sem magnification calibration. magnification errors proper calibration of the sem scans...
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SEM Magnification Calibration
Magnification Errors• Proper calibration of the SEM scans
(magnification) is primary to metrology.• SEM Magnification requires calibration
– Standards needed
• Instrument has inherent systematic problems– kV compensation– Working distance compensation
• Operator Errors– Working distance
Magnification Calibration
• SEM magnification calibration is generally based on the measurement of the pitch (displacement) between two structures.– Pitch will be discussed later
• All traceable SEM magnification calibration is based on the measurement of a pitch.
SEM Magnification Calibration
• Procedures vary with instrument manufacturer.
• All require user supplied calibration sample.
• Most common sample for laboratory instruments is a copper grid.
• NIST SRM 484 is a sample with accurate pitch dimensions for SEM magnification calibration.
SEM Instrumentation
• Vast array of instruments in the field.
• Performance and capabilities vary substantially.– lab instruments– production line instruments
• Universally useful NIST sample preferred because of time and cost involved.
SEM Instrumentation
INSTRUMENT CLASS
RESOLUTION HIGHEST USEFUL MAGNIFICATION
RANGE In-lens FESEM
.4-.8 nm 1,000,000x+
Post-lens FESEM
.8- 1.2 nm 500,000x+
LaB6 Systems 4.0 - 5.0 nm 100,000x
Tungsten Systems
5.0+ nm 50-100,000x
Independent of Accelerating Voltage
Calibration Based on Pitch
Pitch vs. Width
Magnification Calibration
• Pitch measurements are considered to be self-compensating.
• Width measurements are NOT self compensating.
• There currently is NO accurate or traceable standard for the width of a line or a structure.
Pitch Measurements
• Electron beam modeling is not needed for pitch measurements or calculations based on pitch
• Pitch Measurements are self compensating
• But - the rules must be followed.– The edges measured must be the same
Resiliency of the Standard
High kV Low kV
SEM Magnification Calibration Samples
• Instrument Manufacturer– Hitachi– Biorad
• In-house standards– Company standards laboratory
• NIST Traceable Standards
NIST Traceable Standards
• SRM 484– Traditional SEM magnification standard
• RM 8090• RM 8820• Reference material currently available• ~$400-500
• MRS-2/MRS-3 (Geller MicroAnalytical)
• VLSI Standards
Traceable SEM StandardsSRM 484
• NIST certified standard• Electro-deposited gold and
nickel layers, cross sectioned and polished.
• Pitch is certified using a metrology SEM.
• Certified spacing*: 0.5, 1.0, 2.0, 5.0, 10.0, 30.0 and 50.0 micrometers.– *newer issues may vary from
these figures
SRM 484• Developed before the
emphasis on low keV SEM operation
• Much thicker than a semiconductor wafer.
• Does not easily fit in contemporary wafer inspection instruments.
• Suitable for many SEM applications
SRM 484
SRM 484
Traceable SEM StandardsMRS-5
• NIST traceable standard commercially available.
• Accessory structures for distortion measurements and astigmatism correction are present.
RM 8820 SEM Magnification Calibration Artifact• Metrology reference artifact - PolySi Chip
and Wafer
• Made with 193 nm phase shifting, 6 inch mask
• The design combines NIST and many leading IC manufacturing companies experts’ dimensional metrology patterns
• A very large variety of patterns:
– Isolated and dense lines and spaces
– Varying line width, space width, pitch
– Various contact holes
– Optical and SEM alignment and navigation patterns
– Scatterometry: optical and x-ray
– Line edge roughness
– Geometry distortion patterns
– Many other patterns
– Phase shifting and resolution enhancement patterns
• Grounded and electrically floating patterns
MTP will be presenting a paper on this standard during this Conference!!
• NIST patterns dedicated to– Optical metrology – SEM metrology– Optical scatterometry– X-ray scatterometry
• Optical metrology section– Based on the NIST SRM 2059 design– Linewidth model comparison features– Special, “noisy” scatterometry patterns– Binary and phase shifting patterns
• SEM linewidth metrology– Patterns sized for mask
measurements– Patterns sized for wafer measurements– Grounded and electrically floating
patterns– 70 nm to 1000 nm patterns– 4x 70 nm to 4 x 1000 nm patterns
• X-ray scatterometry– 4x and 1x dense structures
• Size 1500 mm by 1500 mm• Pitch patterns 1500 mm to 140
nm• Isolated and dense lines 1 mm to
70 nm• Vertical and horizontal structures• Beam focusing, navigation and
distortion measurement patterns• SEM, SPM, optical,
scatterometry and line scale interferometry
• Grounded structures – less charging
SEM pitch calibration metrology patterns
New SEM Magnification Calibration Artifact
New SEM Magnification Calibration Artifact
Pitch patterns
1500 mm to 140 nm
Isolated and dense lines 1 mm to 70 nm
Vertical and horizontal structures
Beam focusing, navigation and distortion measurement patterns
SEM pitch calibration metrology patterns
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