synthesis of networks on chips for 3d systems on chips srinivasan murali, ciprian seiculescu, luca...
TRANSCRIPT
SYNTHESIS OF NETWORKS ON CHIPS FOR 3D SYSTEMS
ON CHIPS
Srinivasan Murali, Ciprian Seiculescu, Luca Benini, Giovanni De Micheli
Presented by Puqing Wu
Context
3D Chip Smaller Footprint Shorter Wires
Delay Power Routing Congestion…
NoC: helps reduce TVS (Through Silicon Vias)
Copy from reference [2]
Contribution
Synthesis Approach (power focus) NoC topology NoC switches placement
Comparing to 3D optimized mesh-- 38% power reduction-- 25% latency reduction
Design Approach
Copy from reference [1]
Input of Synthesis
Specification Cores: name, size, position, layer
assignment Communication: bandwidth, latency,
message type Technology constraints: # TSV
Synthesis Procedure power, area and timing models of Switch &
TSV
Output of Synthesis
Topologies Switches layer placement and position Result of power, latency and area
Knobs: # TSV
Area Place and Route
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Knobs: # Switches
# Switches = # Cores / Ports on switches Fewer switches leads to longer links thus
larger link power consumption (Congestion?)
More switches leads to more switching activities thus larger switch power
More ports on switches leads to lower frequency
Connecting Cores and Switches # Switches per layer:
Min: # Cores /max # ports (frequency) Max: # Cores / 1
Adapted from reference [1]
Connecting cores to switches
Questions: How to group cores? Different connectivity across layers?
Adapted from reference [1]
Connecting Switches to Switches Constraints for cost computation
max_ill – IFN-- When 2 to 3 links less then max_ill, assign
soft_IFN max_switch_size – IFN-- When exceeding switches connectivity, create
indirect switches Questions:
What is cost? How to connect switches based on cost analysis?
Placing Switches
Solve Linear Program by minimize obj
Also remove overlaps, pipeline long links and add NI to cores
Taken from reference [1]
Case Study: Triple Video Object Plane Decoder
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Case Study
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Case Study
Frequency (Lowest f results in Min Power)
Max switches size Switch counts sweeping
Power Consumption
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Comparisons with Mesh
Testbench: D_36_4, D_36_6 and D_36_8; D_35_bot, D_65_pipe 38% power saving 24.5% latency reduction?
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Impact on ILL Constraint
A very tight constraint on the number of ILL significantly increase power and latency (Questions)
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Reference
[1] Srinivasan Murali , Ciprian Seiculescu , Luca Benini , Giovanni De Micheli, Synthesis of networks on chips for 3D systems on chips, Proceedings of the 2009 Asia and South Pacific Design Automation Conference, January 19-22, 2009, Yokohama, Japan.
[2] Dae Hyun Kim, Saibal Mukhopadhyay, and Sung Kyu Lim. Through-Silicon-Via Aware Interconnect Prediction and Optimization for 3D Stacked ics, SLIP’09, July 26–27, 2009, San Francisco, California, USA.