beyond moore nxp

8/8/2019 Beyond Moore NXP

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Beyond Moore the challenge for Europe

Dr. Alfred J. van Roosmalen

Vice-President Business Development, NXP Semiconductors

Company member of MEDEA+/CATRENE/AENEAS/Point-One

FIT-IT 08 Spring Research

Wien, May 8, 2008


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May 13, 2008FIT-IT 08 Wient Fred van Roosmalen

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Agenda

Value chain de-verticalization

Expanding European strengths

Ecosystem collaboration


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The semiconductor value chain has become

very complex and very multinational e.g.

designcenter

waferfab

assemblycenter

customersite


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The semiconductor landscape is changing

Increasingly demanding market Disparity in innovation life cycle between semiconductor technologies

(typically 3 yrs) and final applications (down to 6 months)

Complete reference designs required, first-time-right and zero-defect

Leading to ongoing value chain de-verticalization Increasing outsourcing of shareable tasks to Original Design

Manufacturers (IP) and Electronic Manufacturing Services (foundries)

Growing role of semiconductor companies in defining the final applications


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Chip makers are moving up the value chain

Semiequipment

Semimaterials

Wafer foundry

Software

Systemmgmt

Chip maker

Application

Content

protection

Infrastructure

Systemintegrator

Service

provider

Contentprovider

Deliverynetwork

Gateway

mgmt

Legislatorregulations

From the hardware supply sideinto the final application


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Why are CMOS foundries so successful?

Ramp-up of any new wafer fab must be as fast as possible to allow for

quick learning and rapid yield improvement

To be cost-effective, the scale of CMOS wafer fabs must increasesignificantly in each new technology node (every 2-3 yrs)

Foundries can reach the necessary volume in ramp-up AND final

production by combining many chip designs in one unified technology

For individual chip makers, this foundry / fablite model is becoming the

most cost-effective way to manufacture CMOS digital logic

Early engagement in manufacturing technology R&D continues to be

needed to guide future chip design methodologies and architectures


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The growing role of chip makers

Building intelligent systems for the future requires close collaboration

between the innovation teams of chip suppliers and chip customers

The electronic part of final applications is increasingly determined anddesigned by semiconductor chip makers

Customer interface is shifting to the boundary between the embedded

code in the semiconductor device and the application software


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Intelligent systems need a brain, but they

also need arms, legs, ears and eyes

PowerSensor

Actuator

Storage

Processor

Radio

Multiple solutionsare possible


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Following Moores Law is one approach:

Monolithic CMOS logic System-on-Chip

PowerSensor

Actuator

Storage

Processor

Radio

Advantage:-Smallest footprint

Disadvantage:

-Limited functionality

More Moore


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Adding More-than-Moore is another:

System-on-Chip and System-in-Package

PowerSensor

Actuator

Storage

Processor

Radio

Advantage:-Full functionality

Disadvantage:

-Complex supply chain

More than Moore

More Moore


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M

oreMoore:Miniat

urization

More-than-Moore adds a non-scaling dimension

Bas

elineCMOS:CPU,Me

mory,Logic

130nm

90nm

65nm

45nm

32nm

22nm

Beyond Moore

More than Moore: Diversification

Analog/RF Passives HV / PowerSensors

ActuatorsBio-logic

InformationProcessing

Digital contentSystem-on-Chip

(SoC)

Interacting with people and environmentNon-digital content System-in-Package (SiP)

CombiningSoCandSiP: HigherValueSyst

ems


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Creating value in important new applications

InfotainmentCommunicationEnergy

SecurityHealth Transport


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Addressing key societal challenges in the

21st century

Ageing society

Personal health monitors Ambient intelligence care

Global warming / CO2 emission

Intelligent power control Electric vehicles and solar power

All-day traffic jams

Electronic road tolling Systems for guided individual transport

Terrorism

ePassport

Public security while retaining personal privacy

More-than-Moore is the essential element everywhere!


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Building on European strengths

Europe has a successful history of structured

collaboration between equipment and materials suppliers,

chip makers, and final application designers Mobile communication, smartcards, automotive, avionics

Europe has a strong fabric of large multinationals,

innovative SMEs, and renowned academic institutes, and

a broad expertise in setting standards Industries: e.g. semiconductors, lithography, SOI

Institutes: e.g. IMEC, CEA-LETI, FhG

Standards: e.g. GSM, MPEG, DVD, Bluetooth, DVB, NFC

More-than-Moore can be sourced from past generation

CMOS infrastructures, thereby enabling effective reuse of

existing wafer fabs


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More-than-Moore dimensions are lagging


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It is much more than just miniaturization

and cost-effective packaging

Multi -functionality

Multi -discipline

Multi -scale

Multi -technology

Multi -process and design

Multi -material and interface

Multi -variability

Multi -failure mode


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Need for leveraging critical workforce skills


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Collaboration of all stakeholders is needed

The number of More-than-Moore options increases, while the

availability of resources (money and people) in Europe is limited

Regional competence clusters (e.g. PdCs, Silicon Saxony, PointOne)provide a fertile breeding ground by bringing all R&D actors together

Transnational collaboration creates the economy of scale needed to

address the growing diversity of More-than-Moore

Public-private partnership is a key element in harnessing the European

innovation ecosystem vis-a-vis global competition


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Because we are not alone


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Summary

Semiconductor industry in Europe

is healthy

More-than-Moore adds competitivevalue through new functionalities

More-than-Moore supports

European public priorities and

application strongholds

More-than-Moore builds on know-

how and infrastructure in Europe

Public-private partnership is acritical enabler for global success


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