apsSales & Service GmbH

Technologyfor

BetterContacts

aps Solutions GmbHGutenbergstrasse 1D-82178 Puchheim-MunichGermany: +49-(0)89-841027-0 Fax: +49-(0)89-841027-11www.aps-munich.com

Probe Card

Test Socket

PCB

Solutions

PCB – SolutionsDesign Highlights:• One contact for all design steps• Several design houses available• Design and PCB production in one hand• Schematic capture • Netlist (IPC standard) • Mechanical pcb design • RF requirements • Mother - daughter solutions • Analog / digital / mixed Signals • Fine pitch design / BGA design • Bill of Material • Documentation

PCB Highlights• one contact for PCB production steps – including

component sourcing and assembly• Several production houses available• PCB fab will be chosen by best fit for application• Up to 36 multi-layers• Up to 6.5mm thickness• Max. Board Size: 750mm x 580mm• Improved Planarity through CIC• μ-BGA Boards down to 0.4mm pitch• Component Assembly• Test

apsSpring Pin Solution• WLCSP• Multi DUT Probe Head• down to 0.4mm pitch• Manual Test option

Probe Card – SolutionsSolutions GmbH

Probe Card Repair Station• for fast, accurate, cost-effective in-house maintenance• Cantilever und Vertical Technology - Tip to Top • 50% reduction in repair time• Standard – multi-DUT – fine Pitch• Up to 310mm diameter Probe Card• Adresses 98% of Probe Card failures• Maintain / improve / out perform tolerance limits

apsSales & Service GmbH

Technologyfor

BetterContacts

Probe Card – Solutions Probe Card – Solutions Test socket – Solutions

Spring Pin• Crown, conical• Pitch below 0,2 mm• Temp -40°C to -180°C• Easy to install• Low Resistance < 50 mOhm• Frequency rage up to 40 Ghz

U - Contact• pitch down to 0.3mm• Up to 1million operations • (on specified condition)• High frequency Characteristics• Bandwidth -1dB@12.8GHz• Current up to 2A• Inductance <0.1nH

PCR Test Sockets• Pressure conductive Rubber• Pitches down to 0.3mm• Min. contact resistance: ~ 20mΩ• Up to 3000 contacts• Max. Bandwidth: -1dB@14GHz)• Temperature range: -40 – 125°C• Life time: ~300k

Vertical PC Technology• HW/SG-HW/MLO/MLC/INT

Space Transformer• maintenance-optimized

PH-construction• Needle-treatment forincreased Test-Current

• HF (RF) Test with HF-ProbeHead

Parametric Card• Pad-Size 40µm x 40µm• 20 Needles• Ferrit-Rings• up to 160 (250°C)

For analog Signals up to 3GHz• Quasi- Coaxial• Signal-Pin with adjacent GND-line for

impedance-matching• No pitch limitation other than std.

For all Applications• Analog / Digital / Mixed Signal• Image- / CMOS Sensors• Temperature- / Humidity- Sensors• Memory• Parametric / PCM Test • Logic• Chip Card• RF

Available Configurations• Fine Pitch down to 25µm• High Frequency 3+ GHz• High Current up to 2A/pin• Kelvin• High temperature up to 160°C• Needle Material: W; ReW, A+