synthesis of networks on chips for 3d systems on chips srinivasan murali, ciprian seiculescu, luca...

SYNTHESIS OF NETWORKS ON CHIPS FOR 3D SYSTEMS

ON CHIPS

Srinivasan Murali, Ciprian Seiculescu, Luca Benini, Giovanni De Micheli

Presented by Puqing Wu

Context

3D Chip Smaller Footprint Shorter Wires

Delay Power Routing Congestion…

NoC: helps reduce TVS (Through Silicon Vias)

Copy from reference [2]

Contribution

Synthesis Approach (power focus) NoC topology NoC switches placement

Comparing to 3D optimized mesh-- 38% power reduction-- 25% latency reduction

Design Approach

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Input of Synthesis

Specification Cores: name, size, position, layer

assignment Communication: bandwidth, latency,

message type Technology constraints: # TSV

Synthesis Procedure power, area and timing models of Switch &

TSV

Output of Synthesis

Topologies Switches layer placement and position Result of power, latency and area

Knobs: # TSV

Area Place and Route

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Knobs: # Switches

# Switches = # Cores / Ports on switches Fewer switches leads to longer links thus

larger link power consumption (Congestion?)

More switches leads to more switching activities thus larger switch power

More ports on switches leads to lower frequency

Connecting Cores and Switches # Switches per layer:

Min: # Cores /max # ports (frequency) Max: # Cores / 1

Adapted from reference [1]

Connecting cores to switches

Questions: How to group cores? Different connectivity across layers?

Adapted from reference [1]

Connecting Switches to Switches Constraints for cost computation

max_ill – IFN-- When 2 to 3 links less then max_ill, assign

soft_IFN max_switch_size – IFN-- When exceeding switches connectivity, create

indirect switches Questions:

What is cost? How to connect switches based on cost analysis?

Placing Switches

Solve Linear Program by minimize obj

Also remove overlaps, pipeline long links and add NI to cores

Taken from reference [1]

Case Study: Triple Video Object Plane Decoder

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Case Study

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Case Study

Frequency (Lowest f results in Min Power)

Max switches size Switch counts sweeping

Power Consumption

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Comparisons with Mesh

Testbench: D_36_4, D_36_6 and D_36_8; D_35_bot, D_65_pipe 38% power saving 24.5% latency reduction?

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Impact on ILL Constraint

A very tight constraint on the number of ILL significantly increase power and latency (Questions)

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Reference

[1] Srinivasan Murali , Ciprian Seiculescu , Luca Benini , Giovanni De Micheli, Synthesis of networks on chips for 3D systems on chips, Proceedings of the 2009 Asia and South Pacific Design Automation Conference, January 19-22, 2009, Yokohama, Japan.

[2] Dae Hyun Kim, Saibal Mukhopadhyay, and Sung Kyu Lim. Through-Silicon-Via Aware Interconnect Prediction and Optimization for 3D Stacked ics, SLIP’09, July 26–27, 2009, San Francisco, California, USA.