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Nano Res
1
Chemical vapor deposition growth of large-scale
hexagonal boron nitride with controllable orientation
Xiuju Song1, Junfeng Gao3, Yufeng Nie1, Teng Gao1, Jingyu Sun1, Donglin Ma1, Qiucheng Li1, Yubin
Chen1, Chuanhong Jin4, Alicja Bachmatiuk5, Mark H. Rümmeli6,7, Feng Ding3 ( ), Yanfeng Zhang1,2 (),
and Zhongfan Liu1 ( )
Nano Res., Just Accepted Manuscript • DOI 10.1007/s12274-015-0816-9
http://www.thenanoresearch.com on May 15, 2015
© Tsinghua University Press 2015
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Nano Research
DOI 10.1007/s12274-015-0816-9
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Chemical Vapor Deposition Growth of Large -scale
Hexagonal Boron Nitride with Controllable
Orientation.
Xiuju Song, Junfeng Gao, Yufeng Nie, Teng Gao,
Jingyu Sun, Donglin Ma, Qiucheng Li, Yubin Chen,
Chuanhong Jin, Alicja Bachmatiuk, Mark H. Rümmeli,
Feng Ding*, Yanfeng Zhang*, Zhongfan Liu*
Center for Nanochemistry (CNC), Peking University,
People’s Republic of China
Wafer-scale high-quality h-BN monolayer film is obtained with the
largest domain sizes up to 72 μm using a folded Cu enclosure
approach. The orientations of as-grown h-BN monolayers are strongly
correlated with the underneath Cu crystalline facets, with the Cu (111)
being the best substrate for growing high-quality single crystalline
h-BN monolayer.
Chemical vapor deposition growth of large-scale
hexagonal boron nitride with controllable orientation
Xiuju Song1, Junfeng Gao3, Yufeng Nie1, Teng Gao1, Jingyu Sun1, Donglin Ma1, Qiucheng Li1,
Yubin Chen1, Chuanhong Jin4, Alicja Bachmatiuk5, Mark H. Rümmeli6,7, Feng Ding3( ), Yanfeng
Zhang1,2( ), Zhongfan Liu1( )
3
Received: day month year
Revised: day month year
Accepted: day month year
(automatically inserted by
the publisher)
© Tsinghua University Press
and Springer-Verlag Berlin
Heidelberg 2014
KEYWORDS
hexagonal boron nitride,
Cu foil, domain size,
orientation, CVD
ABSTRACT
Chemical vapor deposition (CVD) synthesis of large-domain hexagonal boron
nitride (h-BN) with uniform thickness is of great challenge, mainly originating
from the extremely high nucleation density. We report herein the successful
growth of wafer-scale high-quality h-BN monolayer films with large
single-crystalline domain size up to ~72 μm in edge length using a folded Cu
enclosure approach. The highly-confined growth space and smooth Cu surface
inside the enclosure enable the effective suppression of precursor feeding rate
together with a drastic decrease of nucleation density. The orientations of
as-grown h-BN monolayer are found to be strongly correlated with
crystallographic orientations of Cu substrates, with Cu (111) being the best
substrate for growing aligned h-BN domains and even single-crystalline
monolayers, consistent with density functional theory calculations. The present
study offers a practical pathway for growing high-quality h-BN films by
deepening our fundamental understanding of its CVD growth process.
1 Introduction
Two-dimensional materials have received
increasing attention since the discovery of graphene
[1-3]. Specifically, hexagonal boron nitride (h-BN), a
structural analogue of graphene, possesses only a
1.8% lattice mismatch with graphene but has a large
band gap (~5.9 eV). The combinations of graphene
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2 Nano Res.
and h-BN, including both in-plane h-BN-graphene
hybrids and stacked graphene/h-BN (G/h-BN)
structures, have been demonstrated very intriguing
physical properties such as Hofstadter’s butterfly
[4-10]. In particular, G/h-BN vertical stacks exhibit
the excellent field effect transistor performance with
extremely high carrier mobility [11]. As the perfect
dielectric layer, h-BN has an atomically flat and
dangling bond-free surface, which ensures no charge
traps at the G/h-BN interface and results in an order
of magnitude increase of graphene’s carrier mobility
as compared to the typical SiO2/Si substrate [12, 13].
h-BN has also stimulated various applications in
deep ultraviolet light emitters [14], protective
coatings [15], and transparent electronics [16], due to
its excellent mechanical strength, chemical inertness
as well as nice optical transparency. These attractions
of h-BN have ignited numerous efforts on its
synthesis in the past few years, targeting uniform
thickness, large domain size and high crystallinity.
Indeed, the chemical vapor deposition (CVD)
growth of h-BN has been explored by using a variety
of transition metals as substrates, such as Ni films, Pt
foils, Fe films and Cu-Ni alloys [17-24]. Cu foil is the
most common substrate for h-BN growth due to its
low cost, commercially easy availability and
well-behaved catalytic performance for obtaining
high-quality h-BN films. Kim et al. pioneered the
monolayer h-BN growth on Cu foil via a low
pressure CVD (LPCVD) route and obtained h-BN
triangles with ~1 μm in edge length [25]. By
employing electropolished Cu foils, Teo et al.
obtained h-BN hexagons with a maximum edge
length of ~5 μm very recently, attributable to a
reduced nucleation density [26]. Nucleation sites can
also be suppressed simply by increasing the
pre-annealing time of Cu foil up to 6 h, which
resulted in the largest h-BN monolayer triangles with
an edge length of ~20 μm [27]. However, the
challenges still remain with respect to h-BN/Cu
synthesis including the uniformity control, thickness
control and domain size enlargement, which are
crucial for various applications of h-BN, especially in
high-performance G/h-BN devices.
In this work, we demonstrate the large
single-crystalline monolayer h-BN domain
synthesized on Cu foils by using an LPCVD
technique. The key to its success lies in effectively
suppressing the nucleation density during the CVD
growth process by using the inner surface of a folded
Cu foil enclosure as the substrate. Though Cu
enclosure has been used in graphene growth [28-30],
this is first time to be employed in h-BN growth.
Triangular-shaped single crystal h-BN flakes with a
domain size up to ~72 μm in edge length and a high
monolayer percentage up to 92% have been obtained
through kinetic control of the Cu-CVD process. More
importantly, we find that the orientations of the
as-grown h-BN flakes are strongly correlated to the
underlying Cu crystalline facets. In other words, the
symmetry of the Cu facet (representatively (111),
(110), or (100)) greatly affects the orientations of the
h-BN monolayers on it. The edge of an h-BN domain
tends to be aligned along a high symmetry direction
of the crystal facet, as evidenced by atomically
resolved scanning tunneling microscopy (STM)
images with a uniform large moiré (>10 nm)
formation, consistent with supporting density
functional theory (DFT) calculations. The Cu (111)
single crystal is found to be the ideal surface for
growing well-aligned h-BN domains. The present
study certainly provides a future direction for
growing high-quality h-BN films as well as
deepening the fundamental understanding of the
Cu-CVD process.
2 Results and Discussion
As schematically illustrated in Figure 1a, h-BN was
grown on polycrystalline Cu foils via a LPCVD
method by using ammonia borane (BH3-NH3) as the
precursor. Prior to the CVD growth, the Cu foil was
electropolished to reduce the surface roughness and
remove attached contaminations, followed by folding
it into an enclosure shape (Figure S1 in the Electronic
Supplementary Materials (ESM)). The BH3-NH3
precursor was put into a specially-designed
half-opened quartz cell and then loaded into the
CVD growth tube, where a heating belt was wrapped
around to aid the sublimation of BH3-NH3 at a
precursor evaporation temperature (Tp) range of
65 °C ~ 120 °C. The BH3-NH3 was sublimated and
decomposed into (BH2NH2)n, (BHNH)3 and hydrogen
(H2) [31], which were further pyrolyzed into B- and
N-containing intermediate species at the hot zone of
the reaction tube for h-BN growth. Before feeding
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3 Nano Res.
with the precursors, the Cu enclosure was annealed
at 1000 °C for 2 h in a flow of 20 sccm H2 and 50 sccm
Ar. The schematic view in Figure 1b illustrates the
surface growth process of h-BN on Cu foils.
Figure 1 Large-area synthesis and characterizations of h-BN films. (a) Experimental setup of LPCVD. (b) Schematic diagram of the
formation process of h-BN flake on Cu foils. (c) SEM image of large-domain h-BN triangle showing the edge length of ~72 μm. (d)
Optical microscope image of transferred h-BN film on SiO2/Si. (e) AFM image of h-BN film transferred onto SiO2/Si. The white line
profile shows a typical thickness of monolayer h-BN on SiO2 (~0.7 nm); the red and blue rectangles indicate the roughness-measuring
area at SiO2 and h-BN, respectively. (f) Wafer-scale monolayer h-BN film. (g) XPS spectra of N 1s (left) and B 1s (right) of h-BN film
with binding energy peaks at 398.1 eV and 190.5 eV, respectively. (h) Raman spectrum of h-BN on SiO2/Si with a typical peak at 1369
cm-1. (i) UV-Vis absorption spectrum of h-BN film with a calculated band gap of 5.9 eV.
The scanning electron microscope (SEM)
micrograph in Figure 1c depicts the h-BN triangular
flakes grown for 120 min at 1000 °C with a Tp
temperature of 65 °C, which show a darker contrast
with regard to the bare Cu substrate. The middle
triangle presents a maximum edge length of ~72 μm,
larger than that reported on the Cu foils [27]. With an
increase of growth time, these individual flakes can
gradually merge into a continuous layer, enabling
full coverage of monolayer h-BN on Cu foils. The
optical microscope (OM) image in Figure 1d displays
an h-BN film after transferred onto 280 nm SiO2/Si
via a conventional wet etching technique [32]. A
uniform contrast can be seen for the h-BN covered
area, suggesting the formation of a uniform h-BN
layer. The atomic force microscopy (AFM) image of
the transferred sample reveals a thickness of ~ 0.7 nm,
as shown in Figure 1e. The surface roughness of
h-BN film is measured to be 0.145 nm, lower than
that of the SiO2/Si substrate (0.166 nm) [25, 33].
Further statistical analysis of AFM height
distribution (48 points in total, Figure S2 in the ESM)
manifests a thickness fluctuation between 0.5~0.9 nm,
well consistent with that for typical monolayer h-BN
[26]. These observations confirm the monolayer
nature of the CVD-grown h-BN film. Wafer-scale
h-BN film has been grown in such a way with over
92% coverage (Figure 1f and Figure S2 in the ESM).
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4 Nano Res.
Spectroscopic characterizations, including X-ray
photoemission spectroscopy (XPS), Raman
spectroscopy and UV-visible spectroscopy (UV-Vis),
were carried out to determine the elemental
composition and stoichiometry, lattice vibration
modes as well as band gap information of the
obtained monolayer h-BN. Two characteristic XPS
peaks located at 398.1 eV and 190.5 eV, which can be
assigned to N 1s and B 1s signals, respectively, were
observed. The N/B ratio is estimated to be 1.09,
indicative of the predominant B-N chemical bonding
in the h-BN lattice (Figure 1g and Figure S3 in the
ESM). Raman spectrum of the h-BN film on a SiO2/Si
substrate shows a characteristic peak at ~1369 cm-1,
originating from the boron-nitrogen bond stretching
of monolayer h-BN (Figure 1h) [34]. The full width at
half maximum of the peak is ~25 cm-1, likewise
suggesting the monolayer feature and high
crystallinity [34]. The optical band gap measured
from UV-Vis spectroscopy of the h-BN monolayer
transferred onto quartz substrate is 5.9 eV as shown
in Figure 1i, which is very close to the theoretical
value (6.0 eV) [35].
Figure 2 Effect of precursor evaporation temperature on the CVD growth of h-BN with Cu enclosure approach. (a-e) SEM images of
h-BN triangles grown at different Tp temperatures and growth time: (a) 120 °C, 2 min; (b) 100 °C, 5 min; (c) 70 °C, 90 min; (d) 65 °C,
120 min; (e) 55 °C, 180 min, respectively. (f) SEM image of a continuous monolayer h-BN obtained at 70 °C Tp temperature for 2 h. (g)
Change of nucleation density as a function of Tp. (h, i) SEM image of h-BN films obtained on the outer (h) and inner (i) surfaces of Cu
enclosure with Tp=70 °C for 30 min, respectively. (j, k, l) AFM images of the outer (j) and inner (k) surfaces of Cu enclosure after
annealing at 1000 °C for 1 h and their height profile.
It is a general trend that, the h-BN film grown on
Cu foils is of polycrystalline nature with small grains
and highly concentrated grain boundaries and
defects [27]. This is attributed to the extremely large
nucleation centers created in the CVD growth
process. Compared with the Cu-CVD-graphene
process, the nucleation density on Cu foils during
h-BN growth is generally much higher, which is most
possibly attributed to the high chemical affinity of
N-containing intermediate species to the Cu surface
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5 Nano Res.
[36, 37]. In general, many factors determine the
nucleation density of h-BN on Cu foils, including
precursor evaporation temperature and rate,
substrate roughness, growth temperature, and
external impurities. Our systematic investigations
indicate that the feeding rate of precursors is a key
factor for nucleation density control. As a solid
precursor source was used, the amount of precursor
was fixed at 0.04 g and the feeding rate was adjusted
by varying the evaporation temperature of the
precursor cell. Figures 2a-e exhibit the SEM images of
h-BN monolayer triangles obtained on the inner
surface of Cu enclosure at different Tp temperatures
and hence feeding rates. At a 120 °C Tp temperature,
and a growth time of 2 min, h-BN triangles with an
average edge length of 2.8 μm were most available,
corresponding to a nucleation density of ca. 1.7×105
mm-2 (Figure 2a). When the Tp temperature was
decreased to 100 °C, h-BN triangular flakes with an
average edge length of 6.6 μm were obtained after 5
min growth (Figure 2b). If further reducing the Tp
temperature to 70 °C, the edge length of the h-BN
triangles increased to ~9.2 μm (Figure 2c) at a growth
time of 90 min. Further reducing the Tp temperature
to 55 °C, almost no h-BN was observed within a
growth time up to 3h (Figure 2e). The optimized Tp
temperature was 65 °C, with which large h-BN
triangles of ~50 μm in edge length were synthesized
for 120 min (Figure 2d). The nucleation density in
this case was estimated to be 2.7×103 mm-2, about two
orders of magnitude lower than the 120 °C
evaporation case. Simply increasing the growth time
only led to the formation of continuous monolayer
film with a full surface coverage and even
multilayers (Figure 2f and Figure S4 in the ESM). The
nucleation density on the inner surface of Cu
enclosure is plotted in Figure 2f against Tp
temperature, indicating that decreasing the Tp
temperature can effectively reduce the nucleation
density. On the other hand, when the growth time
was fixed at 2 h and the Tp temperature was changed
from 60 °C to 75 °C, submonolayer, monolayer and
multilayer h-BN could be obtained, respectively
(Figure S5 in the ESM).
The above experimental observations strongly
suggest that controlling the precursor feeding rate is
crucial for suppressing the nucleation of h-BN.
Indeed, the use of a Cu enclosure approach is the key
for drastically decreasing the feeding rate of
precursor species by a few orders of magnitude. To
achieve a deep understanding of the role of the Cu
enclosure, we examined both the outer and inner
surface of the Cu enclosures. As seen from the SEM
images in Figures 2h and i, very few h-BN triangles
exist on the inner surface of the Cu enclosure as
compared to that on the outer surface. As the growth
proceeds, h-BN flakes merged into a fully covered
monolayer on the outer surface (Figure S6a in the
ESM) while large h-BN triangles were obtained on
the inner surface (Figure S6b in the ESM). A uniform
h-BN monolayer can also be obtained on the inner
surface after prolonged growth (Figure S6c in the
ESM) while multilayer h-BN film was already
observed on the outer surface (Figure S6d in the
ESM). From these observations, it can be concluded
that the Cu enclosure approach can effectively reduce
the precursor concentration, nucleation density and
growth rate of h-BN on the inner surface.
AFM was used to obtain the morphology
information of Cu enclosure on the inner and outer
surfaces. As shown in Figures 2j and k, the inner
surface was much smoother than the outer surface.
The average roughness of the outer surface was
estimated to be ~3.92 nm (Figures 2j and l) while that
of the inner surface was only ~1.08 nm (Figures 2k
and l). The considerably high outer surface
roughness was attributed to the thermal evaporation
of Cu atoms at high temperature [29]. For the inner
surface of Cu enclosure, the evaporative loss of Cu
atoms was strongly suppressed by re-deposition
effect in the limited space. Obviously, such a
remarkable morphology difference on the outer and
inner surfaces resulted in the difference in nucleation
density and hence growth results. In addition, a
numerous number of BN nanoparticles were
observed on the outer surface of Cu enclosure
(Figures S7a in the ESM). In contrast, the inner
surface of Cu enclosure was very clean, featured with
large h-BN triangles under the same experimental
conditions (Figures S7b in the ESM).
In brief, the Cu enclosure approach has the
following three advantages for achieving
high-quality h-BN monolayer growth: (a) drastically
reducing the feeding rate of precursors and hence the
nucleation density; (b) effectively suppressing the Cu
loss and providing a smooth surface; (c) preventing
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6 Nano Res.
the Cu surface from external contaminations.
Figure 3 TEM characterizations of the atomic lattice, thickness and domain orientation of h-BN films. (a) Bright-field TEM image of an
h-BN flake. (b) Overlaid SAED patterns randomly taken on the h-BN triangle shown in (a). (c) Atomic-resolution TEM image of the
h-BN film. (d) High-resolution TEM image of a folded edge reconfirming the monolayer nature of the h-BN film. (e) EELS spectrum of
the h-BN film. (f) False color dark-field TEM image and corresponding SAED pattern of an h-BN triangle (g). (h) False color dark-field
TEM image of two triangles merged with the same orientation and the corresponding SAED pattern (i). (j) False color dark-field TEM
image of mirror-twins with the corresponding SAED pattern in (k). (l) Dark-field TEM image of merged h-BN flakes with a relative
rotation of ~21°, as proved by the SAED pattern (m).
Transmission electron microscopy (TEM)
combined with selected area electron diffraction
(SAED) and electron energy loss spectroscopy (EELS)
were employed to probe the layer thickness,
crystallinity, and elemental stoichiometry of the
obtained h-BN flakes. Transmission electron
microscopy (TEM) combined with selected area
electron diffraction (SAED) and electron energy loss
spectroscopy (EELS) were employed to probe the
layer thickness, crystallinity, and elemental
stoichiometry of the obtained h-BN flakes. Figure 3a
displays a bright-field TEM image of an h-BN
triangle (with edge length of ~40 μm) transferred
onto TEM grid. SAED patterns recorded at five
random positions (marked by red dots in Figure 3a)
on this h-BN triangle were overlaid with an image
processing tool into one frame shown in Figure 3b.
Apparently, the only one set of six-fold symmetric
diffraction pattern with sharp spots justifies the large
area uniform single crystalline nature [27]. Figure 3c
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7 Nano Res.
shows the clear atomic-resolution TEM image of
h-BN with the lattice constant of ~0.25 nm, the same
as that of bulk h-BN [37]. Moreover, the
high-resolution TEM image on the film edge (Figure
3d) with a line shape contrast also verifies the single
layer feature of the as-grown h-BN film. To
investigate the chemical composition of the sample,
an EELS spectrum was recorded (Figure 3e) which
show the representative peaks of boron and nitrogen
K-shell ionization edges with the characteristic π*
and σ* energy loss peaks at boron and nitrogen,
indicating the sp2 hybridization nature of the h-BN
flake [38].
Figure 4 Orientation dependence of h-BN triangles on Cu crystalline facet. (a) EBSD mapping of polycrystalline Cu foil. (b)
Corresponding SEM image of the as-grown h-BN on polycrystalline Cu foil. (c) X-ray diffraction pattern of Cu foil after growth,
consisting of three facets: Cu (111), Cu (100), Cu (110). (d-f) Representative SEM images of h-BN grown on Cu (111), Cu (100) and Cu
(110), respectively. (g-i) Statistical distributions of the edge angles of individual triangular h-BN domains grown on Cu (111), Cu (100)
and Cu (110), respectively.
Dark-field TEM (DF-TEM) was then employed to
examine the orientation of h-BN triangular flakes and
their aggregates. Figure 3f displays a false color
DF-TEM image of an equilateral h-BN triangle with
all perfect interior angles of 60°, indicative of its
single crystalline nature (Figure 3g). During CVD
growth, such kinds of h-BN triangles gradually
expand their sizes and finally merge with each other,
forming an entire film. Apparently, the orientations
of these triangles will determine the merging
boundaries and the finally-formed polycrystalline
films. One of the typical merging behavior is shown
in Figure 3h, in which two perfectly aligned flakes
coalesce together. The corresponding overlaid SAED
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8 Nano Res.
pattern exhibits only one set of hexagonal spots
(Figure 3i), suggesting their identical crystalline
orientation. Another frequently-observed case for
merging is the coalescence of two triangles with 180°
rotation forming a mirror-twinned structure (Figure
3j) [39]. Their SAED patterns surprisingly show only
one set of hexagonal spots as seen in Figure 3k,
indicating the precise alignment of two triangles with
an edge angle of 60°. The above experimental
observations suggest that the h-BN triangles with the
same orientation or with a relative rotation of 180°
are able to coalesce into a well-aligned film, which
contribute to the high crystalline quality with
reduced grain boundaries. Moreover, misoriented
polygonal h-BN flakes can also be occasionally
detected. The DF-TEM image in Figure 3l clearly
displays the merging of two single-crystalline
domains with different orientations (marked in
different colors). The relative rotation can be
determined from the corresponding SAED pattern,
which are ~21° in Figure 3m. Apparently, grain
boundaries are created between these misaligned
domains, leading to the polycrystalline nature of the
h-BN film. It is hence a natural conclusion that
controlling the orientations of individual triangles is
the prerequisite for achieving a single-crystalline
h-BN monolayer film.
Figure 5 DFT calculations of the binding energies for h-BN flakes on different Cu facets. (a, b) Calculated binding energies between
h-BN flakes and Cu substrates as a function of angle to the close-packing directions of Cu (111) and Cu (100), respectively. (c)-(h)
Schematic orientations corresponding to two maximum binding energies of h-BN flakes on Cu (111) (c, d) and four binding energies
peaks on Cu (100) (e-h), respectively. The insert images show the three equivalent close-packing directions of Cu (111) (i) and two
equivalent close-packing directions of Cu (100) (j).
On a highly polycrystalline surface, the
orientation of adlayer is usually affected by the
crystalline facet [40]. The dependence of h-BN
growth behavior on different crystalline facets of Cu
foil was systematically examined by employing
electron backscatter diffraction mapping (EBSD) and
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9 Nano Res.
SEM. Figure 4a shows the EBSD map of a typical area
on Cu foils (corresponding SEM image shown in
Figure 4b), which displays the coexistence of Cu (111),
Cu (100) and Cu (110) facets, consistent with the XRD
result shown in Figure 4c. The growth behaviors of
h-BN films on these crystalline facets are exhibited in
Figures 4d-f, respectively. Obviously, the nucleation
density and domain sizes of h-BN islands do not
show remarkable facet dependent behavior. However,
the orientation distributions of h-BN triangles are
distinctly different (Figures 4g-i). The h-BN triangles
are well aligned on Cu (111), where the difference in
relative orientation can be expressed as multiples of
60o (Figure 4d). The two dominant orientations of
h-BN on Cu (111) are 0° and 60°, as clearly seen from
the orientation distribution plot (Figure 4g). This
implies that the h-BN flakes may be aligned along the
lattice of the Cu (111) surface. In contrast, on Cu (100),
there are four typical orientations, i.e. 0°, 30°, 60°, 90°
(Figures 4e and h) with the alignment deviations of
±30°. Similarly, the h-BN flakes on Cu (110) facet have
six dominant orientations with the deviations of ±10°
(Figures 4f and i). These facet dependent orientations
of h-BN on Cu (100) and Cu (111) facets can be
attributed to the alignment of h-BN on the 4-fold and
6-fold symmetries of facets. However, the reason for
the six orientations on Cu (110) is not clear, possibly
caused by the reconstruction of Cu (110) facet under
the experimental conditions.
To achieve a deeper understanding of how the
symmetry of the Cu facet affects the orientation of
the grown h-BN, the interaction between the h-BN
flakes and Cu facets was studied by DFT calculations
(See Supporting information for details of the
computation). It is known that the inert h-BN wall
interacts weakly with the substrate surface (e.g., the
calculated height of h-BN monolayer to Cu (111)
surface is about 3.17 Å and the van der Waals
interaction between them is only 0.104 eV per atom
according to our calculations) and thus its orientation
should be determined by the edge-catalyst
interaction during the early stage of its growth,
similar as that for graphene CVD growth [41]. That
means the binding of an h-BN domain on metallic
substrate mainly occurs at the edge, and thus, the
average binding energy is a function of its perimeter,
1 2
3 3A A B B C CE E L E L E L
L
(1)
where E(θ) is the average bind energy (in eV/nm) of
an triangular h-BN flake on the substrate; EA(θ),EB
(θ+2π/3), EC(θ+2π/3) are the binding energies of its
three edges as shown in Figure 5c. L = LA + LB + LC is
the perimeter of the h-BN flake and LA, LB and LC are
the lengths of the three edges of the triangle. θ is the
angle between the A edge and one high symmetric
direction of the Cu surface. Due to the symmetry of
the h-BN, and corresponding direction of edge B and
C to the direction is θ+π/3 and θ+2π/3, respectively.
As shown in Figures 5i and j, θ is the angle between
edge A and the [-110] direction of Cu (111) or [00-1]
direction of Cu (100).
The binding energies of several h-BN edges with
different orientation angles (θ = 0.0°, 8.1°, 18.4°, 26.6°,
31.0°, 36.9°, 39.8°, 45.0° respectively on the Cu (100)
surface and θ = 0.0°, 6.6°, 19.1°, 23.4°, 26.3°, 30.0°,
respectively on the Cu (111) surface) were calculated
with the DFT method and shown in the Figures S8
and S9 of ESM. The binding energies of the h-BN
edge with other angles are obtained by linear
interpolation method and those with angles beyond
this range (0°-45° for Cu (100) surface and 0°-30° for
Cu (111) surface) can be obtained by simply
considering the symmetry of the system. Then the
binding energy of an h-BN triangular flake on Cu
surface is calculated by Eq. (1). As aforementioned,
the equilateral triangular h-BN flake has an
periodicity of 120°, E(θ)=E(θ+i×120°). Thus, as shown
in Figures 5a and b, the binding energies of h-BN
flakes on Cu (111) and Cu (100) versus the
orientation of the flake are plotted in the range of
0°-120°. It is distinct that there are two high binding
energy peaks for an h-BN triangle on the Cu (111) (0°
and 60°) and four peaks on the Cu (100) ((0°, 30°, 60°
and 60°), in excellent agreement with the
experimental observed orientations of the h-BN
flakes on them. The orientations of h-BN flakes
corresponding to these peaks are schematically
shown on the right panel of Figure 5. It is apparent
that all these h-BN flakes possess at least one edge
parallel to the close-packing direction of Cu surface
(labeled with white lines). This can be understood
that the close-packing direction has much dense Cu
atoms, which passivate the edge of h-BN more
effectively. Therefore, the highly populated
orientation angles of h-BN flakes on Cu (111) and Cu
(100) surfaces can be interpreted as the energetically
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10 Nano Res.
preferred orientation of the h-BN flakes. This
indicates that the growth of h-BN on Cu foil follows
the edge-epitaxial growth mode [42], which may be
benefited from the low pressure environment on the
clean inner cavity of Cu enclosure.
Figure 6 Alignment of h-BN flakes with underlying Cu facet and large-area h-BN monolayers on Cu (111) single crystal. (a, b) Typcial
STM images of h-BN moiré pattern with a large period (~10.8 nm) showing the alignment of h-BN with Cu (111) facet (a: 300 nm×300
nm; VT=-0.123 V, IT=2.665 nA; b: 45 nm×45 nm; VT=-0.019 V, IT=2.582 nA). The inserted height profile along the indicated line
demonstrates the period of moiré pattern is up to 10.8 nm. (c) Schematic illustration of the non-rotated h-BN unit cell on Cu (111). (d)
Optical microscope image of h-BN transferred onto Cu grid. (e-i) SAED patterns taken randomly on (d) over 600×600 μm2.
To confirm the alignment of h-BN with underlying
Cu facets, STM was employed to investigate the
moiré and the atomic-scale feature of h-BN grown on
Cu foils. Considering the small lattice mismatch
between Cu (111) (2.556 Å ) and h-BN (2.500 Å ), a
specific moiré structure can evolve due to the lattice
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11 Nano Res.
mismatch between h-BN and Cu (111), and different
moiré structures can also appear by changing their
relative orientation from oriented to disorientated
[43]. Figures 6a and b display the representative STM
images with h-BN moiré pattern (~10.8 nm in period),
indicating a less than 1° rotation of h-BN with Cu
(111). Figure 6c shows the schematic illustration of a
non-rotated h-BN unit cell on Cu (111). The
atomic-resolution STM image in the Figure S10a of
ESM demonstrates its high crystal quality. It is noted
that, most of the h-BN flakes are nearly aligned with
the underlying Cu (111) facet, forming a ~10.8 nm
moiré pattern, consistent with DFT calculation results.
As clearly seen from Figure S10b of ESM, when
grown on Cu (111) single crystal, nearly all the h-BN
triangles are aligned along the same or reversed
orientation. We transferred a fully covered h-BN
monolayer grown on Cu (111) onto Cu grids (Figure
6d) and obtained the SAED patterns at random
positions over 600×600 μm2. As shown in Figures 6e-i,
the SAED patterns exhibits less than 1.06° rotation of
the h-BN lattice throughout the entire film, indicative
of the excellent alignment of h-BN film along Cu (111)
crystalline facet.
3 Conclusions
In summary, high-quality h-BN monolayer films
with the large single-crystalline domain size up to
~72 μm in edge length have been achieved on Cu
foils using a LPCVD technique. The folded Cu
enclosure approach has been proved to perfectly
suppress the nucleation centers during CVD growth
process, which leads to the remarkable improvement
of single-crystalline domain size and preferential
monolayer growth. It is revealed that the orientations
of as-grown h-BN monolayers are strongly correlated
with crystallographic orientations of Cu substrates,
with Cu (111) being the best substrate for growing
high-quality single-crystalline h-BN monolayer films.
DFT calculations well explain these crystalline facet
effects. The present work provides a future direction
for growing high-quality h-BN monolayer films and
opens a practical pathway for high-performance
G/h-BN electronics.
Experimental method
h-BN growth: The growth of h-BN film was
performed on copper foils (25 μm in thickness; Alfa
Aesar; purity 99.8%) by using a low pressure
chemical vapor deposition technique. Prior to the
growth, copper foil was electrochemically polished
for 30 min to remove the surface impurities as well as
reduce the surface roughness. Ammonia borane
(BH3-NH3) precursor was placed inside a 1 inch
nested quartz tube. The furnace was ramped up to
1000 °C in 40 min, followed by sample annealing for
2 h in Ar (50 sccm) and H2 (50 sccm). BN precursor
was introduced by sublimation with the aid of a
heating belt (heating temperature range: 55~120 °C),
which could be delivered onto the Cu substrate by
Ar/H2 carrier gas for h-BN synthesis. After growth,
the furnace was cooled down to room temperature.
Transfer: As-grown h-BN was transferred onto
SiO2/Si substrates, quartz plates, and Cu grids after
growth with the aid of Poly (methyl methacrylate)
(PMMA). Briefly, PMMA was spin-coated onto the
sample and cured for 5 min on hot plate (180 °C),
followed by etching the Cu foil in iron chloride (FeCl3)
solution. The PMMA-supported film was then
repeatedly rinsed and washed by DI-water for
several times, after which the film was transferred
onto desired substrates, where the removal of PMMA
was achieved by using hot acetone vapor.
Characterization: The as-grown h-BN samples were
characterized by using scanning electron microscopy
(SEM, Hitachi S-4800, 2 kV), Electron backscatter
diffraction mapping (EBSD was collected using a
Hitachi S-4500 analytical SEM with Oxford
Technology EBSD System. During EBSD collection,
the probe current is 5 nA, the accelerating voltage is
20 kV, and the angle of incidence is 70 degrees.), STM
(Omicron UHV-VT-SPM-MBE System), and X-ray
photoelectron spectroscopy (XPS, Kratos Axis Ultra).
The transferred samples were examined by using
optical microscope (Olympus DP71), Raman
spectroscopy (Horiba HR-800, 457.8 nm laser
excitation), atomic force microscopy (AFM, Veeco
Nanoscope III, tapping mode), transmission electron
microscopy (TEM, FEI TecnaiF20; FEI Tecnai T20,
acceleration voltage of 200 kV), and UV-Vis
absorption spectroscopy (Perkin Elmer Lambda 950).
The atomic-resolution transmission electron
microscopy (TEM) investigations were taken on a
third-order aberration corrected (objective lens) FEI
Titan 300-80 operating with an acceleration voltage of
80 kV.
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12 Nano Res.
Acknowledgements
The work was supported by the Natural Science
Foundation of China (Grants 51432002, 50121091,
51290272, 51222201), the Ministry of Science and
Technology of China (Grants 2013CB932603,
2012CB933404, 2011CB933003, 2011CB921903,
2012CB921404), and the Ministry of Education (Grant
20120001130010).
Electronic Supplementary Material: Further details
of XPS data, AFM, SEM, DFT calculations and STM
images regarding the h-BN sample is available in the
online version of this article at
http://dx.doi.org/10.1007/s12274-***-****-*
(automatically inserted by the publisher).
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Nano Res.
Electronic Supplementary Material
Chemical vapor deposition growth of large-scale
hexagonal boron nitride with controllable orientation
Xiuju Song1, Junfeng Gao3, Yufeng Nie1, Teng Gao1, Jingyu Sun1, Donglin Ma1, Qiucheng Li1,
Yubin Chen1, Chuanhong Jin4, Alicja Bachmatiuk5, Mark H. Rümmeli6,7, Feng Ding3( ), Yanfeng
Zhang1,2( ), Zhongfan Liu1( )
3
Supporting information to DOI 10.1007/s12274-****-****-* (automatically inserted by the publisher)
Figure S1 Photograph of a Cu enclosure.
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Nano Res.
Figure S2 AFM height measurement of h-BN transferred onto SiO2/Si. AFM images of an h-BN triangle (a) and
near-fully covered h-BN film (c). (b) and (d) are the height histograms of green rectangular region in image (a)
and (c), respectively. (e) Distribution of height measurement of h-BN are measured at 48 regions, showing that
the thickness of 92% h-BN film is between 0.5-0.9 nm, which is consistent with the thickness of monolayer h-BN
films [1].
Figure S3 A survey XPS spectrum of as-grown h-BN on Cu foils. The existence of B 1s and N 1s peaks
demonstrates the presence of h-BN [2].
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Nano Res.
Figure S4 Time dependence of h-BN growth on Cu foils. SEM images of h-BN grown on Cu foils at different Tp
temperatures and growth time: (a) 120 °C, 2 min; (b) 120 °C, 3 min; (c) 70 °C, 30 min; (d) 70 °C, 90 min; (e) 70 °C,
120 min.
Figure S5 Precursor evaporation temperature dependence of h-BN growth on Cu foils. SEM images of h-BN
grown on Cu foils for 2 h at different Tp temperatures: (a) 75 °C; (b) 70 °C; (c) 65 °C; (d) 60 °C.
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Nano Res.
Figure S6 h-BN growth on the outer and inner surface of Cu enclosure. SEM images of h-BN grown on the
outer (a) and inner surface (b) of Cu enclosure with Tp=70 °C for 2 h. SEM images of h-BN grown on the inner (c)
and outer surface (d) of Cu enclosure with the Tp =100 °C for 3 min.
Figure S7 Contaminations on the outer surface of Cu foils. SEM images of h-BN grown on the outer (a) and
inner surface (b) of Cu enclosure with Tp=65 °C for 2h. There are a numerous number of BN nanoparticles were
observed on the outer surface of Cu enclosure.
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Nano Res.
DFT calculations
First-principle calculations were performed by using the DFT and plane wave pseudopotential technique, as
implemented in the Vienna Ab-initio Simulation Package (VASP) [3, 4]. Generalized gradient approximation
(GGA) with the Perdew–Burke–Ernzerhof (PBE) functional [5] was used to describe the exchange-correlation
interaction.
Projector-augmented wave (PAW) method [6] was used to describe the core electrons. The plane-wave basis
kinetic energy cutoff of 400 eV and convergence criterion criteria of 10-4 eV were used in all the calculations. A
conjugate-gradient algorithm was used to relax the ions until the force was less than 0.02 eV/Å . The partial
occupancies for each wavefunction were determined by method of Methfessel-Paxton with an order of 1 and
the width of the smearing is 0.2 eV. In all calculations, the Brillouin zone was sampled with dense reciprocal
meshes (the separation is less than 0.2 Å -1).
Four-row wide zigzag BN ribbon with hydrogen-terminated B edges was put on the Cu surfaces. To evaluate
the interaction of h-BN edges with different orientations on Cu surface, six supercell with one co-periodic
dimension of h-BN zigzag periods and Cu direction were built for BN edges on Cu (111) surface. That is 1
zigzag periodic BN edge versus 1R0° direction (in related to the lattice vectors of [-110] and [01-1]) of Cu
subsurface (1ZZ@1R0°), 8 Zigzag periodic BN edge versus 57 R6.6° (8ZZ@ 57 R6.6°), and similar (8ZZ@
3 7 R19.1°), (9ZZ@ 2 19 R23.4°), (8ZZ@ 61 R26.3°) and (7ZZ@ 4 3 R30.0°) with same abbreviated formation.
Similar to on Cu (111), BN edges with eight orientations were sampled on Cu (100) surface, that is (1ZZ@1R0°),
(7ZZ@5 2 R8.1°), (10ZZ@3 10 R18.4°), (7ZZ@3 5 R26.6°), (6ZZ@ 34 R31.0°), ([email protected]°), (8ZZ@ 61
R39.8°), (3ZZ@ 2 2 R45.0°) versus lattice vectors of [01-1] and [011] of Cu (100) surface.
All the Cu surface is modeled with three layers metal slab with bottom layer fixed. In all calculations,
periodic boundary conditions (PBC) are applied along all the three directions. The vacuum space larger than 10
Å is adopted between the neighboring images to eliminate their interactions.
There are three close-packed directions of the family [-110] for Cu (111) surface and two close-packed
directions of the family [01-1] for Cu (100) surface. The binding energy between h-BN edge with an angel to
one close-packed direction of Cu surface was defined as:
E()= (Etot – Efree – Esub)/L
where Etot is the total energy of BN edges on Cu surfaces, Efree is energy of free BN ribbons with
hydrogen-terminated B edges in vacuum, spin-polarized DFT was used for free edge calculation. Esub is the
energy of Cu surface for each model, and L is the length of h-BN edge.
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Nano Res.
Figure S8 Binding energies of h-BN edges with different angles on Cu (111). Binding energy as a function of
angle of h-BN edge to the close-packed direction on Cu (111) surface and six models of BN edges with different
orientations on Cu (111) surface. Considered on top layer of Cu (111) surface, E () = E (60° - ).
Figure S9 Binding energies of h-BN edges with different angles on Cu (100). Binding energy as a function of
angle of BN edge to the close-packing direction on Cu (100) surface and eight models of h-BN edges with
different orientations on Cu (100) surface. Considered on top layer of Cu (100) surface, E () = E (90° - ).
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Nano Res.
Figure S10 h-BN growth on Cu (111) single crystal. (a) Atomic-resolution STM image of h-BN lattice (VT=-0.002
V, IT=9.498 nA). (b) SEM image of h-BN grown on Cu (111) single crystal with Tp=75 °C for 20 min.
Reference
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