amphenol other board level and rectangular interconnects · other board level and rectangular...

AmphenolAerospace

111Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com

AmphenolAerospaceAmphenolAerospaceAmphenolAerospace

Amphenol

AmphenolAerospace

LRM Typical Markets:• Military & Commercial Aviation• Military Vehicles• Missiles/Ordnance

• C4ISR• Space• Radar

AmphenolAerospace

AmphenolOther Board Level and Rectangular Interconnects

TABLE OF CONTENTSOther Board Level and Rectangular Interconnects from Amphenol• TableofContents... ... ... ... ... ... ... ... . 111• HeatSink&MetalManufacturing... ... 112,113• ARINCRack&Panel,R27,R39,R58SeriesConnectors ... ... ... ... ... ... ... ... .. 114,115• FilterRectangularConnectors,D-Sub,Micro-D,Miicrominiature,Connectors .. . .. . 116• BackplaneAssemblies. . .. . .. . .. . .. . .. . .. . 117• UHDConnectors. .. . .. . .. . .. . .. . .. . .. . .. . 118• NAFIConnectors ... ... ... ... ... ... ... ... . 119• PrintedCircuitBoards.. . .. . .. . .. . .. . .. . .. . 120• FlexTermination. . .. . .. . .. . .. . .. . .. . .. . .. . 121• IntegratedSystems. . .. . .. . .. . .. . .. . .. . .. . 122• QuadraxHiSpeedContactsforPCBAttachment... ... ... ... ... ... ... ... ... ... . 123• RADSOK®HighPowerContactsforBoardLevelInterconnects. . .. . .. . .. . .. . .. . .. 124,125• HighFrequencyContactsforBoardLevelInterconnects . .. . .. . .. . .. . .. . .. . .. . .. . .. . 126• CylindricalInterconnectsforPrintedCircuitBoardAttachment.. . .. . .. . .. . .. . .. . 127• Amphenol’sBroadProductOfferingofCircularInterconnects. . .. . .. . .. . .. . .. . .. . 128

Other Rectangular Interconnects Typical Markets:• MedicalEquipment• FactoryAutomation• ICChipTesters• GPSSystems,Telecommunications

• Military&CommercialAvionics• MilitaryVehicles

BackplaneAssemblies

Heatsink&MetalMachining

PrintedCircuitBoards

ARINCRack&Panel

RectangularPCBProductswithRADSOK®HighPowerContactsforIndustrialApplications

RADSOK®Mil-PowerInterconnects

NAFIInterconnects

UHDInterconnects

QuadraxHiSpeedContactsforPCBAttachment

IntegratedSystems

D-Sub&Micro-DConnectors

FlexTermination

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Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com

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HeatSinkandMetalManufacturingCapabilitiesTO FIT CUSTOMER BOARD LEVEL NEEDS

AmphenolAerospacehasExtensiveHeatSinkandMetalMachiningManufacturingCapability.OurexperiencedengineeringgroupcandesignacustomheatsinktofityourboardorworkfromyourCADmodels,assemblies,orstepfiles.

• Amphenol’sfamiliaritywithmajorindustryandmilitaryspecifications.

• AmphenolhasbeenleadingthemarketplaceinLRM(LineReplaceableModuleConnectors)andRectangularLowMatingForceConnectors.

• OurLRMandVME64xproductsareusedonmajorprogramsthatincludethefollowingandmore:F-35,F-16,F-15,F/A-22,F/A-18,B2,JTRS,EH101,Sincgars,ATACMS,M1A2Tank,Grippen,F-117,Harpoon,LANTRIN,AH-64APACHE,ASRAAM,ATFLIR

• ThismanufacturinganddesignexcellenceprovidescustomerswiththeassurancethattheircustomorstandardAmphenolrectangularconnectorwillmatetotheirheatsinkdesign.

• AmphenolisanISO9001facility.Focusisalwaysonqualitywithcosteffectivenessandcontinuousimprovementofprocesses.

Benefits of Amphenol’s Design and Manufacture of Custom Heat Sinks:

Heat Sink Design Capabilities• Providemanufacturingstudiesonprototypemodels,CADmodelsordrawingpackages.(ConsultAmphenolaboutacceptableCADformats.)

• Providerapidprototypinginhouse.• Manufactureinterfaceplatesandotheraccessories;Design-inandinstallpins,studsandthreadedinserts

• Provideextensiveknowledgeingeometricdimensioningandtolerancingtechniquesthatcanassistinoptimizingyourdesigntoenhancemanufacturabilityfromtheinitialdesignphase(DFM).

• Provideeaseofdesignforavarietyofheatsinkconfigurationsandheatsinkmaterials.

• DesignflexibilityforcontactcavitiesforRF,digitalI/O,highspeed,fiberoptic,powerandlowvoltagedatasignalcontacts.

• Providein-processandfinaldimensionchecking

Variety of Heat Sinks manufactured by Amphenol

Heat Sink and LRM Connector Prototype

Interface Plate

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ContactAmphenolAerospaceformoreinformationat800-678-0141•www.amphenol-aerospace.com

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60, 66HeatSinkandMetalManufacturingCapabilities,cont.STATE-OF-THE-ART EQUIPMENT

AtAmphenol,wehaveexperiencemanufacturingawidevarietyofcustomheatsinkdesigns.Ourstate-of-the-arttwinspindlemachineswithmulti-axiscontrol,uniquefixturing,andindexingguaranteetruepositiontolerancingonmultiplefacesofamachinedpiece.OthermanufacturingfeaturesincludeglassscalesandHSKheatshrinktoolholdersforgreateraccuracy.Inaddition:through-spindleprobingforin-processchecks,through-spindlehigh-pressurecoolantsystem,singlespindlemillswithrotarytables,and3-axismillswhichsupplementthetwin-spindlemachineopera-tions.OtherkeybenefitsandfeaturesofAmphenol’smanufacturingoperationsinclude:• Theabilitytohandlehighorlowrunquantities.• Machinessetupandusedexclusivelyforheatsinkandrelatedcomponentmilling.

• Temperaturecontrolledenvironmenttoreducetheeffectofthermalexpansion/contraction.

• Capabilitytoholdveryprecisepositional,sizeandprofiletolerances.

• UseofCAMsoftwaretotranslatesolidmodelstomachineinstructions.Thisallowsforaquicktransitionbetweendesignandmanufacturing,andensurespartsareheldtotheproperdimensionaltolerances.

• CAMprogramsareoptimizedtoeachmachine’scapabilitieswhichminimizesruntimeandmaximizesquality.

• Partscanbeselectivelyplatedandselectivelymachinedtosuitcustomerrequirements

• Amphenolhasapreferredstatuswithmaterialsupplierswhichensurestimelyprocurementofrawmaterials.

Horizontal Manufacturing of Heat Sinks - Maximizes the Set-up and Production Efficiency for Metal Machining

Quality Assurance• Alldimensionsareverifiedaftermachinesetup,priortoproductionruns.

• DimensionsarecheckedbycontactoropticalCoordinateMeasuringMachine(CMM).

• WeimportCAD/CAMfilestoourCMM’stoguaranteepartsarewithinthedesign’sdimensionalspecifications.

• Inadditiontosetuppartchecking,wealsodo100%orsamplepartchecking.

Heat sink and Metal Machining Production Area at Amphenol

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ARINCRack&PanelConnectors

FROM AMPHENOL CANADA DIVISION

ARINC 404 & ARINC 600 Rack and Panel ConnectorsRackandpanelARINC404connectorsmeetorexceedMIL-C-81659andARINCSpec.404.TheARINC600connectoristhesuccessortothe404formanyavionicdesignsandofferslowermatingforcecontacts,increasedcontactcountandafrontrelease,floatingkeyingsystem.OtherfeaturesoftheARINC600include:• ARINC600connectorsarearecognizedstandardrackandpanelconnectorforaircraftapplicationswithbothenvironmentalandnon-environmentalversionsavailable.

• DesignedtomeetallrelevantARINC600connectorspecifications

• Frontremovablekeyingposts• Upto800size22contactpositionsinoneconnector• Contactoptions:standardcontactsarepower/signalcrimprearreleaseinsizes12,16,20and22incrimporPCB;orshieldedcoax,concentrictwinax,quadraxcontacts;orfiberoptics

• Filteredornon-filtered• WaveguideconnectionsSeeAmphenolCanada*publication,ARINC600RackandPanelConnectors,forcompleteinformationandhowtoorder.

ARINC 600 Rack and Panel Connectors

R27 Rack and Panel ConnectorsTheR27SeriesfromAmphenolCanadaisarobustrectangularconnectordesignedtomeetorsurpassalltherequirementsoftheML-DTL-83527specificationandEN3682EuropeanStandard.FeaturesoftheR27Seriesinclude:• Wellsuitedforharshenvironments-enhancedenvironmentalsealing,robustanddurableshells,EMIshieldingspring

• Filteredornon-filtered• Connectors,shells,inserts,terminationmodulesandcontactsaresoldseparatelyorfullyassembled

• InterchangeableinsertpatternswithARINC600models

• Contactoptions:standardcontactsarepower/signalcrimprearreleaseinsizes12,16,20and22incrimporPCB;orshieldedcoax,concentrictwinax,quadraxcontacts;orfiberoptics

SeeAmphenolCanadapublicationforR27SeriesConnectorsforcompleteinformationandhowtoorder.

*ContactAmphenolCanadaat:605MilnerAvenue,Toronto,Ontario,CanadaM1B5X6Phone:416-291-4401Fax:416-292-0647www.amphenolcanada.com

R27 Series Rack and Panel Connectors

ARINC 404 with Flex

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60, 66R39&R58RectangularConnectors

FROM AMPHENOL CANADA DIVISION

R39 Series with High Performance 38999 FeaturesTheR39seriesfromAmphenolCanada*provideshighperformanceinthesevereenvironmentdemandsofmilitaryspecifications.Itslowerprofiletranslatesintoasmallerspace-savingfootprint.Itdeliversthesamereliable,familiarbenefitsfoundinAmphenol’s38999circularconnectors:effortlessinstallation,blindpush-pullmating,extremedurability,quickmate.FeaturesoftheR39Rectan-gularConnectorseriesinclude:• Lowprofileandspacesavings• Highdensity127positioninsertsormixedinsertswithpower,RForfiber-optics

• Usessamecontactsandtoolingasstandard38999connectors• Blindmate• Rugged• Filteredornon-filteredSeeAmphenolCanada*publicationR39forcompleteinformationandhowtoorder.

R39 High Performance Rectangular Connectors

R58 Series Designed to Requirements of MIL-DTL-83733 and JN1122 TheR58seriesfromAmphenolCanada*arehighperformanceenvironment-resistant,rectangularconnectorsdesignedtoexceedtherequirementsofMIL-DTL-83733andtomeettheEFArequirementsofJN1122.FeaturesoftheR58Seriesinclude:

R58 Series Rectangular Connectors

• Wellsuitedforhostilemilitaryaircraftapplicationswhereenvironmentisanissueorshieldingeffectivenessandcorrosionresistanceismandatory

• Availablein2shellsizeswithavarietyofhardandspringmountingconfigurations

• Broadrangeofcontactarrangementsavailablefromcustomto185standardcontacts

• CrimpcontactsorPCBinsizes12,16,20and22D.Coax,twinax,triax,quadraxandfiberopticsalsoavailable

• Filteredversionisalsoavailable(458series)• Shellsaremachinedaluminumalloywithseveralfinishoptions,includingODchromateovercadmiumoverelectrolessnickelfinish.

• Insulatorsarehighgrade,plastictoMIL-M-14• Siliconerubberisusedforgrommets,interfacialsealsandperipheralsealsSeeAmphenolCanada*publication,“InfinitePossibilities”,AmphenolRectangularandFilteredProducts,forcompleteinformationandhowtoorder.

458 Series Filtered Rectangular Connectors

*ContactAmphenolCanadaat:605MilnerAvenue,Toronto,Ontario,CanadaM1B5X6Phone:416-291-4401Fax:416-292-0647www.amphenolcanada.com

R393 Series Low Profile Connectors with High Speed RF ContactsAproductlinedevelopedfromtheR39,theR393contains38999SeriesIIIhighspeedRFcontacts.Theseconnectorshavealowprofile,light-weightdesign,andareidealforamaximumnumberofhighspeedcontactsusingasmallamountofspace.ConsultAmphenolCanadaformoreinformationandhowtoorder.Featuresinclude:• QualifiedtoBACC65BYandBACC65BWspecifications• Size8highspeedRF38999contacts• Environmentalandfilteredoptionsavailable• Multipleshellsizes,includingcustomgeometry• Captivehardwareandbackshellsavailable

R393 Series Rectangular Connectors

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SinglepiecemachinedaluminumalloyshellperQQ-A-225,platedinaccordancewith1)ElectrolessnickelperMIL-C-26074or2)TinperMIL-T-10727or3)CadmiumperQQ-P-416withclearchromateor4)GoldperMIL-G-45204overelectrolessnickelperMIL-C-26074

FilterRectangularConnectors,Micro-D,Microminiature&D-SubConnectorsFROM AMPHENOL AEROSPACE & AMPHENOL CANADA

Amphenol Offers a Full Range of Rectan-gular Interconnects that Provide Filter ProtectionFilterrectangularconnectorsareusedtoprovidecostandspaceeffectivesolutionstoEMIproblemsinawiderangeofmilitaryandcommercialapplicationsincludingavionicssystems,satellites,missiles,communications,controlsystemsandtempestequipment.Amphenol’suniquesolder-lessconstruc-tionwhichreducesstressontheceramicelementsandresultsinsuperiorphysicalandthermalshockcapabilities.FilteringisavailableinthefollowingAmphenolrectangularconnectors:• ARINC404&ARINC600• R39-Rectangular38999• 458-M83733Style• Micro-D• D-Sub• R27• R64FFilteredDockingConnector• D83CompactD-Sub• FilteredHeadersandCustomDesigns

Ferriteinductor

Monolithicplanarcapacitorarray

Copperalloysoldercuptermination,goldplatedperMIL-G-45204.

Copperalloycrimpbarreltermination,goldplatedperMIL-G-45204.

Berylliumcoppercontactsprings,goldplatedperMIL-G-45204.

BerylliumcopperEMIgroundingspring

Sealingandstressisolatingelastomericgaskets(3places)

Machinedcopperalloycontact,goldplatedperMIL-G-45204

Hightemperaturedielectricinsert-polyethersulfonethermoplasticperMIL-P-46185

Micro-D (M83513 Style) ConnectorsAsmallconnectorsolutionwhichexceedstherequirementsofmilitaryM83513,theMicro-DconnectorisprovidedbyAmphenol.Featuresinclude:• RackandPanelmounting,orpanelmount,cablemountorPCBmounting• Usedwherespaceandweightareatapremium• Wireharness,verticalandrightanglePCBterminations• Filteredornon-filtered• Press-fitcontact

Microminiature ConnectorsSeries106MicrominiatureCardConnectorswerealsodesignedtomeettherequirementsofMIL-DTL-83513.Featuresinclude:• Highdensity• Board,panelandcablemountingforcard-to-cardandcard-to-cableapplications• EmploysaD-shapeforcorrectmating.Jackscrewsandjackposts• Wireharness,verticalandrightanglePCBterminations105SeriesMicrominiatureStripConnectorsprovidedbyAmphenolPhoenix*Featuresinclude:• Singlerowstriplineconfiguration• Board,panelandcablemounting• Guidepins,jackscrews• Wireharness,rightanglePCB,surfacemountterminations

D-Sub ConnectorsAmphenolCanadasuppliesD-SubminiatureRectangularConnectors:• SD308SealedD-Subs• 308/481FilteredD-Sub• C308Press-fitD-Subs(NAFIcontact)FeaturesofD-Subconnectorsinclude:• Standarddensityandhi-densityinsertarrangementswithpinandsocketcontacts

• Fixedscrewmachinecontacts,availableinsoldercup,straightPCB,rightanglePCB

• EMIfilterD-Subconnectorsuseplanarcapacitors

D-Sub Rectangulars

Micro-D Connectors

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FROM AMPHENOL AEROSPACE & AMPHENOL CANADA

BackplaneSystemsandEnclosures

FROM AMPHENOL BACKPLANE SYSTEMS DIVISION

Forover40years,AmphenolBackplaneSystems(ABS)hasbeenaleadingmanufac-turerofbackplaneassembliesandenclosuresformilitaryandaerospaceapplications.ABScombinesawiderangeofinnovataiveproductandprocesstechnologies,advancedcomponentmanufacturing,andprocesscontrolwithhighlyfocused,customerspecificprogrammanagementandtestingattheassemblylevel.Inaddition,weprovideexpertdesignandunsurpassedapplicationsengineeringassistanceateverystepoftheway.AmphenolBackplaneSystemsproductioncapabilitiesaretheresultofinvestmentinnewstate-of-the-artequipmentandsoftwaresuchas:• Press-fitinstallation• Through-holesoldering• Automatedhi-tempsoldering• Large-formatsurfacemountsoldering• Aqueouscleaning• Conformalcoat(typeURandXY)• ElectricaltestForelectricaltesting,ABSoffersLevelI(bareboard),LevelII(postassembly),andLevelIII(in-circuit)capabilities.Ourindustryleadinglarge-formatsurfacemountlinewithacapabilityofupto29”X60”circuitsiswellpositionedforthelargestbackplanesintheindustryaswellasvolumeproductionofstandardbackplaneproducts.

Backplane Incorporating LRM Modules with Brush Contacts and MT Fiber Optic Inserts

Amphenol’s Solutions - The Pinnacle of TechnologySomeoftheworld’smostdemandingprogramsrelyonAmphenol’spackagingsolutions,including:• F-35• F-22• F-18• MIDS/JTRSRadio• TheatreHighAltitudeAirDefenseRadar(THADD)• AH-64Apache• 787Dreamliner• FutureCombatSystems• DDG-51• DDG-1000IntegratedSystemsSolutions*arefoundaboardcommercialairliners,helicopters,NavyandAirForcefighters,C4Ielectronics,missiles,groundvehicles,HomelnadSecuritySystems,andNavywarships.

Ouradvancedmanufacturingsupportsoftwareallowsustomaintainourworldclassconfigurationcontrolaswellascreateastate-of-the-artvisualworkplacetoensureweareexceedingcustomerexpectations.Ourin-housecapabilityforenvironmentaltestingsuchasEnvironmentalStressScreening(ESS)supportstheincreasingcustomerneedforproductassurance.Wehavealsoexpandedourmanufacturingcapabilitytoinclude:• EnclosureandValue-addedAssembly• High-endCableandFlexAssemblies• IntegratedBusSystems• MachinedEnclosuresandMetalFaceplatesInsupportofthecontinuedneedforleading-edgetechnologycoupledwithbestcostmanufacturing,wehaveestablishedaqualifiedDoDManufacturingLicensingAgreement(MLA)approvedworkcenteratourAmphenolNogales,Mexicocampus.ThissiteisaduplicationofourNashua,NewHampshiremanufacturingcapabilityandwillmeettheneedsofprogramslookingforalowcostoption,whileremaininginNorthAmerica.ABSMIL-SpecificedqualificationsincludeMIL-C-28859(forcomponents)andMIL-A-28870(forassembledbackplanes).

*Seepage12formoreinformationaboutAmphenolIntegratedSystemSolutions.

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UHD Backplane Connectors on Board, Rigid Pin Termination, with Fiber Optics, Coax or Power Contacts

UHD Module Connector with Flex Termination

UHD Series with Fork and Blade ContactsAmphenol’swiderangeofboardlevelinterconnectsalsoincludeshighdensityUHD(UltraHighDensity)Seriesmoduleandbackplaneconnectors.Theseutilizeforkandbladecontactsinastaggeredgridpatternforattachmenttoprintedcircuitboards.Thestaggeredpatternis80contactsperinch,.025pitchin8rows.TheyareSEM-Eformatandarequalifiedto:EIA15-763,DESC89065,IEEE1101.1to1101.9.SUconfigurationsarealsoavailable.TheUHDmoduleconnectorshavesurfacemountbladecontactsandthematingUHDbackplaneconnectorshavesolderlesscompli-antpress-fittuningforkcontacts.Thereareawiderangeofhighcontactdensitypatternsandthelengthandstylecanbetailoredtomeetcustomerrequirements.Theyarerigidpinterminatedtotheboardorflexterminatedtotheboard.Coax,fiberopticsandpowercontactscanalsobeintegratedintotheconnectorconfiguration.OtheroptionsincludeEMIshieldingandUHDinterconnectscanbeprovidedinastackingconfiguration.Modulecoverscanbeintegratedintotheconnectorsystem.Extend-erboardconnectorconfigurationsarealsoavailablesothatcustom-erscanhaveaccesstoprobeandtestmodulesthatareelectricallyconnectedtothebackplane.StandardconfigurationsofUHDconnectorsare:•372pin•300pinmulti-purpose(fiberoptic,coax,powercontactscanbeintermixed•296pinwith270Vpowercontacts•292pinwithcoax•396pinFuturebus+SEM-E•556pinFuturebus+10SU(designsupto680contacts)UHDSeriesconnectorsareprovidedbyAmphenolBackplaneSystemsdivisionofAmphenol.Theseconnectorsareaproveninterconnectsolutionforadvanced,high-reliabilitypackagingrequirementsinmarketsofmilitaryandcommercialaviation,spaceapplications,shipboardapplications,militaryvehicles,C4Ielectronicsandordnance.Formoreinformationseecatalog12-036on-lineatwww.amphenol-abs.com.

UHD Module Connector with Rigid Pin Termination

UHD Module Connector, Rigid Pin Termination plus Coax Contacts

UHDConnectorswithFork&BladeContacts

FROM AMPHENOL BACKPLANE SYSTEMS DIVISION

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60, 66NAFIConnectorswithFork&BladeContacts,I/ONAFIwithRearRemovableCrimpContactsFROM AMPHENOL BACKPLANE SYSTEMS DIVISION

NAFI Series with Fork and Blade ContactsAmphenolNAFIdaughtercardandbackplaneconnectorsareanotherboardlevelinterconnectsolutionfromAmphe-nolBackplaneSystems.TheyprovideawiderangeofmediumcontactdensitypatternsandmeetMIL-C-28859standards.Daughtercardterminationisthough-hole,usingnickel/goldsolderplatedcontacts.Thematinginterfaceisabladecontactwhichcanbeeitherparallelorperpendiculartothedaughtercard.TheMSeriesofNAFIconnectorsareforthroughholeinterconnectiontoprintedcircuitboardswithrigidpintermination.Connectorlengthsandbodystylescanbetailoredtomeetspecificneeds.Theyareavailablewith2,3,4and5rowsofcontacts,.100X.100pitch.StandardNAFI-stylefeaturessuchasguidepinsandD-andV-shapedpolarizingkeysareavailable.TheFMSeriesofNAFIconnectorsareforsurfacemountinterconnectiontoprintedcircuitboardswithflexcircuittermination.Upto5rowsofcontactscanbeconfigured.ThestandardNAFIinterfaceismaintainedwhiletheflexiblecircuittracesprovidethelinktothemodule.Theflexiblecircuitterminationallowsforhandsolderingorvariousautomatedsurfacemountsolderingprocesses.Tomeetcustomerneeds,connectorlengthsandbodystylescanbetailored,andtheflexcircuitrylengthsandconfigu-rationsalsoaredesignedpercustomerspecifics.NAFIbackplaneconnectorsusesolderless,compliantpress-fittuningforkcontacts.

NAFI Daughtercard Connector with Flex Termination

I/O NAFI Series with Rear Removable Crimp TerminationAmphenolalsoprovidesanI/ONAFIinterconnectthatallowsforterminating#22and#26gaugestrandedwirestoabackplane.Itisavailablewith24,36,40or120rearremovablecrimp-stylebladecontactsandincludescaptivehardwareandpolarizingfeatures.Thereceptacle(tuningfork)connectorcanbeplacedwhereneededoneithersideofthebackplane.

NAFIinterconnectsareusedinmilitaryandcommercialaviation,inspaceapplications,shipboardandinmilitaryvehicles.Formoreinformationseecatalog12-036fromAmphenolBackplaneSystems,on-lineatwww.amphenol-abs.com.

I/O NAFI Connector - for Terminating Stranded Wire to a Backplane

NAFI Backplane Connectors on Board

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PrintedCircuitBoardsCapabilities

FROM AMPHENOL PRINTED CIRCUITS DIVISION

Amphenol Printed Circuits’ (APC) CapabilitiesProvenengineeringandmanufacturingexpertiseinthemanufactureofprintedcircuitboardshasbeenprovidedbytheAPCdivisionofAmphenolformorethan25years.Consistentqualityandreliabilityfordemandinghighbandwidthsystemsandmissioncriticalapplica-tionsismetalongwithoptimizationinmaterialhandling.APCprovidestightlycontrolledprocessesforprototypethroughproduc-tionsofprintedcircuitboards.ThechartbelowshowsthePrintedCircuitBoardcapabilityofAmphenolPrintedCircuits.

DESIGNFORMATS •Mentor•PADS

•Cadence•Zuken

MANUFACTURINGFORMATS

•ODB++(preferred)•DXF•Gerber274X•Autoplot•Excellon

•HPGL•DPF•Gerber274D•IPCD356

MAXIMUMPANELSIZE•24”x54”(609.5mmx1371.5mm)•30”x44”(762.0mmx1117.5mm)•36”x42”(914.4mmx1066.8mm)

MAXIMUMPANELTHICKNESS .500”(12.7mm)

LAYERCOUNT Upto64

INTERCONNECTFORMATIONTYPES

•Backdrilled•DualDiameter•ThruHole**withconductiveandnon-conductiveviafill

•Blind(laser&mechanical*•Electricallyisolated•Buried•SMT

ASPECTRATIO-DRILLEDSIZE

•Compliantholes>+0.225(drilledsize17:1)•Viaholes<.022(drilledsize13:1)

FINISHEDHOLESIZE

•CompliantPinned:0.018”(0.457mm)•Via(A/Rdependent):0.008”(0.203mm)•BuriedVias:0.006”(0.152mm)•Microvias(upto3electricallayers)(0.101mm)

BLINDVIAASPECTRATIO 1.25:1

INTERNALFEATURES

•Lines:0.003”(0.0762mm).5oz.copper•Spacing:0.003”(0.0762mm).5oz.copper•BuriedResistors:No•BuriedCapacitance:No•MinimumCoreThickness:0.0001”(0.0254mm)

EXTERNALFEATURES •Lines:0.004”(0.1016mm).5oz.copper•Spacing:0.004”(0.1016mm).5oz.copper

MATERIALS*

•LowTgFR4(includingphenoliccure)•Getek•Nelco4000-13&Nelco4000-13SI•Rogers4350/FR4•BT

•HighTgFR4(includingphenoliccure)•IsolaFR408•Rogers4350•Polymide•CyanateEster•Megatron6

COPPERPROCESSING 1/4oz.-10oz.copper(U/L7oz.)

IMPEDANCESINGLE&DIFFERENTIAL

•±10%•±7.5%•±5.0%

SURFACEFINISHES

•ElectrolyticNi/Au•HASL•ImmersionTin•ReflowedTin/Lead

•ENIG•ImmersionSilver•OSP-Entek106

CERTIFICATIONS

•IPCA600ClassI,II&III•AS9100-B/ISO9001:2000•ITARRegistration•MILPRF31032/2a

•IPC-6012ClassI,II&III•ISO14001:1996•MIL-PRF-31032/lb.•MIL-P-55110

* PleasecontactAPCfortheavailabilityofadditionalmaterials.

Formoreinformationcontact:AmphenolPrintedCircuits,Inc.91NortheasternBlvd.Nashua,NH03062Phone:603-324-4500www.amphenolprintedcircuits.com

Variety of Printed Circuit Boards from APC

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60, 66FlexCircuitTechnology

TIGHT FITTING, SOLDERLESS TERMINATION TO BOARDS

Flexible and Rigid-Flex CapabilitiesAmphenolPrintedCircuitsDivisionisaworldleaderinprintedcircuits,manufacturinghighlycomplexBackplanes,Daughter-Cards,FlexandRigid-Flexassemblies.Locatedforover30yearsinNewHampshire,APChasbeendeliveringhighqualitycircuitstotheDefenseandhigh-endCommercialmarkets,ontimeandwithinbudget.WhilemanufacturingahighlydiversifiedproductlinespecializingintechnicallychallengingRigid-Flexassemblies,wearealsoabletodeliverlowcost,lowerlayercountFlexandtheirassemblies,intoday’sprice-competitiveenvironment.Oftenanafterthought,FlexandRigid-Flexallowsdesignerstoshrinkpackagingandthinkaroundcorners.Belowisalistofsomeofourcapabilities.

Flex Circuitry with Rectangular Interconnects and PC Boards

Flex Circuitry used in cStackTM TechnologyFlexisakeycomponentofthecStackTMtechnologyusedinAmphenol’shighspeedGigastakTMandDigastakTMconnectors,(seepage35).AmphenolInterConproducescStackTMflexcircuitassembliesthatcombinelowcostterminationwithhighspeed,impedancecontrolledinterconnectionperformance.ThepatentedcStackTMstackingconnector*usedtoterminatetheseassembliesprovideshighsignalintegrityinterconnectiontechnology,becauseoftheconnector’slow(.048inch)profilebetweenflexandboard.FlexcircuitryforallcStackTMflexassembliescanbeelectricallyandmechanicallycustomizedtoexactlyfitsystemspecifications.

FlexcircuitryisusedinawidevarietyofAmphenolboardlevelandrectangularinterconnects,asshownthroughoutthiscatalog:• FlexincorporatedintoLRMassemblies,(seepages10,25and31-35)

• ARINC404connectorwithFlex,(seepage114)

• UHDandNAFIconnectorswithFlex(seepgs.118&119))

DESIGNFORMATS •DXF•Gerber

•IGES•Pads

PANELSIZE

•12”x18”(304.8mmx457.2mm)•18”x24”(457.2mmx609.6mm)•24”x24”(609.5mmx609.5mm)•24”x36”(609.5mmx914.4mm)•24”x54”(609.5mmx1371.5mm

PANELTHICKNESS .003”-.225”(0.0762mm-5.715mm)

LAYERCOUNT 1-30+

INTERCONNECTFORMATIONTYPES

•ThruHole•Buried•Blind

•SMT•FilledVia’s•DualDiameter

FINISHEDHOLESIZE

•CompliantPinned(rigidzoneonly):0.018”(0.457mm)•Via(A/Rdependent):0.008”(0.203mm)•BuriedVias:0.006”(0.152mm)•Microvias(upto3electricallayers):0.004”-.006”(0.101mm)

BLINDVIAASPECTRATIO 1.25:1

INTERNALFEATURES(COPPERWEIGHTDEPENDENT)

•Trace:0.003”(0.0762MM)•Spacing:0.003”(0.0762mm)

MATERIALS

•Polyimide-Std.Acrylic•Polymide-FR•Polymide-AP•Polymide-GI•SilverEpoxyShielding

•CopperEpoxyShielding•Soldermask•FR-4/-24,26and28•LCP•FEP

COPPERPROCESSING 1/4oz.-.400”(10.16mm)

IMPEDANCESINGLE&DIFFERENTIAL

•±10%•±7.0%

SURFACEFINISHES

•HASL•ReflowedTin/Lead•ODP-Entek106•ENIG

•ImmersionTin•ImmersionSilver•BrightTin•Ni/Au

ASSEMBLYCAPABILITIES

•FullTurn-Key•Thru-Hole-Wave&Manual•SMT-Pick&Place

•Wire-Bond•Crimp•RoHSCompliance

ASSEMBLYFINISHING •ConformalCoat-UR,Acrylic,Parylene,Flouropel•GlopTop

TESTCAPABILITIES

•Overmolding•ImpedanceTesting•Hi-Potupto5,000VDC•2,000+PointsperCircuit•InsulationResistanceupto1,000VDC

•FourWireKelvin.001ohmto1ohm•BedofNails•FlyingProbe•FlexCycling•Environmental•FunctionalTest

CERTIFICATIONS

•IPC6013ClassI,II&III:Types1-5•MIL-P-50884Types1-5•ITARRegistration

•AS9100Certification•IPC-601•UL94VO•ISO9001:2000

cStackTM Flex Circuits

*USpatentnumber6,176,707and6,217,342.Otherpatentspending.

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IntegratedSystems

THE LEADING CHOICE FOR PACKAGING SOLUTIONS

Integrated System PackagingAmphenolistheleadingmanufacturerofintegratedsystemsolutionsforthemilitaryandaerospacemarkets.AmphenolIntegratedSystemsisthesynergisticcombinationofkeyAmphenoldivisions:• AmphenolBackplaneSystems• AmphenolPrintedCircuits• AmphenolAerospaceOperationsBoardLevelProducts• AmphenolBorischWehaveover60yearsofexperienceinthemilitaryandaerospacemarketandourcommitmenttotheindustryisexemplifiedineverythingwedo.Weunderstandtherelationshipbetweentheinterconnect,theprintedcircuitboard,thebackplaneandthechassis,andweusethatknowledgetoprovidecompletesolutions.

Above:AnexampleintegratedsystemboxthatincludesthefollowingAmphenolinterconnectproducts.• Circulars:D38999cylindricalconnectorswithMTfiberoptics,RJFieldconnectors

• Rectangulars:LRMinterconnects,NAFIconnectors,UHDconnectors

• Rectangulars:ARINC600connectors,Micro-DSubminatureconnectors

• Rectangulars:HDB3highdensitybrushcontactconnectors• BackplaneSystems,Flexcircuitry,metalenclosure

Amphenol Products- Peformance in the Most Demanding EnvironmentsAmphenolcanprovidesystemsolutions-everythingyouneedinsideandoutsidethebox-includingproductsthatwillperforminharshenvironmentalconditions:Highperformanceinterconnectproducts,printedcircuitboards,backplaneassemblies,flexcircuitry,heat-sinksandmetalenclosures.Amphenolalsoprovidesvalueaddedassemblyinclud-ingbussing;fullsystemassemblyincludingchassisbuildandsub-systemintegrationandtesting.AmphenolleadstheindustrybyofferingtheelementsnecessaryforsuccessinthemilitaryandaerospaceOEMsupplychain:• DesignandModeling• ApplicationsEngineering• Fabrication• Value-addedAssembly• TestCoupledwiththelargestinterconnectofferinginthemar-ket,Amphenolsupportsallofyoursystem-levelneeds.

Seepage117forinformationonAmphenolBackplaneSystemscapabilitiesforbackplanesandadvancedproductsystemsandtesting.Seealsopages4&5intheintroductionsectionofthiscatalogformoreinformationonPackageSolutions,orcall:AmphenolAerospaceat800-678-0141,AmphenolBackplaneSystemsat888-318-3553

Other examples of Amphenol Integrated Systems and Enclosures.

The Engineering EdgeAmphenolIntegratedSystemstacklesproblemssuchasPWBrouting,signalintegrity,mechanicalrobustness,andthermalreliabilityconcurrentlyratherthanindepen-dentlybyvalue-addedapplicationsengineeringsupport.Solvingcomplexpackagingchallengesdependsonmakingsurethatenvironmental,mechanical,andelectricalfactorsarealladdressesatthesystem-level.Bytakingthissystem-levelperspectiveandfocusingonthesefactors,AmphenolIntegratedSystemsisabletomeetyourprogram’smostchallengingpackagingrequirements.Weareanextensionofyourdesignteam,providingexpertdesignandapplicationsengineeringassistanceeverystepofthewaytoensureprogramsuccess.

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60, 66QuadraxHighSpeedContactsforBoardLevelInterconnectsHIGH SPEED QUADRAX, COMPLIANT PIN TERMINATION

Quadrax Contacts for Board Level ConnectorsAmphenolsuppliessize8compliantpinQuadraxPCBcontactswhichprovideseveraladvantagesforhighdatatransferrates,lowpowerconsumptionandexcellentEMIcompatibility.• Fourstrategicallyspacedinnercontactsformtwo100or150Ohmmatchedimpedancedifferentialpairs

• Outercontacthasruggedwallsectionfordurability• Sameasusedincylindrical38999connectors-SeeAmphenolCombinedCircularConnectorcatalog/PCBcontactsectionformoreinformationonquadraxcontactsandcables.

Quadrax Contacts are gold plated, crimp terminationFinishofmatingcontactsparts:suppliedwith0.000050min.goldovernickelonmatingparts.ConsultAmphenolforavailabil-ityofotherfinishes.Quadrax Size 8 Contact Performance:• Bandwidth:Upto3Gigahertz• DataRate:Exceeding3Gbits/sec.• VoltageRating:500Vrmsmax.@sealevel• DielectricWithstandingVoltage:1000VACrmsbetweenallinnercontacts@sealevel500VACrmsbetweeninnerandoutercontacts@sealevel

TYPICAL QUADRAX SOCKET CONTACT has socket outer contact with a socket inner contact

TYPICAL QUADRAX PIN CONTACT has pin outer con tact with a pin inner contact

BRAID JACKET

INSULATION

(4) CENTERCONDUCTORS

ORIENTATIONKEY

PIN CONTACTMATING FACE

SOCKET CONTACTMATING FACE

1

23

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2

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Suggested Numbering for Quadrax Contacts

CompliantPinQuadraxsize8contactsareavailablewithholediameters:.025±.002PTHQuadraxcontact.040±.003PTHshellgroundingAccomodatesbackplane.125inchmin.thickness(ConsultAmphenolAerospaceforavailabilityofadditionalconnectorconfigurations.)

3.440

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H G F E D C B A A B C D E F G H

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.475

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4 POSITION BOARD LEVEL CONNECTOR WITH QUADRAX

8 POSITION BOARD LEVEL CONNECTOR WITH QUADRAX

Cable Illustration Quadrax Contact

Board Level Interconnects with Quadrax Contacts

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The RADSOK® Design:RADSOK®technologyisbaseduponastampedandformedflatgrid,uniquelytwistedintoahyperbolicgeometrytoproviderobust,highdensitycontacttothematingpincontact.Mostpinandsockettechnologiesrelyuponspring(beamelement)proper-tiesofthecontactelements,whichtendtoweakenovertime.Unlikemostotherpinandsocketsolutions,theRADSOK®alsoutilizesthetensilestrengthpropertiesoftheflat,highconduc-tivityalloygrid.Thisprovidesthehighnormalforcesrequiredforconductivitywhilealsoprovidinglargeconductivesurfacearea.Correspondinglylowvoltagedropandlowtemperaturerisearealsoachievedwhilemaintaininglowinsertionforces.

RADSOK®InterconnectSolutions

HIGH POWER APPLICATIONS

RADSOK® Advantages:• High ReliabilityUniqueRADSOK®designandconstructiontechnologycreateanelectricalcontactinterfacethatexceedstypicalinterconnectrequirements.Applicationsinaerospace,medical,industrial,automotive,mining,offshore,andotherharshenvironmentsdependonhighreliabilityoftheAmphenolRADSOK®technology.

• Low Contact Engagement/ Separation ForcesThehyperboliclamellasocketcontactconstructiondistributesnormalforcesoverahighpercentageofthematingpinsurface.Thiscreatesasmooth,evenengagementeffort.Thisforcedistributionalsocontributestoexcellentperformanceinvibrationapplicationswithresistancetotypicalfrettingcorrosion.

0

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RADSOK® Derating Chart - Temp. vs. CurrentBasedonsingleconductorsinfreeair.Wirecross-sectionsamesizeaspincontactcross-sectionalarea.

RADSOK® Technology brings power to the board in a wide variety of applications such as:• Replacementofringterminals(lugs)onthreadedstuds• HighcurrentPCBs• Communicationtowers• Backplanepower• Uninterruptedpowersupplies• Fuelcellconnectors• Hybridelectricvehicles• ACinductivedrivemotors• Powerdistributionmodules• Busbarterminations(plug-inhardware/modules)• “Pluggable”breakers• Batteryterminals• ContactswithRADSOK®technologygive50%moreampacity.• RADSOK®contactscanbedesignedtofitanyhousing.• CombinationsofRADSOK®andhighspeedcoppercontactsinthesameinterconnectpackage

RADSOK® Technology brings high power to Military and Aerospace applications:• Naval• Military&CommercialAvionics• MilitaryVehicles• MissilesandOrdnance• C4ITherearemanydevelopingmilitaryapplicationsofRAD-SOK®technology-combinationsofRADSOK®andhighspeedcoppercontactsinthesameinterconnectpackagehasbecomearequirementinrectangularaswellascircularconnectors.

RADSOK® Key Features:• Socketcylinderwithinfemalecontacthasseveralequallyspacedlongitudinalbeamstwistedintoahyperbolicshape• Asmalepinininserted,axialmembersinthefemalehalfdeflect,impartinghighcurrentflowacrosstheconnectionwithminimalvoltageloss.• Thehyperbolic,stampedgridconfigurationensuresalarge,coaxial,face-to-facesurfaceareaengagement.• Idealforcrimpterminationapplicationsrequiringrepeatedmatingcyclesandhighcurrentwithlowmilli-voltdrop.

• Low Contact Resistance Thelargeinterfaceareabetweenthesocketlamellaandpinsurfaceresultinverylowcontactresistance,enablingtheRADSOK®contacts’highcurrentratingscomparedtotraditionalpowercontactdesigns.

• High Mating Cycle DurabilityRADSOK®contactswithtypicalsilverplatingfinisheshavedemonstratedsurvivalof20,000matingcycles.Specializedplatingandcontactlubricantscanextendcyclelifeto200,000matingsorhigher.Evenwithcontinuousexposuretoharshenvironmentalabuse(salt,sand,andhighhumidity),RADSOK®contactshavebeentestedtomaintainlowcontactresistancebeyond10,000matingcycles.

TheRADSOK®(RADialSOcKet)HighAmperage,LowInsertionForceElectricalTerminalprovidesvaluetoyourpurchasing,engineering,qualityandmanufactur-ingobjectives.

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Amphenol offers high current single-point connec-tions for PC boards with RADSOK® contacts: • PowerBlokTM

• RADSERTTM

• PGYTM

Thecompactfootprintdesignoftheseproductscansupplyupto120Amptotheboardwhichpreservessurfaceareaandprovidesmoreflexibilityinboarddesign.• PowerBlokisavailableina3.0mm(70AMPS)whichispress-fitintothePCB• RADSERT’sareavailablein2.4mm(35AMPS)and3.6mm(70(AMPS).Offeredinsolderorpress-fitstyles,andavailableformanyboardthicknesses.• RADSOKPGY’sareavailablein3.6mm(70AMPS)and5.7mm(120AMPS).Pgy’sareconnectedtothePDBthroughasolderreflowprocess.

RADSOK®InterconnectSolutions

HIGH POWER FOR BOARD LEVEL CONNECTORS

Standard and Custom-Developed Solutions• InadditiontothevariousstandardsizesofRADSOK®components,custom-developedsolutionsarealsoavailable.Amphenolhastheglobaldesign,engineeringandmanufacturingresourcestoprovideRADSOK®socketspressedintobusbars,crimpedtocables,assembledintoconnectors,assembledintocustomerorAmphenoldesignedspecializedelectricaldevices,orasstand-alonecomponents.Amphenolalsomanufacturesafullcomplimentofmatingpincontactsforanyapplication.• Steady-statecurrentcapacitiesforstandardRADSOK®productsrangefrom50ampstoover1000amps.• AmphenolconnectorswithRADSOK®contactsareofferedwithavarietyofpositive-lockingfeaturesthatinsureandmaintainfully-matedconnections.• Sealing(SealtacTM)andhighvoltagehotbreakoptionsareavailablewithintheRADSOK®itselforwithinaverywiderangeofIPratedconnectorhousingstoprovideenvironmentalprotectiontothecontactarea.

RADSOK® contacts in LRM connectors: see page 30 of the LRM Section.

RADSOK® contacts in Ruggedized Rack and Panel Connectors - see pages 97 & 98.

New Mil-Power Group of Connectors

Rectangular Connectors for High Power ApplicationsAmphenol’soffersnewPowerInterconnectsforyourhighpowerapplicationsfeaturingRADSOK®technology.Thismulti-polefamilyofconnectorsisdesignedfor1750VRMSor2450VDCat400Acontinuous.Designfeaturesinclude:• Easytoidentifyshellpolarization• Split-insertconstructionforeaseofassemblyofcontacts• Shelltoshellbottomingforelectricalconductivity/EMIprotection• Customerprogrammablekeyingandalatchwithsnapdetentforsolidengagementlocking

• Alsoofferedinalowprofilerightangle90degreebackshelloptionwithovermoldcapabilities,helpingeasethestrainoftightfittingapplications.

• OfferedinstandardplatingoptionsaswellasDurmalonfinish*

* ConsultAmphenolAerospaceformoreinformationoncadmiumalternative,Durmalonfinish.

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RFHighFrequencyContactsforLRMInterconnectsFROM SV MICROWAVE, AMPHENOL DIVISION

.164 ±.001DIAMETER

.188DIAMETER

(.316)(.352 FREE STATE)

(.751)

.160 .002PANELRP

RF High Frequency Contacts Available for LRM ConnectorsAmphenoldivisionsofSVMicrowaveandAmphenolAerospaceworktogethertoprovideconnectorswithhighfrequencies.SVMicrowavedivisionofAmphenolisaworldleaderinthedesignandmanufactureofRF/MWconnectorsandcompo-nents.Theyprovidehighfrequencycontactswithaunique“FloatMount”technol-ogywhichallowsforconsistentmicrowaveperformancewhilemaintainingtightmechanicaltolerances.Thesecontactsexhibitsuperiorelectricalperformanceandwillmaintainanaccuratephaselengthwhenmated.SystemdesignandplatformneedshaverequiredsmallerpackagingwithRF,D/Csignalandpowerallincloseproximity.SVMicrowave’sprovendesignsandblindmatetechnologyhaveenabledtheintegrationofmultiportRFsignalsintosinglehousingsforgangmatingcapability.Formoreinformation,consultSVMicrowave.*SMPMcontactsshownonthispageareavailableforuseinLRMinterconnects(asshowninstaggeredgridpatternsonpage29intheLRMsectionofthiscatalog).

* SVMicrowave Phone:561-840-1800 Website:www.svmicrowave.com

SMPM RF Contacts for use in Amphenol LRM ConnectorsSOCKETSize12,50Ohm

Socket Contact, SMPM RF used in LRM Interconnects

SMPM RF Contacts for use in Amphenol LRM ConnectorsPINSize12,50Ohm

Pin Contact, SMPM RF used in LRM Interconnects

(.462)

(.174)

.146 ±.001DIAMETER

(.288)

.160 ±.002PANEL

.188DIAMETER

127

AmphenolAerospace



odules)Staggered/

GEN

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Hybrids - Fiber O

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Options/

Accessories

High D

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Hi Speed

Low M

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Coax/Fiber Optics

Rack & Panel

Brush Ruggedized

Docking Conn./


LMD

/LMS


Other



Ruggedized V

ME 64x/

VITA

60, 66CylindricalInterconnectsforPrintedCircuitBoardAttachmentPC TAIL OR COMPLIANT PIN TERMINATION

Cylindrical Connectors with PC Tail ContactsAmphenolAerospaceistheleaderininterconnectsystemsforaerospace/harshenvironmentapplications.MIL-DTL-38999,MIL-C-26482,MIL-5015aswellasproprietarycylindricalscanincorporatepctailcontacts.Jamnut(Dhole)orpanelmount(fourhole)stylesaresoldermountedtoprintedcircuitboards.PCBcontactsareavailableinsizes16,20and22D.ConsiderationsmustbemadeforlengthofPCBtailsandanymechanicalmethodsneededtostabilizetheboard.Commonlyusedtaildiametersandtailstick-outdimensionsaregiveninamphenol’scombinedCircularInterconnectCatalog/PrintedCircuitBoardsection.PCBcontactsareavailableincoax,twinax,triaxandquadraxtypes.Cylindricalconnectorscanbeattachedtoboardswithflexterminationwhichcreatesaself-lockingterminalpadandeliminatestheneedforanadditionalinterconnecttothePCboard.

Cylindrical Connectors on PC Board

MIL-DTL-38999 with PC Tail contacts

MIL-DTL-38999 with Special Stand-off Shell Configuration and Quadrax Contacts with PC Tails

Cylindrical Press Fit Connectors with Compliant PinsMIL-DTL-38999connectorscanbesuppliedwithcompliantpincontactsforsolderlessmountingonprintedcircuitboards.CompliantpinsengagetheplatedthroughholesinthePCboardwithouttheneedforsolderingwhichprovidesforhighspeed,lowcostboardassembly.Theyaccommodateboardswithminimumof0.090inchthicknessand0.040±.003platedthroughholes.BothpinandsocketcontactsareavailableinanyMIL-DTL-38999SeriesI,IIorIIIinsertpatternhavingcontactsize16,20or22D.Connectorsaresoldcompletelyassembledorareavailablefullypre-assembledonablackplaneassembly.FormoreinformationonPressFitconnectorsseeAmphenol’sCombinedCircularInterconnectcatalog/Options&Otherssect.,on-lineatwww.amphenol-aerospace.com.

Cylindrical Connectors with Flex Circuitry. Flex is designed to geometrically fit the shape of the connector to board package. It is strong and rigid, yet the circuit body is highly flexible.

Alignment Discs on PC tail connectors provide simplified installation of contacts to PCB boards.

Cylindrical Connectors with Compliant Pin Contacts

128

AmphenolAerospace


LRM

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Amphenol’sBroadProductOfferingofCircularInterconnectsSOLUTIONS FOR A WIDE RANGE OF APPLICATIONS

Amphenol Corporation

Amphenol Aerospace

40-60 Delaware AvenueSidney, NY 13838-1395Phone: 800-678-0141 or 607-563-5011Fax: 607-563-5157www.amphenol-aerospace.com

Am

ph

eno

l Circular Interconnects

Amphenol

• Aluminum• Stainless Steel/Firewall• Composite• Printed Circuit Board Connectors• High Speed Connectors

12-C

AmphenolAerospace

The Interconnection

Leader

Products for Military, Aerospace and Harsh Environments

12-CE

ditio

n 4

• Fiber Optics• Full Complement of Contacts/Cables• EMI Filter/Transient• Accessories• Backshells

Edition 4

26482M

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III

SJT

38999

I

83723 IIIM

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Crimp Rear

Release M

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26500 Pyle

22992 C

lass L Back- Shells

Options

Others

HD

EMI Filter

Transient

Fiber Optics

ContactsConnectorsCables

HIgH SPEED

PCB

Accessories

Aquacon

Herm/Seal

WhenyoucometoAmphenol,youareconnectedtothebroadestrangeofinterconnectionproductsinthemarketplace.Amphenolhasbecometheleaderininterconnectionproductsthroughitslonghistoryofengineeringexpertiseforproductsolutionsolving.TheBoardLevelandRectangularinterconnectsshowninthiscatalogareonlyapartoftheverywiderangeofinterconnects-thereisalsothewholeworldofCirculars.ManyofthemilitaryspecificationsforcylindricalconnectorsweredevelopedbyAmphenol,formerlyBendixConnectorOperations,attheSidney,NYfacility.

CircularProductsofferedbyAmphenolAerospaceincludethemajormil-speccylindricalsandcommer-cialversions,plusmanyinterconnectsthatmeetspecialapplications.Alsowithinthecircularintercon-nectofferingfromAmphenol,throughtheAmphenolIndustrialOperationsdivision,aremanycommercialtypesofconnectors.

ThefollowinglistisabriefoverviewofCircularInterconnectproductsofferedbyAmphenolAero-spaceandAmphenolIndustrialOperations.Thereisavastarrayofproducts-manyserieswithinMIl-specs,andmanyoptionswithinseries.• MIL-DTL-38999SeriesI,IIandIII• MIL-DTL-5015and5015types:97SeriesCommercial,GTandACA-BReverseBayonetConnectors

• MIL-DTL-26482,SeriesI&2• MIL-DTL-83723,SeriesIII• HermeticConnectors• FilterProtectionConnectors• FiberOpticConnectors• EnergySuppressionConnectors• HighPowerConnectorsincludingproductswithRADSOK®highamperagecontacts

• Plusawiderangeofcontactsforcirculars:•Standard500cycleand1500cycle,M39029typepowerandsignal•Crimpforfrontorrearreleaseconnectorapplications•Soldertypefixedcontacts•Highfrequencyshieldedcoax,triax,twinaxcontacts•High-speedquadraxanddifferentialtwinaxcontacts

• WiderangeofAccessoresforusewithCircularConnectors

TheproductbreadthofAmphenolforCircularInterconnectsrepresentstheAmphenolexpertisetoprovidealmostanyinterconnectionsolution.Amphenoldivisionsworkinsynergytoprovideourcustomerswithwhattheyneedfortheirspecifcperformancerequirements.ItisthissynergyandteamdriveneffortthathasmadeAmphenoltheinterconnecttechnologyproviderofchoicetoindustryleadingcompaniesthroughouttheworld.Withabroadanddiverseproductportfolio,Amphenolisabletodevelopetherightsolutionsforourcustomersacrossthediversesegmentsoftherapidlyexpandingelectronicmarket.

We invite you to see our Combined Circular Interconnects catalog online at www.amphenol-aerospace.com

Also see the many circular interconnects offered by Amphenol Industrial Operations at www.amphenol-industrial.com.

Contact us at: Phone: 607-563-5011 or 800-678-0141

Military/Aerospace Markets - Amphenol Circular InterconnectsMilitary Avionics . . Commercial Avionics . . Military Vehicles . . UAVs . . Missiles/Missiles Defense . . Naval . . C4I . . Space

Industrial Markets - Amphenol Circular InterconnectsRail/Mass Transit . . Process Control . . Wind & Solar Energy . . Heavy Equipment . . Telecommunications . . Power Generation . . Petro-Chemical

amphenol other board level and rectangular interconnects · other board level and rectangular...

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