company presentation – september 2012. | 2 | proprietary and confidential contents company...

Company Presentation – September 2012

| 2 |Proprietary and Confidential

Contents

Company Overview Enpirion Technology Enablers of High Density PowerSoC Featured Products Back-up

Product Quality/Reliability Supply Chain Summary Key Contract Manufacturers Currently Supported PowerSoC Differentiation: Quantifying Ease of Design

PowerSoC Highly Integrated Power System-On-Chip

Hardware/Power Designer Challenges PowerSoC Benefits

Increasing # of power rails More function in smaller form factors Noise sensitivity & lower power budgets Time-to-market Pressures; fewer resources While improving Cost & Reliability!

High efficiency, smallest size Excellent noise/transient performance Simple, low risk power design Highest reliability, fewest components

Target Markets

• <=15V DC-DC switching regulators• 300mA to 15A • standard product & ASSP• www.enpirion.com

Enterprise

Storage/SSD

Telecom Embedded/Industrial

Integrated:- Power FETs - PWM Controller- Compensation Circuit- Inductor


Test & Measurement

Optical Networking

Enpirion: Focused on “Power Done Right!”

The Leader of Integrated Power IC Solutions driving the miniaturization of DC-DC power systems The only semiconductor company with all key

enabling analog power technologies

Broad patent & IP portfolio - 45 issued + 25 pending

Private fab-less semiconductor company since 2001

Our products lead the discrete-to-integrated transition in the multi-billion dollar power IC market Growing 7 times faster than the power IC market

Our Power, Your Innovation Our power enables customers to maximize

innovation without compromise. Smallest, coolest, fastest, easiest, most reliable

integrated power IC solutions


R&D Sales & Support

Fabrication Test & Assembly

Broad Market Demand for Uncompromised Power

Server

Storage Array

Network Router Backhaul

WirelessAccess

Optical Transport

Solid State Drives

EmbeddedComputing

Test &Measurement

Controllers

Cloud Computing Increased density; uncompromised efficiency

Smart Phones, IPTV, Tablets Increased density; uncompromised reliability

Highest Power DensityCombined withHigh Efficiency

Low Thermals, Noise, RippleFast TTM

Affordable Reliability

| 5 |Proprietary & Confidential

Memory capacity, I/O speed, & ReliabilityIncreased density; uncompromised TTM

Automation & monitoring sophistication, many SKUs Increased density; uncompromised TTM & noise

Enterprise

Industrial Storage

Telecom

Target Markets & Our Value Proposition

Markets Key Applications Key Customers Value Proposition

Revenue

Enterprise Servers

NIC cards

Storage Controllers

Office Automation

Small Footprint

Energy Efficiency

Performance

Reliability 26%

Embedded, Industrial

Embedded Computing, Test & Measurement

Ease of Use

Small Footprint

Reliability21%

Telecom DSL/GPON CPE, MSAN

& Gateways

Cellular Base Stations

Reliability

Small Footprint

Energy Efficiency 12%

Storage Solid State Drives

USB 3.0 Pen Drives

Secure USB sticks

Small Footprint

Ease of Design

Reliability 25%



DC-DC System Engineering

Inductor Selection

Capacitor Selection

Power Stage Analysis

Controller &

Compensation DesignStability

Time Domain Simulation

3 FocusedTechnology

Developments

Delay Box

Key Enablers of High Density PowerSoC

Validation

Production Testing


Enpirion’s Power Technology Roadmap

SemiconductorProcess

Packaging

Magnetics

2011 2012 20142004-2010

Gen 1Laminate

Gen 2Leadframe

Gen 3Stacked

Gen 5Spiral

Gen 7Monolithic Chip Scale

WireWound

Copper onFerrite

SMTChip

Open Bar

ClosedBar

Alloy onSilicon

InductorOn Silicon

Copper on AlloyHybrid Cores

Gen 6Bumped Die

RDL

40V 0.18um LDMOS(up to 10MHz )

Gen 4Clips

20V 0.18um CMOS w/ LDMOS(up to 15MHz )

10V 0.25um CMOS w/ LDMOS(up to 20MHz )

Enpirion FET Technology = Efficiency + High Density

90% Line

State of the art products built with industry’s fastest performing power FET technology


Vout= 1.8VVout= 1.8V

>90% Efficiency

6V, 0.25u LDMOS 6V, 0.25u LDMOS 12V, 0.18u LDMOS


Enpirion PowerSoC = Uncompromised Power

Highest Density without Compromising Performance, Reliability, Cost

4-6x larger area2.5x taller94% @ Peak

7x larger area2x taller96.5% @ Peak

75 mm2

1.85 mm height94% @ Peak

PowerSoCEnpirion

Modules/PSiP Competitor A Competitor B

Discrete RegulatorsCompetitor C

4-5x larger area1.25x taller92% @ Peak

Enpirion PowerSoC Uncompromised Power


Smallest Solution Footprint• 50 to 80% size reduction; very low profile

Increased Reliability; Lower Total Cost• Fully simulated/characterized/validated/production

tested power system• >35,700 years MTBF (10x improvement); FIT 3.2• True Industrial-rated; No de-rate, heat sink, airflow• Fewer components/Higher assembly yield

High Performance + Low Noise• Very High Efficiency: up to 97%• Low EMI & Conducted noise (10dB margin)• Up to 95% less ripple• Secondary filtering not required Ease-of-use• Simple Design Flow; nearly 100% 1st pass success • 45% fewer Design steps• Significantly less exposure to design iteration• Fully-validated PCB files

FEATURED PRODUCTS


Select Featured Products – 5V


Part Number Description

Package Size (mm)Solution Size Est.

(mm2)Device Capacity

L W H

5V Input PowerSoC Product Offering

EP5348QI Ultra-Small Power SoC, 8MHz, "LDO Killer" 2.00 1.75 0.90 20 0.4A

EP5357xUI 5MHz PowerSoC, VID, "light load mode" 2.50 2.25 1.10 20 0.6A

EP5358xUI 5MHz PowerSoC, VID 2.50 2.25 1.10 20 0.6A

EP53A7xQI 5MHz PowerSoC, VID, "light load mode" 3.00 3.00 1.10 21 1.0A

EP53A8xQI 5MHz PowerSoC, VID 3.00 3.00 1.10 21 1.0A

EN5311QI 4MHz PowerSoC, VID 4.00 5.00 1.10 40 1.0A

EP53F8QI 4MHz PowerSoC, VID 3.00 3.00 1.10 40 1.5A

EN5322QI 4MHz PowerSoC, VID 4.00 6.00 1.10 60 2.0A

EN5337QI 5MHz PowerSoC 4.00 7.00 1.85 75 3.0A

EN5339QI Low Profile 4.00 6.00 1.10 60 3.0A

EN6337QI "High Efficiency" PowerSoC 4.00 7.00 1.85 75 3.0A



EN5367QI Low Cost 6A 5.50 10.00 3.00 160 6.0A



EN63A0QI "High Efficiency" PowerSoC 10.00 11.00 3.00 227 12A

Select Featured Products – 12V


Part Number Description



L W H

12V Input PowerSoC Product Offering

EN2340QI 4A PowerSoC 8.00 11.00 3.00 191 4.0A

EN2360QI 6A PowerSoC 8.00 11.00 3.00 191 6.0A

EN2390QI 9A PowerSoC 10.00 11.00 3.00 235 9.0A

EN23F0QI 15A PowerSoC 12.00 13.00 3.00 308 15A

Select Featured Products – Application Specific


Note: Availability dates for yet to be released products subject to change.

L W H

EQC1241 4 Channel Current Monitor, I2C I/F, programmable sense amp gain 5.00 5.00 0.90 25 1Q13 4Q13

Current Monitoring and Protection

Part Number DescriptionPackage Size (mm) Solution Size

Est. (mm2)Samples

Production Release

Part Number

Description



L W H

DDR VTT PowerSoC Product Offering

EV1320 DDR VTT, Low Vin Power SoC Solution 3.00 3.00 0.55 402A

EV1340 DDR VTT, Low Vin Power SoC Solution 10.00 5.50 3.00 125 5A

EV1380 DDR VTT, Low Vin Power SoC Solution 11.00 8.00 3.00 200 8A

| 16 |Proprietary and Confidential | 16 |Proprietary and Confidential

| 16 |EV1320 High Efficiency 2A VTT Converter DDR Memory Termination

Features Solution complies with JEDEC for DDR2/3/4 Ultra high 96% peak efficiency Parallel up to 4 devices for 8A VTT load High reliability; 4.1 FITs; 28,200 years MTBF

Specifications: Sources/Sink up to 2A VDDQ Input Voltage Range: 0.95V – 1.8V Output Voltage = ½ VDDQ; tracks VDDQ 40 mm2 total solution size

80

82

84

86

88

90

92

94

96

98

100

0 0.25 0.5 0.75 1 1.25 1.5 1.75 2

VDDQ=1.8V

VDDQ=1.5V

VDDQ=1.35

VDDQ=1.2V

EV1320 Competitive Comparison: Uncompromised Power!


Nearly 2x efficiency of a VTT LDO in a smaller footprint and =< cost

DDR Memory Termination (VTT) Power Options

Linear Regulator

EnpirionEV1320

Converter

Switching regulator

Solution Size (mm2) ~88 40 ~200 - 300

Efficiency @ Peak (%) 50 96 88 to 92

Power Loss @ 2A (W) 1.8 0.08 ~0.2

Relative Power Loss at 2A 24x x ~2.6x

Published Price @ 1K =>1x 1x >2x


Specifications:• 400mA Minimum Output Current• Input Voltage Range: 2.4V – 5.5V• Output Voltage Range: 0.6V – (VIN-0.2V)• Output Voltage Programming• Tiny, 14-pin QFN Package• Solution Footprint: 20mm2

EP5348UI Tiny 400mA DCDC

Features:• 66mW/mm2 Solution Power Density• Compatible with Noise Sensitive RF• Over-current Protection • Thermal Protection: 150C/15C• Under-voltage Lock-Out

2mm x 1¾mm x 0.9 mm QFN2

x1.7

5x0

.9

0603

ca

p

4.4mm

4.4mm

02

01

02

01

02

01

0603

ca

p

Specifications:• Input Voltage: 2.4V – 5.5V• Output Voltage: 0.8V – 3.3V• 3% accuracy over Line, Load, and Temp• VOUT Programming• 3A Continuous Output Current

EN5339QI 3A Low Profile DCDC

Features:• Pin Compatible with EN5322QI• High Efficiency; 95% Peak• Very Low Ripple• Over-current Protection: 5A Typical• Thermal Protection: 155C/15C• Under-voltage Lock-Out • Enable and POK

Proprietary and Confidential | 19 |

• 4 mm x 6 mm x 1.1 mm QFN Package

Solution Footprint: 60mm2


Specifications:• Input Voltage Range: 2.375V – 6.6V• Output Voltage Range: 0.75V – (VIN-0.5V)

• 2% Output Accuracy (line, load, temp)• Minimum Output Current

• 3A – EN6337QI (@2MHz)• 4A – EN6347QI (@3MHz)

• Solution Footprint: 75 mm2

EN6337(3A) / 47(4A) DC-DC w/ LLM

Features:• 95% peak efficiency• Low Ripple • Over-current Protection • Under-voltage Lock-Out

• Light Load Mode • Enable and POK • Directly interchangeable with EN5337QI• Sync to External Clock

4mm x 7mm x 1.85 mm QFN

XFB47F

15 nF

VOUTPOK

PGNDAGND

SS

PVIN

AVIN

VOUTVIN

22F


EN5367QI “Cost Optimized” 6A DCDC

Features:• High efficiency up to 93%• Low Ripple• Excellent Transient Recovery• Programmable Soft start• Over-current Protection • Under-voltage Lock-Out • Enable and POK • Sync to External Clock

Specifications:• Input Voltage Range: 2.5V – 5.5V• Output Voltage Range: 0.6V – (VIN-VDO)

• 3% Output Accuracy (line, load, temp)• Resistor Divider VOUT Programming

• 6A Minimum Output Current• Solution Footprint: 160mm2

10mm x 5.5mm x 3.0 mm QFN

VOUTVIN

47F1206

47F1206

VOUT

ENA

AGNDSS

PVIN

AVIN

PGND

CA

PGND

RA

RB

VFB

EN

5367

QI

SYNC

CSS

10Ω

47nF 0805

0.1µF

EN2300 12V Product Family Overview


Max. Load (A)

Input Voltage

Output Voltage

Package Size (mm)

Solution area (mm2)

EN2340QI

4

4.5 to 14

0.75 to 5

8 x 11 x 3

191

EN2360QI

6

0.60 to 5

8 x 11 x 3

191

EN2390QI

9

0.60 to 5

10 x 11 x 3

235

EN23F0QI

15

0.60 to 3.3

12 x 13 x 3

308

EN2300 Family Features


Common Features Integrated inductor, MOSFETs, Controller Efficiency up to 94% 2% Voltage Output Accuracy (line, load, temp) Input Voltage Range: 4.5V – 14V Resistor Divider Vout Programming Operating temperature range: -40oC to 85oC without airflow/lead de-rating Excellent total AC + DC regulation Frequency Synchronization (External Clock) Output Enable Pin and POK Signal Programmable soft start Protections: programmable over-current, UVLO, thermal

Scalability Features EN2340 and EN2360 are pin compatible EN23F0 may be paralleled – up to 4 devices, 60A (see next page)

EN23F0 Parallel Operation


Up to 4x 15A EN23F0 devices can be paralleled for high load applications

EN6360QIMASTER

EN6360QISLAVE

S_OUT

S_IN

VOUT

VOUTVIN

VIN

GND

GND

VFB

VFB

Feedback &Compensation

OPEN

VIN

VOUT

M/S

M/S

REXT

51.1k

5.0V

1.0V at 14A

EN23F0QI

EN23F0QI

EN2300 Competitive Comparison


12V DC-DC POL Power DC-DC Alternatives (@ 15A)

12V DC-DC Discrete

Regulator

Modules/ PSiP

Enpirion PowerSoC

Solution Size (mm2) >650 500 308

Solution Height (mm) 8 >4 3

Efficiency @ Peak (%) 95 92 94

Ripple (mVp-p) 24 15 15

# of Components >30 16 16

Estimated Solution Cost @ 1K 0.8x 2x 1x

>2x Space Savings with Low Noise, Low Total Cost without compromising Efficiency, Ease of Design and Reliability

Got Footprint, Performance, Reliability Challenges?


Get Power Done Right - Enpirion PowerSoC!

Server Blade

PCIe RAID Controller + SSD ‘sPCIe Quad NIC

PCIe Security Processor Enterprise SSD

USB Cellular Data Card

DDR Non-Volatile DIMM

USB3.0 SSDEmbedded PC Module

Notebook SSD

Intel Atom Module

Compact PCI DSP Card

Digital Receiver

AV Receiver

Atom PCIe server board

Back-up


Enpirion Power SoC has High Reliability

Enpirion fully characterizes the integrated inductor/regulator pair This removes significant risk from the power supply design

Enpirion Power SoC undergoes IC level testing FIT rate = 3.2 @ 55 degrees C, 0.7eV activation energy, 60% confidence level, based on HTOL data collected to date

MTBF ~ 35,700 years (312.5M hours)


Quality, Reliability & Environmental Management System

Enpirion deploys a Total Quality Management System ISO 9001:2000 Certified Sony Green Partners

Enpirion utilizes a proven fabless model with world-class global suppliers: ISO 9001/ TS16949 Certified ISO14001 Certified and RoHS Compliant Sony Green Partners

Enpirion PowerSoCs maintain high reliability System level performance with IC Level Reliability Product design and qualification based on established industry standards & practices (JEDEC,

JESD,…) FIT rate = 3.2 (MTBF ≈ 35,700 years) Long Term Reliability ensured by Manufacturing Process Controls and Long Term Reliability

Monitoring Enpirion Environmental Management System includes:

Follows ISO14001 Principles Sony Green Partner Certified RoHS (EU Directive 2002/96/EC) WEEE (Directive 2202/96/EC) Lead Free assembly compatible, 10sec/260°C reflow profile JIG101 PFOS/PFOA Ban (EU Directive 2006/122/EC) Halogen Free (Bromine + Chlorine) Sony SS-00259


Customer Quality Issues & Failure Analysis Failure Mode Analysis Flow

Receipt of Failure

Internal Analysis

Customer Request

Non-destructive Testing

Failure Verification

Initial Response < 2 days

• X-ray Radiography

• C-SAM Analysis

• Optical Inspection

• Curve Trace

• Decapsulation

• Cross Section / Delayering

• Analytical (SEM, Auger, FIB etc.)

• Optical Inspection

• Active Circuit Probe

• Automated Tester

• Manual Tester

• Hot / Cold / THB Environmental Chambers

• Visual Inspection

Failure Report

Final Response < 15 days

• Problem Report Number Assigned

Subcontracted Services

• Component Supplier / Manufacturing Subcontractor

• Failure Analysis and Corrective Action

• Device Analysis Request Form


Supply Chain Summary

Enpirion utilizes a Fabless semiconductor manufacturing model Finished wafers are procured from wafer fabrication facilities in Korea Final products are assembled, tested, and drop shipped from factories in Asia Order entry, planning, scheduling, shipment release occur in the USA

7 weeks 1 week3 weeks 1 week

Lead Time

12 Weeks

Korea

IC ControllerCMOS

8” Wafers

IC ControllerWafer Test

AssemblyModule Package

TestModule Package

Finished Goods& Shipping

Drop ship

Strategic Die BankStrategic Inventory

Inductors

Japan/Taiwan

Malaysia, Taiwan, Thailand



Key Contract Manufacturers Currently Supported

>75 CM/ODM relationships

Benchmark Electronics Celestica Flextronics Foxconn Technology Group Jabil Circuit Plexus Corp. Sanmina-SCI Corp. Quanta Zinwell


QUANTIFIED EASE-OF-DESIGN


Design Flow Comparison: 3 DC-DC Topologies

Common Pre-Design Steps (6)


Enpirion PowerSoC = Faster Design Time & High Probability of 1st Pass Success

~14Steps

DC-DC Regulator Design Flow (~20)

~6steps

Enpirion PowerSoC Design Flow

(~12)

>18Steps

Traditional Discrete Design Flow (>24 steps)

Detailed Design Steps

Delay


Enpirion PowerSoC Simplied Design Steps

At least 40% fewer steps (i.e. 8 less)Significantly (~1/3) lower exposure to design iteration

Quantitative Comparison of PowerSoC vs. DC-DC Regulator Design Effort


PwrSoC/PSiP reduces complexity & significantly improves time to market by 45%!

Source Darnell Group * Sized for 1 DC-DC power rail

company presentation – september 2012. | 2 | proprietary and confidential contents company...

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