ceramic capacitor catalogue 2010/11 - holy … capacitor. catalogue 2010/11. holy ... smd...

CERAMIC CAPACITORCATALOGUE 2010/11

Holy StoneEnterprise Co., Ltd.

www.holystone.com.tw www.holystonecaps.com

Introduction

The Company Holy Stone EnterpriseCompany Ltd (HolyStone) was establishedin June of 1981 as anagent and distributor ofelectronic components.In 1994, with technology

and cooperation from a Japanese partner, HolyStone began manufacturing multi-layer ceramiccapacitors. Today, Holy Stone is recognized as anindustry leader in application specific ceramiccapacitors.

Holy Stone integrates active and passivecomponent distribution with significantmanufacturing capabilities. Holy Stone’s uniquebusiness model combines the service andinventory management strengths of a broad linedistributor with the technical knowledge and worldclass pricing of a manufacturer.

Holy Stone was founded by five engineers in 1981.Since this point, Holy Stone has maintained afocus and commitment to providing customerswith innovative products and exceptional service.The result of that unwavering commitment isevident in Holy Stone’s phenomenal growth (2009revenues of US$412 million). Holy Stone alsomaintains a high profile on the Taiwan StockExchange, ranked in the top 100 companies andthe leader among its peers.

Manufacturing FacilitiesHoly Stone capacitorsAre produced in a modern40,000 square meterfactory located in Lungtan,Taiwan. In addition to theLungtan factory, Holy Stonehas facilities in Dongguan and Wujiang China.The advanced materials research laboratory islocated in Japan. The factory operating systemsare certified to ISO-9001and ISO-14001.

Sales and Support LocationsHoly Stone administrativeheadquarters are locatedin Taipei, Taiwan.Holy Stone maintainssales and support officesin Kaohsiung Taiwan,Dongguan China andShanghai China.

Holy Stone Enterprise Company Ltd hassubsidiary companies in North America and inEurope. Holy Stone International, located inMurrieta, California, U.S.A. is responsible forsales and technical support in the Americas. HolyStone (Europe) Ltd, located in Norwich, Englandis responsible for sales and technical service forEurope. Holy Stone opened its Singapore office toservice southeast Asia. Holy Stone also has anetwork of independent representatives,distributors and agents throughout the world.

The EnvironmentHoly Stone is committed to achieving andmaintaining a healthy environment. Holy Stone isalso among the first suppliers of halogen freeepoxy coated capacitors. The factory is Certifiedto ISO-14001 and all standard products aredesigned and produced conforming to full RoHScompliance.

Our EmployeesHoly Stone’s success is measured by thesatisfaction of our customers and share holders.Achieving that satisfaction is the result of the sumcontribution of our employees. Thosecontributions come from all of our employees,whether they are engaged in administrativefunctions, manufacturing our goods or servicingour customers. Holy Stone strives to maintain awork environment that stimulates creativity,encourages enthusiasm and rewards results.

- 1 -

Component Quick Reference ------------------------------------------ 2

Capacitor Availability Guide --------------------------------------------- 3-4

Products Series ----------------------------------------------------------- 5-34

Technical Specifications -------------------------------------------------- 35-41

Packing Information ------------------------------------------------------ 42-44

EIA Designations ------------------------------------------------------------ 45

Precautionary Information ---------------------------------------------- 46-49

Reducing Short Circuit Risks –Super Term ----------------------- 50-51

Coated Products for Surface Arc Prevention --------------------- 52-53

ROHS Compliant ----------------------------------------------------------- 54

ISO Certifications ---------------------------------------------------------- 55

CONTENTS

Contents

Component Quick Reference

- 2 -

Product Series Application PageHVC series --High Voltage Capacitors

For Power Circuits(Backlight Inverter, DC to DC,…) 5-8

SCC series --Safety Capacitors

For Isolation and Protection Circuits (UL,EN132400 Class X2/Y3,X1/Y2) 9-11

TCX series --Trigger Capacitors For DSC Strobe Circuits 12-13

LDC series --Low Distortion Capacitors For Oscillation and Filter Circuits 14-15

NCC series --Normal Chip Capacitors For Decoupling Circuits 16-17

HCC series --High Capacitance MLCC-More than 1uF For Smoothing (DC to DC) and Decoupling Circuits 18-19

HCN series --High Capacitance NP0

For ADSL/XDSL (Replacement for Film Capacitor) 20-21

HCX series --High Capacitance X7R For Input, Output Filters (DC to DC) 22-23

SAC series --Tip & Ring Capacitors For telephone line ringer circuits 24-25

HBC series --Low-Loss High Frequency Snubber Capacitors

For High Frequency Lighting Ballasts 26-27

HTC series --X8R rated to +150°C For high temperature applications 28-29

LCC series --Large Size MLCC Capacitors 1515 to 7565

For Voltage Multipliers, Power circuit (DC-DC, Ballast, Snubber), Surge protection, Industrial control, … 30-31

SMC series --Stacked MLCC Capacitors

For Power Circuits(Backlight Inverter, DC to DC, Surge protection …) 32-34

Capacitance Availability Guide – Standard MLCC

- 3 -

Vdc 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225

6.3vNP0X7R 2.2uF 4.7uFX5R 100nF 1uF 10uF 22uF 47uF 100uF

10VNP0X7R 100nF 2.2F 4.7uF 10uF 10uFX5R 1uF 4.7uF 10uF 22uF 22uF

16VNP0 3.3nF 10nF 27nF 47nF 120nFX7R 100nF 2.2uF 2.2uF 4.7uF 22uFX5R 100nF 2.2uF 10uF 22uF 22uF

25VNP0 3.3nF 10nF 10nF 22nF 47nFX7R 10nF 1uF 1uF 2.2uF 10uFX5R 100nF 1uF 4.7uF 10uF 10uF

35VNP0X7R 470nF 1uF 4.7uF 2.2uF 10uFX5R 1uF 10uF

50VNP0 470pF 3.3nF 10nF 10nF 22nF 47nF 82nFX7R 10nF 100nF 330nF 1uF 2.2uF 4.7uF 4.7uF 10uF 6.8uFX5R 1uF

100V

NP0 270pF 1.2nF 6.8nF 10nF 18nF 56nF 56nF 68nFX7R 18nF 100nF 470nF 2.2uF 2.2uF 2.2uF 4.7uF 4.7uF

X5R

200VNP0 270pF 1.2nF 5.6nF 8.2nF 12nF 47nF 47nF 56nFX7R 47nF 100nF 470nF 1uF 1.5uF 2.2uF 2.2uFX5R

250VNP0 270pF 1.2nF 5.6nF 8.2nF 12nF 47nF 47nF 56nFX7R 47nF 100nF 470nF 1uF 1.5uF 2.2uF 2.2uFX5R

500VNP0 680pF 2.2nF 3.9nF 1.8nF 8.2nF 39nF 39nF 47nFX7R 22nF 56nF 100nF 39nF 220nF 270nF 470nF 470nFX5R

630VNP0 2.2nF 3.9nF 1.8nF 8.2nF 27nF 27nF 33nFX7R 33nFX5R

1KVNP0 1nF 1nF 1.2nF 6.8nF 12nF 12nF 15nFX7R 1nF 10nF 27nF 15nF 47nF 100nF 100nF 100nFX5R

2KVNP0 390pF 680pF 1.2nFX7R 1.5nF 2.7nF 3.3nF 10nF 18nF 18nF 18nFX5R

3KVNP0 39pF 1nF 1.2nF 1.2nFX7R 1.8nF 2.7nFX5R

4KVNP0X7R 1nFX5R

5KVNP0 27pF 150pFX7RX5R

Capacitance Availability Guide – 250Vac Safety Capacitors

- 4 -

SMD CapacitorsVdc 1808 1812 2208 2211 2220 2825

X2/Y3250Vrms NP0 2.2pF-1nF

250Vrms X7R 150pF-2.2nF 1nF-4.7nF

X1/Y2250Vrms NP0 2.2pF-150pF 2.2pF-330pF 2.2pF-680pF 2.2pF-1.2nF

250Vrms X7R 150pF-1nF 130pF-1nF 36pF-1nF 68pF-2.7nF 130pF-4.7nF

X2250Vrms NP0

250Vrms X7R 150pF-10nF 47nF-56nF

Also available as Lead (Pb) free

How To Order

HVC Series High Voltage NP0 and X7R Capacitors Up to 5KV

Operating Temperature -55~+125 Rated Voltage 100Vdc to 5000Vdc

Temperature CoefficientNP0 : ≤ ± 30ppm/ , -55~+125 (EIA Class Ι )X7R : ≤ ± 15% , -55~+125 (EIA Class Ⅱ )

Dissipation Factor NP0: Q≧1000 ; X7R : D.F.≦2.5%Insulation Resistance 10GΩ or 500/C Ω whichever is smallerAgeing NP0:0% ; X7R: Typically 1.0% per decade of time

Dielectric Strength100V ≦ V ＜ 500V : 200% Rated Voltage500V ≦ V ＜ 1000V : 150% Rated Voltage1000V≦ V : 120% Rated Voltage

Summary of Specifications

Special internal electrode design offerthe highest voltage rating.

Surface mount suited for solder wave andreflow soldering.

High reliability. RoHS compliant.

Suitable for LAN/WLAN interface,Back-Lighting Inverter, DC-DC Converters,Ballast, Modems & Power Supplies.

Product Code

C : MLCCMultilayerCeramic Capacitor

Chip Size

EX. :0603 0805 12061210 1808 18122220 2225

Dielectric

Ex. :N : NP0X : X7R

CapacitanceUnit : pFEx. :2R0 : 2.0pF100 : 10×100

471 : 47×101

102 : 10×102

Tolerance

Ex. :C : +/-0.25pFD : +/-0.50pFJ : +/- 5%K : +/-10%M : +/-20%

Rated Voltage Ex. :101 : 100Vdc251 : 250Vdc501 : 500Vdc631 : 630Vdc102 : 1000Vdc202 : 2000Vdc302 : 3000Vdc402 : 4000Vdc502 : 5000Vdc

Packaging

T : Tape& Reel

B : Bulk

SpecialRequirement Ex. :O : Arc

PreventionCoating

X : PolymerTermination (Super Term)

HVC Series - High Voltage Capacitors

Holy Stone high voltage products are designed and manufactured to meet the general requirements ofinternational standards. This product offering is well suited for commercial and industrial applications andincludes NP0 (C0G) and X7R characteristics in sizes 0603 to 2225 and with working voltages up to 5KV.

Applications. Features

C 1210 X 103 K 102 T X

- 5 -

W

T

BW B

L

Dimensions

Capacitance Range – NP0 100Vdc to 1KVdc

TYPE L W T (max) B (min) BW (min)

0603 1.60±0.1[.063±.004]

0.80±0.1[.031 ±.004]

0.90[.039]

0.40[.016]

0.15[.006]

0805 2.00±0.20[.079±.008]

1.25±0.20[.049±.008]

1.45[.057]

0.70[.028]

0.20[.008]

1206 3.20±0.30[.126±.012]

1.60±0.20[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.30[.126±.012]

2.50±0.20[.098±.008]

2.60[.102]

1.60[.063]

0.30[.012]

1808 4.60±0.30[.181±.012]

2.00±0.20[.079±.008]

2.20[.087]

2.50[.098]

0.30[.012]

1812 4.60±0.30[.181±.012]

3.20±0.30[.126±.012]

3.00[.118]

2.50[.098]

0.30[.012]

1825 4.6±0.30[.181±.012]

6.35±0.40[.250±.016]

3.00 [.118]

2.50[.098]

0.30[.012]

2220 5.7±0.40[.220±.016]

5.00±0.40[.197±.016]

3.00 [.118]

3.50 [.137]

0.30[.012]

2225 5.7±0.40[.220±.016]

6.35±0.40[.250±.016]

3.00 [.118]

3.50 [.137]

0.30[.012]

Unit : mm [inches]


- 6 -

Consult HEC for thickness information

2R0

3R3

3R9

5R0

8R2

100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B B B B B B C C C DB B B B B B B B B B B B B B B B B B B B B B B B B B B C C C DB B B B B B B B B B B B B B B B B B B B B B B B B B B C C C DC C C C C C C C C C C C C C C C C C C C C C C C C C C C

B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/D B/D B/D D/E D/E D/E D/E D/E D/E D/E D/E D/E EB/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/D B/D B/D D/E D/E D/E D/E D/E D/E D/E D/E D/E EC C C C C C C C C C C C C C C C C C D D D D/E D/E D/E D/E D/E

C C C C C C C C C C C C C C C C C C D D D D/E D/E D/E D/E D/E

D D D D D D D D D D D D D D E E E E E E E E E E E

B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C D D D D D/E D/E D/E D/E D/E E EC C C C C C C C C C C C C C C C C D D D D D/E D/E D/E D/E D/E E EC C C C C C C C C C C C C C C C D D D E E F F FC C C C C C C C C C C C C C C C D D D E E F F F

D D D D D D D D D/E D/E D/E D/E D/E D/E D/E

D D D D D D D D D D D D D D D D D D E E E E E E E E E E E E E E E

D D D D D D D D D D D D D D D D D D E E E E E E E E E E E E F

D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E E E E

D D D D D D D D D D D D D D E E F F E/F E/F E/F F F/G F/G G

D D D D D D D D D D D ED D D D D D D D D D D E E

D D D D D D D D D D D D/E E FD E E E F F G G

1825

100V200V250V500V630V1KV

1KV

2220

100V200V250V500V630V1KV

1812

100V

1808500V630V1KV

200V250V500V630V

630V1KV

1210

100V200V250V500V630V1KV

1206500V

0805

100V200V250V500V

TemperatureCharacteristic Size Rated

Voltage

Capacitance Range (pF)

NP0

0603

50V100V200V250V

100V200V250V

Capacitance Range – X7R 100Vdc to 1KVdc


- 7 -

Capacitance Range – NP0 100Vdc to 1KVdc cont.

2R0

3R3

3R9

5R0

8R2

100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

D D D

2225

100V200V250V500V630V1KV


Voltage


NP0

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

155

225

B B B B B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B B B B B B B CB/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C D D D DB/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C D D D DB/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C C C C C C C C CC C C C C B/C B/C B/C B/C B/C B/C B/C C C C C C C C C C

B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C C C D E E EB/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C/D D/E D/E D/E

B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C/D D/E D/E D/E

C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C DD D D D D D D D D D D D D D D D D D D D D D D D D E ED D D D D D D D D D D D D D D D D D D D D

C C C C C C C C C C C C C C C C C C C C C D E E F G GC C C C C C C C C C C C D D D D D E E E FC C C C C C C C C C C C D D D D D E E E FD D D D D D E E E F F F FD D D D D E

D D D D D D D D D D D D D D DD D D D E E E F F F

D D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E E E E E F GD D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E E E F GD D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E E E F GD D D D D D D D D D D D D D D D D D D D D D D D D D D D E E E E E F F/G H HD D D D D D D D D D D D D D D D D D E E E E E E F F/G F/G F/G F/G

D D D D D D D D D D D E E F HD D D D D D D D D D D E E F HE E E E E F G G H

E E E E E E E/F F F G G H HD D D D D D D D D D D D D D D D D D D D E E E E ED D D D D D D D D D D D D D D D D D D D E E E E ED D D D D D D D D D D E E ED D D E E F F F F F F F F

D D D D D D D D D D D D D D D D D E GD D D D D D D D D D D D D D D D D E GE E E E E E E E E F FE E E E E

2225

200V250V500V1KV

2220

200V250V500V1KV

1825

200V250V500V1KV

1808500V1KV

1812

100V200V250V500V1KV

1210

100V200V250V500V1KV

1206

100V200V250V500V630V1KV


X7R

0603 100V

0805

100V200V250V500V1KV


Voltage


Symbol Code S O A B C D E F G HThickness(mm) 0.3±0.03 0.5±0.05 0.6±0.1 0.85±0.1 1.0±0.1 1.25±0.15 1.6±0.2 2.0±0.2 2.4±0.2 2.8±0.2

Thickness Specification

Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office.


- 8 -

Capacitance Range 2KV




Capacitance Range 3KVdc to 5KVdc

2R0

3R3

3R9

5R0

8R2

100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

D D D D D D D D D D D D D D D/E D/E D/E E E E

D D D D D D D D D D D D D D D D D D E/F E/F E/F E/F E/F E/F

D D D D D D D E E F F F F F F F F


Voltage

2KV


NP01206 2KV1808 2KV1812

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

D D D D D D D D D/E E ED D D D D D D D D E E E F G

D D D D D D D D D D D D D D E F FD D D D D D D D D D E E F F F F F F G H

E E E E F F FD D D D D D E E F F F F F

E/F E/F

1825 2KV2220 2KV2225 2KV


X7R

1206 2KV1210 2KV1808 2KV1812 2KV


Voltage2R

03R

33R

95R

08R

08R

210

012

015

018

022

027

033

039

047

056

068

082

010

112

115

118

122

127

133

139

147

156

168

182

110

212

215

218

222

2

D D D D D D D D D D D E E ED D D D D D D D D D D D D D D D D D D E E E/F E/F E/F E/F E/F F F F F FF F F F F F F F F F F F

D D D D D D D D D D D D E/F E/F E/F E/F E/F E/F E/F E/F E/F E/F F F GF F F F F F F F F F F F F FF F F F F F F F F F F F F F F F FF F F F F F F F F F F F F F F F F F F F F

2208 5KV

2220 5KV

Size RatedVoltage

1812 3KV


NP0

1206 3KV

18083KV5KV

2211 5KV

TemperatureCharacteristic

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

D D D D D D D D D D D F F FD D D D D/E D/E D/E D/F D/F D/F D/F

E F F F F F F FX7R

18083KV4KV

1812 3KV

Capacitance Range (pF)TemperatureCharacteristic

Size RatedVoltage





How To Order

SCC SeriesSafety Capacitors rated to 250Vac X1/Y2, X2/Y3 & X2

Safety Detail of Specifications

The SCC series of X1/Y2, X2/Y3 & X2 safety capacitors are designed specifically for use in modem, facsimile,telephone and other electronic equipment. These parts are compliant to EN/IEC60384-14 and UL60950-1standards. These capacitors are available in NP0 (C0G), SL and X7R dielectrics.

EN 60384-1: 2001EN 60384-14: 2005

Meets the electrical requirements and certification for equipment requiring class X1/Y2 and X2/Y3 devices.

IEC 60950-1 : 2005 Component certified for equipment requiring IEC 60950 compliance

IEC 60384-1: 1999IEC 60384-14: 2005

Component certified for equipment requiring IEC-384 compliance

UL 60950-1: 20072nd edition TNV/SELV Isolation capacitors certified to UL 60950 -1

SCC Series - Safety Capacitors

Features Application

SCC 1808 X 102 K 502 T S

- 9 -

Small size & high capacitance values. Suitable for reflow soldering. Surface mount. RoHS compliant and Lead (Pb) free option. Safety standard approval by EN/IEC 60384-14

and UL 60950-1. Certified to:

TUV R50005234, R50103496 & UL E229738TUV R50162550 & UL E229738 for Lead (Pb) free.

Specially designed for use in modem, facsimile,telephone and other telecommunicat ionequipment, electronic equipment for lightningand surge protection, EMI filtering and isolation.

Product Code

SCC : Safetyapproved MLCC

Chip Size

Ex. :18081812 220822112220 2825

Dielectric

Ex. :N : NP0X : X7RL : SL

CapacitanceUnit : pFEx. :

2R0 : 2.0pF100 : 10×100

471 : 47×101

182 : 18×102

Tolerance

Ex. :J : +/- 5%K : +/-10%M : +/-20%

Class

Ex. :202 : X2302 : X2/Y3502 : X1/Y2602 : X1/Y2 for

SCC2208N,SCC2211N,SCC2220N

Packaging

T : Tape & Reel

B : Bulk

SpecialRequirement Ex. :S : Arc Prevention

CoatingX : Polymer Termination

(SuperTerm)Z : Arc Prevention Coating

& SuperTermG : Lead (Pb) free

W

T

BW B

L

X: Across The Line (Ex.: SCC1808N151K302T)Y : Line By Pass (Ex.: SCC2211X102K502T)

Rated Voltage AC 250Vrms

Temperature CoefficientNP0 : < 30ppm/ , -55~+125 (EIA Class Ι )SL: +350~ -1000ppm/°C -55~+85°CX7R : < ± 15% , -55~+125 (EIA Class Ⅱ)

Capacitance Range See table below Quality and Dissipation Factor NP0/SL : Q≧1000 ; X7R : D.F.≦2.5%Climatic Category -55/125/21Insulation Resistance 10GΩ

Voltage Proof X Capacitor : Applied Voltage 1075Vdc(4.3Ur)Y Capacitor : Applied Voltage 1500Vac

Impulse Y3 : 2.5KV (Compliant to IEC 60950) ; X2 : 2.5KV / Y2 : 5KV for three times Ageing NP0 : 0 % ; SL : 1.5% ; X7R : 1.0 % per decade hr, typical

Y


1808 4.60±0.3[.181±.012]

2.00±0.2[.079 ±.008]

2.20[.087]

2.50[.098]

0.20[.008]

1812 4.60±0.3[.181±.012]

3.20±0.3[.126±.012]

2.60[.102]

2.50[.098]

0.20[.008]

2208 5.70±0.4[.220±.016]

2.00±0.2[.079±.008]

2.20 [.087]

4.00 [.157]

0.30[.012]

2211 5.70±0.4[.220±.016]

2.80±0.3[.110±.012]

3.00[.118]

4.00[.157]

0.30[.012]

2220 5.70±0.4[.220±.016]

5.00±0.4[.197±.016]

3.00[.118]

4.00[.157]

0.30[.012]

2825 6.80±0.4[.280±.016]

6.35±0.4[.197±.016]

4.00[.157]

4.00[.157]

0.30[.012]

Dimensions

Application Example Circuit


Unit : mm [inches]

Y Tip & Ring

X

TNV SELV

2nd 1st


- 10 -


- 11 -

Capacitance Range

Capacitance Range Lead (Pb) free

‘X’ denotes values that have been tested to a rated voltage of 305VacTUV test report number 28208004 dated 27th May 2010

2R0

5R0

6R8

8R2

100

120

150

180

220

270

330

360

390

470

560

680

820

101

121

131

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

472

473

563

x x x x x x x x x x x x

Class Size TemperatureCharacteristic

RatedVoltage Certificated 10

112

113

115

118

122

127

133

139

147

156

168

182

110

212

215

218

222

227

233

239

247

256

268

282

210

312

315

318

322

327

333

339

347

356

368

382

310

412

418

4

TUV/ULX2

250Vrms TUV/ULTUV/ULTUV/UL

2220

SLX7R

NP0X7RNP0X7R

X7R

18081808

1808

250Vrms250Vrms

250Vrms TUV/UL

TUV/ULTUV/UL

CertificatedCapacitance Range (pF)


RatedVoltage

TUV/UL

1812 X7R 250Vrms TUV/UL

X2/Y3

1808 NP0 250Vrms

180818121812

250Vrms250Vrms

X1/Y2 2208 NP0 250Vrms TUV/UL2208 X7R 250Vrms TUV/UL

2211 X7R 250Vrms TUV/UL2211 NP0 250Vrms TUV/UL

2220 NP0 250Vrms TUV/UL2220 X7R 250Vrms TUV/UL

250Vrms

2R0

5R0

6R8

8R2

100

120

150

180

220

270

330

360

390

470

560

680

820

101

121

131

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

472

473

563

x x x x x x x x x x x xX2 2825 X7R 250Vrms TUV




1812 X7R 250Vrms TUV/UL

TUV

X1/Y2


X2/Y31808 NP0 250Vrms

1812 X7R 250Vrms

TUV/UL1808 X7R 250Vrms TUV/UL


RatedVoltage Certificated


TCX SeriesTrigger Capacitors for Strobe Circuits

How To Order

Operating Temperature -55~+125

Rated Voltage 350Vdc and 630Vdc

Temperature Coefficient X7E : ≤ ± 4.7% , -55~+125 (EIA Class II )

Capacitance Range 1.0nF to 100nF

Dissipation Factor 1.0% max. at 1KHz 25

Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad)

Dielectric Strength350Vdc : 200% Rated Voltage

650Vdc : 150% Rated Voltage

Capacitance Tolerance ± 5% , ± 10% , ± 20%

Ageing 1.0% per decade hr, typical


Features

TCX 1206 C 223 K 631 T

Product Code

TCX : TriggerCapacitor

Chip Size

Ex. :08051206 1210

Dielectric

C : X7E

CapacitanceUnit : pFEx. :102 : 10×102

473 : 47×103

Tolerance

Ex. :J : +/- 5%K : +/- 10%M : +/- 20%

Rated Voltage

Ex. :351 : 350Vdc631 : 630Vdc

Packaging

T : Tape &Reel

B : Bulk

Applications Excellent trigger characteristics. Low ESR & low tan δ. Excellent DC bias. Provide good damping characteristics results in

more light. RoHS compliant.

Suitable for strobe trigger circuit in digital and electric cameras.

The TCX series is specifically designed with a proprietary material for discharge applications such as strobecircuit applications. The unique properties of the X7E material and the design of the TCX series makes themsuitable for any discharge application which requires the capacitor to have a good damping characteristic. Thisseries is also suitable for applications requiring a minimum change in capacitance over temperature (T/C). TheTCX series is offered in sizes 0805, 1206 and 1210 and at 350Vdc and 630Vdc.

TCX Series - Trigger Capacitors for Strobe Circuits

- 12 -

Characteristics

Capacitance Range

Dimensions

W

T

BW B

L


+-

DSC Strobe Circuit

Trigger Cap.


0805 2.00±0.2[.079±.008]

1.25±0.2[.049 ±.008]

1.45[.057]

0.70[.028]

0.20[.008]

1206 3.20±0.3[.126±.012]

1.60±0.2[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.3[.126±.012]

2.50±0.2[.098±.008]

1.80 [.071]

1.60 [.063]

0.30[.012]

Unit : mm [inches]

Other dimensions, capacitance values and voltage ratings are available. Please contact HEC.

TCX Series -Trigger Capacitors for Strobe Circuits

Damping (Trigger) Properties

-4000

-3000

-2000

-1000

0

1000

2000

3000

4000

5000

0 1 2 3 4 5 6 7 8 9 10Time (µs)

Trig

ger

Vol

tage

(V

p)

TCX/1206/223K/630V

X7R/1206/223K/630V

R-C Charge Curv e

0

50

100

150

200

250

300

0 1 2 3 4 5 6 7Time (sec.)

Vol

tage

(V

)

TCX/1206/223K/630V

X7R/1206/223K/630V

- 13 -


102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

154

224

C C C C C C C C C C C C C C C D D DC C C C D D D E E

D D D D D D D E E ED D D D D D D E E

DielectricCharacteristic Size Voltage

Capacitance Range

X7E

0805 350V

1206350V630V

1210 630V

LDC SeriesLow Distortion Capacitors NP0/X7R Hybrid

LDC 1206 C 103 K 025 T

Product Code

LDC : LowDistortionCapacitor

Chip Size

Ex. :060308051206121018122220

Dielectric

C : X7E


224 : 22×104

Tolerance

Ex. :J : +/- 5%K : +/- 10%M : +/- 20%

Rated Voltage

Ex. :025 : 25Vdc050 : 50Vdc

Packaging

T : Tape &Reel

B : Bulk


Rated Voltage 25V and 50Vdc

Temperature Coefficient X7E : ≤ ± 4.7% , -55~+125 (EIA Class II )

Capacitance Range 1nF ~ 270nF

Dissipation Factor For 50V : 1.2% max. at 1KHz 25

For 25V : 2.0% max. at 1KHz 25

Insulation Resistance 10GΩ or 500/C Ω whichever is smaller

Dielectric Strength 250% Rated Voltage for 5 second @ 50mA max. current


Ageing 1.0% per decade hr , typical

How To Order


Suitable for telecommunication (ADSL modem),power (inverter for oscillation circuit) & audiocircuits.

Features Application Small size & high capacitance. Ultra stable T/C for a Class ll. Excellent bias, high temperature stability &

low tan δ. High breakdown voltage. Replacement for film capacitors. RoHS compliant.

LDC Series - Low Distortion Capacitors

- 14 -

W

T

BW B

L


0603 1.60±0.1[.063±.004]

0.80±0.1[.031 ±.004]

0.90[.035]

0.40[.016]

0.15[.006]

0805 2.00±0.2[.079±.008]

1.25±0.2[.049 ±.008]

1.45[.057]

0.70[.028]

0.20[.008]

1206 3.20±0.3[.126±.012]

1.60±0.2[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.3[.126±.012]

2.50±0.2[.098±.008]

1.80 [.071]

1.60 [.063]

0.30[.012]

1812 4.60±0.3[.181±.012]

3.20±0.3[.126±.012]

2.20[.087]

2.50[.098]

0.30[.012]

2220 5.70±0.4[.220±.016]

5.00±0.4[.197±.016]

2.20[.087]

3.50[.137]

0.30[.012]

Characteristics


FILTER6.8nF

6.8nF

819R

100R

100R

1.8nF

1.8nF

1

2

4.7nF

316R

50Ω

50Ω

Dimensions

Capacitance Range

Unit : mm [inches]


LDC Series - Low Distortion Capacitors

Temperature Capacitance Coefficient

-20.0

-15.0

-10.0

-5.0

0.0

5.0

10.0

15.0

20.0

-55 -45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95 105 115 125

Temperature

dC/C

(%)

X7R 1206/103

LDC 1206/103

Impedance/ESR & Frequency

0.01

0.1

1

10

100

0.1 1 10 100 1000Frequency (MHz)

(oh

m)

Z - LDC/1206/103Z - Film Cap 1206/103ESR - LDC/1206/103ESR - Film Cap /1206/103

Temperature

- 15 -


102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

154

224

274

B B B B B B B B B B B B BC C C C C C C C C C C

C C C C C C C C C C C C CC C C C C C C C C C C C C

C C C C C CD D D D D D

D D D D

DielectricCharacteristic Size Rated

VoltageCapacitance Range

X7E

0603 50V0805 50V1206 25V

50V1210 50V1812 50V2220 50V

Application

NCC SeriesNormal Chip Capacitors NP0, X7R, X5R,Y5V


Standard Multilayer Ceramic Chip Capacitors (MLCCs) are available in a full range of sizes and temperature coefficients, with voltage ratings from 6.3V to 50V.

Surface mount suited for wave and reflow soldering. Small size and high reliability. Excellent in high frequency characteristic. RoHS compliant.

Suitable for general electronics circuit,telecommunications, personal computersand peripheral, power circuit & mobileapplication etc.

Features

NCC Series - Normal Chip Capacitors

- 16 -

Operating Temperature -55°C~+125 for NP0 and X7R: -55°C ~+85°C for X5R: -30°C~+85°C for Y5VRated Voltage 6.3Vdc to 50Vdc

Temperature Coefficient

NP0 : ≤ ± 30ppm/ , -55°C~+125 (EIA Class Ι)X7R : ≤ ± 15% , -55°C~+125 (EIA Class Ⅱ)X5R : ≤ ± 15% , -55°C~+85 (EIA Class Ⅱ)Y5V: +22%/-82% , -30°C ~ +85°C (EIA Class Ⅱ)

Dissipation Factor NP0 : More than 30pF: Q≥ 1000 (0.001) 30pF and below : Q≥400+20C (C=pF)

X7R, X5R and Y5V: please see table 1 on page 39 for detailsInsulation Resistance 10GΩ or 500/C Ω whichever is smallerAgeing NP0:0% ; X7R/X5R: typically 1.0% and Y5V ≤ 7% per decade of timeDielectric Strength 250% rated voltage

Dimensions

W

T

BW B

L


0201 0.60±0.03[.024±.001]

0.30±0.03[.011 ±.001]

0.33[.013]

0.20[.008]

0.10[.004]

0402 1.00±0.05[.039±.002]

0.50±0.05[.020 ±.002]

0.55[.022]

0.30[.012]

0.15[.006]

0603 1.60±0.10[.063±.004]

0.80±0.10[.031 ±.004]

0.90[.035]

0.40[.016]

0.15[.006]

0805 2.00±0.20[.079±.008]

1.25±0.20[.049 ±.008]

1.45[.057]

0.70[.028]

0.20[.008]

1206 3.20±0.30[.126±.012]

1.60±0.20[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

Product Code


Chip Size

Ex. :0201 0402 0603 08051206

Dielectric

Ex. :N : NP0X : X7RB : X5RY : Y5V


102 : 10×102

473 : 47×103

104 : 10×104

Tolerance

Ex. :C : +/- 0.25pFD : +/- 0.50pFF : +/- 1%G : +/- 2%J : +/- 5%K : +/- 10%M : +/- 20%Z : +80/-20%

Rated Voltage

Ex. :007 : 6.3Vdc010 : 10Vdc016 : 16Vdc025 : 25Vdc050 : 50Vdc

Packaging

T : Tape & ReelB : Bulk

How To Order

C 0402 B 104 M 010 T

Capacitance Range

NCC Series - Normal Chip Capacitors

-17 -



101

121

151

181

221

271

331

391

471

561

681

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

154

224

334

474

684

OO O O O O O O O O O O

O O O O OO O O O O O O O O O O O O O O O O O O O O O O O

B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B

B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D DB B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D DB B B B B B B B B B B B B B B B B B B B B B B B B B B B B C D

B B B C DB B B C DB B B C D


Voltage

0402

10V16V25V50V16V25V50V

080516V25V50V

0603

120616V25V50V

X7R

Capacitance Range (pF)10

222

247

210

322

347

310

422

447

4

O OOB B BB B BBB B BB B BB B BB B BB B BB B B

Capacitance RangeDielectricCharacteristic Size Rated

Voltage

25V50V

120616V25V50V

Y5V

0402 10V16V

060316V25V50V

080516V

0R5

1R0

1R5

2R0

3R0

4R0

5R0

6R0

7R0

8R0

9R0

100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

O O O O O O O O O O O O O O O O O O O O OB B B B B B B B B B B B B B B B B B B B B B B BB B B B B B B B B B B B B B B B B B B B B B B B0805 50V


NPO


Voltage

0402 50V0603 50V

273

333

393

473

563

683

823

104

154

224

334

474

684

SO O

O O OO O O O O O O OO O O O O O O O

B BB B B B B B

BB B B B B BB B B B B

B

X5R


Voltage

6.3V10V

6.3V10V

16V25V

0402

16V25V

0603


0201 6.3V

Surface mount, suited for wave and reflowsoldering.

High reliability. Small size and high capacitance value. Excellent high frequency characteristics. RoHS compliant.

HCC SeriesHigh Capacitance MLCC - 1uF and above



Ideal for smoothing and decoupling circuits Suitable for DC-DC converter , personal

computer and peripherals, telecommunicationand general electronic equipment

HCC Series - High Capacitance MLCC

- 18 -

Operating Temperature -55°C~+125 for X7R: -55°C ~+85°C for X5R: -30°C~+85°C for Y5VRated Voltage 6.3Vdc to 50Vdc

Temperature CoefficientX7R : ≤ ± 15% , -55°C~+125 (EIA Class Ⅱ)X5R : ≤ ± 15% , -55°C~+85 (EIA Class Ⅱ)Y5V: +22%/-82% , -30°C ~ +85°C (EIA Class Ⅱ)

Dissipation Factor : X7R, X5R and Y5V: Please see table 1 on page 39 for detailsInsulation Resistance 10GΩ or 500/C Ω whichever is smallerAgeing X7R/X5R: Typically 1.0% and Y5V ≤ 7% per decade of timeDielectric Strength 250% Rated Voltage

DimensionsTYPE L W T (max) B (min) BW (min)

0402 1.00±0.05[.039±.002]

0.50±0.05[.020 ±.002]

0.55[.022]

0.30[.012]

0.15[.006]

0603 1.60±0.10[.063±.004]

0.80±0.10[.031 ±.004]

0.90[.035]

0.40[.016]

0.15[.006]

0805 2.00±0.20[.079±.008]

1.25±0.20[.049 ±.008]

1.45[.057]

0.70[.028]

0.20[.008]

1206 3.20±0.30[.126±.012]

1.60±0.20[.063±.0108

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.30[.126±.012]

2.50±0.20[.098±.008]

2.60 [.102]

1.60 [.063]

0.30[.012]

1812 4.60±0.3[.181±.012]

3.20±0.3[.126±.012]

3.00[.118]

2.50[.098]

0.30[.012]

2220 5.7±0.40[.220±.016]

5.00±0.40[.197±.016]

3.00 [.118]

3.50 [.137]

0.30[.012]

W

T

BW B

L

Product Code


Chip Size

Ex. :0402 0603 0805 1206 1210 18122220

Dielectric

Ex. : X : X7RB : X5RY : Y5V


105 : 10×105

106 : 10×106

226 : 22×106

Tolerance

Ex. :J : +/- 5%K : +/- 10%M : +/- 20%Z : +80/-20%

Rated Voltage

Ex. :007 : 6.3Vdc010 : 10Vdc016 : 16Vdc025 : 25Vdc035 : 35Vdc050 : 50Vdc

Packaging

T : Tape& Reel

B : Bulk

How To OrderC 0805 B 106 M 010 T

Capacitance Range

HCC Series - High Capacitance MLCC

- 19 -



Code VDC 16V 35V105 1uF B B B B D D D D D E E D D D D F F225 2.2uF B B B D D D E E E F F F475 4.7uF D D E E F F F106 10uF E F F G

121025V 35V

060316V10V6.3V 10V 25V 6.3V 16V

Size 0805 18121206 2220X7R (X) Series

25V 10V 35V50V 35V50V 16V 25V

Code VDC105 1uF O O B B B B B D225 2.2uF B B B D D D475 4.7uF B B D D D D D106 10uF D D D D E E E E E226 22uF D D E F F

Y5V (Y) Series

50V50V 10V 35V16V 25V 35V 50V 6.3V 10V 16V 25V16V 25V 6.3V 10V 16V 25V6.3V 10V 6.3 10VSize 0402 0603 0805 1206 1210

Code VDC105 1uF O O B B B B D D D D D E E225 2.2uF O B B B D D D D E E E E E/F F D475 4.7uF B B D D D D E E E E F F F106 10uF B D D D E E E E F F F F226 22uF D D E E E G G G476 47uF E E107 100uF G

35V12060603 0805 1210

16V 25V 50V

X5R (B) SeriesSize 0402

6.3V 10V 6.3V 10V 6.3V 10V 16V 25V 10V6.3V 10V 16V 25V 16V 25V35V 50V 6.3V

HCN SeriesHigh Capacitance NP0 - 1nF and above

Small size & high capacitance. Suitable for wave and reflow soldering. Excellent characteristics and tight tolerance. Excellent bias, high temperature stability & low tan δ. Replace film capacitors. RoHS compliant.

C 1206 N 103 J 025 T

Product Code

C : MLCCMultilayer Ceramic Capacitor

Chip Size

0603 0805 1206 1210 1812

Dielectric

N : NP0


103 : 10×103

124 : 12×104

Tolerance

Ex. :F : +/- 1%G : +/- 2%J : +/- 5%

Rated Voltage

Ex. :016 : 16Vdc025 : 25Vdc050 : 50Vdc

Packaging

T : Tape &Reel

B : Bulk


Rated Voltage 16V to 50Vdc

Temperature Coefficient NP0 : ≤ 30ppm/, -55~+125 (EIA Class Ι )

Capacitance Range 1nF ~ 220nF

Dissipation Factor Q ≥1000 at 1KHz 20

Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad)

Dielectric Strength 250% rated voltage for 5 second @ 50mA max. current

Ageing 0% per decade hr

How To Order



Suitable for ADSL filter circuits, cable modem andcoupling circuits, general telecommunications use,power (inverter for oscillation circuit) and audiocircuits.

HCN Series - High Capacitance NP0

- 20 -

Characteristics

Application Example Circuits

Dimensions

Capacitance Range

680uH

Tx Filter560pF

560pF

1.5nF 2.7nF

4.75KR

4.75KR680uH

348R

348R

1

2

Unit : mm [inches]

Z/ESR & Frequency

0.001

0.01

0.1

1

10

100

1000

10000

100000

0.1 1 10 100 1000 10000 100000Frequency (KHz)

Ohm

Z- MLCC- NPO 1812/683ESR-MLCC NPO 1812/683Z- Film Cap 1812/683ESR- Film Cap 1812/683


-5000

-4000

-3000

-2000

-1000

01000

2000

3000

4000

5000

-55 -45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95 105 115 125

Temperature()

dC/C

(ppm

)

NPO-1812/683Film-1812/683

Rx Filter1.5nF

1.5nF

1.8nF

1.8nF

1.8nF

1.8nF

3.3nF

3.3nF

6.8nF

680uH 680uH 680uH

4.7nF 18nF 4.2KR

4.2KR100nF

2

1

TYPE L W T (max) B (min) BW (min)0603 1.60+/-0.1

[.063+/-.004]0.80+/-0.1

[.031+/-.004]0.90[.039]

0.40[.016]

0.15[.006]

0805 2.00±0.2[.079±.008]

1.25±0.2[.049 ±.008]

1.40[.055]

0.70[.028]

0.20[.008]

1206 3.20±0.3[.126±.012]

1.60±0.2[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.3[.126±.012]

2.50±0.2[.098±.008]

2.20 [.087]

1.60 [.063]

0.30[.012]

1812 4.60±0.3[.181±.012]

3.20±0.3[.126±.012]

2.20[.087]

4.00[.157]

0.20[.008]

HCN Series - High Capacitance NP0

W

T

BW B

L

- 21 -



102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

224

B B B B B B BB B B B B B BB B B B B B BB B B B C/D D D D D D D D DB B B B C/D D D D D D D D DB B B B C/D D D D D D D D DB B B B B B B B B B B B B D D D D EB B B B B B B B B C D D DB B B B B B B B B C D D EC C C C C C C C C C C C C D D D D D E E EC C C C C C C C C C C C C D E E FC C C C C C C C C C C C C D E E FD D D D D D D D D D D D D D D D E E E E F F F F F FD D D D D D D D D D D D D D D D E E E E FD D D D D D D D D D D D D D D D E E E E F

181216V25V50V

16V25V50V

121016V25V50V

NPO

060316V25V50V

080516V25V50V

1206


Capacitance Range

HCX SeriesHigh Capacitance X7R - 100nF and above

Product Code


Chip Size

Ex. :1210 1812 1825 2220 2225

Dielectric

X : X7R


102 : 10×102

224 : 22×104

105 : 10×105

Tolerance

Ex. :K : +/- 10%M : +/- 20%

Rated Voltage

Ex. :050 : 50Vdc101 : 100Vdc

Packaging

T : Tape &Reel

B : Bulk

SpecialRequirement Ex. :O : Arc

PreventionCoating

X : FlexibleTermination (Super Term)


Rated Voltage 50V to 100Vdc

Temperature Coefficient X7R : ≤ ± 15% at -55~+125 (EIA Class II )

Capacitance Range 100nF ~ 10uF

Dissipation Factor 2.5% max. at 1KHz 25

Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad )

Dielectric Strength50V : 250% rated voltage for 5 second @ 50mA max. current

100V :200% rated voltage for 5 second @ 50mA max. current

Capacitance Tolerance ± 10% , ± 20%

Ageing 1.0% per decade hr , typical

How To Order



DC-DC converters (filter) Industrial controls Power supplies Surge protection

Rated working voltage of 50V and 100Vdc. Small size & high capacitance. Excellent bias, high temperature stability & low tan δ. Low ESR and excellent ripple current characteristics RoHS compliant

HCX Series - High Capacitance X7R

C 1210 X 225 K 101 T X

- 22 -


1210 3.20±0.3[.126±.012]

2.50±0.2[.098±.008]

2.60 [.102]

1.60 [.063]

0.30[.012]

1812 4.60±0.3[.181±.012]

3.20±0.3[.126±.012]

3.00[.118]

2.50[.098]

0.30[.012]

1825 4.60±0.3[. 181±.012]

6.35±0.4[.250±.016]

3.00[.118]

2.50[.137]

0.30[.012]

2220 5.70±0.4[.220±.016]

5.00±0.4[.197±.016]

3.00[.118]

3.50[.137]

0.30[.012]

2225 5.70±0.4[.220±.016]

6.35±0.4[.250±.016]

3.00[.118]

3.50[.137]

0.30[.012]

W

T

BW B

L

Characteristics


Dimensions

Capacitance Range

Filter Isolation Transformer

DC-DC Converter

Unit : mm [inches]


HCX Series - High Capacitance X7R

- 23 -


Code WVDC104 100nF C C D D/E D D154 150nF C C D D/E D D224 220nF C C D D/E D D334 330nF C C D D/E D D474 470nF C C D E D D E E D D564 560nF D D D E D D E E D D684 680nF D E D E D D E E D D105 1uF D F D E D D F F D E155 1.5uF F F E F E F F F D F225 2.2uF G G E G E F F F E F335 3.3uF F F F F E F475 4.7uF H F F F E F685 6.8uF G F106 10uF H G

Size 1210 1812 1825 2220 222550V 100V 50V 100V 50V 100V 50V 100V 50V 100V

Product Code


Chip Size

Ex. :0805 1206 1210 1812 2220

Dielectric

Ex. :X : X7RE : Y5U


103 : 10×103

474 : 47×104

Tolerance

Ex. :K : +/- 10%M : +/- 20%

Rated Voltage

Ex. :251 : 250Vdc

Packaging

T : Tape & Reel

B : Bulk

SAC SeriesTip & Ring Capacitors

How To Order


FeaturesTelephone lines use a DC voltage of 48 voltsand pass the subscriber’s AC signal pulse of 15to 25Hz at 70 to 90Vrms. These MLCC Tip &Ring capacitors replace bulky leaded filmcapacitors and offer excellent frequencyresponse, low ESR and improved temperaturecharacteristics. Ideal for telecommunication andmodem applications.

Small size & high capacitance. Suitable for wave and reflow soldering. Surface mount. Low ESR characteristics & improved temperature

performance. RoHS compliant.

SAC Series -Tip & Ring Capacitors

C 1812 X 474 M 251 T

- 24 -

Operating Temperature X7R : -55~+125 , Y5U : -30~+85

Rated Voltage 250Vdc

Temperature CoefficientY5U : ≤ +22 /-56 % , -30~+85 (EIA Class II )

X7R : ≤ ± 15% , -55~+125 (EIA Class II )

Capacitance RangeY5U :10nF ~ 1.0uF

X7R :180pF ~ 2.2uF

Dissipation Factor Y5U : D.F.≦4.0% ; X7R : D.F.≦2.5%

Insulation Resistance 10GΩ or 500/C Ω whichever is smaller

Dielectric Strength 200% rated voltage for 5 second @ 50mA max. current

Ageing Y5U: 4.0 %; X7R: 1.0 % per decade hr , typical

Capacitance Range

W

T

BW B

L

Ring

Tip

Ring

Tip0.47uF

200ms/DIV

-48Vdc

Dimensions


Characteristics

TYPE L W T (max) B (min) BW (min)0805 2.00±0.2

[.079±.008]1.25±0.2

[.049 ±.008]1.45[.043]

0.70[.028]

0.20[.008]

1206 3.20±0.3[.126±.012]

1.60±0.2[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.3[.126±.012]

2.50±0.2[.098±.008]

2.60 [.102]

1.60 [.063]

0.30[.012]

1812 4.60±0.3[.181±.012]

3.20±0.3[.126±.012]

3.00[.118]

2.50[.098]

0.30[.012]

2220 5.70±0.4[.220±.016]

5.00±0.4[.197±.016]

3.00[.118]

3.50[.137]

0.30[.012]

Unit : mm [inches]

SAC Series - Tip & Ring Capacitors

Temperature Capacitance Coef f icient

-80-70

-60-50

-40-30-20

-100

1020

-55 -35 -15 5 25 45 65 85 105 125Temperature (C)

Cap

acita

nce

Cha

nge

(%)

X7R 1812/474Y5U 1812/474

X7R Impedance/ESR & Frequency

0.01

0.1

1

10

100

1000

10000

0.1 1 10 100 1000 10000 100000Frequency (KHz)

(oh

m)

X7R 1812/474 -ZX7R 1812/474 -ESRY5U 1812/474 -ZY5U 1812/474 -ESR

- 25 -

Subscribers AC Signal



181

221

271

331

471

681

102

152

182

222

332

472

562

682

103

153

223

273

333

393

473

563

683

823

104

154

224

334

474

564

684

824

105

155

225

B/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/C D D DB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CC/DD/ED/ED/E

C C C C C C C C C C D D DD D D D D D D/ED/ED/ED/ED/ED/ED/ED/E E E E F G

E E E E E E E E E F HD D D D D D D D D D D D D E E E E F G


Capacitance Range

1812 250V2220 250V

Y5U 1812 250V

X7R

0805 250V1206 250V1210 250V

HBC Series Low-Loss, High Frequency Snubber Capacitors

Low stable ESR at high frequency. Ultra stable NP0 performance. Suitable for solder wave and reflow soldering. ROHS compliant. High peak to peak voltage capability.

HBC 1206 N 100 J 501 T

Product Code

HBC : Low-loss High Frequency Capacitors

Chip Size

Ex. :1206 1210

Dielectric

Ex. :N : NP0


101 : 10×101

102 : 10×102

Tolerance

Ex. :F : ±1%G : ±2% J : ± 5%K : ±10%

Rated VoltageEx. :501 : 500Vdc631 : 630Vdc

Packaging

T : Tape & Reel

B : Bulk

HBC Series - Low-Loss, High Frequency Snubber Capacitors


Rated Voltage 500V and 630Vdc

Temperature Coefficient ≤ ± 30ppm at -55~+125

Capacitance Range 10pF ~ 2700pF

Dissipation Factor 0.1% max. at 1MHz 25

Insulation Resistance 10GΩ

Dielectric Withstanding 1.5 × WVDC for 5 sec

Capacitance Tolerance F, G, J, K

Ageing None

Piezo Effects None

dv/dt rating >6KV/µ second

How To Order


High frequency pulse circuits. Lighting ballast snubber circuits. DC-DC converters. High dv/dt rating.


- 26 -


1206 3.20±0.3 1.60±0.2 1.80 1.50 0.30

1210 3.20±.30 2.50±0.2 2.60 1.60 0.30

W

T

BW B

L

HBC Series - Low-Loss, High Frequency Snubber Capacitors

Characteristics Peak to Peak Voltage

Dimensions

Unit : mm [inches]

- 27 -

AC Voltage Pulsed Voltage

DC + AC Voltage

0V

DC + Pulsed Voltage

0V

= peak to peak voltage

Capacitance Range


100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

684

824

105

155

225Dielectric

CharacteristicSize Voltage

Capacitance Range

500V1210 630V

630V1210

NP0

1206 500V1206

To convert a DC voltage rating to maximum peak to peak voltage a conversion factor of 1.25 : 1 should beUsed. For example : 500VDC rating = 500/1.25 = 400V peak to peak voltage where peak to peak is definedas below.

HTC SeriesHigh Temperature CapacitorsX8R rated to +150°C

Rated voltages from 25V to 250V. Stable temperature coefficient at temperatures

up to 150°C. Near zero loss of capacitance at peak temperature (see chart).

Fully RoHS compliant. Available with flexible termination (Super Term)

to minimize mechanical / thermal stress effects.

HTC 1206 H 103 K 025 T

Product Code

HTC :HighTemperatureCapacitor

Chip Size

Ex. : 0603 08051206 1210

Dielectric

Ex. :X8R

CapacitanceUnit : pF

Ex. :102:10×102

224:22×104

Tolerance

Ex. :J : +/- 5%K : +/- 10%M : +/- 20%

Rated Voltage

Ex. :025:25Vdc050:50Vdc101:100Vdc251:250Vdc

Packaging

T : Tape &Reel

B : Bulk

Special Requirement

Ex. :X:Super TermO:Arc Prevention

Coating

HTC Series- High Temperature Capacitors


Rated Voltage 25V ~ 250Vdc

Temperature Coefficient X8R : ≤ ± 15% , -55~+150 (EIA Class II )

Capacitance Range 180pF ~ 390nF

Dissipation Factor 2.5 % max. at 1KHz 25

Insulation Resistance 100GΩ or 1000/C Ω whichever is smaller at 25

Dielectric Strength< 200V : 250% rated voltage for 5 second @ 50mA max. current

200~500V : 150% rated voltage for 5 second @ 50mA max. current


Ageing 2.0% per decade hr, typical

How To Order


Suitable for automotive, oil exploration(drilling and logging) and other demandinghigh temperature environments andapplications.

Instrumentation and other equipmentcircuit operating at high temperatures.

Features Applications

- 28 -

X

W

T

BW B

L


0603 1.60±0.1[.063±.004]

0.80±0.1[.031 ±.004]

0.90[.039]

0.40[.016]

0.15[.006]

0805 2.00±0.2[.079±.008]

1.25±0.2[.049 ±.008]

1.45[.057]

0.70[.028]

0.20[.008]

1206 3.20±0.3[.126±.012]

1.60±0.2[.063±.008]

1.80[.071]

1.50[.059]

0.30[.012]

1210 3.20±0.3[.126±.012]

2.50±0.2[.098±.008]

1.80 [.071]

1.60 [.063]

0.30[.012]

Characteristics

Dimensions

Capacitance Range

Unit : mm [inches]


- 29 -

X8R-1206 / 100nF

-25.0

-20.0

-15.0

-10.0

-5.0

0.0

5.0

10.0

15.0

20.0

-55 -40 -25 -10 5 20 35 50 65 80 95 110 125 140

dC/C

(%

)

150

HTC Series - High Temperature Capacitors

181

221

271

331

391

471

561

681

102

122

152

182

222

272

332

392

472

562

682

103

123

153

183

223

273

333

393

473

563

683

104

124

154

184

224

274

334

394

474

564

684

105

155

225

50V

X8R

0603

0805

25V50V

25V

250V

121050V

1206

25V

100V

100V250V

100V250V25V50V


VoltageCapacitance Range (pF)

How To Order

LCC SeriesLarge Size NP0 & X7R MLCC Capacitors50V – 8KV

Operating Temperature -55~+125 Rated Voltage 50Vdc to 8KVdc

Temperature CoefficientNP0 : ≤ ± 30ppm/ , -55~+125 (EIA Class Ι )X7R : ≤ ± 15% , -55~+125 (EIA Class Ⅱ )

Capacitance Range NP0 :100pF to 820nF ; X7R :1000pF to 33uFDissipation Factor NP0 : Q≧1000 ; X7R : D.F.≦2.5%Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad )

Ageing NP0:0% ; X7R: 1.0 % per decade of time

Dielectric StrengthV ≤ 500V : 200% rated voltage500V ≤ V < 1000V : 150% rated voltageV ≥1000V : 120% rated voltage


Optimized internal design offers the highest possiblevoltage rating up to 8KVdc.

Capacitance range from 470pF - 33uF and case sizesfrom 1515 – 7565.

Available with proprietary surface coating for arcprevention

Available with flexible termination (Super Term) tominimize the effects of mechanical stress.

High reliability screening is available. Pd/Ag, 100% Sn and 90/10 Sn/Pb terminations available. RoHS compliant.

Voltage multipliers Power supplies DC-DC converters Surge protection Industrial control circuits Isolation Ballast Snubber Custom applications

Product CodeC: MLCC

MultilayerCeramic Capacitor

Chip Size

EX.:1515 2520 3530 3640 4540 555065607565

Dielectric

Ex.:N: NP0X: X7R

CapacitanceUnit : pFEx.:100:10×100

471:47×101

102:10×102

Tolerance

Ex.:C:+/-0.25pFD:+/-0.50pFJ:+/- 5%K:+/-10%M:+/-20%

Rated Voltage Ex.:050:50Vdc251:250Vdc631:630Vdc102:1000Vdc

Packaging

Ex.:T: Tape

& ReelW: Waffle

PackB: Bulk

Termination

Ex.:S:Solderable

AgP:Pd/AgN: 100%

Sn PlatedW:90/10

Sn/Pb Plated

Testing RequirementEx.:S:Standard ElectricalH:Hi-Reliability

SpecialRequirementEx.:Blank:StandardO: Arc PreventionCoatingX: Flexible Termination (Super Term)Z: Arc Prevention and SuperTerm

LCC Series - Large Size MLCC Capacitors

Applications. Features

C 2520 X 103 K 102 T N S X

- 30 -

Dimensions

Capacitance Range


1515 3.80±0.50[.15±.020]

3.80±0.50[.15 ±.020]

3.20[.126]

1.60[.059]

0.30[.012]

2520 6.35±0.50[.25±.020]

5.00±0.50[.20±.020]

3.20[.126]

4.00 [.157]

0.30[.012]

3530 8.90±0.50[.35±.020]

7.60±0.50[.30±.020]

5.00 [.200]

5.50 [.217]

0.30[.012]

3640 9.20±0.50[.36±.020]

10.2±0.50[.40±.020]

5.00 [.200]

6.00 [.236]

0.30[.012]

4540 11.5±0.50[.45±.020]

10.2±0.50[.40±.020]

5.00 [.200]

7.50 [.295]

0.30[.012]

5550 14.0±0.50[.55±.020]

12.7±0.50[.50±.020]

5.00 [.200]

9.00 [.354]

0.30[.012]

6560 16.5±0.50[.65±.020]

15.3±0.50[.60±.020]

5.00 [.200]

11.50 [.453]

0.30[.012]

7565 19.0±0.50[.750±.020]

16.5±0.50[.65±.020]

5.00 [.200]

14.00 [.551]

0.30[.012]

Unit : mm [inches]

All values are capacitance EIA codes. Other dimensions, capacitance values and voltage ratings are available. Please contact HEC.

LCC Series-Large Size Multilayer Ceramic Chip Capacitors

50V 100V 200V 500V 1KV 2KV 3KV 4KV 5KV 8KVNPO 473 393 363 103 222 821X7R 225 105 474 124 473 682NPO 823 683 563 473 103 392 222 102 471X7R 475 225 474 224 473 153 472 222 102NPO 154 134 104 823 253 103 472 332 102 471X7R 106 475 225 824 224 473 183 822 472 102NPO 224 184 124 104 373 153 562 362 122 561X7R 126 565 225 105 274 683 273 153 103 182NPO 284 244 184 154 483 203 962 472 152 621X7R 156 685 225 125 394 104 393 223 153 392NPO 364 304 224 184 683 273 153 562 182 681X7R 186 825 275 225 474 124 823 333 223 562NPO 654 484 404 304 104 423 223 682 332 821X7R 226 186 106 335 105 224 104 563 333 103NPO 844 674 504 474 134 553 283 103 472 102X7R 336 226 186 475 125 364 154 823 473 153

6560

7565

Capacitance maximum

3530

3640

4540

5550

2520

1515

DielectricSize

W

T

BW B

L

*Soldering and handling precautions:Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to behandled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that ceramic chips donot come into contact with one another causing chip outs, cracks or other mechanical damage.The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering are not recommended.Ceramic capacitors should be preheated to within 50°C of the peak soldering temperature and then use a maximum 2°C/second ramprate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracks.

Available Options:• HEC offers flexible termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing.• To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating.• Pure tin terminated / ROHS compliant products are offered as standard, however, lead (Pb) content plated termination is also available.• Pd/Ag termination is also available as an option for hybrid circuits and other applications.

- 31 -


Operating Temperature -55 to +125 Rated Voltage 50Vdc to 1000Vdc

Temperature Coefficient of Capacitance

NPO : ≤ ± 30ppm/ , -55 to +125 (EIA Class Ι )X7R : ≤ ± 15% , -55 to +125 (EIA Class Ⅱ )

Capacitance RangeNPO: 1.0nF to 400nFX7R : 27nF to 34uF

Dissipation Factor NPO : Q≧ 1000 at 1KHz

X7R : 2.5%max. at 1KHzInsulation Resistance 10GΩ or 500/C Ω whichever is smallerAging NPO : 0% , X7R : 2.5% per decade of time

Dielectric Withstand Voltage

V ≤50V ; 250% Rated Voltage100V ≤ V <500V ; 200% Rated Voltage500V ≤ V <1KV ; 150% Rated Voltage

1000V = 120% Rated VoltageTolerance ± 1% & ± 2% tolerances are only available in NPO

Stacked designs offer the high capacitance similarto tantalum but with the advantage of very low ESR.

‘J’, ‘L’ and ‘N’ leaded configurations providemechanical and thermal stress relief.

Capacitance values up to 34µF Voltages from 50V to 1000V. Available in NP0 and X7R dielectrics. HIREL screening available. RoHS compliant.

Power supplies DC-DC converters Surge protection Industrial control circuits Snubbers Filtering, smoothing and decoupling applications HIREL applications Custom applications


- 32 -

SMC Series Stacked MLCC Capacitors

SMC Series - Stacked MLCC Capacitors

SMC 49 J X 224 K 501

Product Code

SMC:Commercial Size Switchmode Stack Capacitor

Stack and Size

The first digit :# of chips in stack

Second Digit:Chip Size5 : 12106 : 18127 : 22208 : 18259 : 2225

LeadConfiguration

Ex.:J : J Lead for

h=0.070”L : L Lead for

h=0.070”N : Straight LeadP : J Lead for

h=0.045”S : L Lead for

h=0.045”

Material

Ex.:N : NPOX : X7R

Capacitance(pF)

Ex.:103 : 10x103

224 : 22x104

475 : 47x105

Tolerance

Ex.:F : +/-1.0%G : +/-2.0%J : +/-5.0%K : +/- 10%M : +/- 20%

Rated Voltage

Ex.:050 : 50Vdc 101 : 100Vdc201 : 200Vdc 501 : 500Vdc102 : 1000Vdc

Packaging

Ex.:T : Tape &

Reel W : Waffle

pack

Special test Requirement

Ex.:S : Standard electrical testH : Hi-Rel Testing

Special Requirement

Blank :No special requirement01~99 : Customer special requirement

How To Order T H 01

Dimensions


- 33 -

1812 Size1210 Size 2220 Size

1825/2225 J Type 1825/2225 L Type 1825/2225 N Type


- 34 -

EIA Size Code 1210 1812 2220 1825Size Code 15 25 16 26 17 27 18 28

L 3.80 Max[.150 Max]

3.80 Max[.150 Max]

5.50 Max[.217 Max]

5.50 Max[.217 Max]

6.50 Max [.256 Max]

6.50 Max [.256 Max]

5.35±0.50 [.210±.020]

5.35±0.50 [.210±.020]

W (max.) 2.90[.114]

2.90[.114]

4.00[.157]

4.00[.157]

5.50[.217]

5.50[.217]

6.85[.270]

6.85[.270]

H (max.) 2.15[.083]

4.30[.165]

2.10[.083]

4.20[.165]

2.10[.083]

4.20[.165]

2.54[.100]

5.08[.200]

S 1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

P 2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

h* (Typical) 1.30 Max[.051 Max]

1.30 Max[.051 Max]

1.30 Max[.051 Max]

1.30 Max[.051 Max]

1.30 Max[.051 Max]

1.30 Max[.051 Max]

1.78[.070]

1.78[.070]

h* (P/S Type) 1.14[.045]

1.14[.045]

LL** (min.) 2.54[.100]

2.54[.100]

2.54[.100]

2.54[.100]

t 2.25±0.1[.089±.004]

2.25±0.1[.089±.004]

0.50±0.05[.020±.002]

0.50±0.05[.020±.002]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

# of leads per side 1 1 2 2 2 2 3 3

Unit : mm [inches]

* ‘h’ varies depends on the lead style. See lead configuration above ** “LL” Applies only to straight (N) leads

Capacitance Range

Other stacked configuration with other sizes, capacitance values and voltage rating sare available. Please contact HEC.

EIA Size Code 1825 2225Size Code 38 48 58 19 29 39 49 59

L 5.35±0.50 [.210±.020]

5.35±0.50 [.210±.020]

5.35±0.50 [.210±.020]

6.35±0.50 [.250±.020]

6.35±0.50 [.250±.020]

6.35±0.50 [.250±.020]

6.35±0.50 [.250±.020]

6.35±0.50 [.250±.020]

W (max.) 6.85[.270]

6.85[.270]

6.85[.270]

6.85[.270]

6.85[.270]

6.85[.270]

6.85[.270]

6.85[.270]

H (max.) 7.62[.300]

10.16[.400]

12.7[.500]

2.54[.100]

5.08[.200]

7.62[.300]

10.16[.400]

12.70[.500]

S 1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

1.65±0.50[.065±.020]

P 2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

2.54±0.25[.100±.010]

h* (Typical) 1.78[.070]

1.78[.070]

1.78[.070]

1.78[.070]

1.78[.070]

1.78[.070]

1.78[.070]

1.78[.070]

h* (P/S Type) 1.14[.045]

1.14[.045]

1.14[.045]

1.14[.045]

1.14[.045]

1.14[.045]

1.14[.045]

1.14[.045]

LL** (min.) 2.54[.100]

2.54[.100]

2.54[.100]

2.54[.100]

2.54[.100]

2.54[.100]

2.54[.100]

2.54[.100]

t 0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

0.50±0.10[.020±.004]

# of leads per side 3 3 3 3 3 3 3 3

*Soldering And Handling Precautions:The recommended method for soldering large capacitors is reflow soldering. Wave soldering and manual soldering are not recommended.Ceramic capacitors should be preheated to within 50ºC of the peak soldering temperature and then use a maximum of 2º/second ramprate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracking.

15 (1×Cap) 183 103 822 222 102 125 105 224 683 27325 (2×Cap) 363 203 163 442 204 245 205 444 134 54316 (1×Cap) 293 183 123 822 562 335 155 824 154 68326 (2×Cap) 583 363 243 163 113 665 305 165 304 13417 (1×Cap) 623 543 453 393 123 475 335 155 274 82327 (2×Cap) 124 104 903 783 243 945 665 305 544 16418 (1×Cap) 653 563 473 393 123 475 335 155 274 82328 (2×Cap) 134 114 943 783 243 945 665 305 544 16438 (3×Cap) 194 164 144 114 363 146 995 455 814 24448 (4×Cap) 264 224 184 154 483 186 136 605 105 32458 (5×Cap) 324 284 234 194 603 236 166 755 135 41419 (1×Cap) 813 653 563 473 153 685 475 225 394 10429 (2×Cap) 164 134 114 943 303 136 945 445 784 20439 (3×Cap) 244 194 164 144 453 206 146 665 115 30449 (4×Cap) 324 264 224 184 603 276 186 885 155 40459 (5×Cap) 404 324 284 234 753 346 236 116 195 504

100V 200V/250V500V 500V1000V

1825

2225

1812

2220

1000V50V

1210

EIAChip Size

Size CodeNPO Maximum Capacitance

50V 100V 200V/250V

X7R Maximum Capacitance

Item Specification Test Conditions

Operating Temperature

Specifications & Test Conditions

Char. Operating Temp. NP0(N) -55°~ +125°CSL (L) -55°C~+125°CX5R (B) -55°C~ +85°CX7R (X) -55°C~ +125°CX8R (H) -55°C~+150°CX7E (C) -55°C~+125°CX6S (S) -55°C~+105°CY5V (Y) -30°C~ +85°C

Technical Specifications

- 35 -

Visual No abnormal exterior appearance Visual Inspection

Capacitance Within the specified tolerance Char. Frequency Voltage

ClassⅠ(NP0/SL):More Than 30pF : Q ≧100030pF & Below: Q≧400＋20C (C:Cap., pF)

NP0/SLQuality Factor

C≤100pF 1MHz±10% 1.0±0.2VrmsC>100pF 1KHz±10%

Dissipation Factor Perform a heat temperature at 150±5 for

30min. then place at room temp. for 24±2hr.

ClassⅡ(X7R/X5R/X8R/X6S/Y5V):

Please see table 1 for details

1KHz±10% 1.0±0.2Vrms

ClassⅡ(X7E: Maximum 1%

Insulation Resistance

10,000MΩ or 500/C Ω whichever is smaller for rated voltage>10V and greater 100/C Ωfor rated voltage≤10V.

X1/Y2 and X2/Y3: 10GΩ min

Applied voltage : rated voltage Charge time : 60±5 sec. Charge-discharge current shall be less than 50mA current.

Applied voltage: 500V charge time 60 sec

Dielectric Withstand Voltage (DWV) (Unless otherwise stated on product descriptions)

No dielectric breakdown or mechanical breakdown

X1/Y2 and X2/Y3

Voltage applied for 1~5 sec.Current is limited to less than 50mAX Capacitor : Applied voltage 1075Vdc(4.3Ur)Y Capacitor: Applied Voltage 1500VacFor 1 Min. Current limited to less than 50mA

V ≤ 50V : 250% rated voltage100V ≤ V < 500V : 200% rated voltage 500V ≤ V < 1000V : 120% rated voltage


(C2-C1)/C1 × 100%T1:Standard temperature(25)T2:Test temperatureC1:Capacitance at standard temperatureC2:Capacitance at test temperature

ClassΙ:[C2-C1/C1(T2-T1)] × 100%

ClassⅡ:

Char. Temp. Range Cap. ChangeNP0(N) -55°C~+125°C ± 30ppm/SL (L) -55°C~+85°C +350/

-1000ppm/ °CX7R (X) -55°C~ +85°C ± 15%X5R (B) -55°C~ +125°C ± 15%X8R (H) -55°C~+150°C ± 15%X5E (C) -55°C~ +85°C ± 4.7%X6S (S) -55°C~+105°C ± 22% Y5V (Y) -30°C~ +85°C +22/-82%

5N⋅fAdhesive Strength of Termination

No indication of peeling shall occur on the terminal electrode.

A 5N⋅f (≈ 0.5Kg⋅f) pull force shall be applied for 10±1 sec.



Solderability Solder Temperature : 245±5Dip Time : 5 ± 0.5 sec.Immersing Speed : 25±10% mm/sSolder : H63AFlux :RosinPreheat : At 80~120 For 10~30sec.

More than 90% of the termination surface should be soldered so the metal part does not come out or dissolve .


- 36 -

Resistance toFlexure of Substrate R230

BendingLimit

C Meter

45±1mm 45±1mm

No mechanical damage or capacitance change more than the following table.

The board should bend 1.0mm with a rate of 1.0 mm/sec.

Char. Capacitance ChangeNP0(N)/SL(L) ≦ ± 5.0% of initial valueX7R (X) ≦ ± 12.5% of initial valueX5R (B) ≦ ± 12.5% of initial valueX8R (H) ≦ ± 12.5% of initial valueX7E (C) ≦ ± 12.5% of initial valueX6S (S) ≦ ± 12.5% of initial valueY5V (Y) ≦ ± 30.0% of initial value

ClassⅠ(NP0):

Appearance No mechanical damage shall occur

Resistance to Soldering Heat

CapacitancePreheat : at 150±10°C for 60~120sec.Dip : solder temperature of 260±5Dip Time : 10 ± 1sec.Immersing Speed : 25±10% mm/sSolder : H63AFlux : Rosin

Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours

ClassⅡ:

Within 2.5% or ±0.25pF whichever is larger of initial value

ClassⅡ capacitor shall be set for 48± 4 hours at room temperature after one hour heat treatment at 150 +0/-10 before initial measuring.

Char. Cap. change X5R(B) ≤ ±7.5% of initial valueX7R(X) ≤ ±7.5% of initial valueX8R (H) ≤ ±7.5% of initial valueX7E (C) ≤ ±7.5% of initial valueX6S (S) ≤ ±7.5% of initial valueY5V(Y) ≤ ±20% of initial value

Q / Tanδ To satisfy the specified initial value

InsulationResistance

To satisfy the specified initial value

Temperature Cycle

Capacitance


ClassⅡ capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at 150 +0/-10 before initial measuring.Capacitor shall be subjected to five cycles of the temperature cycle as following:

Step Temp.() Time(min)1 Min Rated Temp.+0/-3 302 25 33 Max Rated Temp.+3/-0 304 25 3


ClassⅠ(NP0):Within 2.5% or ±0.25pF whichever is larger of initial value

Char. Cap. change X5R(B) ≤ ±7.5% of initial valueX7R(X) ≤ ±7.5% of initial valueX8R(H) ≤ ±7.5% of initial value X7E(C) ≤ ±7.5% of initial value X6S(S) ≤ ±7.5% of initial valueY5V(Y) ≤ ±20% of initial value



Q / Tanδ To satisfy the specified initial value




Humidity ClassⅡ capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at 150 +0/-10 before initial measure.

Temperature : 40± 2 Relative humidity : 90 ~95%RHTest Time : 500 +12/-0 hr


Capacitance

ClassⅡ:

ClassⅠNP0(N)/SL(L):


30pF & over : Q ≧35010 to 30pF : Q≧275+2.5C30pF & below: Q≧200+10C

Q Class Ι

TanδClassⅡ

Within 5.0% or ±0.5pF whichever is larger of initial value

Char. Cap. change X5R(B) ≤ ±12.5% of initial valueX7R(X) ≤ ±12.5% of initial valueX8R(H) ≤ ±12.5% of initial value X7E(C) ≤ ±12.5% of initial value X6S(S) ≤ ±12.5% of initial valueY5V(Y) ≤ ±30% of initial value

1,000MΩ or 50/C Ω whichever is smaller for rated voltage>10V and greater 10/C Ω for rated voltage≦10V. (C in Farad)


- 37 -


Char. Cap. change X5R(B) ≤ ±12.5% of initial valueX7R(X) ≤ ±12.5% of initial valueX8R(H) ≤ ±12.5% of initial valueX7E(C) ≤ ±12.5% of initial valueX6S(S) ≤ ±12.5% of initial valueY5V(Y) ≤ ±30% of initial value


ClassⅡ capacitors applied DC voltage of the rated voltage is applied for one hour at maximum Operating temperature ±3 then shall be set for 48±4 hours at room temperature and the initial measurement shall be conducted.

Applied Voltage :Rated Voltage Temperature : 40±2Relative humidity : 90 ~95%RHTest time : 500 +12/-0HrCurrent applied : 50 mA Max.

Damp Heat/ Steady State


Capacitance

ClassⅡ:

ClassⅠ(NP0)/SL(L):Within 7.5% or ±0.75pF whichever is larger of initial value


30pF & Over : Q ≧35010 to 30pF : Q≧275+2.5C30pF & Below: Q≧200+10C

Q Class Ι

TanδClassⅡ

500MΩ or 25/C Ω whichever is smaller for rated voltage>10V and greater 5/C Ω for rated voltage≦10V. (C in Farad)



Vibration Appearance No mechanical damage shall occur


Solder the capacitor on P.C. board.

Vibrate the capacitor with an amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hzin about 1 min.

Repeat this for 2 hours each in 3 perpendicular directions.

Q / Tanδ

Capacitance Within the specified tolerance



- 38 -

Char. Cap. change X5R(B) ≤ ±12.5% of initial valueX7R(X) ≤ ±12.5% of initial valueX8R(H) ≤ ±12.5% of initial valueX7E(C) ≤ ±12.5% of initial valueX7R(S) ≤ ±12.5% of initial valueY5V(Y) ≤ ±30% of initial value


ClassⅡ Capacitors : The applied DC test voltage is applied for one hour at maximum operating temperature ±3, then left to stabilize for 48±4 hours at room temperature before the initial measurement is taken.

Applied voltage : please see HEC specificationdata sheet.

Temperature : max. operating temperatureTest Time : 1000 +48/-0HrCurrent applied : 50 mA max.

High TemperatureLoad(Life Test)

Measure at room temperature after cooling for ClassⅠ: 24 ± 2 hours ClassⅡ: 48 ± 4 hours

Capacitance

ClassⅡ:

ClassⅠ(NP0)/SL(L):Within 5.0% or ±0.5pF whichever is larger of initial value


30pF & Over : Q ≧35010 to 30pF : Q≧275+2.5C30pF & Below: Q≧200+10C

Q Class Ι

TanδClassⅡ

1,000MΩ or 50/C Ω whichever is smaller . For rated voltage>10V and greater 10/C Ω for rated voltage≦10V. (C in Farad)



Table 1

- 39 -

SizeRated Voltage

Capacitance Range

Tanδ

-Initial -Vibration-Resistance to solder heat-Temperature Cycle

-Humidity-Damp Heat/Steady state-High Temperature Loading

0201

DC 6.3VC≤0.01µF 5.0% 7.5%C=0.1µF 15.0% 25.0%

DC 10V C≤0.01µF 5.0% 7.5%

DC 16VC≤2.2nF 3.5% 7.5%2.2nF<C≤3.3nF 5.0% 7.5%

DC 25V C≤2.2nF 2.5% 5.0%DC 50V C≤1.0nF 2.5% 5.0%

0402

DC 6.3VC≤0.22µF 10.0% 15.0%C≥0.47µF 15.0% 25.0%

DC 10VC≤0.1µF 5.0% 7.5%0.1µF<C≤1µF 15.0% 25.0%

DC 16V C≤0.22µF 5.0% 7.5%DC 25V C≤0.1µF 3.5% 7.5%DC 50V C≤3.9nF 2.5% 5.0%

0603

DC 4V C≥10µF 15.0% 25.0%

DC 6.3V

C<1µF 7.5% 12.5%1µF≤C<2.2µF 10.0% 15.0%2.2µF≤C<4.7µF 10.0% 15.0%C≥4.7µF 15.0% 25.0%

DC 10VC<1µF 5.0% 7.5%1µF≤C<2.2µF 7.5% 12.5%C≥2.2µF 10.0% 15.0%

DC 16VC≤0.1µF 3.5% 7.5%C<1µF 5.0% 7.5%C≥1µF 7.5% 12.5%

DC 25VC≤0.1µF 3.5% 7.5%0.1µF<C≤0.47µF 5.0% 7.5%C>0.47µF 7.5% 12.5%

DC 50VC<0.1µF 2.5% 5.0%C≥0.1µF 3.5% 7.5%

0805

DC 4V C≥10µF 15.0% 25.0%

DC 6.3VC≤3.3µF 7.5% 12.5%C≥4.7µF 10.0% 15.0%C≥10µF 15.0% 25.0%

DC 10VC≤2.2µF 5.0% 7.5%2.2µF<C≤4.7µF 10.0% 15.0%C>4.7µF 2.5% 5.0%

DC 16V

C≤0.47µF 2.5% 5.0%0.47µF<C≤1µF 5.0% 7.5%1µF<C≤4.7µF 10.0% 15.0%C>04.7µF 15.0% 25.0%

DC 25VC≤0.47µF 3.5% 7.5%0.47µF<C≤4.7µF 10.0% 15.0%

DC ≥ 50VC≤0.033µF 2.5% 5.0%0.033µF<C≤0.47µF 3.5% 7.5%

Dielectrics: X5R, X7R, X8R, X7E, X6S


Table 1 cont.

- 40 -

Dielectrics: X5R, X7R, X8R, X7E, X6S

Size Rated Voltage Capacitance Range

Tanδ-Initial -Vibration-Resistance to solder heat-Temperature Cycle


1206

DC 6.3VC<10µF 10.0% 15.0%C≥10µF 15.0% 25.0%

DC 10VC≤10µF 5.0% 7.5%C>10µF 10.0% 15.0%

DC 16VC<4.7µF 5.0% 7.5%C≥4.7µF 10.0% 15.0%

DC 25VC≤2.2µF 3.5% 7.5%2.2µF<C≤4.7µF 5.0% 7.5%4.7µF<C≤10µF 10.0% 15.0%

DC ≥ 50VC≤0.22µF 2.5% 5.0%0.22µF<C≤1µF 3.5% 7.5%

1210

DC 6.3VC≤47µF 10.0% 15.0%47µF<C≤100µF 15.0% 25.0%

DC 10VC≤10µF 5.0% 7.5%10µF<C≤22µF 10.0% 15.0%22µF<C≤47µF 15.0% 25.0%

DC 16VC≤10µF 5.0% 7.5%10µF<C≤47µF 15.0% 25.0%

DC 25VC≤10µF 5.0% 7.5%10µF<C≤22µF 15.0% 25.0%

DC 35VC<4.7µF 5.0% 7.5%C≥4.7µF 10.0% 15.0%

DC ≥ 50V C≤1µF 3.5% 7.5%

1812

DC 6.3V All Capacitance 10.0% 15.0%DC 10V 10.0% 15.0%DC 16V 5.0% 7.5%DC 25V 5.0% 7.5%DC 25V 2.5% 5.0%DC 35V 2.5% 5.0%DC ≥ 50V 2.5% 5.0%

≥2220 All Voltages All Capacitance 2.5% 5.0%


Tanδ

-Initial -Vibration-Resistance to solder heat-Temperature Cycle


0201 DC 6.3V All Capacitance 20.0% 30.0%

0402

DC 10V All Capacitance 20.0% 30.0%





Dielectric: Y5V


Table 1 cont.

- 41 -

Dielectric: Y5V


Tanδ-Initial -Vibration-Resistance to solder heat-Temperature Cycle


0603

DC 6.3V All Capacitance 20.0% 30.0%

DC 10VC<1µF 7.0% 10.5%C≥1µF 16.0% 25.0%C≥2.2µF 20.0% 30.0%

DC 16VC<1µF 7.0% 10.5%C≥1µF 16.0% 25.0%

DC 25VC≤0.1µF 5.0% 7.5%C<1µF 7.0% 10.5%C≥1µF 12.5% 20.0%

DC 50VC<0.1µF 5.0% 7.5%C≥0.1µF 7.0% 10.5%

0805

DC 6.3V All Capacitance 20.0% 30.0%

DC 10VC≤4.7µF 12.5% 20.0%C≥10µF 20.0% 30.0%

DC 16VC≥1µF 7.0% 10.5%1µF≤C<4.7µF 10.0% 15.0%C≥4.7µF 12.5% 20.0%

DC 25VC<1µF 7.0% 10.5%C≥1µF 10.0% 15.0%

DC 50VC<1µF 5.0% 7.5%C≥1µF 10.0% 15.0%

1206

DC 10VC≤1.0µF 12.5% 20.0%C≥2.2µF 20.0% 30.0%

DC 16VC<1µF 7.0% 10.5%1µF≤C<10µF 10.0% 15.0%C≥10µF 12.5% 20.0%

DC 25V

C<1µF 5.0% 7.5%1µF≤C<4.7µF 7.0% 10.5%C≥4.7µF 10.0% 15.0%C≥10µF 12.5% 20.0%

DC 35V C≤2.2µF 7.0% 10.5%

DC 50VC<1µF 5.0% 7.5%C≥1µF 7.0% 10.5%

1210

DC 6.3V All Capacitance 20.0% 30.0%DC 10V All Capacitance 20.0% 30.0%DC 16V All Capacitance 12.5% 20.0%

DC 25VC<1µF 7.0% 10.5%C≤10µF 10.0% 15.0%10µF<C≤22µF 12.5% 20.0%

DC 35V C≤10µF 10.0% 15.0%DC 50V All Capacitance 7.0% 10.5%

1812

DC 6.3V All Capacitance 20.0% 30.0%DC 10V All Capacitance 20.0% 30.0%DC 16V All Capacitance 12.5% 20.0%DC 25V All Capacitance 10.0% 15.0%DC 35V All Capacitance 10.0% 15.0%DC 50V All Capacitance 10.0% 15.0%

Standard packing 10Kpcs/pack. Special customer requirements considered. Bulk Packing

Paper Tape Embossed Tape

Embossed Carrier Tape

Top Cover Tape

Bottom Cover Tape

Carrier Tape

Top Cover Tape

Tape Packing

Leader Section20mm min.

Trailer Section40mm min. Chip Section

400mm min.Drawing Direction

NA：Not Available

Material And Quantity (¢180mm)

0201 0.6 0.3 T≤0.33 15,000 pcs/reel N/A0402 1.0 0.5 T≤0.55 10,000 pcs/reel N/A0603 1.6 0.8 T≤0.90 4,000 pcs/reel N/A0805 2.0 1.25 T≤0.90 4,000 pcs/reel N/A

0.9< T≤1.25 N/A 3,000 pcs/reel1206 3.2 1.6 T≤0.90 4,000 pcs/reel N/A

0.9< T≤1.25 N/A 3,000 pcs/reelT>1.25 N/A 2,000 pcs/reel

1210 3.2 2.5 T≤1.25 N/A 3,000 pcs/reel T>1.25 N/A 2,000 pcs/reel

1808 4.6 2.0 T≤1.25 N/A 3,000 pcs/reelT>1.25 N/A 2,000 pcs/reel

1812 4.6 3.2 T≤2.20 N/A 1,000 pcs/reelT>2.20 N/A 700 pcs/reel

1825 4.6 6.35 T≤2.20 N/A 700 pcs/reelT>2.20 N/A 400 pcs/reel

2208 5.7 2.0 T≤2.20 N/A 1,000 pcs/reel2211 5.7 2.8 T≤2.20 N/A 1,000 pcs/reel

T>2.20 N/A 700 pcs/reel2220 5.7 5.0 T≤2.20 N/A 1,000 pcs/reel

T>2.20 N/A 700 pcs/reel2225 5.7 6.35 T≤2.20 N/A 700 pcs/reel

T>2.20 N/A 400 pcs/reel

Chip Size Dimension (mm) ¢180mm reel(EIA Code) L W T Paper Tape Plastic Tape

Multilayer Ceramic Chip Capacitor

Packing Information

-42 -

t C D E

HG

FA

B

Pitching Hole I Chip Cavity

Dimensions of Tape Specification

Paper Tape

0201 0402 0603 0805 1206 1210 A 0.37±0.1 0.61±0.1 1.10±0.2 1.50±0.2 1.90±0.2 2.90±0.2 B 0.67±0.1 1.20±0.1 1.90±0.2 2.30±0.2 3.50±0.2 3.60±0.2 C 4.00±0.1 -- --> D 2.0±0.05 -- --> E 2.00±0.1 -- --> 4.00±0.1 -- --> F 1.75±0.1 -- --> G 3.5±0.05 -- --> H 8.00±0.3 -- --> I ¢1.5+0.1/-0 -- --> t 1.1 max. -- -->

Unit：mm

C D E

HG

FA

B

Pitching Hole I Chip Cavity

Ot

J

Embossed Tape

Unit：mm 0805 1206 1210 1808 2208 1812 1825 2211 2220 2225

A 1.5±0.1 1.9±0.2 2.9±0.2 2.5±0.2 2.5±0.2 3.6±0.2 6.9±0.2 3.2±0.2 5.4±0.2 6.9±0.2B 2.3±0.2 3.5±0.2 3.6±0.2 4.9±0.2 6.1±0.2 4.9±0.2 4.9±0.2 6.1±0.2 6.1±0.2 6.1±0.2C 4.0±0.1 D 2.0±0.05 E 4.0±0.1 8.0±0.1 F 1.75±0.1 G 3.5±0.05 5.5±0.05 H 8.0±0.3 12.0 +3/-0 I ¢1.5+0.1/-0 J 3.0 max. 4.0 max. t 0.3 max. O 0.15 min.

Packing Information

- 43 -

Reel Dimension

r D

E

C

A W t

B

Unit：mm 0402 to 1210 1808 to 2220

A ¢ 382 max. ¢ 178±0.2 B ¢ 50 min. ¢ 60±0.2 C ¢ 13±0.5 ¢ 13±0.5 D ¢ 21±0.8 ¢ 21±0.8E ¢ 2.0±0.5 ¢ 2.0±0.5W 10±0.15 13±0.3 t 2.0±0.5 17±1.4 r 1.0 1.0

Bulk Cassette Packing19

.0mm

5.0mm

6.8±0

.1mm

8.8±0

.1mm

12.0±

0.1mm

10mm

53.3mm

1.5 mm +0.1-0

2.0 mm +0-0.1

3.0 mm +0.2-0

36.0

m

m

+0 -0

.2

31.5

m

m

+0

.2-0

110±0.7 mm

165 to 180°Top Tape

Bottom Tape

The peel off force of cover tape is 5 to 70 grams in the direction of the arrow.

Cover Tape Peel Off Force

Packing Information

Chip Size 0402 0603 0805Cassette Packing

Length 1.00±0.05 1.60±0.10 2.00±0.20 Width 0.50±0.05 0.80±0.10 1.25±0.20 Thickness 0.50±0.05 0.80±0.10 0.60±0.10 Quantity 50,000pcs 15,000pcs 10,000pcs

Unit：mm

- 44-

Peel direction

Temperature Coefficient Performance Class EIA Symbol Dielectric Code Temperature Range() Capacitance Change Reference Temperature

Ι NP0 N -55 ~ +125 0±30 ppm/ 25

SL L -25 ~ +85 +350/-1000 ppm/ 25Π X7R X -55 ~ +125 ±15% 25

X7E C -55 ~ +125 ±4.7% 25X5R B -55 ~ +85 ±15% 25Y5V Y -30 ~ +85 +22/-82% 25Y5U E -30 ~ +85 +22/-56% 25Z5U Z +10 ~ +85 +22/-56% 25

EIA Designations

Low Temp. Symbol

High Temp. Symbol

Max. %C Symbol

-55 X-30 Y+10 Z

+45 3+65 4+85 5+105 6+125 7+150 8+200 9

±1.0% A±1.2% B±2.2% C±3.3% D±4.7% E±7.5% F±10.0% P±15.0% R±22.0% S+22% /-33% T+22% /-56% U+22% /-82% V

Ageing RateNP0: 0X7R/X5R : 1 ~ 4 % /decadeY5V : 6~10 % /decade

Dielectric Material – Ageing Rate

After performing de-ageing at 150±5 for 30 minutes andplacement at room temperature for 48 hours.

Coefficient of capacitance (ppm/ )

Multiplier applicable to column

Tolerance of temp. coeff.(ppm/ )

0.0 C1.0 M1.5 P2.2 R3.3 S4.7 T7.5 U

-1.0 0-10 1-100 2-1000 3-10000 4+1 5+10 6+100 7+1000 8+10000 9

30 G60 H120 J250 K500 L1000 M2500 N

For Class Π DielectricsFor Class Ι Dielectrics

Ex.: C0G 0±30ppm/ U2J Negative 750±120ppm/

Ex.: X7R -55 ~ +125 ±15%Y5V -30 ~ +85 +22%/-82%

EIA Designations

- 45 -

Improper circuit layout and pad/land size may cause poor solder joints between the component and thePC board. Insufficient solder may create weak joints and excessive solder may increase the potential ofmechanical or thermal cracks within the ceramic capacitor. Therefore we recommend the solder pad/landsize to be as shown in the following table:1. Size and recommended land dimensions for reflow soldering

EIA CodeChip (mm) Land (mm)

L W A B C D E0201 0.60 0.30 0.2~0.3 0.2~0.4 0.2~0.4 -- --0402 1.00 0.50 0.3~0.5 0.3~0.5 0.4~0.6 -- --0603 1.60 0.80 0.4~0.6 0.6~0.7 0.6~0.8 -- --0805 2.00 1.25 0.7~0.9 0.6~0.8 0.8~1.1 -- --1206 3.20 1.60 2.2~2.4 0.8~0.9 1.0~1.4 1.0~2.0 3.2~3.71210 3.20 2.50 2.2~2.4 1.0~1.2 1.8~2.3 1.0~2.0 4.1~4.61808 4.60 2.00 2.8~3.4 1.8~2.0 1.5~1.8 1.0~2.8 3.6~4.11812 4.60 3.20 2.8~3.4 1.8~2.0 2.3~3.0 1.0~2.8 4.8~5.31825 4.60 6.35 2.8~3.4 1.8~2.0 5.1~5.8 1.0~4.0 7.1~8.32208 5.70 2.00 4.0~4.6 2.0~2.2 1.5~1.8 1.0~4.0 3.6~4.12211 5.70 2.80 4.0~4.6 2.0~2.2 2.0~2.6 1.0~4.0 4.4~4.92220 5.70 5.00 4.0~4.6 2.0~2.2 3.5~4.8 1.0~4.0 6.6~7.12225 5.70 6.35 4.0~4.6 2.0~2.2 5.1~5.8 1.0~4.0 7.1~8.3

2. Mechanical strength varies according to the location of the chip capacitors on the P.C. board.Design the layout of the PCB in such a way as to minimize stress imposed on the components uponflexing the boards during depanelization or other processes.

Component layout close to the edge of the board or the“depanelization line” is not recommended. Susceptibilityto stress is in the order of: a>b>c and d>e

a

cb

d

slitperforatione

In the pick and place operation, if the low dead point is too low, excessive stress is applied tocomponent. This may cause cracks in the ceramic capacitor, it is therefore recommended to move thelow dead point of the nozzle to a higher level to minimize board warpage and stress on the components.Nozzle pressure should be adjusted to 1N to 3N (static load) during the pick and place operation.

1. Sometimes cracking can be caused by the impact load of the pick and place nozzle.

Nozzle

Crack

Excessive Stress Warping of Board

PCB

Warping of Board

Support pin

2. Amount of Adhesive a a

b

c c

Example : 0805 & 1206

Construction of Board Pattern

Mounting

E

Land

A

Solder Resistor

C

B

Capacitor

D

Slit

Precautionary Information

a 0.2mm min.b 70 ~ 100 μmc Do not touch the solder land

- 46 -

Handling after chip mounting

1. Proper handling of the PCB is recommended since excessive bending and twisting of the PCB may induce mechanical stress and cause internal cracking of the capacitor.

2. There is a potential of cracking if the board is warped due to excessive load from the check pin.

Check pinCheck pin

Support Pin

3. Examples of PCB de-panelization jigs:

High potential of cracking Low potential of cracking

Bending

Twist

Bad

V-groove

PCB splitting jig

PCB

The outline of a PCB breaking jig is shown below. It is recommended when dividing or breaking PCBsthat they are held near the jig where no bending will occur. In this way there will be no compressivestress applied to the components or capacitors on the PCB. Do not hold the PCB at a position which isfar away from the jig. Tensile stress may cause the capacitors to crack.

Poor Dividing Load DirectionLoad Direction

PCB

V-groove

Chip Component

Recommend Dividing

Load Direction

Load Direction

Chip Component


- 47 -

Good

1. Wave Soldering

Recommended wave soldering profile

Soldering

Most components are wave soldered with solder at 230 to 250°C. Adequate care must be taken toprevent the potential of thermal cracks in the ceramic capacitors. Refer to the soldering methods belowfor optimum soldering benefits. For SMC range see special recommendations on page 34.

Soldering Method Change in Temp.()1206 and Under ∆T ≤100~130max.

1210 to 1812 ∆T ≤70~100max2220 and greater Not recommended

To optimize the result of soldering, proper preheating is essential:1) Preheat temperature is too low

a. Flux flows too easilyb. Possibility of thermal cracks

2) Preheat temperature is too higha. Flux deteriorates even when oxide film is removedb. Causes warping of the circuit boardc. Loss of reliability in chips and other components

2. Reflow SolderingPreheating to the reflow temperature is recommended to decrease the potential of thermal cracking inthe components. The recommended heating rate depends on the size of component, however it shouldnot exceed 3°C/Sec.Recommend reflow profile for lead-free soldering temperature profile (MIL-STD-202G #210F)

Soldering Method Change in Temp.()1206 and Under ∆T ≤1901210 and Over ∆T ≤130

Cooling Condition:Natural cooling using air is recommended. Forced cooling should be avoided. However if the chips aredipped into a solvent for cleaning, the temperature difference (ΔT ) between the solvent and the chipsmust be less than 100°C.

Tem

pera

ture

(°C

)

217

260max.

150°C /60sec. Min. 70 to 90 sec.

Pre-heating SolderingCooling

∆T

260 °C max./ 10 sec.

120seconds or more2 to 3 sec.

60seconds or more

∆T

Tem

pera

ture

(°C

)

200

250

300

Pre-heatingSoldering

Cooling

230

※ Number of soldering cycles : 2 (max.)


- 48 -

How to Solder Repair by Solder Iron

1) Selection of the soldering iron tip The required temperature of the soldering iron for any type of repair depends on the type of the tip, the substrate material and the solder land size.

2) Recommended solder iron condition a.) Preheat the substrate to 60°C to 120°C on a hot plate. Note that due to the heat loss, the actualsetting of the hot plate may have to be higher (for example 100°C to 150°C).b.) Soldering iron power should not exceed 30 W.c.) Soldering iron tip diameter should not exceed 3mm.d.) Temperature of the iron tip should not exceed 350°C and the process should be finished within 5seconds (refer to MIL-STD-202G).e.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip tothe ceramic body may cause thermal cracks.f.) After soldering, products should be allowed to cool naturally in air.

Capacitors should be stored where temperature and relative humidity do not exceed 40°C and 70%RH.We recommend capacitors be used within 12 months from the date of manufacturing. Products should bestored in the original packaging and should not be removed from the outer polyethylene bag until justbefore usage. If the packaging is open, seal it as soon as possible or keep it in a desiccant with adesiccation agent.

3. Hand SolderingSudden temperature changes in ceramic capacitors will result in a temperature gradient within thecomponent and may therefore cause internal thermal cracking. In general a hand soldering method is notrecommended particularly on sizes 2220 and over, unless proper preheating and handling precautionsare taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solderingiron. The soldering iron tip should always be placed on to the solder pad. For SMC range see specialrecommendations on page 34.

Soldering Method Change in Temp.()1206 and Under ∆T ≤1501210 and Over ∆T ≤130

∆T

Tem

pera

ture

(°C

)

200

250

350

Within 5 seconds.

Storage


- 49 -

Internal MLCC crackingcan result in serious failurem o d e s . I f c e r a m i ccapacitors are subjected tosevere mechanical stress,a bending crack may occur.This crack can run throughtwo or more electrodes ofopposing polarity and resultin a short circuit. Typicalbending cracks are shownbelow. In the worst casescenar io , t hese shor tcircuits may lead to theMLCC overheating andc a t a s t r o p h i c f a i l u r e .

Bending

Ag/Cu

Plating-SnPlating-Ni

PCB

Solder

force

Crack

Typical Applications are power circuit input and output filtering, smoothing…

Standard termination construction may result in cracking during PCB bending, vibration, Depanelizing, etc.

CrackCrack running through at least two electrodes.

Surface View Cross Section View

Actual Examples:Failure Mode Type 1

The failure mode results fromPCB bending forces. Thesecracks may not be visible onthe MLCC surface. Crosssectional analysis is requiredto determine these internalcracks.

Failure Mode Type 2 (wetting greater than 2/3 of thickness)

Top View Cross Section View

MLCC cracking frequentlyoccurs during the circuitboard depanelizing process.The root cause is knife (blade)vibration during the process.

CrackCrack

Eliminating Mechanical Cracking – Super Term

- 50 -

Super Term Advantages

• “Flexible” Termination Layer incorporated• Reduce Cracking due to Mechanical Stress

Bending test on Super Term shows animprovement of about 5.0 mm bend vs. an averageof about 2.0 mm. for standard termination.

Thermal shock test on standard termination resultsin inception of failure at 500 cycles. Super TermTX Series reliability improves to over 3000 cycles.

Holy Stone has developed the “Super Term” Series (TX suffix in the part number), which incorporates a“flexible layer” in the termination structure. This construction effectively absorbs external forces, reduces theincidence of cracking and improves overall product reliability. Super Term product applications include :high temperature automotive, power circuits and other critical end products with extreme processingconditions.

Bending

Ag/Cu

Plating-SnPlating-Ni

PCBSolder

Flexible Layer

force

Crack Prevention

Super Term ‘TX’ Product

(a) Thermal Shock Comparison ( 0805/X7R)

Reliability/Durability Comparison (b) Substrate Flexure Comparison ( 0805/X7R)

Plating : SnPlating : Ni

Polymer AgGlass Ag

During destructive bending tests,the PCB is subjected to bendinguntil capacitor failure. With SuperTerm there is no cracking damagein the ceramic. Super Termeffectively prevents ceramic bodycracking during extrememechanical stress as simulated bythis test.

No cracking apparent in the ceramic

Super Term failures resulting from destructive bending test tend to occur in the OPEN mode and not shortcircuit mode typical of standard termination failures. The Super Term material is a ”polymer silver” materialand can be seen in the above photo.

Polymer Ag

Eliminating Mechanical Cracking – Super Term

- 51 -

0

10

20

30

40

50

1 10 100 1000 10000

Failu

re R

ate

Cycles

Thermal ShockNormal SuperTerm

0

10

20

30

40

50

1 10 100 1000 10000

Failu

re R

ate

Cycles

Thermal ShockNormal SuperTerm

Holy Stone has developed an Arc Preventioncoating process that coats the surface of thedielectric without encroaching onto thetermination material. This coating makes thesurface of the dielectric non porous and preventsmoisture and dirt becoming trapped thusreducing the surface resistance and the arcingvoltage of the capacitor. It has been shown thatthe arcing voltage can be increased by up to65% on soldered parts by using the Holy StoneArc Prevention Coating.

MLCC Arc Prevention – for Hi-Pot Testing

Typical Applications for telecommunication devices(IEEE802.3) in LAN interface, Ballast…

Due to the open and porous natureof the surface of the X7R dielectric,moisture and/or dirt which will havea lower resistance than thedielectric grains, can becomeentrapped in the surface. Dirt canalso include any flux residues as aresult of the soldering process. Thisdirt/flux as well as becomingentrapped into the surface will, initself, attract additional moistureonto the surface thus reducing thesurface resistance and the voltageat which arcing occurs. Surfacearcing or flashover at worst cancause equipment failure duringisolation testing and, in addition, willleave a carbon track on the surfacewhich can lead to eventual failure ofthe capacitor.

Typical surface arcing on X7R MLCC is from termination-to-termination (shown in polarized light)

NP0 & X7R Material Characteristic Comparison

Item NP0 X7RDielectric Constant 30 ~ 100 2000 ~ 4000

I. Resistance >1013 Ω >1011 Ω

B.D. Voltage 70~80 Vdc/um 40~50 Vdc/umGrain Size < 500nm 900nm ~ 1500nm

Grain Size(x8000)

Porosity (x1000)

• The different grain shape and size willlead to different grain density aftersintering.

• The grain size of NP0 dielectric issmaller than that of X7R resulting adenser and less porous structure.

• Surface porosity will trap dirt, flux andm o i s t u r e c a u s i n g t h e s u r f a c eresistance to dramatically decrease.

• Low surface resistance will cause thearcing voltage to reduce, possiblyleading to failure of the capacitor orequipment during isolation testing.

• Using the Holy Stone Arc Preventioncoating effectively makes the surface ofX7R dielectric similar to that of NP0.

Arc Prevention

Passed IEEE 802.3 1500VAC or 2250VDC

Increases voltage at which arcing occurrs

Coated Products for Surface Arc Prevention

- 52 -

3.2mmSolder Ball

Solder balls reduce the creepage distance between terminations and thus reduce the arcing voltage

Creepage distance v.s. Arcing Voltage Recommended Solder Pad Design

Land

A

Solder Dam

C

B

Capacitor

EIA Code Chip (mm) Land (mm)L W A B C

1808 4.6±0.3 2.0 ±0.2 3.2~3.6 1.2~2.4 1.5~1.81812 4.6±0.3 3.2 ±0.2 3.2~3.6 1.2~2.4 2.3~3.02208 5.7±0.4 2.0 ±0.2 4.0~4.6 1.2~2.4 1.5~1.82211 5.7±0.4 2.0 ±0.3 4.0~4.6 1.2~2.4 2.0~2.62220 5.7±0.4 5.0 ±0.4 4.0~4.6 1.2~2.4 3.5~4.8

Distance between terminations also has a direct effect on the arcing voltage. The greater the distance (chipsize) the higher this voltage will be. Solder pad design will have a significant effect on the arcing of highvoltage capacitors. Above is our recommended solder pad land design or each chip size.

Arc Prevention Coating. The application of the Arc Prevention coating, which is a high insulation resistance material, coats the surfaceof the dielectric with a smooth and non porous layer that prevents moisture entering the surface pours and alsoaids cleaning post soldering. The following diagrams show the difference between coated and non coated X7Rcomponents.

Item Porosity (x1000)Before

After

Surface Appearance of non coated and coated product.

Surface Comparison High Voltage Test Comparison

• The coating reduces the porosity of the X7R surface and provides a smooth surface which help prevent surface arcing.• The maximum Hi-pot test level may be increased by >1000Vdc after coating with both unsoldered and soldered components.

Using the Holy Stone Arc Prevention coating increases the surface arcing voltage of X7R capacitors toalmost that of an equivalent NP0 part, however the higher dielectric constant of X7R allows for highercapacitance values to be achieved in any given case size. The Holy Stone Arc Prevention coating providesa total solution to the harmful effects of surface arcing.

High Voltage Test

0

10

20

30

40

50

60

70

100 1000 10000Voltage (Vdc)

Failu

re R

ate

(%) Normal Type

Coated Product

- 53 -

Coated Products for Surface Arc Prevention

MLCC , Ceramic Disc Capacitors: NP0, SL, X7R, X5R, X6S, X7E, Y5V and Y5U dielectrics. Description:

Basic Construction/Homogenous Material :(a) Standard Type (b) “X” Type: Super Termination (Option)

External Electrodes

Barrier

Solder Metal

Inner Electrodes

Polymer ElectrodesExternal ElectrodesBarrier

Solder Metal

Inner Electrodes

Ceramic Body Ceramic Body

․Multi-layer Ceramic Chip capacitors are homogenous devices manufactured from materials that cannot be mechanically disjointed into different materials.․Multi-layer Ceramic Chip products : Standard sizes are fully RoHS compliant.

Group Series RoHS Status

Cadmium HexavalentChromium

Lead * Mercury PBBs PBDE

Limit <0.01% <0.01% <0.1% <0.01% <0.01% 0.01%

MLC FamilySurface MountProducts

NCC,HCC,VAC,RFC, HCX, SMC, LCC

Available √ √ √ √ √ √

TCX,LDC, HTC Available √ √ √ √ √ √

HCN,SACSCC,

Available √ √ √ / √ * √ √ √

HVC NP0 Available √ √ √ / √* √ √ √

X7R Available √ √ √ / √ * √ √ √

* Pb in internal ceramic insert – exempt from RoHS annex 7 to Article 4.1

RoHS Status Lead-Free Status / MSL level

※ External plating : 100% Matte Sn as standard. ※ Pb-free reflow & wave solder compliant, MSL=1․Reflow : 260 max recommended.․Wave : 260 max recommended,

Wave & reflow profile refer to HEC recommended solder profile.

Part Number Designation: RoHS compliant : No change to P/N(Generally no change to P/N, but available Pb-free : No change to P/Nas P/N prefix at customer request)

Product marking : Pb free : Pb free(available at customer request, highlighted ormarked on reel and container) refer to JEDEC&IPC Std.

-54 -

RoHS Compliant

ISO Certifications

Plant Certificated Date Organization Registration No.

Taipei HQ/Lung Tan Factory ISO 9001:2000 20,Mar.,2002 BVQI TW08098Q

Taipei HQ/Lung Tan Factory ISO 14001:1996 29,May,2003 BVQI 131145

Dongguan Manufacturing ISO 9001:2000 16.Dec.,2003 BVQI TW08098Q

Taipei HQ/Lung Tan Factory QS 9000 : 1998 04.Oct.,2004 BVQI 162522

ISO 14001:1996ISO 9001:2000 QS 9000:2004

- 55 -

ISO Certifications

- 56 -

MEMO

Wor

ldwi

de S

ales C

onta

cts

Edition 2010.10

禾伸堂企業股份有限公司Holy Stone Enterprise Co., Ltd.

A Partner You Can Trust

• Lungtan Plant / 龍潭生產事業處桃園縣龍潭鄉烏林村工五路90巷56號No.56, Lane 90, Kung Wu Road, Wu Lin Village, Lung Tan Hsiang, Tao Yuan County, Taiwan, R.O.C. Tel: 886-3-4995288Fax: 886-3-4995299 Zip code: 325

• Taipei HQ / 台北總公司台北市內湖區環山路二段62號1樓

1FL, No. 62, Sec. 2, Huang Shan Rd., Nei Hu Dist., Taipei, Taiwan, R.O.C. Tel: 886-2-26270383Fax: 886-2-27987181 Zip code: 114

• Kaohsiung Sales Office / 高雄分公司高雄市前鎮區一心一路239號8樓之一8FL-1, No.239, Yi-Hsin 1st. Road, Chien Chen Dist., Kaohsiung, Taiwan, R.O.C. Tel: 886-7-5366115Fax: 886-7- 5366105 Zip code: 806

• Suzhou Sales Office / 蘇州分公司蘇州市新區鄧尉路9號潤捷廣場 1棟208室Room 208, Building 1 Runjie Plaza, No.9 Dengwel Road, Suzhou New Area, ChinaTel: 86-512-82100058 Fax: 86-512-68026968 Zip code: 215021

• Dongguan Plant / 東莞廠廣東省東莞市塘廈鎮蛟乙塘村寶石工業區Baoshi Industrial Area, Jiaoyitang Tangxia Town, Dongguan Guangdong, China.Tel: 86-769-87928002Fax: 86-769-87914761 Zip code: 523723

• Shanghai Sales Office / 上海分公司上海市延安西路1160号首信银都大厦16楼16F, Shouxinyindu Building, 1160 YanAn (W) Road, Shanghai, China.Tel: 86-21-51875266Fax: 86-21-62826722 Zip Code: 200052

Location in Taiwan

Location in China

Location in USA• Holy Stone International

26395 Jefferson Ave. Suite H Murrieta, CA, 92562, USATel : 951-696-4300Fax: 951-696-4301 Website: http//www.holystonecaps.comEmail: [email protected]

• Hong Kong Office / 香港分公司香港九龍灣宏開道15號九龍灣工業中心726室Room 726, Kowloon Bay Industrial Center , 15 Wang Hoi Road, Kowloon Bay, Hong Kong.Tel: 852-23055141Fax: 852-23055789

Location in Europe• Holy Stone (Europe) Ltd.

Henderson Business Centre, Unit 24, Ivy Road, Norwich, Norfolk, NR5 8BF, United KingdomTel: +44 (0)1603 251780Fax: +44 (0)1603 251786Website: http//www.holystonecaps.comEmail: [email protected]

Location in Singapore

Blk 7 Kallang Place #03-04 ,Singapore 339153Tel : (65) 6513 2343Fax: (65)6563 6705

• Holy Stone Holdings Co., Ltd.

ceramic capacitor catalogue 2010/11 - holy … capacitor. catalogue 2010/11. holy ... smd...

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