ranging the electroplating tip, in the operating position, such that the at least one discharge opening is positioned horizontally on the bottom whereas the passages ex- tend from the at least one dis- charge opening upward; supply- ing the electrolyte to the electroplating tip from above; and moving the base at the lower end of the electroplating tip parallel to the tip such that the region in- tended for the contact surface of said base is positioned at a uni- form distance from and at the level of the at least one discharge opening.

FUNGUS-RESISTANT BORIC ACID-SULFURIC ACID ANODIZING U.S. Patent 6,149,795. Nov. 21, 2000

J.C Oelund et al., assignors to the Boeing Co., Seattle

An improved method of anodizing an aluminum or aluminum alloy workpiece and concurrently in- hibiting the growth of fungus without hindering the effective- ness of the anodizing process, comprising providing an aqueous anodizing bath consisting essen- tially by weight of 3 to 5% sulfuric acid, 0.5 to 1% boric acid, not more than 5.0 g/L aluminum ion, not more than 0.2% chloride ion, and a benzoic acid, or mixtures thereof; maintaining the bath at 70 to 90°F; ramping the voltage applied across the workpiece in from 5 to 20 V such that the cur- rent density is substantially uni- form across the workpiece and the

average current density does not exceed about 10 A/i~2; and main- taining for a time such that an adherent coating of aluminum ox- ide is applied thereto having a coating weight between 200 and 600 mg/ft 2.

APPARATUS FOR IN-LINE PLATING U.S. Patent 6,153,064. Nov. 28, 2000 R.C. Condra and R.M. Johnson, assignors to Oliver Sales Co., Dallas

A plating apparatus for moving a flat work piece with through holes through an electrolyte solution to electroplate a metal onto the planer surfaces and the surfaces of the through holes of the work- piece the workpiece having a width, which is transverse to the

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direction of travel of the work- piece and a length parallel to the direction of travel of the work- piece.

BLBCTNODBPOSI1110N BATN FOR ZINC ON ZINC ALLOYS U.S. Patent 6,153,079. Nov. 28, 2000 G. I~am et al., assignors to Sollac, Puteaux, France

An a q u e o u s e l ec t rodepos i t i on bath based on chlorides for prep- aration of a coat based on zinc or zinc alloy, where in the pH is higher than 4; the molar concen- tration of ions of zinc or zinc alloy is higher than i mole/liter, and which contains in solution at least one polyethylene glycol polymer.

POtNDIEll COATING U.S. Patent 6,153,267. Nov. 28, 2000

P.R. Horinka et al., assignors to Morton International Inc., Chicago

A method of coating the surface of a porous substrate with a coating powder to form a continuous uni- form coating, said substrate in- cluding a first fluid in an amount that enhances the capacity of the substrate to carry an electrical charge, the method comprising preheating to between 130 and 300°F; exposing to an atomized second fluid; electrostatically ap- plying a coating powder to the surface of the mois tened sub- strate; and treating so as to form a uniform continuous coating.

AQUEOUS COMPOSIT ION FOR PLASTICIZ ING PAINT PRIOR TO N I P P I N G U.S. Patent 6,153,573. Nov. 28, 2000

P.A. Reynolds, assignor to Eco Solutions Ltd., North Somerset, U.K.

An aqueous emulsion composition for plasticizing or softening paint, va rn i sh , and s imi lar coat ings prior to stripping the coating from a surface comprising an emulsi- fied hydrophobic phase consisting of a plasticizing/softening mix- ture; an effective amount of at least one water-soluble block co- polymer surfactant of more than one alkylene oxide to stabilize the emulsion; an aqueous phase in- cluding water in an amount suffi- cient to comprise the major por- tion of the composition; and said emuls i f ied hydrophob ic phase suspended in the aqueous phase.

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