bump bonding of pilatus multichip modules
TRANSCRIPT
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Bump Bonding of PILATUS Multichip ModulesChristian Brönnimann
Swiss Light Source SLS5232 Villigen-PSI
Pixel Apparatus for the SLS
PILATUS Outline of the talk:
1. Project and component description
2. PSI bump bonding process
3. What can go wrong
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Swiss Light Source: The Beamlines
10m
LINAC (100 MeV)
Booster (2.4 GeV)
Storage Ring (2.4 GeV, 288 m)
Undulators
DiagnosticsXA
S
1L
2S
3M
4S
5L
6S7M
8S
9L
10S
11M
12S
IRVUV
MYTHENDetector
PILATUSDetector
Surfaces/Interfaces Spectroscopy
Surfaces/Interfaces Microscopy
ProteinCrystallography
Material Science
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
PILATUS DetectorFinal Size: 40 x 40 cm2 (0.16m2)
2000 x 2000 pixels
Modular detector -> dead area ~6%Frame rate: >10Hz
High duty cycle: <6% (Tro~6ms)
6x3 modules (2003)
Sensor
RO-Chips
Module Control Board(RO-electronics) High Density
Interconnect (HDI)
Al-Support
1 Module: (35 x 80 mm2)
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Module Geometry
+
(0.7,0.7)(-0.2,-1.285)
(1.85,-1.18)
(0,0)
+(79.422,34.069)
(80.122,34.769)(79.620,35.355)
18.2
6m
m0.
60m
m
35.4
8m
m36
.64
mm
37.6
5m
m38
.60
mm
6.24 mm
9.90 mm
79.77 mm
80.80 mm81.20 mm
STEP: 9.982
Active Area: X (8*44+7*2)*0.217=79.422 Y(2*78+1)*0.217=34.069
Ch. Brönnimann, SLS Detector Group
SLS06 Chip: Specification
Radiation tolerant DMILL technologyAvailable since Mai 20016”-wafersChip size : 20 x 10 mm2, (44 x 78 pixels)64 chips/ wafer Yield: 30% Low noise analog block (ENC tot = 70 e-)Shaping time tsh = 100 ns -> 1MHzIndividual threshold adjustment Low overall threshold variation (σ < 100e-)15 bit pseudo random counter (Semi static)chip size 44 x 78 pixels (20 x 10 mm2)Each pixel is XY-addressableRead-out time: 6.7ms (at 10 MHz)
Ch. Brönnimann, SLS Detector Group
Sensors
• Colibrys SA, Neuchatel, Switzerland• 4” wafer, single sided process• Si-N-Material, 6-10kΩcm, d=0.3mm• Backside: n+ implant, aluminized• Vdep ~+30 V, Vbias ~+90V• UBM deposition Ti/W, Au
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Indium Bump Bonding (PSI)Developed for CMS by R. Horisberger, S. Streuli, F. Glaus
Aluminum - Chip Pads
Under Bump Metal
Foundry or LNS (PSI)
Photoresist for lift off
LMN (PSI)
Indium
Reflow Bump diameter 18 µm
Lift-off
Single Chips
10mm Wafers
15mm Wafers
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Bump bonding (cont)Sensors:- Wafers with Indium- Dicing- Reflow
Chips:- Wafers with UBM+Indium- Dicing- Testing of the chips
-Bump pressing-Reflow of bump bonded assembly
PILATUS Module
Ch. Brönnimann, SLS Detector Group
PILATUS ModuleModule Data• Active Area: 79.6 x 35.3 mm2
(continuously sensitive)
• 157 x 366 = 57462 pixels
• 16 chips (radiation hard)
• Pixel size 0.217x0.217 mm2
• Readout-time: 5 ms
• Energy Range:Eγ >6 keV
• Minimum Threshold 3 keV
• Threshold adjust per pixel
• Threshold RMS 6% of threshold
• Rate: 1MHz/pixel
• 15-bit counter/pixel
• single photon counting, no readout noise
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Indium Evaporation
• 4,6,8” wafers
• single wafer evaporation
• 4 wafers/day
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Sensor Liftoff
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Sensor after Reflow
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Sensor after Reflow
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Sensor after Reflow
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
SLS06 Chip: Testing
• Manual Probestation• Chips are tested after dicing
Probecard
6” CMOS Wafer (diced)
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Bump bonder
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Geometrical verification
Deviation from x=341,y=0
-4.0
-3.0
-2.0
-1.0
0.0
1.0
2.0
3.0
1 2 3 4 5 6 7 8 9 10 11 12 13 14
gap nr
[um
] dxdy
(341,0)
Sensor
Chips
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Pull tester, removing of chips
Pull Tests:
- Good chips hold > 300 g (~0.1 g / bump)
- Pull each chip with 75 g
- Miss-positioned chips hold 0 g
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
• Module with 54912 bumps
•55Fe (6keV) illumination
• Result corrected by a map of digital+analog defects+ high threshold: 3293 pixels (5.9%)
• 217 pixels give no response for Fe55 (0.39%)
• If test is done with 90Sr, < 50 bad pixels
Bad bond map (Mod 9)
Eric F. EikenberrySLS Detector Group
PILATUS Detector at Spring-8 BL38B1
Lysozyme1° rotation10 s exposure
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Modul Nr Date Chips Remarks Modul Nr Date Chips Remarks
Wafno Electrically Defect Wafno Defects
Module 1 Aug 01 4 2 chips D1 Jan 03 15,17 0 chips 1 bad chip W15
Module 2 Aug 01 1 2 chips D2 Jan 03 15,17 0 chips 7 bad chips W15
Module 3 Oct 01 3 4 chips D3 Jun 03 18 ? ?
HDI 1 Oct 01 2 2 chips D4
HDI 2 Oct 01 5 2 chips D5
Module 4 Nov 01 6 1 chip Bank D6
Module 5 Nov 01 3,5,10 1 chip Bank D7
Module 6 Feb 02 10,11 0 chips Bank D8
Module 7 Mar 02 10 Unusable Sensor overetched D9
Module 8 Jun 02 12 0 chips Overheated D10
Module 9 Jan 03 13,14 0 chips good D11
Module 10 Jan 03 14,15 0 chips 3 bad chips W15 D12
Module 11 Jan 03 17,18,20,21,22 0 chips good D13
Module 12 Jun 03 18 0 chips good D14
Module construction history
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
What can go wrong:Module 7: Scanning electron microscope pictures
• Passivation topology
• Passivation attacked by UBM etching
• lift-off with MAR 404 etched Al away
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
What can go wrong:Modules 10,D1,D2: Problems with Chips from wafer 15
Scanning electron microscope analysis with EDX, Auger electron spectroscopy (surface sensitive)
0 1 2 3 4 5 6
-200
20406080
100120140160180200220240260280
3.3/4.40.6/3.4
24/14
TiSi
Al
C20A_intens: Pad2 C20B_intens: Pad2 (im Kratzer)
#X-R
ays
Energy [keV]0 1 2 3 4 5 6
0
50
100
150
2.7/2.60.6/1.1
0.9/1.78.5/0.9
0.09/0.070.17/0.21
8/40.5/13
1.7/1.360.6/3.6
AuTi
Al
Si
In
C17BUMB1: Pad C15BUMP1: Pad C15BUMB2: Indium C15BUMB3: Ring
#X-R
ays
Energy [keV]
C15bumb1C17bumb1
C15bump2
C15bump3
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Summary and Outlook
• PSI Bump-Bonding Process based on a lift-off process with Indium
• Processing of the 4 and 6”-wafers is done professionally in the clean-room of the LMN at PSI
• Bump-bonding of big multi-chip modules is working
• Problems at the processing level are solved: Tools like SEMs, EDX, AES are very helpful for debugging
• Visual and mechanical tests are very efficient and do not harm the modules (as opposed to electrical tests)
• Rework on mis-positioned chips is routinely done
• Plan for this year: Fabricate 20 more modules of this type
• Plan for the future: Upgrade clean-room for 8”-processing,
• Ev. move bump-bonding equipment to clean room.
Workshop on Bonding and Die Attach Technologies, 11-12 June 2003 CERN
Ch. Brönnimann, SLS Detector Group
Many thanks to my colleagues
Christoph Bühler
Eric Eikenberry
Fredi Glaus
Michael Horisberger
Roland Horisberger
Gregor Hülsen
Markus Naef
Hermann Rickert
Tilman Rohe
Bernd Schmidt
Silvan Streuli