COMPANY OVERVIEW

ADVANCED TECHNOLOGY FOR RESEARCH & INDUSTRY

2 Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

Inseto is a leading technical distributor of equipment and related materials to the semiconductor, microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.

Inseto, located approximately one-hour west of London, operates from a state-of-the-art facility that houses our Administration, Goods Storage & Distribution, Adhesives Application Laboratory & Demonstration, Repair & Training Facilities.

The company, established in 1987 and ISO 9001 Certified since 2005, prides itself on forming long-term relationships with our principals and in obtaining mutual respect from our customers.

Our advanced equipment and materials are available from specialist technology divisions, which offer carefully selected, technically innovative, high performance products.

Customer support activities are at the centre of Inseto’s “Total Customer Service” philosophy, where we aim to understand, communicate and fulfil the needs of our customers, better than any competitor.

We are committed to meeting these requirements through the application of high standards of quality and customer care, both before and after sales, by continually investing in training and adopting a policy of continuous improvement in our company and in our people.

ADHESIVES 4 - 7

EQUIPMENT 8 - 11

CONSUMABLES 12 - 17

3Inseto See our website for more details www.inseto.co.uk

ADVANCED TECHNOLOGY FOR RESEARCH & INDUSTRY

ADHESIVESA comprehensive range of technical adhesives and sealants for the automotive, electronic and general manufacturing industries.

Inseto’s Adhesive Division provides technically advanced adhesives for bonding, sealing & encapsulation throughout the UK & Ireland.

Exclusively representing DELO Industrial Adhesives, our adhesive division has the technical expertise to advise on all your project requirements.

Adhesive Division See our website for more details www.inseto.co.uk

UV CURED ADHESIVE

• Rapid curing with UV or visible light

• Curable through translucent plastics that filter UV

• Provides invisible, high-strength bonds

• Single part in a range of low to high viscosities

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UV CURED AND LIGHT ACTIVATED EPOXIES

• Light activated versions can be used in opaque applications

• Epoxy base ensures dry surface after cure

• Excellent chemical resistance

• Single part, ideal for manual or automated processing

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Inseto’s experienced specialists will help with product selection, lab testing, trials, qualifications and application methods.

Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

DUAL CURING ADHESIVES

• Initial cure with light for handling or securing

• Full cure with heat and light or moisture

• Ideal for applications with shadow zones

• Excellent adhesion to many substrate materials

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DELO manufactures a comprehensive range of epoxies and acrylates with diverse curing mechanisms, including: heat-cured, light-cured & light-activated, dual-cured with heat and either light or moisture, plus room temperature curing. Complementing these are two part polyurethanes, in addition to anaerobic adhesives that are traditionally cured or with an additional light-curing capability, cyanoacrylate instant adhesives, and one part silicones.

ONE PART HEAT CURED EPOXY RESINS

• Single part materials that require no mixing

• Curing temperatures from 60°C

• Excellent temperature and chemical resistance

• Electrically conductive and non-conductive versions

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TWO PART EPOXY RESINS

• Fast curing at room temperature

• Low-high viscosities and gap-fill versions available

• Uniform stress distribution with long-term durability

• Excellent adhesion to similar and dissimilar substrates

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6 Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk © DELO

Adhesive Division See our website for more details www.inseto.co.uk

ADHESIVE DIVISION

- UV CURED ADHESIVES

- UV & LIGHT-ACTIVATED EPOXIES

- DUAL CURED ADHESIVES & SEALANTS

- HEAT CURED EPOXY RESINS

- TWO PART COLD CURED EPOXIES

- ANAEROBIC CURED ADHESIVES

- CYANOACRYLATE INSTANT ADHESIVES

- SILICONE SEALANTS & ADHESIVES

- POLYURETHANES

- DISPENSING EQUIPMENT

- UV CURED EQUIPMENT

INDUSTRY SEGMENTS

- AUTOMOTIVE

- ELECTRONICS

- LIGHTING

- MILITARY & AEROSPACE

- TELECOMMUNICATIONS

- PHOTO VOLTAIC

- ENGINEERING

- MEDICAL

Inseto can also offer tailor-made adhesive solutions that meet your technical bonding requirements.

The DELO range of equipment for adhesives incorporates dispense & cure systems and associated accessories including single-channel dispense systems, manual & pneumatic dispensing guns, plus pressure tanks and accessories.

Light sources for curing include LED spot lights and flood lamps, designed in specific wavelengths to cure every type of light cured adhesive.

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EQUIPMENTInseto provides assembly, test & inspection equipment for the semiconductor, microelectronic and related technology sectors.

Inseto’s Equipment Division provides fabrication, assembly, test & inspection equipment for the research and production of Semiconductor, Microelectronic and related advanced electronic devices, as well as products for high technology & industrial manufacturing.

Our range of high-quality and innovative equipment from leading manufacturers is available from Inseto throughout the UK, Ireland and the Nordic regions.

Equipment Division See our website for more details www.inseto.co.uk

We are a leading supplier of lithography equipment for exposure, resist coating and development, plus semiconductor furnaces, wafer bonders, probing systems, dicing saws and diamond scribing machines, die bonders and sorters, inspection and metrology equipment, ultrasonic wire bonding machines, plasma cleaners and etching systems, vacuum solder reflow ovens, material testers for wire pull and shear testing etc.

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MASK ALIGNERS

• High-quality UV mask and bond aligners

• For research, development or production

• High accuracy submicron resolution

• Process small pieces through to 300mm wafers

• Reliable, robust & simple to use

WAFER PROBING SYSTEMS

• Affordable manual, semi-automatic through to fully automatic equipment

• Individual die, partial or full wafers from 50-450mm

• DC, HF ambient & thermal configurations

• Application specific: vacuum, HV-HC, MEMS, electro-optical etc.

• Modular and upgradable

Full technical support including process, operation and maintenance is provided, with extensively trained field personnel and information databases.

9Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

Certified training can be provided either onsite or at our training facility in order to maximise equipment performance and productivity.

MANUAL DIE BONDERS

• Compact flexible die attach equipment

• Swiss made quality, reliability & performance

• Epoxy, eutectic, flip chip, ultrasonic & sintering etc.

• High accuracy with low-high bond forces

• For R&D through production applications

DICING EQUIPMENT & CONSUMABLES

• Manual & semi-automatic wafer mounters

• Manual, semi & fully automatic dicing saws

• Precision diamond scribers

• Peripheral equipment for washing, UV curing, filtration, cooling etc.

• Dicing blades & accessories

10 Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

Equipment Division See our website for more details www.inseto.co.uk

INDUSTRY SEGMENTS

- POWER ELECTRONICS

- UNIVERSITIES

- RESEARCH DEVELOPMENT

- RF & MICROWAVE ELECTRONICS

- MICROELECTRONICS

- SEMICONDUCTOR

- MEDICAL

- PHOTONICS

- AUTOMOTIVE

- PHOTO VOLTAIC

All work is certified according to our ISO accreditation & procedures.

We have been providing microelectronic fabrication, assembly, inspection and test equipment since 1987. Our customers range from small OEMs through Research Institutes, Universities, and large multi-national companies. With several hundred equipment installations throughout Europe, our dedicated team of specialist engineers provides each of our customers with a full technical and after sales support programme.

EQUIPMENT DIVISION

- WAFER COATING-DEVELOPING

- MASK ALIGNERS

- WAFER FURNACES & BONDERS

- WAFER-SOLDER BUMPING

- PLASMA CLEANING & ETCHING

- WAFER PROBERS

- DICING & SCRIBING EQUIPMENT

- DIE BONDERS

- VACUUM SOLDER REFLOW

- WIRE BONDERS

- BOND & MATERIALS TEST EQUIPMENT

- INSPECTION & METROLOGY

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CONSUMABLESFor assembly materials and machine consumables used in electronic, semiconductor, photonic and hybrid assembly etc.

Inseto’s Consumable Division provides assembly materials and machine consumables for the research and production of Semiconductor, Microelectronic and related advanced electronic devices, as well as products for high technology & industrial manufacturing.

Our specialist engineers will help you in selecting the correct material or machine consumable to suit your specific requirements or process.

Consumable Division See our website for more details www.inseto.co.uk

DIE ATTACH & ENCAPSULATION ADHESIVES

• Fast curing epoxy adhesives

• Optional light-fixing capability

• High temperature resistance, up to 250°C

• Suitable for various substrates including leadframes, FR4 & ceramic

• Conductive & non-conductive materials

BONDING ACCESSORIES

• Gold, Al/Si and copper fine bonding wire

• Large diameter aluminium and copper bonding wire

• Gold, aluminium and copper ribbon

• Capillary and wedge bonding tools

• Die attach consumables

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Inseto is one of the largest specialist suppliers of assembly materials and machine consumable tooling. Materials are made to order, according to exacting specifications, with stock of regular consumable and material parts available for rapid shipment from our logistic centre via ISO controlled processes.

CERAMIC & GLASS TO METAL SEALED MICROELECTRONIC PACKAGES

• Power packages

• RF and microwave packages

• Thermal imaging HTCC packages

• Optoelectronic, bathtub and flatpacks

• European-based manufacturer

13Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk© DELO

Our Consumable Division provides semiconductor & silica wafers, sub-contract wafer bumping grinding & dicing, wires & ribbons for bonding and soldering, precision stampings & preforms, hermetic metal & ceramic packages, thick film materials, thin film substrates, thermal dissipation materials, welding electrodes, plus bonding wedges, capillaries, die collets & dicing blades etc.

SOLDER PREFORMS, SPHERES & RIBBONS AND PRECISION METAL STAMPINGS

• Eutectic gold alloys• All indium, tin / lead & other alloys• Stamped or EDM for special profiles• Copper, kovar, molybdenum etc.• Clad with solder, or aluminium• In waffle packs, tape & reel or vials

DICING BLADES & ACCESSORIES

• Resin-bond dicing blades

• Nickel bonded dicing blades

• Metal-bond (sintered) blades

• Hubbed & annular dicing blades

• Flanges & accessories

• Dicing equipment

14 Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

Consumable Division See our website for more details www.inseto.co.uk

CONSUMABLES DIVISION

- DICING BLADES

- THIN FILM METALLISED SUBSTRATES

- THICK FILM MATERIALS

- HERMETIC PACKAGES

- SOLDER SPHERES, PREFORMS & STAMPINGS

- DIE ATTACH ADHESIVES & GLOB TOPS

- DIE ATTACH PICKUP TIPS & TOOLING

- BONDING WIRE & RIBBONS

- BONDING CAPILLARIES

- BONDING WEDGES AND COLLETS

- WELDING ELECTRODES & HOT BAR THERMODES

INDUSTRY SEGMENTS

- WAFER FABRICATION

- MILITARY & AEROSPACE

- TELECOMMUNICATIONS

- MEDICAL ELECTRONICS

- PHOTONICS

- MICROWAVE ELECTRONICS

- MICROELECTRONICS

- POWER SEMICONDUCTOR ASSEMBLY

- SEMICONDUCTOR BACK-END ASSEMBLY

- PCB ASSEMBLY INDUSTRIES

- UNIVERSITIES & RESEARCH

- PASSIVE COMPONENT MANUFACTURING

Inseto is a leading supplier of machine consumable tooling.

Products are manufactured to customer requirements for applications that include RF, microwave & millimetre wave, fibre-optic, and hi-rel products. Markets include wireless communications, defence, aerospace and satellite communications, medical electronics, and the fibre-optic industry.

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WAFERSInseto supplies a wide range of wafer and substrate materials worldwide, with rapid delivery from our large UK inventory.

Inseto has a long history of supplying wafers for semiconductor, micro and nanotechnology applications as well as other applications needing very flat and exceptionally smooth hydrophobic surfaces.

Our high-quality wafers are used worldwide by University and Industrial Research, Manufacturing and equipment manufacturers.

In addition to silicon, we stock an extensive range of glass and fused silica wafers including borosilicate glass, alumino silicate glass and fused silica.

A large percentage of wafers we stock and ship are available with either oxide or nitride coatings.

We also offer a full wafer dicing service, with no minimum order quantity and a very rapid turnaround.

INDUSTRY SEGMENTS

- SEMICONDUCTOR & RELATED RESEARCH AND MANUFACTURING

- COATING DEVELOPMENT

- ADHESION TESTING ETC.

- EQUIPMENT CHARACTERISATION

Consumable Division - Wafers See our website for more details www.inseto.co.uk

SILICON WAFERS

• Wafer sizes 1” to 300mm in inventory

• SEMI std PRIME and non std thicknesses

• Next day fully tracked deliveries

• Single and double side polished

• Full traceability with certificate of conformance

• No minimum order quantities

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All of our wafers are processed using Inseto’s ISO 9001 procedures, providing traceable, consistent delivery and quality.

COATED WAFERS

• Thermally coated SiO2 wafers from stock

• LPCVD coated Si3N4 wafers from stock

• Customised coating thicknesses

• Coating of wafers with Au, Al, Pt, Ni, Cr & Ti layers

• ALD coatings available

• Patterning of wafers with location grids

GLASS & FUSED SILICA WAFERS

• Wafers from 2” to 200mm

• Polished to 20/10 MIL standard

• Edge rounded for safe secure handling

• Pre-cleaned wafers available

• No minimum order quantities

• Wafer dicing available to any die size

17Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

18 Contact Inseto Telephone: +44 (0) 1264 334505 Email: enquiries@inseto.co.uk

Support packages can be designed according to customer requirements, covering single or multiple equipment types.

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Inseto See our website for more details www.inseto.co.uk

We understand that requirements may vary, depending on the size of your facility & “in-house” capabilities and so will tailor our services accordingly, matching your requirements precisely.

All of our work is carried out in accordance with the manufacturers guidelines using comprehensive service checklists, calibrated instruments, OEM warrantied parts and is certified according to our ISO accreditation & procedures.

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SUPPORT SERVICES

- ANNUAL MAINTENANCE

- EQUIPMENT CALIBRATION

- ANNUAL SERVICE CONTRACTS

- EMERGENCY SERVICE SUPPORT

- EXTENDED SUPPORT

- EMAIL/TELEPHONE SUPPORT

- ONLINE SUPPORT

- TRAINING CLASSES

- APPLICATION SUPPORT

- LEGACY EQUIPMENT

EQUIPMENT & PROCESS SUPPORTCustomer support activities are at the centre of Inseto’s “Total Customer Service” philosophy.

Inseto’s engineering team has developed high levels of knowledge and experience in the implementation of quality support services.

These include: Process Reviews & Improvements, Breakdowns, Certified Maintenance & Calibrations, Support Contracts, Equipment & Process Training Classes & Machine Repairs.

ADVANCED TECHNOLOGY FOR RESEARCH & INDUSTRY

Telephone: +44 (0)1264 334505 Email: enquiries@inseto.co.uk

www.inseto.co.uk

Inseto (UK) Limited, Unit 25 Focus Way, Andover SP10 5NY, United Kingdom