UTC plans micro electronics centre United Technologies Corporation, the company that acquired Mostek at the beginning of this year, is creat- ing a microelectronics centre in the US.

The centre will be functioning as part of United Technologies Elec- tronics Group. Its services, including computer-aided design techniques and integrated circuit engineering, will be available to all UTC divisions.

These include Pratt & Whitney Aircraft, Carrier, Otis, Sikorsky Air- craft and Mostek.

The centre will be completed next year on a site adjacent to a 300 000 ft 2 Mostek plant now under construction at Colorado Springs. General manager of the centre is Gordon Hoffman, previously Manager of Business and Technology Development with Mostek.

Mostek 16k dynamic R A M certified Mostek's 200 ns dynamic RAM, MK 4116, has received QPL certifi- cation.

Designated M38310/24001 BEC, this 16k x 1 device is JAN specified over a -55°C to 110°C operating case temperature range and is available in a high density 16-pin hermetic dual-in-line package. It is one of a line of military memories, all screened to MI L-STD 883B methods 5004.4 and 5005.5. In addition to dual-in-line packaging, Mostek Military offers high density, hermetic leadless chip carriers and flat packages.

Ontel buys OEM rights to CIS C O B O L . . . MicroFocus CIS COBOL software has been purchased by Ontel Corporation, New York-based manufacturer of information systems and display computers.

Ontel is one of a number of com- puter manufacturers to have purchased OEM rights to CIS COBOL including Texas Instruments, Intel and BASF.

Under the terms of the contract,

Ontel will sell on its equipment three MicroFocus products: Standard CIS COBOL, Compact CIS COBOL, and FORMS-2.

Standard CIS COBOL requires a minimum of 48 kbyte of user RAM and can compile and execute on Ontel's current equipment range, which are typically supplied with 64 kbyte of RAM.

For users of its earlier systems, usually equipped with 32 kbyte RAM, Ontel will supply Compact ClS COBOL.

• , . and MicroFocus makes enhancements MicroFocus has produced Release 4.3 of CIS COBOL, which includes several enhancements. As well as more than doubling compilation speed, Release 4.3 has improved execution speed, principally by providing mechanisms for binary-coded decimal arithmetic and an optimized ISAM. The ANSI- defined batch debug facility has also been added.

Simplification of the operating system interface has meant that CIS COBOL can more easily be installed by a computer manufac- turer's inhouse software team, with minimal dependence on MicroFocus. Other benefits include greater upward compatibility, for example to multi- user operating system environments,

and greater modularity. MicroFocus sells off-the-shelf

object packs for any 8080, 8085 or Z80-based microcomputer running under the CP/M operating system, and for DEC LSI-11 based computers running RT-11.

Dage Eurosem stock A m Z 8 0 0 0 family The complete AMD family of 16-bit Z8000 microprocessors and support devices is now available from Dage Eurosem. This family comprises com- ponents, boards and systems support equipment such as the AmSys 8/8 development system.

Both segmented and unsegmented CPU devices are available to suit particular systems. Both CPUs execute the full Z8000 instruction set with the segmented Z8001 capable of addres- sing directly up to 8 Mbyte of memory while the nonsegmented Z8002 is more suitable for smaller memory systems up to 64 kbyte. Evaluation boards, fully assembled and tested, are available for systems evaluation.

The Am Z8000 family are MOS LSI devices with second source agree- ments between both AMD and Zilog. They are available from Dage Eurosem Limited, Haywood House, 64 High Street, Pinner, Middlesex, HAS 5QA, UK.

Tectonic opens semiconductor packaging division

Tectonic Electronics has established a Division for Semiconductor Packag- ing at Fishponds Road, Wokingham.

Initially, the division aims to serve the electronic subassembly market with semiconductor devices assembled into leadless carriers. The carrier mounted semiconductor chip provides users with a compact device which can be fully tested to AC and DC para- meters and to acceptable quality assurance standards. Reduction in size compared to the dual-in-line package allows increased packing density while minimizing the problems of inter- connection to associated circuitry. The chip carrier is easily handled and

can be mounted to substrates simul- taneously with other face bonded components, thereby reducing assembly costs. Reduction in the length of interconnection achieved by this technique is of benefit to systems involving high speed signals.

Unlike the naked chip the mounted semiconductor can be fully tested before interconnection to its substrate, minimizing the incidence of failure of assembled systems.

The company is fully equipped to carry out functional and environ- mental testing of completed devices, and is committed to the requirements of the BS 9000 system.

vol 4 no 8 october 80 335