chaoji/chademo 3.0 development update...chaoji/chademo 3.0 development update 1. coupler design 2....
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ChaoJi/CHAdeMO 3.0 Development Update
1. Coupler Design2. Control Pilot Circuit Specification3. Heat Dissipation Analysis4. Schedule for IEC Proposal5. Communication Protocol for Next Generation
Oct. 17th , 2019Hidetoshi KUSUMI
Toyota Motor Corporation
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1. Coupler Design
CHAdeMO Confidential
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1. Coupler Design - Mechanical Strength -
CHAdeMO Confidential
Drive over/Crush/Drop tests are under going in both China and Japan. Results and final spec to be discussed by the end of 2019.
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1. Coupler Design - Adapter -
CHAdeMO Confidential
In addition to type-B, the availability of type-A is also under discussion. Plan to bring the topics in IEC61851/IEC62196 for better conversation.
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2. Control Pilot CircuitChaoJi EVSE ChaoJi Vehicle
EVSE Vehicle
[ Start sequence ]1. Vehicle wakes up by DP2 becomes 12V. And Sv -> ON (if Sv is normaly open)2. Vehicle knows Coupler mated by CC2 circuit closed(DP3=6V). And S2’ -> ON3. EVSE knows Coupler mated by DP1 becomes low.4. EVSE close S1 to make entire system ready for charging.5. CAN communication start.
6V
- ChaoJi System -
Ver. 2019 Sep.
CHAdeMO Confidential
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- Backward Compatibility -
CHAdeMO 2.0
GB/T 2015
CCS Type2
ChaoJi VehicleAdapterEVSE
2V
8V
4V
100Ω
200Ω
400Ω
1.43 1.0kΩ kΩ
1.5kΩ
300Ω
250Ω
CHAdeMO Confidential
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CHAdeMO Confidential
Step1:BMC for current connectors→Take a data of each contact resistance and temp. rise during charging @400A, 30min.
EVSE Connector Terminal: A, B, C Vehicle Inlet Terminal
95sq w/h
Inlet resistance(heat source)
A
B C
Background: To prevent vehicle inlet temp. rise becomes over 50K during high current charging, the heat dissipation performance value for connector needs to be defined as a boundary condition between EVSEs and Vehicles.
Contact resistance, mΩ
Tem
p. ri
se, Δ
K 50
0.10 0.20
Good in EVSE cooling performance
Fig.2 Test piece for BMCFig.1 Temp. rise by contact resistance (assumed)
0.15
Step2:Study and optimize the contact resistance→e.g. If the contact resistance is 0.2mΩ, 32W of heat dissipation is required for liquid cooling connector. If 32W is not realistic then the contact resistance needs to be improved.
Determine a reasonable value for both contact resistance and heat dissipation target.
3. Heat Dissipation Analysis
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- Reference terminal (sleeve terminal) for data acquisition
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connector Ref. terminals
w/h(95sq)
<Cross section of Reference terminal>
<Reference terminals mating with connector>
Fasten by screw⇒with torque management
Climping /welding w/h
Support pin(connector terminal)at 3 points
3. Heat Dissipation Analysis
Remove part of the connector to allow reference terminal mating.
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2018年
12月 1月 2月 3月 4月 5月 6月 7月 8月 9月 10月 11月 12月
2019年
◆ Apply Schedule for CHAdeMO/ChaoJi standard
①Discuss needs and deal②Decide direction ⇒make a deal about the position of the heat dissipation③BMC for market available connectors(CCS(Jun)、ChaoJi(Nov~)): (Fig.1)④Study and optimise the inlet resistance (~Dec)⑤Making of the reference terminal⑥Tuning of the referenct terminal⑦Proposal for CHAdeMO/ChaoJi standard (Dec)
・HPC_SWG(12/19)
②Decide approach
⑤Making of ref. terminal
Proposal⑦
①Deal・K/O
③BMC for connectorsCCS
⑥TuningDesign of ref. terminal
CHAdeMO Confidential
③ChaoJi
Optimise④
3. Heat Dissipation Analysis
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4. Schedule for IEC Proposal
CHAdeMO Confidential
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4. Schedule for IEC Proposal- Five Years Schedule -
CHAdeMO Confidential
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5. Communication Protocol for Next Gen.
CHAdeMO Confidential
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Thank you!
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