date conference paris february 19th 2004 [email protected] seite 1 © copyright ppc...
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Date Conference Paris February 19th 2004 [email protected] Seite 1© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Optical layers
PPC Electronic OPTOBOARD® Technology
V erticalC avityS urfaceE mittingL aser
VCSEL
VCSEL/Diode
VCSEL/Diode
LayersLayersOpto-electronical
components
Opto-electronical
components
electricalelectrical
dielectricaldielectrical
opticaloptical
ConnectorConnector
PPC Electronic AG
Peter Straub R&D
Riedstrasse 2
CH-6330 Cham
www.ppc-electronic.com
Date Conference Paris February 19th 2004 [email protected] Seite 2© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Electrical vs optical Interconnection over a 100 cm PCB
1990 1994 1998 2002 2006 2010 2014 YEAR
160 Gbps
40 Gbps
10 Gbps
2.5 Gbps
Electrical Copper InterconnectionElectrical Copper Interconnection prefered (cheaper) technologyprefered (cheaper) technology
Optical InterconnectionOptical Interconnection prefered (cheaper) technologyprefered (cheaper) technology
Shannons Theorem: C = B * log2(1+ S/N)
C = channel capacityB = Bandwidth (FR4, 1m Coppertrace ≈ 3 GHz)S = Mean SignalpowerN = Mean Noisepower at the Receivers input S/N ≈ 100 (FR4 Coppertrace 1m long)
Channel capacity over a 100 cm backplane ≈ 20 Gbps
(only with optimal datacoding possible)
50 cm
Date Conference Paris February 19th 2004 [email protected] Seite 3© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
The sum of R&D Cost
(Krubasik 1982)
Technology PerformanceProfit/Cost
Today
New Technology Limit (optical PCB)
Old Technology Limit (electrical PCB)
Op
tob
oar
d
New
Tec
hn
olo
gy
Po
ten
tial
Old
Tec
hn
olo
gy
Po
ten
tial
Technology Potential High Speed PCBs vs Optoboard
V erticalC avityS urfaceE mittingL aser
FC VCSEL
Date Conference Paris February 19th 2004 [email protected] Seite 4© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Electrical Backplane High Speed Problems Architecture
» From multiple-point to point-to-point
with or without switch fabric
Density
» Crosstalk (distance between lines)
» Shielded lines and PTH necessary (PPC Patent)
» Noise (differential signals necessary)
» Impedance tolerance better ± 10%
» High layer count (three plate constr.)
Connectors
» High aspect ratio PTH
» Drill back vias or SMD µVias !
» High price for high speed connectors
Material losses
» High price for low loss polymers
» Skineffect losses on copper
Drivers
» Preemphasis necessary
» Adaptive signal processing
» Lasertuned Resistors on the Backplane
1m Rogers R04350 Material 1m FR4 Material
Switch
PPC Electronic AG Pat. pend.
Date Conference Paris February 19th 2004 [email protected] Seite 5© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Waveguides in the Backplane and Systemcard (250µm PitchFlip Chip VCSEL and Photodiode
Flip Chip VCSELand Photodiode
50$ /Link
10$ /Link
ParallelOptical
Modules
Waveguides in the Backplane (250 µm pitch)
Fiberribbon
OpticalConnector30$ /Link
2006
2008
2003
2nd to 3rd GenerationOptical Backplane Evolution
Date Conference Paris February 19th 2004 [email protected] Seite 6© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Optoboard® Technology Keyelements
1. Transparent Medium Thinglass
2. Multimode Waveguide Technology
3. Optical Connector
4. Parallel Optical Module with VCSEL and Pin Diode Arrays
5. In- Out-Coupler Waveguide
In-Coupler Out-Coupler
Date Conference Paris February 19th 2004 [email protected] Seite 7© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Etched Glass Multimode Waveguide (250µm Pitch)
Date Conference Paris February 19th 2004 [email protected] Seite 8© Copyright PPC ELECTRONIC AG
PPC ELECTRONIC AG
Optical Backplane Market