-line
• Creating a resist with good properties similar to SU-8 with higher sensitivty at i-line and easy to remove
• Herein we like to present different versions of new Atlas 46:
– AR-N 4600-10 (Atlas 46 S) – properties very similar to SU-8 (plug&play resist)
– AR-N 4650-10 (Atlas 46 R) – removable resist version (e.g. for galvanic applications)
– SX AR-N 4610-10/1 – version with significantly enhanced sensitivity at i-line
– SX AR-N 4620-10/1 – h/g-line sensitive (e.g. for two-layer applications)
New development: Atlas 46 S / Atlas 46 R
• Suitable for applications with layers which need to remain permanently & resistively on substrate
• Sensitivity (broad band UV) 120 mJ/cm²
• Depending on exposure dosage and PEB individually adjustable removability
• Sensitivity (broad band UV) 140 mJ/cm²
• Resist thicknesses: 5 µm up to 200 µm (single coating step, temperature ramp recommended for thicker layers)
• Tg: 35°C – 45°C, thermal stability (cross-linked): up to 300°C
• Developers for Atlas 46 S; strong: AR 600-70, weak: AR 300-12
• Developers for Atlas 46 R; strong: AR 300-12, weak: AR 600-0706.06.2018
New development: Atlas 46 S and Atlas 46 R
Resist thickness vs. solid content
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Atlas 46 R: 100 s exposure, 5 min @ 95 °C PEB hotplate, 60 s AR 300-12 (university of Halle)
Atlas 46 S: 40 s exposure, 5 min @ 95 °C PEB hotplate, 60 s AR 300-12, (university of Halle)
• Correlation between film thickness and solid content comparable to SU-8
• Well-defined line pattern with vertical walls
PAG-variation to ensure h-line and g-line sensitivity
PAG4 in SX AR-N 4620-10/1 for h-/g-line sensitivityRed line: SX AR-N 4610-10/1, enhanced i-line sensitivity (PAG3)Blue line: mercury lamp spectra
• Atlas S/R and SU-8 relative low sensitivity at i-line (365nm)
• New PAG’s suitable to enhance sensitivity at i-line: SX AR-N 4610-10/1
• PAG 4, for the first time h-/g-line (405 nm/436 nm) sensitivity established
• SX AR-N 4620-10/1 provides access to new applications for 3d-patterning
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3D structures by variation of PAG
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General process:
First results for 2-layer system trenches; bottom: AR-N 4600-10, top: SX AR-N 4610-10/1 (i-line sensitive)
• Atlas 46 S on bottom, SX AR-N 4610-10/1 or SX AR-N 4620-10/1 on top
• No significant intermixing between the different resists
• Combination of different resist versions allows generation of 3d architectures (e.g. bridged structures)
First results for 2-layer system, trenches; bottom: SX AR-N 4600-10, top: SX AR-N 4620-10/1 (h-line / g-line sensitive)
substrate substrate substrate substrate
Coating layer 1,Soft bake
Exposure 1
Cross-linking (PEB)Coating layer 2,Soft bake
development
substrate
Exposure 2
Cross-linking (PEB)
1006.06.2018[2] C. Steinberg; M. Rumler; M. Runkel; M. Papenheim, S. Wang, A. Mayer; M. Becker; M. Rommel; H.-C. Scheer, Microelectronic Engineering, 2017, 176, 22-27
[1] C. Steinberg; M. Papenheim; S. Wang; H.-C. Scheer, Microelectronic Engineering, 2016, 155, 14-18
3D structures via double imprint lithography (University of Wuppertal)
Comparison NIL properties of SU-8, Atlas 46 S and CAR 44
- Double imprint lithography allowed a combination of nano- and micro structures
- Requirement of different chemically amplified photoresists for pre-preparation of hierarchical structures: hardened nanostructures are most stable during second imprint
- Comparable nanostructure stability between SU-8 and Atlas 46 S
- Insufficient thermal stability with CAR 44
Process sequence suitable for different negative photoresists:
a) definition of nano-structures in a negative tone photoresist via thermal imprintb) surface-near VUV flood exposure of the pre-patterned surfacec) second imprint with microstructures
Fluorescent Atlas 46 S layers
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Different fluorescence of the AR-Logo & lines (Atlas 46 S)
Different fluorescent layers of Atlas 46 S
• Various brilliant fluorescence dyes embedded in polymer matrix
• Suitable for photo resists (Atlas 46 S) and as well for ebeam resists (PMMA, CSAR 62)
• Lithographic application allow generation of fluorescent pattern (e.g. for microscopy)
• Multi-layer process for combination of different dyed architectures: overlapping or adjacent pattern
• Two different path ways:
a) combination of ATLAS 46 versions optimized for different exposure wavelengths
b) processing bottom layer (spin coating, exposure, PEB and development) following by patterning a top resist showing a different fluorescence