design database checklist – (Ⅰ)

Taegee Co., Ltd. Samheung Bldg 705-9 Yeoksam-DongGangnam-Gu Seoul, Korea 135-711 Tel: 02-555-2583 Fax: 02-555-2584www.taegee.co.kr

TaegeeDesign-driven Foundry

- 1 -

1) Customer Device Name : 2) Wafer size : ( ) 6” , ( ) 8”

3) Fab Site : ( ) Cheongju F2-6” , ( ) Gumi F3-8” , ( ) Cheongju F4-8”

4) Application *1) : 5) Device *2) :

6) Poly / Metal Layer : ( ) Poly / ( ) Metal 7) Multi-Chip(Yes/No) : ( ) Yes , ( ) No

8) Please confirm database

( ) New Database ( ) Full Revision ( ) Partial Revision (Rev. reason : )

Privious Device Name :

9) DB Transfer Date : 10) Product Type : ( ) Wafer , ( ) Others ( )

11) FTP account ID ( ) (If you already have an account for DB transfer, please fill it in.)

12) How many wafers need to be input?

Input Q’ty ( ) Fab out Q’ty ( ) Ship to ( ) Hold Q’ty ( ) & Hold Step ( )

13)If you have additional Instruction, please describe it.

Design Database Checklist – (Ⅰ)Checked by : Date : 20 , , 1.PRE Notice Information1.PRE Notice Information

1) Mask P.O. # : 2) Requested Delivery Date :

3) DB File name & size

DB File Name :

DB File Size(byte) :

Top Structure :

Description :

2. Database Transfer Information2. Database Transfer Information

1) Target Process :

2) Frequency & Temp : ( ) MHz , ( ~ )

3) Operating Voltage

Logic : Core( ) V , I/O ( ) V

High Voltage : Drain( ) V , Gate ( ) V , I/O ( ) V

4) Is this already in production at other (1st) Foundry? ( ) Yes ( ) No 1st Foundry :

5) Package Type :

3. Customer Information3. Customer Information

1) Company Name :

2) Business Contact Point

Name :

Telephone :

E-mail :

3) Engineering Contact Point

Name :

Telephone :

E-mail :

1) Business Contact Point

AM :

Field Sales :

Field CE :

2) Engineering Contact Point

Name :

Telephone :

E-mail :

4. MagnaChip Information4. MagnaChip Information

5. Product Information5. Product Information



- 2 -

1) Is your product original version or shrink version? ( ) Original Version ( ) Shrink Version

2) Did you use MagnaChip library? ( ) MagnaChip Library ( ) Full Custom

If Yes, What is the library name? :

3) Is this product designed for MagnaChip process? ( ) Yes ( ) No If yes, fill in the name and version of documents.

Logic Design Rule # :

Spice Parameter # :

Electrical Parameter # :

High Voltage Design Rule # :

Spice Parameter # :

Electrical Parameter # :

4) Are there Special Blocks? ( ) Yes ( ) No

Memory Type :

Memory Size :

Analog Block :

* If Flat ROM / OTP / Mask ROM case, please describe application in detail : * In case of Flat ROM / OTP / Mask ROM (Over 4M bit), customer should release body and all code D/B to MagnaChip. These body and code D/B can be verified by 3rd party.

5) What IPs did you use in your product?

Used IP & Provider :

Qualified or Not :

6) MagnaChip has to merge 3rd party IP into main DB? ( ) Yes ( ) No

IP Types (ex. OTP) :

Design Database Checklist – (Ⅱ)

6. Chip Design Information6. Chip Design Information

1) EPI wafer : ( ) Yes ( ) No If yes, please attach the EPI wafer spec ( ) File Upload

2) Polyimide : ( ) Yes ( ) No If yes, please specify target thickness ( )um

3) Thick Metal : ( ) Yes ( ) No If yes, please specify target thickness ( )um

4) Deep Nwell : ( ) Yes ( ) No

5) Back grinding : ( ) Yes ( ) No If yes, please specify size ( )um

6) Blocking gate poly used? : ( ) Yes ( ) No Generated by? ( ) Customer ( ) MagnaChip

-In case of 1st poly as a resistor (For instance: Optional resistor poly), it means that the blocking poly as Gate Poly (2nd Poly) covers the 1st poly resistor on the resistor area to reduce the variation of thickness caused by the following process.- If Blocking gate poly is used, specify required non-salicided Cpoly resistance ( Ohms/sq )

7) Fuse Pattern used? : ( ) Yes ( ) No-If Yes, what’s the fuse layer? ( )

8) Special Process :

7. Option Process Requirement7. Option Process Requirement



- 3 -

1) Designed for MagnaChip's standard parameter ? ( ) Yes ( ) No

If no, please supply the device parameter target used :

2) Do you need Special Device & Target Specification? ( ) Yes ( ) No

Resistor(ohm/sq)

N-Poly : ( ) Ω /sq Capacitor(fF/um^2)

PIP ( ) fF/um^2

P-Poly : ( ) Ω /sq MM ( ) fF/um^2Metal ( ) ~ Metal ( )

C-Poly : ( ) Ω /sq

N-Well : ( ) Ω /sq BJT ( ) Yes ( ) No

N-Diff. : ( ) Ω /sq Zener Diode ( ) Yes ( ) No

P-Diff. : ( ) Ω /sq Option Transistor ( ) Yes ( ) No

High R : ( ) Ω /sq

Design Database Checklist – (Ⅲ)

8. Device Parameter Target8. Device Parameter Target

1) Corner/ Engineering split conditions required? ( ) Yes ( ) No

If yes, please attach file : File UPLOAD

If yes, please describe it :

2) What is the Scribe Lane Width? ( ) 100um ( ) 80um ( ) Others ( um)

3) Mask Combination. If you need mask combination, please describe it on the table below.

1. ( ) 2. ( ) 3. ( ) 4. ( ) 5. ( ) 6. ( ) 7. ( )

8. ( ) 9. ( ) 10. ( ) 11. ( ) 12. ( ) 13. ( ) 14. ( )

15. ( ) 16. ( ) 17. ( ) 18. ( ) 19. ( ) 20. ( ) 21. ( )

22. ( ) 23. ( ) 24. ( ) 25. ( ) 26. ( ) 27. ( ) 28. ( )

29. ( ) 30. ( ) 31. ( ) 32. ( ) 33. ( ) 34. ( ) 35. ( )

36. ( ) 37. ( ) 38. ( ) 39. ( ) 40. ( ) 41. ( ) 42. ( )

* Revision Layer Name (If yes) :

* Special layer Code Layer Name (If yes) :

Option Layer Name (If yes) :

Base Array Hold Step: ( ) (If you are using a special layer(s), please input base array hold step.)

4) If you have additional Instructions or files, please describe or attach them. Attach File

9. Special Instructions9. Special Instructions

*1) Consumer : Digital TV/ MP3/ DVD .. Data Processing : Note Book/Desktop/Monitor…

Wireless : Mobile Phone/Wireless LAN….

Wired : LAN Card/Router/Modem….

Auto Motive : Telematics /GPS/Sensor…

Industrial : Semiconductor manufacture / Test ….

Other : Direct Input

*2) Analog : Amplifier/ADC/DAC…. Display Driver : OLED Driver/Source Driver….

Micro controller : 4,8Bit MCU/OTP….. Power Management : LDO/Battery Management… MEMS : Microphone/Gyroscope…. Others : RFID/EEPROM/CIS Others : Direct Input



- 4 -

DB File Name :

Top Structure :

File Size :

Window Size CAD Database Window Coordinates Format

X = ( )

Y = ( )

X-LB ( )

Y-LB ( )

X-RT ( )

Y-RT ( )

GDS II

X = ( )

Y = ( )

X-LB ( )

Y-LB ( )

X-RT ( )

Y-RT ( )

MEBES

1) Shrink & Rotation DATA SHRINKAGE : TO ( ) % DATA SHRINKAGE : TO ( ) % DATA SHRINKAGE : TO ( ) %

2) If MagnaChip's design Rule is not used, please supply the used Design Rule. Customer has completed DRC check : ( ) Yes ( ) No Using MagnaChip command file : ( ) Yes ( ) No If yes, please confirm : ( ) Pass ( ) Fail Attach DRC summay file.

3) Customer add OPC pattern : ( ) Yes ( ) No If yes, specify layer name. :

4) Customer add dummy layer fo poly : ( ) Yes ( ) No If yes, specify layer name. : (If using MagnaChip 0.35um lib.)

5) Customer added seal ring structure : ( ) Yes ( ) No if yes, please confirm : MagnaChip rule( ) Put customer's own seal ring ( )

6) Need customer Test-pattern : ( ) Yes ( ) No If yes, specify Test-pattern name. :

7) Customer Job Deck View : ( if yes, please confirm ) ( ) Yes ( ) No ( ) Start mask making after JD confirmed ( ) Start mask making & JD in parallel ( ) Customer Site ( ) Magna Chip Site ( ) Mask Shop Office

8) Customer assign MASK vendor : ( ) Yes ( ) No If yes, please fill in mask vendor name :

CAD Database Information – (Ⅰ)

GDS II DATA DESCRIPTION MEBES DATA DESCRIPTION

Layer #LayerDescript

D.A.Tone Min. GRIDContact & Via Size

PatternFile Name

LayerDescript

Trapezoid Spot SizeScale1X / 5X



- 5 -

CAD Database Information – (Ⅱ)

GDS II DATA DESCRIPTION MEBES DATA DESCRIPTION

Layer #LayerDescript

D.A.Tone Min. GRIDContact & Via Size

PatternFile Name

LayerDescript

Trapezoid Spot SizeScale1X / 5X

Additional Instructions :

If you have additional question , please contact [email protected] or [email protected] Tel : 02 – 555 - 2583

mailto:[email protected]

mailto:[email protected]

design database checklist – (Ⅰ)

Documents