company confidential © 2013 sgi ® 1 sgi ® rackable ® servers first last title
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Company Confidential © 2013 SGI®
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SGI® Rackable®
Servers
First LastTitle
Company Confidential © 2013 SGI®
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Speed and Scale
∞0Human ScaleAtomic to Cellular AstronomicalSubatomic
10610-610-15 10241016 1018
ExascaleFemtometer
Lightyear
Yottascale
Finding Answers™
Company Confidential © 2013 SGI®
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Our Strategy and Focus
Business Computing
HPC
High Performance Computing
Redundancy Speed & Scale
BusinessApplicatio
ns
Company Confidential © 2013 SGI®
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Our Strategy and Focus
Business Computing
HPC
High Performance Computing
Redundancy Speed & Scale
BusinessApplicatio
ns
BigData
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• Rackable® Value Proposition• Half-Depth Servers• Standard-Depth Servers
Agenda
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Customer Problems• Getting the right configuration for a
cluster for specific applications is difficult
• Setting up a cluster can take a lot of time and is prone to error
• Managing clusters can be very difficult• Expanding clusters can lead to
disappointing performance and management challenges
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SGI® Servers for Speed and Scale
HPC
Commercial Scientific
Modeling & Simulation
Cloud
PublicPrivate
Government
Big Data
Hadoop In-memory Analytics Archive
SGI® ICE™ X SGI® UV™ 2000 CloudRack™ C2Rackable® Rackable®
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• Best of breed components, tested and integrated by SGI® Engineering
• Complete software stack including SGI Management Center and SGI Performance Suite
• Integrated, stood-up and tested in SGI factory• Not on your floor
• Not in some 3rd party’s facility
• Supported Worldwide by SGI
Rackable® Clusters Value Proposition
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Comprehensive factory integration simplifies on-site deployment and management
Entirely built on industry-standard hardware and software components, enabling access to the full spectrum of the Linux ecosystem
Full integration with the SGI Performance Suite, which optimizes the performance of applications running on standard Linux, and with the SGI Management Suite, which enables ease of administration, including dynamic power and GPU monitoring and management
Fully Integrated in SGI® Factory
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Complete Factory Integration - SGI Rackable® Cluster: Nodes labeled per customer requirements Delivered fully cabled to switches Cables labeled per customer requirements Servers mounted in rack, if ordered Static IP address range applied Fully integrated and tested software on head node Provisioned compute nodes per customer requirements GigE and IB fabric tested using MPI
Fully Integrated in SGI® Factory(2)
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SGI delivers tightly integrated solutions based on Linux®
For HPC clusters, SGI provides a complete Linux technical computing stack
For virtualized environments, SGI offers VMware certified platforms, supports Red Hat RHEL with KVM, and Microsoft Hyper-V
Full system management and monitoring for both data center and HPC environments with SGI Management Center
Linux Operating Systems: Novell SLES 10 & 11; Red Hat RHEL 5 & 6, CentOS 5 & 6*
Fully Integrated in SGI® Factory (3) SGI Linux HPC Stack
* Shipping when available
Performance Optimization
SGI Performance Suite
System Management SGI Management Center
Workload Manager Altair® PBS Professional™
MPI SGI MPT, Intel MPI Runtime
RAS SGI Foundation Software
File and datamanagement
SGI CXFS, SGI DMF, Lustre
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Hundreds of thousands of SGI Rackable® servers in production powering the world’s largest internet and technical computing environments
Robust reliability and availability features at both the application architecture level and at the server level
World class professional consulting, installation and support services.
Ultimate System RAS and Management Capability
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High Density
Both Rackable® half-depth and standard-depth servers can be deployed at leading core densities: C1001 half-depth server: 2,944 cores/46U cabinet in 92
servers mounted back to back C2112 standard-depth server: 2,688 cores/42U cabinet in
21 quad-node servers (84 nodes)
Rackable servers also deliver a high local storage density, a central requirement for many applications
Practical density is key as most data centers are power limited. A key SGI strength is designing at the cabinet level, optimizing power and thermals for the real life data center environment
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SGI servers can cut 10-150+W of power vs. competitive designs
Power savings delivered by Optimizing component choices
CPU, memory, hard drives Delivering superior thermal
designs that cut cooling fan power
Maximizing AC and DC power supply efficiency and right-sizing power supplies to server configurations
Eco-Logical™ Benefits
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SGI Global Services – Worldwide Reach
Our Global Presence
United States
Atlanta
AustraliaSydney
JapanTokyo
Our Customer Experience
500 Services Professionals in
50 Countries
Global Customer Service Center Infrastructure
Global Logistics Infrastructure with over 60 Spare Parts Depots
Same Day Support in 150 Major Metro Areas in over 20 Countries
Customized Support Available 7x24 via E-mail, Telephone or Web
Support in Multiple Languages
United Kingdom
Reading
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All Rackable servers are 19” rack mount compatible
Rackable® Form Factors
Half-Depth Servers Mount back-to-back in Rackable™
cabinets for double density or in 2-post racks
Ideal for homogeneous deployments implemented at cabinet or row level
Choose either flow-through or hot-aisle containment configurations
15.5” deep form factor ideal for thermals and reducing fan power
Front-facing ports and rail-less design increase serviceability
Best of blade features, without lock-in to a handful of motherboard designs!
Standard-Depth Servers Mount in all standard racks (rail-
based) Ideal for heterogeneous deployments,
including use as HPC management nodes with SGI ICE or UV systems
Not all available motherboard options fit within a half-depth footprint (e.g. many 4S options)
Multi-node solutions such as C2112 server (four nodes in 2U) available for high density deployments
Rear-facing ports ideal for compatibility (e.g. attaching to external storage systems)
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C1103/C1104G
Features 1U dual-socket server
Ideal for GPU Computing
3 x 3.5” or 4 x 2.5” hot-swap drives
Two or three GPUs (C1103 also available with up to 4 x PCIE x8)
Key Models C1103-TY12: Intel Xeon 5600
C1104G-RP5: Intel Xeon E5-2600
Rackable® Standard-Depth Servers
C1110
Features 1U dual-socket server
4x 3.5” or 10 x 2.5” hot-swap drives
Two PCIe Gen 3 x16 slots
Redundant Power Supply (RPS)
Key Models C1110-RP6: Intel Xeon E5-2600
C1110-RN3: Intel Xeon E5-2400
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C2108 Features
2U dual-socket server
Ideal HPC management/head node
Up to 8 x 3.5” hot-swap drives
Up to five expansion slots
1+1 Redundant AC Power Supplies
Key Models C2108-RP2: Intel Xeon E5-2600
C2108-G9: AMD Opteron 62/300
Rackable® Standard-Depth Servers
C2112 Features
2U quad-node dual-socket server
Ideal for HPC cluster nodes
Up to 12 x 3.5” hot-swap drives (3/node)
Four low-profile expansion slots (1/node)
Optional QSFP QDR/FDR InfiniBand port/node
1+1 Redundant AC Power Supplies
Key Models C2112-4RP4: Intel Xeon E5-2600
C2112-4G10: AMD Opteron 62/300
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Rackable® Standard-Depth Servers
H2106 Features
2U quad-socket server
Ideal HPC management/head node
Up to 6 x 3.5” hot-swap drives
32 DIMM slots for up to 1024GB memory using 32GB DIMMs
Four low-profile expansion slots
1+1 Redundant AC Power Supplies
Key Model H2106-G7: AMD Opteron 62/300
C2110G Features
2U quad-socket server
Ideal high GPU/socket density node
Up to 10 x 2.5” hot-swap drives
8 DIMM slots
Up to four GPUs
Two AC Power Supplies
Key Model C2110G-RP5: Intel Xeon E5-2600
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Choice of 22U, 36U, 40U, 44U racks & full range of AMD/Intel
server models
FlexibilityFlexibility DensityDensity
Half-depth server design mounted back-to-back for
2x density
ServiceabilityServiceability
I/O in front and clean cabling reduces maintenance time by up to 75%
IPMI remote management
Unobstructed central air plenum for
superior ventilation
Thermal Management
& Power Distribution
Thermal Management
& Power Distribution
DC Power option provides power savings of up to
30%
Passive cooling design for highest
reliability
Rackable® Half-Depth Advantage
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Hot aisle/cold aisle Typical data center
footprint
Two Airflow Options
Chimney
In-cabinet hot aisle containment
Easily duct hot air out Optimal cooling
Front to Back Airflow
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26” wide, 40” deep Can support both half-depth back-to-back and
standard-depth front-to-back deployments 26” width cabinet cable troughs sufficient for
large cable bundles including InfiniBandinterconnect cabling
Heights offered: 22U, 36U,40U, 44U
24” wide 24” width cabinet better aligned with standard 24 x 24”
data center floor tiles Heights offered: 36U, 42U and 46U Can support both half-depth back-to-back and
standard-depth front-to-back deployments
Rackable® Half-Depth Server Cabinets
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AC power supplies replaced with 96.5% efficient DC power supply with 2 million hours MTBF
Rectifiers convert AC input to DC power for 10%-30% power savings Now available in 1U model
DC distribution bars inside cabinet deliver N+M redundant DC power to individual servers
Easily deployed in any existing AC data center (no infrastructure upgrades needed)
Allows rack-level UPS at significant cost savings over individual chassis RPS
AC-to-DC rectification within the rack for superior combination of reliability and efficiency
Rackable® Half-Depth Rack-level DC Power Delivery
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C1001 Features
• Blade level density (2,208 cores/46U rack)
• 1 x 3.5” / 2 x 2.5” hot-swap drives
• 6 Gb SAS
• Single expansion slot
• AC or DC power
Key Models
• C1001-TY8: Intel Xeon 5600
• C1001-RP6: Intel Xeon E5-2600
• C1001-C1: AMD Opteron 4200
• C1001-G13: AMD Opteron 62/300
Rackable® Half-Depth Servers
C2005 Features
Industry-leading thermals
Up to 5 x 3.5” / 10 x 2.5” hot-swap drives
6 Gb SAS
Up to five expansion slots
AC, DC, or AC RPS power
Key Models C2005-TY6: Intel Xeon 5600
C2005-RP1: Intel Xeon E5-2600
C2005-RN1: Intel Xeon E5-2400
C2005-C3: AMD Opteron 4200
C2005-G11: AMD Opteron 62/300
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4 x 2.5” + 2 x 3.5” tray1 slot on riser
8 x 2.5” tray5 low-profile slots
(2-6)
4 x 3.5” tray1 slot on riser
2 x 3.5” tray5 low-profile slots
(2-6) Plus additional lower-left bay capabilities:
Internal 3.5” drive and/or DVD-ROM & AC or DC power supply Hot-Swap 3.5” drive or pair 2.5” drives & AC or DC power supply Redundant AC power supply
Four top drive tray / expansion slot configurations:
Rackable® Half-Depth Server: C2005
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Rackable® Half-Depth Servers
C30xx Features
High local storage density (720TB and 360 cores/46U cabinet)
Storage and/or I/O focused models
Key Models ISS3012-TY15: Intel Xeon 5600 ISS3009-TY15: Intel Xeon 5600 ISS3012-RP1: Intel Xeon E5-
2600 ISS3009-RP1: Intel Xeon E5-
2600
H4002 Features
Specialized applications Quad-socket models Overclocking options
Key Models H4002-G6: AMD Opteron
6200
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• Rackable™ servers are industry-leading in their configurability and flexibility
• Designed from the data center down, Rackable™ servers are well suited for both homogeneous and heterogeneous scale-out environments
• Fully Integrated for Easy Deployment
• Optimized for RAS and ease of management
Summary
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QUESTIONS?
SGI® Rackable® Servers
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Rackable® Servers Backup Slides
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Rackable® Server Model Grid
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Rackable® Standard Depth: Single Node
Model C1104G-RP5 C2110G-RP5 C2108-RP2 C1110-RP6
Form Factor 1U standard-depth 2U standard-depth
2U standard-depth
1U standard-depth
CPU 2 x Intel Xeon E5-2600 2 x Intel Xeon E5-2600
2 x Intel Xeon E5-2600
2 x Intel Xeon E5-2600
Max. Cores 16 16 16 16
Chipset Intel C600 Intel C600 Intel C600 Intel C600
Memory 8 x DDR3 8 x DDR3 24 x DDR3 16 x DDR3
Hard Drives 4 x 2.5” 10 x 2.5” 8 x 3.5”; 12 x 3.5” or 24 x 2.5”
4 x 3.5” or 10 x 2.5”
Expansion Slots
Two PCI-E 3.0 x 16 (two internal, one external) double-wide slots; one PCI-E 3.0 x8 low-profile
slot
Four PCI-E 3.0 x16 (internal only) double-width slots
(optional riser card for 2 additional
external PCI-E 3.0 x16 double width slots***),
One PCI-E 3.0 x8 and one PCI-E
2.0 x4 low profile
Six PCI-E 3.0 x 8 Full Height
1 x Intel SAS Module***
1 x PCI-E Gen3 x 8 Intel I/O Expansion
module
One PCI-E 3.0 x 16 Full Height and one PCI-E 3.0 x16 Low-
Profile
Networking 2 x GigE 2 x GigE 4 x GigE 3 x GigE
Management IPMI 2.0 IPMI 2.0 IPMI 2.0 IPMI 2.0
Power Supply
AC RPS AC RPS AC RPS AC RPS
*** not available at launch
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Rackable® Standard Depth: Single Node (Cont’d)
Model C2108-G9 H2106-G7 C1103-TY12
Form Factor 2U standard-depth
2U standard-depth
1U standard-depth
CPU 2 x AMD Opteron
62/300 Series
4 x AMD Opteron
62/300 Series
2 x Intel Xeon 5500/5600
Max. Cores 32 64 12
Chipset AMD SR5690 + SP5100
AMD SR5690 + SR5670 +
SP5100
Intel 5520
Memory 16 x DDR3 32 x DDR3 12 x DDR3
Hard Drives 8 x 3.5” 6 x 3.5” 3 x 3.5”
Expansion Slots
Three PCI-E 2.0 x8
Two PCI-E 2.0 x16 and two PCI-E 2.0 x8
[Two PCI-E 2.0 x16] or [one PCIE 2.0 x16 and two PCI-E 2.0 x8] or [four PCI-E 2.0 x8]. Additional PCI-E 2.0 x4 LP
Networking 2 x GigE 2 x GigE 2 x GigE
Management IPMI 2.0(TBD: KVM)
IPMI 2.0 + KVM
IPMI 2.0
Power Supply
AC RPS AC RPS AC
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Rackable® Standard Depth: Multi-Node
Model C2112-4RP4 C2112-4RP3 C2112-4G10
Form Factor 2U standard-depth
2U standard-depth
2U standard-depth
Nodes/Server Four Four Four
CPU/Node 2 x Intel Xeon E5-2600
2 x Intel Xeon E5-2600
2 x AMD Opteron 62/6300 series
Max. Cores/Node 16 16 24
Chipset/Node Intel C600 Intel C600
Memory/Node 16 x DDR3 8 x DDR3 8 x DDR3
Hard Drives/Node 4 x 2.5” or 3 x 3.5”
4 x 2.5” or 3 x 3.5”
3 x 3.5”
Expansion Slots/Node
One PCI-E 3.0 x16 low-profile
PCI-E 3.0 Intel I/O Module
One PCI-E 3.0 x16 low-profile
PCI-E 3.0 Intel I/O Module
1 x PCIe Gen 3 x16 low-profile
Networking/Node 2 x GigE + optional QSFP QDR or FDR* InfiniBand per
node
2 x GigE + optional QSFP QDR or FDR* InfiniBand per
node
2 x GigE + optional IB QDR
single-port
Management/Node IPMI 2.0 IPMI 2.0 IPMI 2.0
Power Supply AC RPS AC RPS AC RPS* Not at launch
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Rackable® Half-Depth: C1001
Model C1001-TY8 C1001-C1 C1001-G13 C1001-RP6
Form Factor 1U half-depth 1U half-depth 1U half-depth 1U half-depth
CPU 2 x Intel Xeon 5500/5600
2 x AMD Opteron 4200
2 x AMD Opteron 6200
2 x Intel Xeon E5-2600
Max. Cores 12 16 32 16
Chipset Intel 5520 AMD SR5690 + SP5100
AMD SR5690 + SP5100
Intel C600
Memory 18 x DDR3 12 x DDR3 16 x DDR3 16 x DDR3
Hard Drives 1 x 3.5” or 2 x 2.5”
1 x 3.5” or 2 x 2.5”
1 x 3.5” or 2 x 2.5”
1 x 3.5” or 2 x 2.5”
Expansion Slots 1 x PCI-E 2.0 x16 1 x PCI-E 2.0 x16 1 x PCI-E 2.0 x16 1 x PCI-E 2.0 x16
Networking 3 x GigE 3 x GigE 3 x GigE 3 x GigE
Management IPMI 2.0 + KVM IPMI 2.0 + KVM IPMI 2.0 + KVM IPMI 2.0 + KVM
Power Supply AC or DC AC or DC AC or DC AC or DC
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Rackable® Half-Depth: C2005
Model C2005-TY7 C2005-TY15 C2005-C3 C2005-G11 C2005-RP1 C2005-RN1
Form Factor 2U half-depth 2U half-depth 2U half-depth 2U half-depth 2U half-depth 2U half-depth
CPU 2 x Intel Xeon 5500/5600
2 x Intel Xeon 5500/5600
2 x AMD Opteron 4200
2 x AMD Opteron 6200
2 x Intel Xeon E5-2600
2 x Intel Xeon E5-2400
Max. Cores 12 12 16 32 16 16
Chipset Intel 5520 Intel 5520 AMD SR5690 + SP5100
AMD SR5690 + SP5100
Intel C600 Intel C600
Memory 18 x DDR3 12 x DDR3 8 x DDR3 16 x DDR3 16 x DDR3 12 x DDR3
Hard Drives 5 x 3.5”, 10 x 2.5” or
combination
5 x 3.5”, 10 x 2.5” or
combination
5 x 3.5”, 10 x 2.5” or
combination
5 x 3.5”, 10 x 2.5” or
combination
5 x 3.5”, 10 x 2.5” or
combination
5 x 3.5”, 10 x 2.5” or
combination
Expansion Slots (Single
Riser Slot Also
Available)
Three PCI-E 2.0 x8 and one
PCI-E 2.0 x4
Four PCI-E 2.0 x8 and one PCI-E 2.0 x4
Two PCIE-E 2.0 x16, one PCI-E
2.0 x8, one PCI-E 2.0 x4 and one PCI-
33
One PCI-E 2.0 x16 or two
PCI-E 2.0 x8 (auto-
selected), one PCI-E 2.0 x8, one PCI-E 2.0
x4
One PCI-E 3.0 x8 full-height
(horiz) or 5 PCI-E 3.0 half-
height x8 (vertical)
Two PCI-E 3.0 x16, one PCI-E 3.0 x8 and two
PCI-E 3.0 x4
Networking 4 x GigE 2 x GigE 4 x GigE 2 x GigE 2 or 4 x GigE 2 or 4 x GigE
Management IPMI 2.0 + KVM
IPMI 2.0 + KVM
IPMI 2.0 + KVM
IPMI 2.0 + KVM
IPMI 2.0 + KVM
IPMI 2.0 + KVM
Power Supply
AC, AC RPS or DC
AC, AC RPS or DC
AC, AC RPS or DC
AC, AC RPS or DC
AC, AC RPS or DC
AC, AC RPS or DC
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Rackable® ServerMotherboards
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SGI Board Form FactorsSGI leverages three principal form factors to achieve best-in-class designs that are thermally superior:
EATX form factor Offset
CPU/memory Ideal for 2U+
Rackable + CloudRack
EATX form factor Rear
CPU/memory Ideal for 1U-2U
Rackable + CloudRack
“Twin” form factor
Ideal for Rackable std-depth + CloudRack
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Intel Romley Platform (SandyBridge EP and EN)
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Processor(2) Intel® Xeon® E5-2600 (Romley EP) 130W 8 core CPUs
ChipsetIntel® C600 series PCH (Patsburg-A/-D)
Memory(4) memory channels per CPU(8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs
PCI Expansion Slots(6) PCI-E G3 x8 slots
Network(4) GbE ports (Intel® I350-AM)
Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support
(w/upgrade key)VGA & IPMI 2.0
Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)
Form FactorSSI EEB (12” x 13”)
Target ApplicationsSearch engineHadoop / storage serverWorkstation
RP1 (Intel® S2600CP “Canoe Pass”)
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Target ApplicationsCPU-centric HPCSearch engineVirtual machine
Processor(2) Intel® Xeon® E5-2600 (Romley EP) 150W 8 core CPUs
ChipsetIntel® C600 series PCH (Patsburg-A/-D)
Memory(4) memory channels per CPU(8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs
PCI Expansion Slots(2) PCI-E G3 x16 slots(2) PCI-E G3 x4 slots
Network(3) GbE port
Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support]
VGA & IPMI 2.0ASPEED AST2300 iBMC w/iKVMShared management port
Form FactorEATX (12” x 13”)
RP6 (Tyan® S7056)
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Target Applications“Summit” RFP2U storage server
Processor(2) Intel® Xeon® E5-2600 (Romley EP) 130W 8 core CPUs
ChipsetIntel® C600 series PCH (Patsburg-A w/option keys)
Memory(4) memory channels per CPUS2600GL4 – (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMsS2600GL4 – (12+12) U/LR/RDDR3 1.5V, 1.35V DIMMs
PCI Expansion Slots(6) PCI-E G3 x8 slots (riser)
Network(4) GbE port (Intel® Powerville-17)
Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS 3Gb ports RAID 0/1/10 support (module)
VGA & IPMI 2.0Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)
Form Factor16.5” x 16.5”
RP2 (Intel® S2600GZ4/GL4 “Grizzly Pass”)
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Processor(2) Intel® Xeon® E5-2600 (Romley EP) 135W 8 core CPUs
ChipsetIntel® C600 series PCH (Patsburg-A/-B)
Memory(4) memory channels per CPU(8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs
PCI Expansion Slots(4) PCI-E G3 x16 slots
Network(1) IB QDR (CX3) WPQ SKU(1) IB FDR (CX3) Q2 2012***(2) GbE ports (Intel® Powerville)
Storage (2) SATA-III ports (one via SATA DOM)(4) SATA-II ports RAID 0/1/10/5 support (via module)
VGA & IPMI 2.0Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)
Form FactorSFF (6.8” x 18.9”)
***not available at launch
Target ApplicationsGPU or CPU-centric HPCApplication gatewayVirtual machineSearch engine
RP4 (Intel® S2600WP “Washington Pass”)
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Processor(2) Intel® Xeon® E5-2600 (Romley EP) 135W 8 core CPUs
ChipsetIntel® C600 series PCH (Patsburg-A)
Memory(4) memory channels per CPU(4+4) U/LR/RDDR3 1.5V, 1.35V DIMMs
PCI Expansion Slots(4) PCI-E G3 x16 slots(1) PCI-E G3 x8 slot
Network(2) GbE ports (Intel® I350)
Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support
VGA & IPMI 2.0Server Engines Pilot III iBMC w/iKVM (w/key)Shared management port
Form FactorSFF (7.71” x 16.64”)
Target ApplicationsGPU-centric HPCStorage serverApplication gatewaySearch engine
RP5 (SuperMicro® X9DRG-HF)
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RN1(Intel® S2400GP “Granite Pass”)
Processor (2) Intel® Xeon® E5-2400 (Sandy Bridge-EN)95W
ChipsetIntel® C600 series PCH (Patsburg-A/D/T)
Memory(3) memory channels per CPU(6+6) U/LR/RDDR3 1.5V, 1.35V DIMMs
PCI Expansion Slots (2) PCI-E G3 x16 slot (1) PCI-E G3 x8 slot (1) PCI-E G3 x8 slot x4 electrical (1) PCI-E G2 x8 slot x4 electrical (1) PCI 32bit/33MHz slotNetwork
(2/4) GbE ports (Intel® I350-AM)Storage
(2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support
(w/upgrade key)VGA & IPMI 2.0
Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)
Form FactorSSI EEB (12” x 13”)
Target Applications
Search engineHadoop / storage serverWorkstation
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AMD Socket G (Magny Cours)
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G11
Form Factor: EATX Chipset: AMD SR5690 + SP5100 CPU: 2 x AMD Opteron 6200 Memory: 16 x DDR3 DIMM (Max. 1600MHz) Expansion Slots:
One PCI-E 2.0 x16 or two PCI-E 2.0 x8 (auto-selected), one PCI-E 2.0 x8, one PCI-E 2.0 x4
Networking: Two GigE (Two Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Asus KGPE-D16
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G13
Form Factor: EATX Chipset: AMD SR5690 + SP5100 CPU: 2 x AMD Opteron 6200 Memory: 16 x DDR3 DIMM (Max. 1600MHz) Expansion Slots:
One PCI-E 2.0 x16 Networking: Three GigE (Intel 82576EB + Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8236IL
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C1
Form Factor: EATX Chipset: AMD SR5690 + SP5100 CPU: 2 x AMD Opteron 4200 Memory: 12 x DDR3 DIMM (Max. 1600MHz) Expansion Slots:
One PCI-E 2.0 x16 Networking: Three GigE (Intel 82576EB + Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8226
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C3
Form Factor: EATX Chipset: AMD SR5690 + SP5100 CPU: 2 x AMD Opteron 4200 Memory: 12 x DDR3 DIMM (Max. 1600MHz) Expansion Slots:
Two PCIE-E 2.0 x 16, one PCI-E 2.0 x8, one PCI-E 2.0 x4 and one PCI-33 Networking: Four GigE (Intel 82576EB +2 x Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8225
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Intel Tylersburg Platform (Westmere EP)
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TY6
Form Factor: EATX Chipset: Intel 5500 CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W) Memory: 8 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:
One PCI-E x8 and One PCI-E x4 Networking: Embedded dual port Intel® 82576 Gigabit
Ethernet with Intel I/O Acceleration Technology (I/O AT) Management: IPMI 2.0 + KVM Options: Modular SAS and SAS RAID solution via optional
Intel® I/O Expansion Module Manufacturer model: Intel S5500WB
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TY7
Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D) CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W) Memory: 18 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:
Four PCI-E 2.0 x8 and PCI-E x4 slot Networking: Four GigE (Intel 82576 + 82574L) Management: IPMI 2.0 + KVM (also Roamer compatible) Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S7012 Application: Edge servers with high memory requirements
and/or need for multiple NICs
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TY8
Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D) CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W) Memory: 18 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:
PCI-E 2.0 x16 or two x8 (auto-selected) Networking: Three GigE (Intel 82576 + 82574) Management: IPMI 2.0 + KVM (also Roamer compatible) Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S7016 Positioning: Application/edge servers with high memory
requirements and/or need for multiple NICs
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TY15
Form Factor: EATX Chipset: Intel 5520 CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W) Memory: 12 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:
Four x PCI-E 2.0 x8 and one x4 Networking: Embedded dual port Intel® 82575EB Gigabit
Ethernet Management: IPMI 2.0 + KVM Options: Modular SAS and SAS RAID solution via optional
Intel® I/O Expansion Module Manufacturer model: Intel S5520HC
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Rackable® ServersModel Reference
Slides
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• Rackable server model numbering is logical and extensible. Important for a large and growing product line.
• All Rackable model numbers are structured as follows:• C: Compute Server• <numeral>: Number of U’s• <numeral>: Form factor
• 0 = half-depth, 1 = std-depth, 2 = ICE Cube optimized
• <two numerals>: Number of hot-swap drive bays• Default to 3.5” bays if a server has the choice of either 2.5”
or 3.5”
• <hyphen>• <optional numeral>: Number of nodes (one, if not present)• <motherboard identifier>: Based on chipset architecture
Rackable® Model Numbering Introduction
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• Rackable C2112-4RP4 (“Steelhead-WP”):• C = Compute Server• 2 = 2U• 1 = Standard Depth• 12 = 12 x 3.5” hot-swap drive bays• 4 = four nodes• RP4 = the 4th Romley-Platform board qualified
Rackable® Model Numbering Example
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Form Factor: 1U half-depth
Hard Drives (hot-swap):
One 3.5” SAS/SATA drive
Two 2.5” SAS/SATA/SSD drives
Access via hinged Roamer LCD
Expansion Slot: One standard-height (on riser)
Power Supply: AC or DC
Remote Management: Integrated IPMI 2.0 + KVM or Roamer
Positioning:
Ideal general-purpose edge server
High configuration flexibility, expansion slot, up to 18 DIMM slots
Rackable® Half-Depth Server: C1001
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Form Factor: 2U half-depth Hard Drives:
Up to five 3.5” SAS/SATA drives Up to ten 2.5” SAS/SATA/SSD drives 2.5” / 3.5” combinations supported Access to lower left bay drive(s) via hinged Roamer LCD
Expansion Slots: One standard-height (on riser) or five low-profile slots, config.
dependent.
Power Supply: AC or DC New redundant AC RPS option
Remote Management: Integrated IPMI 2.0 + KVM or Roamer Positioning:
Ideal general purpose 2U half-depth server where greater local storage density or I/O expansion is required. Strong in Internet search, scale-out database configurations.
Rackable® Half-Depth Server: C2005
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Form Factor: 4U half-depth CPU: AMD Opteron 6200 - quad socket Hard Drives:
Two 3.5” SAS/SATA drives
Memory: 32 x DDR3 1600/1333/1066/800 MHz Expansion Slots:
1 x PCIEx16 (full height) 3 x PCIEx8 (full height)
Power Supply: AC, Redundant AC, (or DC) LSI SAS 2008 : 6Gbs, RAID 0, 1, 10 option 3 x GigE onboard ports Positioning:
Typically sold with redundant AC power, SAS drives as a database server.
Rackable® Half-Depth Server: H4002-G6
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Rackable® Standard-Depth Servers(Intel Xeon E5-2600 and E5-2400)1U
C1104G-RP5
2U
C2110G-RP5
1U 2U
C1110-RP6 C2108-RP2
2U/Multi-node
C2112-4RP4
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Rackable® C1104G-RP5Code Name “Pyramid 1U”
Chassis Profile 1U standard-depth
Servers/System One dual-socket
Chipset Intel® C600
Max. Processors Two Intel® Xeon® E5-2600
Max. CPU TDP 115W
Memory Slots 8 DIMM slots
Memory Type1600/1333/1066/800 MHz DDR3 ECC
Reg
Max. Hard Disk Drives
4 x 2.5" drives
Expansion Slot
Three PCI-E 3.0 x16 (two internal and one external) double-width slots
One external PCI-E 3.0 x8 low-profile slot
Networking (Onboard)
Dual-Port GigE controller (Intel® I350)
IPMI Remote Management Integrated IPMI 2.0
Power Supply 1800W Redundant* Platinum Level
*Redundant per configuration
Compute GPU/ Co-processor support:• Tesla M2075, M2090**, K10, K20, Xeon PHINVIDIA graphics GPU support: • Quadroplex 7000
**130W standard Max CPU TDP. 135W CPU TDP with ambient temp. restrictions
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Code Name “Pyramid 2U”
Chassis Profile 2U standard-depth
Servers/System One dual-socket
Chipset Intel® C600
Max. Processors Two Intel® Xeon® E5-2600
Max. CPU TDP 130W
Memory Slots 8 DIMM slots
Memory Type1600/1333/1066/800 MHz DDR3 ECC
Reg
Max. Hard Disk Drives 10 x 2.5” drives
Expansion Slot
Four internal PCI-E 3.0 x16 double-width
One external PCI-E 3.0 x8 low profile and one PCI-E 2.0 x4 full height
Networking (Onboard) Dual-Port GigE controller (Intel® I350)
IPMI Remote Management Integrated IPMI 2.0
Power Supply 1800W Redundant** Platinum Level
**Redundant per configuration
Compute GPU/ Co-processor support:• Tesla M2075, M2090, K10, K20, Xeon PHINVIDIA graphics GPU support: • Quadroplex 7000
Rackable® C2110G-RP5
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Code Name “Steelhead-WP”
Chassis Profile 2U standard-depth
Servers/System Four dual-socket (hot-pluggable)
ChipsetFour Intel® C600
(one/server)
Max. ProcessorsEight Intel® Xeon® E5-2600
(two per server node)
Max. CPU TDP 135W*
Memory Slots 64 DIMM slots (16/server)
Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg.
Max. Hard Disk Drives16 x 2.5" drives (four per server)
or 12 x 3.5” drives (three per server)
Expansion Slots/Networking
Four PCI-E 3.0 x16 low-profile (one/server)
Four single port IB QDR or FDR onboard optional (one/server)
Four Gen3 x8 I/O module(one/server)
Networking (Onboard) Dual-Port GigE controller (Intel® I350)
IPMI Remote Management Integrated IPMI 2.0
Power Supply 1200W Redundant** Platinum Level*130W standard Max. 135W with ambient temp. restrictions **Redundant per configuration
Rackable® C2112-4RP4
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Code Name “Steelhead-JP”
Chassis Profile 2U standard-depth
Servers/System Four dual-socket (hot-pluggable)
ChipsetFour Intel® C600
(one/server)
Max. ProcessorsEight Intel® Xeon® E5-2600
(two per server node)
Max. CPU TDP 135W*
Memory Slots 32 DIMM slots (8/server)
Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg.
Max. Hard Disk Drives16 x 2.5" drives (four per server)
or 12 x 3.5” drives (three per server)
Expansion Slots/Networking
Four PCI-E 3.0 x16 low-profile (one/server)
Four single port IB QDR or FDR onboard optional (one/server)
Four Gen3 x8 I/O module(one/server)
Networking (Onboard) Dual-Port GigE controller (Intel® I350)
IPMI Remote Management Integrated IPMI 2.0
Power Supply 1200W Redundant** Platinum Level*130W standard Max. 135W with ambient temp. restrictions **Redundant per configuration
Rackable® C2112-4RP3
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Code Name “Summit”
Chassis Profile 2U standard-depth
Servers/System One dual-socket
Chipset Intel® C600
Max. Processors Two Intel® Xeon® E5-2600
Max. CPU TDP 135W*
Memory Slots 24 DIMM slots
Memory Type1600/1333/1066/800 MHz DDR3
ECC reg.
Max. Hard Disk Drives 8 x 3.5“
12 x3.5" or 24 x2.5” drives
Expansion Slots
• Six PCIe Gen3 x8 Full Height or Two PCIe Gen3 x16 Double Width and two PCIE Gen3 x8
Full Height• 1 x PCIe Gen3 x8 Intel I/O
module option
Networking (Onboard) Quad-Port GigE controller(Intel® I350)
IPMI Remote Management Integrated IPMI 2.0
Power Supply 750W Redundant Platinum Level**
*130W standard Max. 135W with ambient temp. restrictions** Redundant per configuration
Compute GPU/ Co-processor support:• Tesla K20, Xeon PHI
Rackable® C2108-RP2
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Code Name “Bison”
Chassis Profile 1U standard-depth
Servers/System One dual-socket
Chipset Intel® C600
Max. Processors Two Intel® Xeon® E5-2600
Max. CPU TDP 135W
Memory Slots 16 DIMM slots
Memory Type1600/1333/1066/800 MHz
DDR3 ECC reg.
Max. Hard Disk Drives 4 x 3.5“ or 10 x 2.5"
drives
Expansion SlotsOne PCIE Gen3 x16 full
height and one PCIE Gen3 x16 low profile
Networking (Onboard)Three GigE controllers (twoIntel® I350 and one Intel®
82574L)IPMI Remote Management Integrated IPMI 2.0
Power Supply650W Redundant PS or
450W Single PS
Rackable® C1110-RP6
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Rackable™ Standard-Depth Servers(Intel 5600 and AMD 62/300)
2U
C2108-G9
1U
2U
2U
C1103-TY12
H2106-G7
C2112-4G10
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C1103-TY12 (1U)
Processor Support Dual Nehalem-EP Xeon CPU, 5500 series
Memory Capacity 12 DIMM, DDR3 1333/1066/800 MHz
Expansion Slots 2 x PCI-e X16 Gen 2.0 (Full height, double width) - Optional riser cards to split one or both x16 slots in two x 8 slots - 1 x PCI-e X4 (Low-profile)
I/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 2 x USB 2.0 ports
System managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0
Drive Bays 3x hot-swap 3.5” SATA HDD
System Cooling4 fans w/ Optimal Fan Speed Control
Power Supply1400W High-efficiency power supply
NVIDIA compute GPU support:• S2090, M2075, M2090, M2070QNVIDIA graphics GPU support: • Quadro FX 1800, 3800, 4800, 5800• Quadro 2000, 4000, 5000, 6000• Quadroplex 7000
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Processor Support AMD Socket G34 Opteron™ 6200 /6300 Series – dual socket
Memory Capacity 16 DIMM , DDR3 1600/1333/1066/800 MHz
Expansion Slots 1 UIO slot3 PCI-E 2.0 x8 slot
I/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 4 x USB 2.0 ports
System managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0
Drive Bays
8 x 3.5” SATA/SAS HDD or SSDs: JBOD, RAID 0, 1, 5, 6, 10
System Cooling4x PWM Fans w/ Optimal Fan Speed Control
Power Supply2 x 720W High-efficiency redundant power supplies
C2108-G9 (2U)
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Processor Support 4 nodes per chassisAMD Socket G34 Opteron™ 6200 /6300 Series – dual socket
Memory Capacity 8 DIMMs (per node), DDR3 1600/1333/1066/800 MHz
Expansion Slots 1 x PCI-e X16 Gen 2 per node (low profile)IB QDR single port optional
I/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 4 x USB 2.0 ports
System managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0
Drive Bays 3 x 3.5” SATA HDD (per node), JBOD
System Cooling4x PWM Fans w/ Optimal Fan Speed Control
Power Supply2 x 1600W High-efficiency redundant power supplies
C2112-4G10 (2U)C2112-4G10 (2U)
Nvidia graphics GPU support: Quadroplex 7000
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H2106-G7 (2U)
Power Supply1400W High-efficiency Gold Level Redundant Power (RPS optional)
Expansion Slots2 x PCI-E 2.0 x16 (low profile)1 x PCI-E 2.0 x8 slot (low profile)
System Cooling6x 4-pin PWM Fans w/ Optimal Fan Speed Control
Drive Bays6x Hot-swappable 3.5” SAS/SATA Hard Drive Bays
I/O ports1 VGA, 1 COM, 2 Gbit LAN, 4 USB 2.0 ports.IPMI 2.0
Processor Support & ChipsetAMD Socket G34 Opteron™ 6200/6300 Series – quad socket
Memory Capacity32 DIMMs DDR3 1600/1333/1066/800 MHz
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Why Romley?
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Romley Value Propositions• Most dramatic performance improvement in a
generation, in some cases up to 3X performance increase
• Most flexible and highest price-performance product line in the industry
• Ideal for workloads in Private Enterprise and Public Cloud, Hadoop, HPC
• Most ecological solution in the industry using fine-grained power optimization
• Replacing systems from 2007 will result in a 66% TCO decrease
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New Capabilities for Romley• New server for GPU compute “Pyramid”
• 3 GPUs + IB in a 1U, or up to 6 GPUs + IB in a 2U• RPS available• Consolidates capabilities from several models
• New 2U/4 node dense cluster node “Steelhead”• Same great density, increased I/O options
• New 2U I/O rich server “Summit”• Six Full Height PCIE slot options, consolidates three models
• New 1U model with RPS: “Bison”• New capability!• Redundant Power Supply option and up to 10 x 2.5” HDDs
in 1U
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“SandyBridge” Servers Summary Project Code Name “Tylersburg”Equivalent Key Features Application Areas
“Steelhead” C2112-4RP4 and C2112-4RP3
C2112-4TY14C1104-2TY9
4 x 2S nodes in a 2U; optional on-board IB; 4 LP PCIe x 16 slots
HPC—dense cluster compute node; cloud
“Summit” C2108-RP2 C2108-TY10C2108-TY11
Single 2S EATX Motherboard; Up to 24 x 2.5 in. HDD; Up to 6 Full Height PCIe slots
Head node for HPC cluster
“Pyramid” C1104G-RP5 (1U),C2110G-RP5 (2U)
C1103-TY12C3108-TY11H4002
Single 2S slim Motherboard; up to3 x GPUs in 1U or 6 x GPUs in 2U; RPS
HPC—GPU computing
“Bison” C1110-RP6 New capability! 1 x 2S EATX motherboard; RPS
Media, Financial Services computer/rending node
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Rackable® Networking
Reference Slides
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Ethernet adaptersThe Silicom SFP+ 10 Gigabit Ethernet PCI Express server adapters are based on Intel 82599ES Ethernet controller with SFP portsThe fourth-generation (T4) technology from Chelsio provides the highest 10GbE performance available and dramatically lowers host-system CPU communications overhead with onboard hardware that off-loads TCP/IP, iSCSI, FCoE, and iWARP RDMA processing from its host system
Silicom PE210G2SPi9 Chelsio T420-CR
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LG-Ericsson stacking switches
• 24 port and 48 port switches provide the infrastructure for Ethernet clusters as well as the administrative fabric for the IB clusters
• Max. stacking limit is 192 ports (4 x 48port switches)
• Fat tree topology utilizing the10 GbE switch at L2 and 1 GbE switches at L1 to support large clusters
iPECS Ethernet SwitchES-4500G Series
iPECS 10G Data Center SwitchES-5000XG Series
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Mellanox/Voltaire IB QDR switches
108 CXP-CXP cables Fully non-blocking Flexible Racking 12 x 12X connectors
4036
36 port QDR (1U)
4200
144 port QDR (11U)
324 port QDR (19U)
2 x 4700
648 ports QDR
4700
IS5025/IS5030/IS5035 36-port 40Gb/s InfiniBand Switch Systems
IS5300 324-Port InfiniBand Chassis Switch
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Qlogic QDR IB switches
6U
1U
Form Factors:– 36 port, Internally Managed (1U)– 72-96 port, Director Class (5U), – 108-144 port, Director Class (6U) – 216-288 port, Director Class
(10U) – 324-432 port, Director Class
(14U)– 648-864 port, Director Class
(29U)
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Mellanox IB FDR adapters and switches5th generation SwitchX® InfiniBand switch devices, up to 56Gb/s (FDR) full bisectional bandwidth per portOnboard subnet manager, enabling simple, out-of-the-box fabric bring-up for up to 648 nodesCompliant with IBTA 1.21 and 1.3Mellanox ConnectX-3 provides one adapter for InfiniBand, 10/40 Gig Ethernet or Data Center Bridging fabrics.PCIe Base 3.0 compliant, 1.1 and 2.0 compatible
SX6025/SX6036 36-port 56Gb/s InfiniBand Switch Systems
SX6536 648-Port InfiniBand Director SwitchConnectX®-3