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    ALD ULTRA-BARRIERS FOR ELECTRONIC

    APPLICATIONSSTRATEGIES AND

    IMPLEMENTATION

    P.F Carcia* , R.S. McLean, B.B Sauer, and M.H. Reilly

    DuPont Research & Development, Experimental Station,

    Wilmington, DE 19880-0400 USA

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    Motivation

    Enable flexible electronics on

    polymer substrates:

    -OLED Displays

    -OLED Lighting-Organic transistors and solar

    cells

    -CIGS solar cells

    18.7%efficiency

    Motivation

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    Need Moisture Barrier Coating

    Most organic devices are extremely moisture sensitive and

    need a packaging strategy to protect from moisture-driven

    degradation.

    However, flexible polymer substrates are highly permeable to

    all atmospheric gases, whereas glass is impermeable.

    What is needed is a barrier coating on flexible polymers thatessentially excludes atmospheric gases, comparable to glass.

    This barrier coating must be pinhole-free, defect-free, and

    dense.A barrier coating grown by atomic layer deposition (ALD) is as

    close to perfect as one can practically achieve.

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    10

    10-1

    10-3

    10-5

    WVTR/OTR

    g or cc/m2/day

    Thin Film PV (CIGS)

    OLEDs

    Polymer films

    PET, PEN,FEP

    Traditionalpackaging films

    Range of Barrier Requirements

    LCD

    Need an Ultra-barrier technology to meet needs for OLEDs and

    and CIGS solar.

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    Ref. A. Dameron (NREL)

    Most sensitive commercial instrument for WVTR

    1-3 days measurement time

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    WVTR measurement using Ca-test

    Light

    PEN or PET

    Barrier f ilm

    Epoxy

    Ca (50 60 nm, semi-transparent)

    Glass Substrate

    14

    16

    18

    0 1000 2000 3000

    %T

    t(hr)

    60 C/85% RH

    38 C/85% RH

    oxide barrier/HS-PEN-5mil

    WVTR~1.7x10-5

    g/m2/day

    WVTR~6.5x10-5

    g/m2/day

    Ca + H2O CaO + H2

    or

    Ca + 2 H2O Ca(OH)2 + H2

    Both CaO and Ca(OH)2 are transparent

    WVTR (CaO)

    D(CaO)/t

    m(H2O)/m(CaO)

    %

    T

    ALD Al2O3 at ~120 C

    10x more sensitive than MOCON

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    How good is a single ALD barrier coating?

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    Outline

    How important is the temperature of the ALD process for

    ultra-barrier properties.

    Does pre-treatment/cleaning of the substrate affect ultra-

    barrier properties

    plasma etching

    How does substrate surface chemistry affect ultra-barrier

    properties.

    Raw polymer side

    Slip-side

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    Leakage current density and breakdown voltage in ALD

    Al2O3 depends of synthesis temperaturebarriers?

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    Moisture permeation in ALD Al2O3 depends on synthesis T and film

    thickness; failure (pinholes) is abrupt, but prior changes track glass.

    (1200 hr at 38 C/85% RH +500 hr at 60 C/85% RH)

    Polymer PET surface

    Films grown at higher T and

    thicker are more stable.

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    Permeation model*

    Moisture permeation in ALD Al2O3 is not due to

    pinholes.

    Permeation is attributed to diffusion of molecularlydissolved H2O along defect clusters (-OH) in the Al2O3amorphous network. ([H]-content increases for low ALD synthesis)

    Permeation breakthrough occurs when the defectclusters percolate the ALD barrier film thickness.(analogous to electrical breakdown)

    Postulate the time-to-failure, tf=t0(H/kT-d0/d), whereH is ~ bonding energy between H2O and

    oxide/hydroxide defect clusters, and d0 ~ threshold

    barrier thickness.*Carcia et al. Appl. Phys. Lett. 97, 221901 (2010)

    Pfeffer and Ohring, J. Appl. Phys. 52, 777 (1981)

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    Effect of plasma-etching PET surface

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    contact angle, c =62.2

    for PET

    Etched PET surface is more hydrophil lic

    c =23.6

    Dark region (phase image) is

    softer amorphous segmentbetween harder (light)

    crystalline domains.

    Etching preferentially removes

    softer amorphous segment.

    Ar-etching at -50 V(10 min)

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    Lower moisture permeation for thinner Al2O3 on etchedPET.

    Hydrophilic surface may

    present a more reactive

    surface for TMA

    adsorption--improved

    nucleation

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    Effect of surface chemistryraw polymer versus

    coated slip-side of PET polymer

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    Coated slip-side of

    PET is rougher andabsent the

    crystalline fibril

    features of raw

    polymer surface.

    Comparison of slip and raw polymer sides of PET

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    Barrier performance is superior for ALD on raw polymer side.

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    ALD Barrier Application to CIGS Solar Cells

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    85 C/85% RH

    Environmental Chamber

    Measured at IEC (U. Delaware)

    Encapsulated PV cell

    2mil FEP

    25 nm ALD

    Al2O3 on

    uv-PET

    encapsulant

    CIGS cellGlass

    Change in efficiency of CIGS ~2% in 1032 hr at

    85

    C/85% RH +solar illumination

    adhesive

    8

    9

    10

    11

    12

    13

    14

    0 10 20 30 40

    85 C/85 % RH +illumination 1032 hr

    Effic

    iency(%)

    t(days)

    1xALD-uv-PET

    2xALD-uv-PET

    Damp Heat Test Results for CIGS

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    Summary

    For best barrier performance: thicker films and higher ALDgrowth temperature are preferred.

    Polymer surface pre-treatment, e.g. plasma etching, improvesbarrier properties.

    The two sides of a polymer film are more often chemicallydifferent, and ALD growth may produce better barrier

    properties on one side.

    ALD barrier films are a promising candidate for a transparent,

    flexible front sheet for CIGS solar cells.

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