pid pbsn pcb molybdenum core -non confidential- · approved in sap by workflow prepared ... pid...
Post on 20-Jun-2018
216 Views
Preview:
TRANSCRIPT
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Copyright/ Schutzvermerk DIN ISO 16016DIN ISO 16016
Copying of this document, and giving it to others and the use or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design.
Weitergabe sowie Vervielfältigung dieser Unterlage, Verwertung und Mitteilung ihres Inhalts ist nicht gestattet, soweit nicht ausdrücklich zugestanden. Zuwiderhandlungen verpflichten zu Schadensersatz. Alle Rechte für den Fall der Patenterteilung oder Gebrauchsmuster‐Erteilung vorbehalten.
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 1/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
PID PbSn PCB Molybdenum core -non confidential-
Approved in SAP by Workflow
Prepared by QS2 D. Fuggmann
Engineering MT21 T. Maihöfer
PCB & Plating MT21 T. Bartscherer
Pre‐Production MT2 M. Jonek
Quality QS2 D. Fuggmann
Configuration Management CS3 I. Rock
CM Release
DVS‐No. TD00893909
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 2/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
CHANGE RECORD
Issue Details of Change Date
A Initial issue 2014‐04‐01
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 3/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
INDEX
1 Introduction ............................................................................................................... 4
1.1 Purpose ............................................................................................................................................... 4
1.2 Scope .................................................................................................................................................. 4
1.3 Abbreviations ...................................................................................................................................... 4
1.4 Applicable Documents ........................................................................................................................ 4
2 Organisation ............................................................................................................... 6
3 Processes ................................................................................................................... 8
4 Manufacturing flow .................................................................................................... 9
5 Qualified domain ..................................................................................................... 11
6 Manufacturing Area ................................................................................................. 12
7 Manufacturing Documentation ................................................................................ 14
8 Manufacturing Quality Control ................................................................................. 14
9 List of Materials........................................................................................................ 15
10 List of Equipment ..................................................................................................... 15
11 List of Test Equipment .............................................................................................. 17
12 List of Manufacturing Instructions ............................................................................ 18
13 List of Inspection Requirements................................................................................ 19
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 4/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
1 Introduction
1.1 Purpose
This document shows the processes for manufacturing PCB’s with molybdenum core and PbSn surface.
1.2 Scope
The listed processes and techniques are qualified in different qualification programs. This docu‐ment describes PCB’s with molybdenum core and PbSn surface. The domain only includes symmetric copper (etching process) layers. Blind via have full copper wrap. Planarization is not qualified. The domain includes the following PCB types (internal definition):
‐ Type 3: Rigid double‐sided PCBs ‐ Type 4: Rigid “Switch”‐PCBs ‐ Type 5: Rigid multilayer up to 8 layer (copper > 35µm) ‐ Type 5.1: Rigid multilayer > 8 layer (copper > 35µm) ‐ Type 6: Rigid multilayer up to 4 layer with blind via ‐ Type 6.1: Rigid multilayer > 6 layer with blind via ‐ Type 8: Rigid multilayer with blind and buried via
1.3 Abbreviations
Abbreviation Description
ECSS European Cooperation for Space Standardization
ESA European Space Agency
FM PbSn
Flight Model Lead tin
PCB Printed Circuit Board
PID Process Identification Document
1.4 Applicable Documents
AD 1 HB‐TESAT Managementhandbuch Management Manual, Iss. C
AD 2 HB‐QS2‐Prüfbefundmangemet Nonconformance Management, Reporting and Docu‐ mentation, Iss. B
AD 3 HB‐QS2‐Evaluation Qualifikation Evaluations, Qualifications, Material and Process Con‐ trol Board, Iss. B
AD 4 HB‐MT21 Leiterplattenproduktion PCB manufacturing and plating area, Iss. A
AD 5 63.3000.002.00FRL Design rules for FM PCB, Iss. C
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 5/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
AD 6 63.1013.001.00FNO Cleanliness‐ and Room Classes, Iss. D
AD 7 ECSS‐Q‐ST‐70‐10 Qualification of printed circuit boards, Iss. C
AD 8 ECSS‐Q‐ST‐70‐11 Procurement of printed circuit boards, Iss. C
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 6/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
2 Organisation
Tesat‐Spacecom’s organizational structure is shown in Figure 1 to Figure 4. They represent the sta‐tus at the time of publishing this issue and include the short names of the organizational units.
Figure 1 provides the top level organization. The units shown are further subdivided as described in Figure 2 to Figure 4.
Figure 1: CEO Organization
Figure 2: COO Organization
PID PBSN PCB MOLYBDENUM CORE -NON CONFIDENTIAL-
Document-Number Issue Project Date Class Page 63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 7/19 PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
Figure 3: MT Organization
Figure 4: MT21 Organization
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 8/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
3 Processes
Processes Specifications
Preproduction and planning 63.1503.000.00VAR Incoming inspection of laminates 63.2721.031.00BVS
63.2721.032.00BVS 63.2721.041.00BVS
Incoming inspection of prepregs 63.2711.005.00BVS Inspection of artwork, -touch up, -control 63.1950.060.00FVS Chemical cleaning 63.1950.054.00FVS
63.4451.008.00IPV Mechanical cleaning 63.1950.013.00FVS Photoresist -application -exposure
63.1950.031.00FVS 63.1950.032.00FVS 63.4451.008.00IPV
Photoresist development Inspection photoresist
63.1950.033.00FVS
Acidic etching process (tenting technology) 63.1950.005.00FVS 63.4451.008.00IPV
Resist stripping process 63.1950.004.00FVS 63.4451.008.00IPV
Inspection etching 63.1892.003.00IPV Treatment of multilayers 63.1950.055.00FVS
63.4451.008.00IPV Storage of prepregs and laminates 63.1950.026.00FVS Laminate process 63.1950.026.00FVS Drilling and milling 63.1950.064.00FVS
Laserdrilling 63.1950.056.00FVS X-Ray drilling 63.1950.057.00FVS Deburring 63.1950.001.00FVS Etchback 63.1950.009.00FVS Inspection after drilling and etchback 63.1892.005.00IPV Panel (through hole) plating and bathcontrol 63.1950.002.00FVS
63.4451.008.00IPV Pattern plating (tin/lead) and bath control 63.1950.003.00FVS
63.4451.008.00IPV Additional surfaces 63.1950.042.00FVS
63.4451.008.00IPV Alkaline etching process (metal resist technology)
63.1950.046.00FVS 63.4451.008.00IPV
Tin lead fusing 63.1950.917.00FVS Microsection and controls 63.1892.006.00IPV Inspection 6P.1892.004.00
63.1892.005.00IPV Ultra sonic cleaning 63.1950.061.00FVS Packaging 63.1950.038.00FVS Baking Other comments 63.4451.008.00IPV
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 9/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
4 Manufacturing flow
The flow is an example of PbSn – PCB’s with molybdenum core and µVia connection. In brackets the steps, described in chapter 2, Processes. It was used for the requalification board in 2011. The different set‐ups defined in the design rules will be documented in the respective traveller.
Layer 51 / 52 Layer 53 til 58 Layer 59 / 60
Preproduction and planning
A
Drilling and milling
Cleaning
Preproduction and planning
Cleaning
Photoresist exposure
Photoresist exposure Cleaning
Preproductionand planning
Drilling and milling
Etchback
Cleaning
Panel (PTH) plating
Cleaning
Photoresist exposure
Photoresist development
Acidic etching
Resist stripping
X-Ray drilling
Cleaning
Inspection etching
Cleaning
Treatment of multilayers
Photoresist development
Acidic etching
Resist stripping
X-Ray drilling
Cleaning
Inspection etching
Cleaning
Treatment of multilayers
Laminate process
Drilling and milling
Deburring
Cleaning
Photoresist development
Acidic etching
Resist stripping)
Cleaning
Inspection etching
Drilling and milling
Cleaning
Treatment of multilayers
Laminate process
Drilling and milling)
Deburring
Laserdrilling
Etchback
Cleaning
Inspection
Panel (PTH) plating
Cleaning
Photoresist exposure
Photoresist development
Acidic etching
Resist stripping
X-Ray drilling
Cleaning
Inspection etching
Cleaning
Treatment of multilayers
Cleaning )
Etchback
Cleaning
Panel (PTH) plating
Cleaning
Photoresist exposure
Photoresist development
Acidic etching
Resist stripping
X-Ray drilling
Cleaning
Inspection etching
Cleaning
Treatment of multilayers
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 10/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
Multilayer complete
A
Preproduction and planning
Laminate process
Drilling and milling
Deburring
Drilling and milling
Ultra sonic cleaning
Etchback
Deburring
Inspection
Panel (PTH) plating
Cleaning
Photoresist exposure
Photoresist development
Pattern plating tin/lead
Resist stripping
Alkaline etching process
Photoresist exposure
Photoresist development
Drilling and milling
Ultra sonic cleaning
Tin lead fusing
Ultra sonic cleaning)
Inspection
Microsection and controls
Baking
Packaging
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 11/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
5 Qualified domain
Objects ESA requirements TESAT – qualified parameters Possible parameters
Base material In Conformance with ECSS-Q-ST-70
Isola FR4 HTg IS420 Isola FR4 HTg IS420
Prepreg types In Conformance with ECSS-Q-ST-70
Isola 1080, 2116 Isola 1080, 2116, 106
External dimension toler-ance
± 0,2 mm +0; -0,15 mm +0; -0,15 mm
Thickness tolerance ± 10% ± 10% ± 10% Maximum board thickness 3,2 mm 3,2 mm 3,6 mm Conductor width minimum Internal: 120µm
External: 200 µm (for fine pitch 120 µm)
Internal: 120µm (17 µm copper thickness) External: 200 µm (for fine pitch 120 µm)
Internal: 100 µm (17 µm copper thickness) External: 150 µm (for fine pitch 120 µm)
Conductor spacing mini-mum
Internal: 150µm External: 300 µm (for fine pitch 150 µm)
Internal: 150µm External: 300 µm (for fine pitch 150 µm)
Internal: 100 µm (17 µm copper thickness) External: 150 µm (for fine pitch 150 µm)
PTH Via hole minimum 0,25 mm Aspect Ratio: 6
0,3 mm Aspect Ratio: 6
0,2 mm Aspect Ratio: 7
Mechanical depth drilled blind via hole minimum
None 0,6 mm Aspect Ratio: 1,0
0,4 mm Aspect Ratio: 1,0
µVia hole laser drilled minimum
None 0,3 mm Aspect Ratio: 0,5
0,2 mm Aspect Ratio: 0,7
Relative misregistration pad/hole
≤ 0,15 mm ≤ 0,15 mm ≤ 0,15 mm
Misalignment External layer solder side
0,2 mm 0,2 mm 0,2 mm
Misalignment External layer Non soldering hole
0,1 mm 0,1 mm 0,1 mm
Misalignment External layer solder side
0,1 mm 0,1 mm 0,1 mm
Misalignment Internal layer 0,05 mm 0,05 mm 0,05 mm Layer to layer registration ± 0,1 mm ± 0,1 mm ± 0,1 mm Number of layers maxi-mum
18 10 30
Electronic copper platingMinimum purity
95% 95% 95%
Copper thickness of sur-face pattern
≥ 25 µm ≥ 25 µm ≥ 25 µm
Copper thickness of plat-ed-through holes
≥ 25 µm ≥ 25 µm ≥ 25 µm
Copper thickness of via holes (blind via)
≥ 18 µm ≥ 18 µm ≥ 18 µm
Copper thickness of via holes (µvia) core connection
No requirements ≥ 10 µm ≥ 10 µm
Copper thickness innerlayer minimum
13 µm 13 µm 13 µm
Copper thickness innerlayer maximum
No requirements No requirements No requirements
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 12/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
Galvanic copper thickness outerlayer minimum
25 µm 25 µm 25 µm
Galvanic copper thickness outerlayer maximum
No requirements No requirements No requirements
Tin lead plating reflow Tin content of alloy
63 ± 8 % 63 ± 8 % 63 ± 8 %
Tin lead thickness on surface
≥ 8 µm in highest part ≥ 8 µm in highest part ≥ 8 µm in highest part
Tin lead thickness in plat-ed-through holes
≥ 8 µm in highest part ≥ 8 µm in highest part ≥ 8 µm in highest part
Tin lead thickness on angle cormer
≥ 2 µm ≥ 2 µm ≥ 2 µm
Insulation between layers minimum
70 µm 70 µm 40 µm (17µm copper)
Prepreg minimum Not required 1 1 Prepreg maximum Not required 5 8 Used core thickness Not required 0,1 up to 1,55 mm 0,1 up to 1,55 mm Warp and twist ≤ 1,1% for board thickness
≥ 1,6 mm ≤ 1,5% for board thickness < 1,6 mm
≤ 1,1% for board thickness ≥ 1,6 mm ≤ 1,5% for board thickness < 1,6 mm
≤ 1,1% for board thickness ≥ 1,6 mm ≤ 1,5% for board thickness < 1,6 mm
6 Manufacturing Area
The manufacturing of PCBs is performed in rooms with a cleanliness level according to the ge‐neric specification 63.1013.001.00FNO.
Plant layout:
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 13/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
The manufacturing area of PCB’s has been located in building No 099
Figure 5: Manufacturing area MT21, building 099/ground floor
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 14/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
Figure 6: Manufacturing area MT21, building 099/first floor
7 Manufacturing Documentation
For each PCB lot a job traveller is maintained. This job traveller contains all information neces‐sary for each subsequent working step. Additional electronic job tracking is used. This job travel‐ler will be kept in a manufacturing folder which contains also all relevant manufacturing draw‐ings.
8 Manufacturing Quality Control
Quality acceptance of the production of FM PCB’s is carried out by production lot control. The control contains 100% electrical and visual inspection. Microsectioning will be carried out on each panel and on one PCB per lot. Automated optical equipment is used additionally for inspection.
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 15/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
9 List of Materials
Material Type Film Idealine PRF
Base material FR4 IS 420 (HTg) Prepreg types: 106; 1080; 2116
Base material Polyimid 49 N (HTg) No Flow Prepreg type: 1080
Base material Polyimide (Flex) Pyralux Types: AP, LF
Copper foil CAC-foil; Cu-foil; 12 µm; 17 µm; 35 µm; 70 µm
Metal core Copper-Invar-Copper;
Metal core Molybdenum
10 List of Equipment
Process Equipment Supplier Artwork Laserplotter Silverwriter
Developper Agfaline 86 HT Barco Agfa
Film registration Punching Machine Digiraster
Microetching layer Microetching machine 930 Pill
Pumice scrubbing Pumiflex IS
Hot – Roll Laminator HRL - 24 Du Pont
Auto. Laminator CSL 2000 Yield Master Du Pont
Resist exposure system PC printer 130 Du Pont
Resist Developer Premium Line Schmid
Etching Innerlayer Premium Line Schmid
Resist stripping Premium Line Schmid
Brown oxidation Innerlayer Horizontal plating line Export 650
Pill
Lamination Multilayer Hydraulic Vacuum Press Bürkle
Drilling and Milling MX1 Schmoll
Etchback Plasma Etching machine Plasonic
Deburring Universal 601 Wesero
Pinning Machine Posafor Posalux
Electroless Copper and Panel plat-ing
Autom.Plating Line Galvabau
Pattern Plating (Tin/ Lead) Autom.Plating Line Galvabau
Etching external layer Horizontal plating line MacDermid
SnPb-fusing Heated Oil Tank Opelka
Dryer Export 450 Pill
Dryer UN 750 Plus Memmert
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 16/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
Ultrasonic washing machine
Export 600 Pill
Automatical exposure FAPS 600 Bacher
Drilling of tooling holes Via x-ray
XRX Schmoll
Registration and bonding of innerlayers
Bonding machine Wicke
Punching of innerlayers Punching machine Piergiacomi
Laserdrilling GS 600 Lumonics
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 17/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
11 List of Test Equipment
Test Test Equipment Supplier Microscope with measuring equip-ment
Axioplan Axioskop Axio Imager (A1)
Zeiss Zeiss Zeiss
Stereo-Microscope Stemi SV8 Stemi SV11
Zeiss Zeiss
Solderability Rotary Solderability Test Station CEMCO
Fluidizes Sand Bath SBL-1 Techne
Lamination and Prepreg Test Polystat 200 T Schwabenthan
Cations Atomic Spectrometer ASZ5000 Hitachi
Microsectioning Microsection Equipment Struers
Metall Coating Thickness, PbSn Fischerscope X-Ray XDLH Fischer
Copper Coating Thickness Fischerscope MMS Multimeasuringsystem
Fischer
Conductor Width/ Spacing Measuring Microsope Leitz
Glas Transition Temperature DSC-Equipment Netzsch
CVS QL 10 EX ECI Technology
MLB Over all Thickness Overarm Micrometer Ceco
Volume resistivity µVia 6290-7BV5 Almemo
Titration analysis Titrando 808 Metrohm
Scanning electron microscope Hitachi TM 1000 Hitachi
Inspection innerlayer Argos Mania Barco
Electrical testing Flying probe tester A3 ATG
Stereo-Microscope LYNX / VS8 Vision Engineering
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 18/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
12 List of Manufacturing Instructions
Mechanics Specification no. Plasmaätzen 63.1950.009.00FVS
Bohren und Fräsen Schmoll - Einrichtungen 63.1950.064.00FVS
Verpressen von Leiterplatten 63.1950.026.00FVS
Laserbohren 63.1950.056.00FVS
Röntgenbohren 63.1950.057.00FVS
Registrieren und Verschweißen von Lagen 63.1950.059.00FVS
Endreinigen von Leiterplatten (Ultraschallreinigen) 63.1950.061.00FVS
Structuring Specification no. Entschichten von Fotoresist (Strippen) 63.1950.004.00FVS
Ätzen von Leiterplatten 63.1950.005.00FVS
Reinigen von unbestückten Leiterplatten 63.1950.013.00FVS
Laminieren und Beschneiden von Fotoresist auf LP 63.1950.031.00FVS
Belichten des Fotoresists auf Leiterplatten 63.1950.032.00FVS
Entwickeln des Fotoresists auf Leiterplatten 63.1950.033.00FVS
Reinigen und Entfernen von Oxidschichten auf Cu-Oberflächen
63.1950.054.00FVS
Oxidieren von Innenlagen 63.1950.055.00FVS
Stanzen von Referenzlöchern 63.1950.058.00FVS
Filme für Strukturierung von Leiterplatten erstellen 63.1950.060.00FVS
Plating Specification no. Reinigen und Entgraten von unbestückten Leiterplatten 63.1950.001.00FVS
Vormetallisieren von Leiterplatten 63.1950.002.00FVS
Aufmetallisieren von Leiterplatten 63.1950.003.00FVS
Zinnstrippen von Leiterplatten 63.1950.042.00FVS
Ätzen von Leiterplatten in Metallresisttechnik 63.1950.046.00FVS
Chemisch Vernickeln und Vergolden von Leiterplatten 63.1950.050.00FVS
Aufschmelzen von Leiterplatten 63.1950.917.00FVS
General Specification no. Rahmenbedingungen für das Fertigen und Prüfen von LP‘n
63.1950.201.00FVS
Verpacken von Leiterplatten 63.1950.038.00FVS
PID ESA PBSN PCB MOLYBDENUM CORE
Document-Number Issue Project Date Class Page
63.1500.570.46PID_PbSn PCB A All 2014-04-01 O-K1 19/19
PROPRIETARY & CONFIDENTIAL All rights reserved according on clause on cover sheet. Tesat-Spacecom GmbH & Co. KG, 2010
13 List of Inspection Requirements
Inspection Specification no. Automatische Optische Inspektion von LP 63.1892.003.00IPV
Visuelle Kontrolle von LP 63.1892.005.00IPV
Schliffprüfung von LP 63.1892.006.00IPV
Elektrische Endprüfung von LP 6P.1892.004.00
Analytik Leiterplatten-Galvanik 63.4451.008.00IPV
top related