weapon safing, arming and fusing (aditia aulia)

Weapon safing, arming and fusing

Aditia Aulia1106052455

A fuze is a weapon subsystem that activates the warhead mechanism in the vicinity of the target and also maintains the warhead in a safe condition during all prior phases of the logistic and operational chain.

Introduction

Basic Functions:(1) Keep the weapon safe(2) Arm the weapon(3) Recognize or detect the target(4) Initiate the detonation of the warhead(5) Determine the direction of detonation (special

fuzes only)

cont’d

Source : CHINESE JOURNAL OF MECHANICAL ENGINEERING

Vol. 24, No. 5, 2011 Title : “Fabrication of Fuze Micro-electro

mechanical System Safety Device” Discussion:

A new micro fabrication method of metal-based fuze MEMS safety device based on ultra violet(UV)-LIGA technology.

Journal

Fabrication Process

Substrate treatment The nickel substrates were grinded and polished by precision lapping/polishing

machine (DNIPOL-1502). Immersed in acetone and treated by ultrasonic cleaner (KQ-250DB) for 15 min. Immersed in ethanol and treated by ultrasonic cleaner (KQ-250DB) for 15 min.

Spincoating SU-8 photoresist

600 r/min for 9 s the speed increased to 1200 r/min for 30 s. Thickness: 70 μm. The nickel substrate with SU-8 layer was put in electric blast drying oven (WG-

20). 65℃ for 1hour 75℃ for 1hour 85℃ for 1,5 hour

Fabrication Details

1st Lithography Exposure dose: 200 mJ/cm2, time: 6 minute Put on a hot plate at 85℃ for 3 min Then, the substrate with SU-8 layer was immersed in SU-8

developer for 4–6 min at room temperature

1st Electroforming

The formulation of electroforming solution was as follows: Ni(NH2SO3)2•4H2O (550 g/L), NiCl2 (10 g/L), H3BO3 (35 g/L)

Operating temperature = 50℃, PH value around 4.0, 8 hour of process

Cont’d

Sputtering Cu

Cu films were sputtered by Sputtering System (JS3X-808). Sputtering time and power were 6 minutes and 300 W.

Spincoating SU-8 photoresist

540 r/min for 9 s the speed increased to 1200 r/min for 30 s. Thickness: 300 μm. The nickel substrate with SU-8 layer was put in electric blast drying

oven (WG-20). 65℃ for 1hour 75℃ for 2hour 85℃ for 2 hours

Cont’d

2nd Lithography

Exposure dose: 400 mJ/cm2, time: 12 minute Put on a hot plate at 85℃ for 6 min Then, the substrate with SU-8 layer was immersed in SU-8

developer for 35–40 min at room temperature

2nd Electroforming

The formulation of electroforming solution was as follows: Ni(NH2SO3)2•4H2O (550 g/L), NiCl2 (10 g/L), H3BO3 (35 g/L)

Operating temperature = 50℃, PH value around 4.0, 8 hour of process

Cont’d

Removal of SU-8 layer

Cont’d

Lower production cost Shorter production cycle Smallest dimension of the devices is 40 μm

(meets the requirement of size) The experimental result shows that the

samples are still in good condition and workable after undergoing impact pulses with 20 kg peak and 150 μs duration and completely met the requirement of strength.

Result